US20140116671A1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
US20140116671A1
US20140116671A1 US13/928,355 US201313928355A US2014116671A1 US 20140116671 A1 US20140116671 A1 US 20140116671A1 US 201313928355 A US201313928355 A US 201313928355A US 2014116671 A1 US2014116671 A1 US 2014116671A1
Authority
US
United States
Prior art keywords
supporting frame
heat sink
base
sink assembly
support portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/928,355
Inventor
Chun-Sheng Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YU, Chun-sheng
Publication of US20140116671A1 publication Critical patent/US20140116671A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/22—Fastening; Joining by using magnetic effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat sink assembly.
  • a traditional computer includes a heat sink assembled to a heat generating device to dissipate heat from the heat generating device.
  • the heat sink is secured to the heat generating device by screws, making the installation process laborious and time-consuming.
  • FIG. 1 is an exploded, isometric view of one embodiment of a heat sink assembly.
  • FIG. 2 is the heat sink of FIG. 1 viewed from another angle.
  • FIG. 3 is an assembled view of the heat sink assembly of FIG. 1 .
  • FIG. 4 is a cross-sectional view of FIG. 3 taken along line IV-IV.
  • FIGS. 1 and 2 show that a heat sink assembly, according to one embodiment, includes a printed circuit board 10 , a supporting frame 30 , and a heat sink 50 .
  • the printed circuit board 10 includes a board body 11 and a heat generating device 13 mounted to the board body 11 .
  • the board body 11 defines a plurality of securing holes 15 .
  • the supporting frame 30 is made of metal.
  • the supporting frame 30 includes a supporting frame body 31 and a plurality of securing portions 33 , extending from the supporting frame body 31 .
  • the supporting frame body 31 defines an opening 310 .
  • the supporting frame body 31 includes a support portion 311 and a flange 313 substantially perpendicularly extending from the support portion 311 .
  • the support portion 311 is rectangular and is substantially parallel to the board body 11 .
  • the support portion 311 and the flange 313 surround the opening 310 .
  • the cross sections of the support portion 311 and the flange 313 are L-shaped taken along a plane substantially perpendicular to the board body 11 .
  • the heat sink 50 includes a base 51 and a plurality of fins 53 extending from the base 51 .
  • the fins 53 are substantially parallel to each other.
  • the base 51 includes a soaking panel 511 and defines a hermetic space 513 .
  • the soaking panel 511 is located in the hermetic space 513 .
  • the soaking panel 511 includes a panel body 5111 , a plurality of protrusions 5115 extending from the panel body 5111 , and a plurality of magnetic posts 5113 around the edges of the panel body 5111
  • the magnetic posts 5113 surround the protrusions 5115 .
  • the protrusions 5115 prevent the panel body 5111 from being deformed in assembly.
  • FIGS. 3 and 4 show that in assembly, the securing portions 33 of the supporting frame 30 are aligned with the securing holes 15 .
  • the securing portions 33 pass through the securing holes to mount the supporting frame 30 to the printed circuit board 10 , such that the heat generating device 13 is received in the opening 310 of the supporting frame 30 .
  • the base 51 is placed on and magnetically adheres to the support portion 311 of the supporting frame 30 because of the magnetic posts 5113 . This allows the panel body 5111 to contact the heat generating device 13 and guide heat to the fins 53 .
  • the flange 313 of the supporting frame 30 prevents the heat sink 50 from moving.
  • the base 51 magnetically adheres to the supporting frame 30 , easily securing the heat sink 50 to the supporting frame 30 .
  • the heat sink 50 is forcibly pulled to detach from the supporting frame 30 .

Abstract

A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a hermetic space. The base includes a panel body and a plurality of magnetic posts extending from the panel body. The plurality of magnetic posts are located in the hermetic space.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat sink assembly.
  • 2. Description of Related Art
  • A traditional computer includes a heat sink assembled to a heat generating device to dissipate heat from the heat generating device. However, the heat sink is secured to the heat generating device by screws, making the installation process laborious and time-consuming.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of one embodiment of a heat sink assembly.
  • FIG. 2 is the heat sink of FIG. 1 viewed from another angle.
  • FIG. 3 is an assembled view of the heat sink assembly of FIG. 1.
  • FIG. 4 is a cross-sectional view of FIG. 3 taken along line IV-IV.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
  • FIGS. 1 and 2 show that a heat sink assembly, according to one embodiment, includes a printed circuit board 10, a supporting frame 30, and a heat sink 50.
  • The printed circuit board 10 includes a board body 11 and a heat generating device 13 mounted to the board body 11. The board body 11 defines a plurality of securing holes 15.
  • The supporting frame 30 is made of metal. The supporting frame 30 includes a supporting frame body 31 and a plurality of securing portions 33, extending from the supporting frame body 31. The supporting frame body 31 defines an opening 310. The supporting frame body 31 includes a support portion 311 and a flange 313 substantially perpendicularly extending from the support portion 311. The support portion 311 is rectangular and is substantially parallel to the board body 11. The support portion 311 and the flange 313 surround the opening 310. The cross sections of the support portion 311 and the flange 313 are L-shaped taken along a plane substantially perpendicular to the board body 11.
  • The heat sink 50 includes a base 51 and a plurality of fins 53 extending from the base 51. The fins 53 are substantially parallel to each other. The base 51 includes a soaking panel 511 and defines a hermetic space 513. The soaking panel 511 is located in the hermetic space 513. The soaking panel 511 includes a panel body 5111, a plurality of protrusions 5115 extending from the panel body 5111, and a plurality of magnetic posts 5113 around the edges of the panel body 5111 The magnetic posts 5113 surround the protrusions 5115. The protrusions 5115 prevent the panel body 5111 from being deformed in assembly.
  • FIGS. 3 and 4 show that in assembly, the securing portions 33 of the supporting frame 30 are aligned with the securing holes 15. The securing portions 33 pass through the securing holes to mount the supporting frame 30 to the printed circuit board 10, such that the heat generating device 13 is received in the opening 310 of the supporting frame 30. The base 51 is placed on and magnetically adheres to the support portion 311 of the supporting frame 30 because of the magnetic posts 5113. This allows the panel body 5111 to contact the heat generating device 13 and guide heat to the fins 53. The flange 313 of the supporting frame 30 prevents the heat sink 50 from moving.
  • The base 51 magnetically adheres to the supporting frame 30, easily securing the heat sink 50 to the supporting frame 30. In disassembly, the heat sink 50 is forcibly pulled to detach from the supporting frame 30.
  • It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (16)

What is claimed is:
1. A heat sink assembly, comprising a heat sink, the heat sink comprises a base; the base defines a hermetic space; the base comprises a panel body and a plurality of magnetic posts extending from the panel body; and the plurality of magnetic posts are located in the hermetic space.
2. The heat sink assembly of claim 1, wherein the base further comprises a plurality of protrusions extending from the panel body; the plurality of protrusions are located in the hermetic space and surrounded by the plurality of magnetic posts.
3. The heat sink assembly of claim 1, wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.
4. The heat sink assembly of claim 1, further comprising a printed circuit board and a supporting frame, wherein the printed circuit board comprises a board body and a heat generating element mounted to the board body; the supporting frame is mounted on the board body; the supporting frame defines an opening; the heat generating element is located in the opening; the base is mounted on the supporting frame; and the panel body contacts the heat generating element.
5. The heat sink assembly of claim 4, wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.
6. The heat sink assembly of claim 5, wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.
7. The heat sink assembly of claim 6, wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.
8. The heat sink assembly of claim 4, wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.
9. A heat sink assembly, comprising:
a printed circuit board, the printed circuit board comprises a board body and a heat generating element mounted to the board body;
a supporting frame mounted to the board body, the supporting frame is made of metal;
a heat sink, the heat sink comprises a base placed on the supporting frame and contacting the heat generating element; the base defines a hermetic space; the base comprises a plurality of protrusions and a plurality of magnetic posts are located in the hermetic space; and the base absorbs the supporting frame via magnetic force.
10. The heat sink assembly of claim 9, wherein the plurality of protrusions are surrounded by the plurality of magnetic posts.
11. The heat sink assembly of claim 9, wherein the heat sink further comprises a plurality of fins extending from the base, and the plurality of fins are substantially parallel to each other.
12. The heat sink assembly of claim 9, wherein the supporting frame defines an opening; the heat generating element is located in the opening.
13. The heat sink assembly of claim 12, wherein the supporting frame comprises a supporting frame body; the supporting frame body comprises a support portion surrounding the opening; the support portion is substantially parallel to the board body; and the base is placed on the support portion.
14. The heat sink assembly of claim 13, wherein the supporting frame body further comprises a flange extending from the support portion; the flange surrounds the base; the flange is configured to prevent the base from moving along a direction substantially parallel to the board body.
15. The heat sink assembly of claim 14, wherein cross sections of the support portion and the flange are L-shaped taken along a plane substantially parallel to the board body.
16. The heat sink assembly of claim 12, wherein the supporting frame comprises a supporting frame body and a plurality of securing portions extending from the supporting frame body; the opening is defined in the supporting frame body; and the board body defines a plurality of securing holes receiving the plurality of securing portions.
US13/928,355 2012-10-26 2013-06-26 Heat sink assembly Abandoned US20140116671A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101139792 2012-10-26
TW101139792A TW201416837A (en) 2012-10-26 2012-10-26 Heat sink assembly

Publications (1)

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US20140116671A1 true US20140116671A1 (en) 2014-05-01

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US (1) US20140116671A1 (en)
TW (1) TW201416837A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160143127A1 (en) * 2014-11-19 2016-05-19 Giga-Byte Technology Co., Ltd. Slat fastening assembly
CN115589646A (en) * 2022-12-12 2023-01-10 久盛电气股份有限公司 Heating system, tank device and control method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6542369B1 (en) * 2001-12-27 2003-04-01 Nextronics Engineering Corp. Fixing frame for CPU cooling devices
US6831541B1 (en) * 2003-09-16 2004-12-14 Concept Workshop Worldwide, Llc Multi-stable magnetic article
US6874568B2 (en) * 2002-07-26 2005-04-05 Tai-Sol Electronics Co., Ltd. Bottom fixation type integrated circuit chip cooling structure
US7661463B2 (en) * 2004-12-03 2010-02-16 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US20120120608A1 (en) * 2010-11-11 2012-05-17 Hon Hai Precision Industry Co., Ltd. Printed circuit board with heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6542369B1 (en) * 2001-12-27 2003-04-01 Nextronics Engineering Corp. Fixing frame for CPU cooling devices
US6874568B2 (en) * 2002-07-26 2005-04-05 Tai-Sol Electronics Co., Ltd. Bottom fixation type integrated circuit chip cooling structure
US6831541B1 (en) * 2003-09-16 2004-12-14 Concept Workshop Worldwide, Llc Multi-stable magnetic article
US7661463B2 (en) * 2004-12-03 2010-02-16 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US20120120608A1 (en) * 2010-11-11 2012-05-17 Hon Hai Precision Industry Co., Ltd. Printed circuit board with heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160143127A1 (en) * 2014-11-19 2016-05-19 Giga-Byte Technology Co., Ltd. Slat fastening assembly
EP3024023A3 (en) * 2014-11-19 2017-06-28 Giga-Byte Technology Co., Ltd. Slat fastening assembly
CN115589646A (en) * 2022-12-12 2023-01-10 久盛电气股份有限公司 Heating system, tank device and control method thereof

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Publication number Publication date
TW201416837A (en) 2014-05-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YU, CHUN-SHENG;REEL/FRAME:030701/0589

Effective date: 20130626

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION