US20140174699A1 - Heat dissipation assembly - Google Patents

Heat dissipation assembly Download PDF

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Publication number
US20140174699A1
US20140174699A1 US13/727,559 US201213727559A US2014174699A1 US 20140174699 A1 US20140174699 A1 US 20140174699A1 US 201213727559 A US201213727559 A US 201213727559A US 2014174699 A1 US2014174699 A1 US 2014174699A1
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United States
Prior art keywords
heat
heat sink
bracket
dissipation assembly
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/727,559
Inventor
Hsuan-I Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, HSUAN-I
Publication of US20140174699A1 publication Critical patent/US20140174699A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat dissipation assembly.
  • Central processing units (CPUs) of computers or servers generate a large amount of heat during operation.
  • the heat needs to be dissipated immediately to ensure the continued proper functioning of the computers or servers.
  • a conventional heat dissipation assembly is usually mounted on a CPU for dissipating the heat.
  • the heat dissipation assembly includes a base, a heat sink, and a substantially U-shaped heat pipe connected between the base and the heat sink.
  • the base and the heat sink cooperatively bound a space for system airflow, the system airflow cannot fully contact with the heat sink, thus reducing heat dissipating efficiency of the heat sink.
  • FIG. 2 is an assembled, isometric view of the heat dissipation assembly and the motherboard of FIG. 1 .
  • FIG. 3 is a side plan view of FIG. 2 , showing the heat dissipation assembly in use.
  • FIG. 1 shows an embodiment of a heat dissipation assembly for dissipating heat of an electronic component 302 mounted on a motherboard 300 .
  • the heat dissipation assembly includes a base 20 , a first heat sink 40 , a second heat sink 60 , and three U-shaped heat pipes 80 .
  • the electronic component 302 is a central processing unit.
  • the base 20 includes a bracket 22 and a connecting member 24 .
  • the bracket 22 includes a substantially rectangular bottom wall 222 .
  • the bottom wall 222 defines a rectangular opening 223 in a middle of the bottom wall 222 , and a plurality of screw holes 224 located at two opposite sides of the opening 223 .
  • Two opposite and spaced baffling pieces 226 extend up from each side of the bottom plate 222 , and cooperatively bound a cutout 227 .
  • Four fasteners 228 are respectively installed on four corners of the bottom wall 222 , to be mounted to the motherboard 300 .
  • the electronic component 302 is received in the opening 223 of the bracket 22 .
  • the connecting member 24 includes a rectangular supporting plate 242 and two flanges 244 extending out from upper portions of two opposite ends of the supporting plate 242 .
  • Each flange 244 defines a plurality of through holes 246 .
  • a top of the supporting plate 242 defines three receiving slots 247 parallel to the flanges 244 .
  • the first heat sink 40 includes a plurality of fins 42 each defining a plurality of inserting holes 44 .
  • the second heat sink 60 includes a rectangular bottom plate 62 and a plurality of fins 64 perpendicularly extending up from the bottom plate 62 .
  • a bottom of the bottom plate 62 defines three parallel receiving slots 66 , opposite to the fins 64 .
  • Each heat pipe 80 includes a positioning portion 82 , two heat-conductive portions 84 , and two connecting portions 83 respectively connected between two opposite ends of the positioning portion 82 and the heat-conductive portions 84 .
  • FIG. 2 shows that in assembly of the heat dissipation assembly, the supporting plate 242 is received in the opening 223 of the bracket 22 , and a bottom surface of the supporting plate 242 is abutted against the electronic component 302 .
  • a plurality of screws extends through the through holes 246 of the connecting member 24 , to be screwed into the corresponding screw holes 224 .
  • a bottom of the positioning portion 82 of each heat pipe 80 opposite to the heat-conductive portions 84 is received in the corresponding receiving slot 247 of the connecting member 24 , and jointed to the supporting plate 424 .
  • the baffling pieces 226 respectively face the connecting portions 82 of the heat pipes 80 .
  • the second heat sink 60 is mounted on the supporting plate 242 .
  • Tops of the positioning portions 82 are received in the corresponding receiving slots 66 , and jointed to the second heat sink 60 .
  • the heat-conductive portions 84 are inserted into the corresponding inserting holes 44 of each fin 42 .
  • the fins 42 are jointed to the heat-conductive portions 84 .
  • the fins 42 are parallel to and spaced from one another.
  • a bottom of the first heat sink 40 is abutted against the baffling pieces 226 , and jointed to the baffling pieces 226 .
  • the second heat sink 60 is located between the cutouts 227 of the bracket 22 .
  • a first part of heat generated by the electronic component 302 is transferred to the second heat sink 60 through the connecting member 24 and the positioning portions 82 of the heat pipes 80 .
  • a second part of the heat is transferred to the first heat sink 40 through the heat-conductive portions 84 of the heat pipes 80 .
  • Airflow generated by system fans flows through the fins 42 , and the fins 64 from the cutouts 227 . The airflow can fully contact with the first and second fins 42 and 64 , to increase heat-dissipation effectiveness.

Abstract

A heat sink assembly includes a base, a heat pipe, a first heat sink, and a second heat sink. The second heat sink is installed between the base and the first heat sink. The heat pipe includes a positioning portion sandwiched between the second heat sink and the base, and two heat-conductive portions extending up from two opposite ends of the positioning portion and inserted into the first heat sink.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat dissipation assembly.
  • 2. Description of Related Art
  • Central processing units (CPUs) of computers or servers generate a large amount of heat during operation. The heat needs to be dissipated immediately to ensure the continued proper functioning of the computers or servers. Presently, a conventional heat dissipation assembly is usually mounted on a CPU for dissipating the heat. The heat dissipation assembly includes a base, a heat sink, and a substantially U-shaped heat pipe connected between the base and the heat sink. However, although the base and the heat sink cooperatively bound a space for system airflow, the system airflow cannot fully contact with the heat sink, thus reducing heat dissipating efficiency of the heat sink.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation assembly, together with a motherboard.
  • FIG. 2 is an assembled, isometric view of the heat dissipation assembly and the motherboard of FIG. 1.
  • FIG. 3 is a side plan view of FIG. 2, showing the heat dissipation assembly in use.
    •  DETAILED DESCRIPTION
  • The present disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • FIG. 1 shows an embodiment of a heat dissipation assembly for dissipating heat of an electronic component 302 mounted on a motherboard 300. The heat dissipation assembly includes a base 20, a first heat sink 40, a second heat sink 60, and three U-shaped heat pipes 80. In the embodiment, the electronic component 302 is a central processing unit.
  • The base 20 includes a bracket 22 and a connecting member 24.
  • The bracket 22 includes a substantially rectangular bottom wall 222. The bottom wall 222 defines a rectangular opening 223 in a middle of the bottom wall 222, and a plurality of screw holes 224 located at two opposite sides of the opening 223. Two opposite and spaced baffling pieces 226 extend up from each side of the bottom plate 222, and cooperatively bound a cutout 227. Four fasteners 228 are respectively installed on four corners of the bottom wall 222, to be mounted to the motherboard 300. The electronic component 302 is received in the opening 223 of the bracket 22.
  • The connecting member 24 includes a rectangular supporting plate 242 and two flanges 244 extending out from upper portions of two opposite ends of the supporting plate 242. Each flange 244 defines a plurality of through holes 246. A top of the supporting plate 242 defines three receiving slots 247 parallel to the flanges 244.
  • The first heat sink 40 includes a plurality of fins 42 each defining a plurality of inserting holes 44.
  • The second heat sink 60 includes a rectangular bottom plate 62 and a plurality of fins 64 perpendicularly extending up from the bottom plate 62. A bottom of the bottom plate 62 defines three parallel receiving slots 66, opposite to the fins 64.
  • Each heat pipe 80 includes a positioning portion 82, two heat-conductive portions 84, and two connecting portions 83 respectively connected between two opposite ends of the positioning portion 82 and the heat-conductive portions 84.
  • FIG. 2 shows that in assembly of the heat dissipation assembly, the supporting plate 242 is received in the opening 223 of the bracket 22, and a bottom surface of the supporting plate 242 is abutted against the electronic component 302. A plurality of screws extends through the through holes 246 of the connecting member 24, to be screwed into the corresponding screw holes 224. A bottom of the positioning portion 82 of each heat pipe 80 opposite to the heat-conductive portions 84 is received in the corresponding receiving slot 247 of the connecting member 24, and jointed to the supporting plate 424. Thereby, the baffling pieces 226 respectively face the connecting portions 82 of the heat pipes 80. The second heat sink 60 is mounted on the supporting plate 242. Tops of the positioning portions 82 are received in the corresponding receiving slots 66, and jointed to the second heat sink 60. The heat-conductive portions 84 are inserted into the corresponding inserting holes 44 of each fin 42. The fins 42 are jointed to the heat-conductive portions 84. The fins 42 are parallel to and spaced from one another. A bottom of the first heat sink 40 is abutted against the baffling pieces 226, and jointed to the baffling pieces 226. The second heat sink 60 is located between the cutouts 227 of the bracket 22.
  • Referring to FIG. 3, in use, a first part of heat generated by the electronic component 302 is transferred to the second heat sink 60 through the connecting member 24 and the positioning portions 82 of the heat pipes 80. A second part of the heat is transferred to the first heat sink 40 through the heat-conductive portions 84 of the heat pipes 80. Airflow generated by system fans (not shown) flows through the fins 42, and the fins 64 from the cutouts 227. The airflow can fully contact with the first and second fins 42 and 64, to increase heat-dissipation effectiveness.
  • While the disclosure describes examples and embodiments, it is to be understood that the disclosure is not limited thereto. On the contrary, the disclosure is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (6)

What is claimed is:
1. A heat dissipation assembly, comprising:
a base;
a first heat sink installed on the base;
a second heat sink installed between the base and the first heat sink; and
a heat pipe comprising a positioning portion sandwiched between the second heat sink and the base, and two heat-conductive portions extending up from two opposite ends of the positioning portion and inserted into the first heat sink;
wherein the base comprises a rectangular bracket, two spaced baffling pieces extend up from each side of the bracket, the baffling pieces at the each side of the bracket cooperatively bound a cutout, the heat pipe further comprises two connecting portions respectively connected between the heat-conductive portions and the two opposite ends of the positioning portion, each baffling piece faces the corresponding connecting portion, and the second heat sink is located between the cutouts of the bracket.
2. The heat dissipation assembly of claim 1, wherein the first heat sink is supported on the bracket, and a bottom of the first heat sink is engaged with the baffling pieces.
3. The heat dissipation assembly of claim 1, wherein the base further comprises a connecting member, the bracket defines an opening, the connecting member comprises a supporting plate received in the opening and two flanges extending out from two opposite ends of the supporting plate to be mounted to the bracket, the baffling pieces are respectively located at two opposite sides of the opening, and the second heat sink is mounted on the support plate.
4. The heat dissipation assembly of claim 3, wherein a top of the supporting plate defines a first receiving slot for receiving a bottom of the positioning portion of the heat pipe.
5. The heat dissipation assembly of claim 4, wherein the second heat sink comprises a bottom plate and a plurality of fins extending up from the bottom plate, the bottom plate defines a second receiving slot for receiving a top of the positioning portion of the heat pipe.
6. The heat dissipation assembly of claim 1, wherein the first heat sink comprises a plurality of fins parallel to and spaced from one another, each fin defines two inserting holes, the heat-conductive portions are inserted into the inserting holes of each fin.
US13/727,559 2012-12-25 2012-12-26 Heat dissipation assembly Abandoned US20140174699A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101149728A TW201425857A (en) 2012-12-25 2012-12-25 Heat sink assembly
TW101149728 2012-12-25

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US20140174699A1 true US20140174699A1 (en) 2014-06-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105758237A (en) * 2016-04-07 2016-07-13 同度能源科技（江苏）股份有限公司 Heat radiator with longitudinal and transverse heat tubes
US10165668B2 (en) * 2017-02-16 2018-12-25 Dell Products, Lp Heat exchanger for an information handling system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080128111A1 (en) * 2006-12-01 2008-06-05 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7443679B2 (en) * 2006-12-15 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device having a fin also functioning as a fan holder
US20090027858A1 (en) * 2007-07-24 2009-01-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device assembly
US20090059532A1 (en) * 2007-08-31 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Electronic system with a heat sink assembly
US20090219690A1 (en) * 2008-03-03 2009-09-03 Tai-Sol Electronics Co., Ltd. Heat sink capable of external deflection
US20100073877A1 (en) * 2008-09-23 2010-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
US20100232109A1 (en) * 2009-03-13 2010-09-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8267157B2 (en) * 2009-04-11 2012-09-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080128111A1 (en) * 2006-12-01 2008-06-05 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7443679B2 (en) * 2006-12-15 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device having a fin also functioning as a fan holder
US20090027858A1 (en) * 2007-07-24 2009-01-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device assembly
US20090059532A1 (en) * 2007-08-31 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Electronic system with a heat sink assembly
US20090219690A1 (en) * 2008-03-03 2009-09-03 Tai-Sol Electronics Co., Ltd. Heat sink capable of external deflection
US20100073877A1 (en) * 2008-09-23 2010-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
US20100232109A1 (en) * 2009-03-13 2010-09-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8267157B2 (en) * 2009-04-11 2012-09-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105758237A (en) * 2016-04-07 2016-07-13 同度能源科技（江苏）股份有限公司 Heat radiator with longitudinal and transverse heat tubes
US10165668B2 (en) * 2017-02-16 2018-12-25 Dell Products, Lp Heat exchanger for an information handling system

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AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, HSUAN-I;REEL/FRAME:029529/0208

Effective date: 20121225

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION