TW201414573A - Cutting apparatus, manufacturing method of polishing pad and polishing pad - Google Patents
Cutting apparatus, manufacturing method of polishing pad and polishing pad Download PDFInfo
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本發明是有關於一種切割裝置、研磨墊的製造方法以及研磨墊，且特別是有關於一種生產具有較均勻特性之研磨墊的切割裝置、研磨墊的製造方法以及研磨墊。 The present invention relates to a cutting device, a method of manufacturing a polishing pad, and a polishing pad, and more particularly to a cutting device for producing a polishing pad having relatively uniform characteristics, a method of manufacturing the polishing pad, and a polishing pad.
隨著產業的進步，平坦化製程經常被採用為生產各種元件的製程。在平坦化製程中，化學機械研磨製程經常為產業所使用；一般來說，化學機械研磨(chemical mechanical polishing,CMP)製程是藉由供應具有化學品混合物之研磨液於研磨墊上，並對被研磨物件施加壓力以將其壓置於研磨墊上，且使物件及研磨墊彼此進行相對運動。藉由相對運動所產生的機械摩擦及研磨液的化學作用下，移除部分物件表層，而使其表面逐漸平坦，來達成平坦化的目的。 As the industry advances, flattening processes are often adopted as processes for producing various components. In the planarization process, the CMP process is often used in the industry; in general, the chemical mechanical polishing (CMP) process is performed by supplying a slurry with a chemical mixture onto the polishing pad and grinding it. The article applies pressure to press it against the polishing pad and causes the article and the polishing pad to move relative to one another. By the mechanical friction generated by the relative motion and the chemical action of the polishing liquid, the surface layer of some objects is removed, and the surface thereof is gradually flattened to achieve the purpose of planarization.
以研磨墊的製作而言，通常會先形成研磨墊半成品，研磨墊半成品為柱狀，例如是圓柱狀(cake)。研磨墊半成品靜置成形後進行切割成片狀之研磨層，再進行挖槽或開孔、貼合等程序，以完成研磨墊的製作。其中切割程序主要係利用一切割裝置將研磨墊半成品切割成研磨層，已知的切割裝置主要是由一定型切刀(blade)以及一可移動的工作台所組成，其中可移動的工作台用以承載研磨墊半成品，並將其快速移動使定型切刀將研磨墊半成品切割成研磨層。 In the production of the polishing pad, the polishing pad semi-finished product is usually formed first, and the polishing pad semi-finished product has a column shape, for example, a cake. After the polishing pad semi-finished product is statically formed, the polishing layer is cut into a sheet shape, and then a process such as grooving or opening, bonding, and the like is performed to complete the production of the polishing pad. The cutting program mainly uses a cutting device to cut the polishing pad semi-finished product into a polishing layer. The known cutting device is mainly composed of a certain type of blade and a movable table, wherein the movable table is used for Carrying the polishing pad semi-finished product and moving it quickly, the shaping cutter cuts the polishing pad semi-finished product into an abrasive layer.
在上述的切割過程中，定型切刀是處於固定的位置(亦即是靜止不動的)，研磨墊半成品是藉由可移動工作台的快速移動，進而切割成預定尺寸之研磨層。經過連續的切割程序，研磨墊半成品與定型切刀間的摩擦力產生熱量累積，這些熱量累積會導致定型切刀產生熱變形(thermal distortion)，進而使所切割出來的研磨層產生不均勻的特性，例如是厚度、均勻性等特性，在日後使用此研磨墊的CMP製程中會影響研磨品質。 In the above cutting process, the shaping cutter is in a fixed position (i.e., stationary), and the polishing pad semi-finished product is cut into a predetermined size of the abrasive layer by rapid movement of the movable table. Through a continuous cutting process, the friction between the polishing pad semi-finished product and the shaping cutter generates heat accumulation, which causes the thermal distortion of the shaping cutter, which in turn causes unevenness of the cut abrasive layer. For example, the properties such as thickness and uniformity affect the polishing quality in the CMP process in which the polishing pad is used in the future.
此外，由於定型切刀是處於固定的位置，因此所得的研磨層表面會產生完全平行刀痕，完全平行刀痕會造成所製造的研磨墊具有缺陷，這些缺陷包括研磨層表面不正常的突起(protrusions)，尤其是當定型切刀鈍化時，會造成研磨墊具有更多的缺陷，進而影響CMP製程的研磨品質。 In addition, since the sizing cutter is in a fixed position, the resulting abrasive layer surface will produce completely parallel scallops, and the completely parallel scallops will cause defects in the manufactured polishing pad, including irregular protrusions on the surface of the polishing layer ( Protrusions), especially when the shaping cutter is passivated, causes the polishing pad to have more defects, which in turn affects the polishing quality of the CMP process.
本發明提供一種切割裝置，其使所生產的研磨墊具有較均勻的特性。 The present invention provides a cutting apparatus that produces a polishing pad having a relatively uniform characteristic.
本發明提供一種研磨墊的製造方法，其使用上述切割裝置，因此所生產的研磨墊具有較均勻的特性。 The present invention provides a method of manufacturing a polishing pad which uses the above-described cutting device, so that the polishing pad produced has relatively uniform characteristics.
本發明提供一種研磨墊，其是透過上述切割裝置切割而製成。 The present invention provides a polishing pad which is formed by cutting through the above cutting device.
本發明提出一種切割裝置，其用於切割研磨墊半成品，以去除研磨墊半成品之一部份成為研磨層，或將研磨墊半成品以面呈平行之方式切割為至少二片研磨層，來製 造研磨墊。切割裝置包括輸入機構以及可移動刀具。輸入機構用於輸入研磨墊半成品。可移動刀具用於切割研磨墊半成品。當進行切割時，可移動刀具沿著第一方向運動，研磨墊半成品沿著第二方向運動，且第一方向與第二方向之間具有一夾角。 The invention provides a cutting device for cutting a polishing pad semi-finished product to remove one part of the polishing pad semi-finished product into an abrasive layer, or cutting the polishing pad semi-finished product into at least two polishing layers in a parallel manner. Make a polishing pad. The cutting device includes an input mechanism and a movable cutter. The input mechanism is used to input the polishing pad semi-finished product. The movable tool is used to cut the semi-finished polishing pad. When the cutting is performed, the movable tool moves in the first direction, the polishing pad blank moves in the second direction, and the first direction has an angle with the second direction.
本發明提出一種研磨墊的製造方法，其包括以下的步驟。首先，提供研磨墊半成品。之後，傳送研磨墊半成品至切割裝置，且切割裝置具有可移動刀具。可移動刀具用於去除研磨墊半成品之一部份成為一研磨層，或將研磨墊半成品以面呈平行之方式切割為至少二片研磨層。當進行切割時，可移動刀具沿著第一方向運動，研磨墊半成品沿著第二方向運動，且第一方向與第二方向之間具有一夾角。 The present invention provides a method of manufacturing a polishing pad comprising the following steps. First, a polishing pad semi-finished product is provided. Thereafter, the polishing pad semi-finished product is transferred to the cutting device, and the cutting device has a movable cutter. The movable cutter is used to remove one part of the polishing pad semi-finished product into a polishing layer, or to cut the polishing pad semi-finished product into at least two abrasive layers in a parallel manner. When the cutting is performed, the movable tool moves in the first direction, the polishing pad blank moves in the second direction, and the first direction has an angle with the second direction.
本發明提出一種研磨墊，其係藉由切割裝置去除研磨墊半成品之一部份或將研磨墊半成品以面呈平行之方式切割為至少二片的片狀研磨墊半成品所製成，研磨墊包括研磨層，研磨層具有至少一切割面，切割面具有多個線狀不完全平行的刀痕。 The invention provides a polishing pad which is prepared by removing a part of a polishing pad semi-finished product by a cutting device or cutting the polishing pad semi-finished product into at least two pieces of a sheet-shaped polishing pad semi-finished product in a parallel manner. The polishing pad comprises The polishing layer has at least one cutting surface having a plurality of linearly incompletely parallel tool marks.
基於上述，本發明之研磨墊的製造方法是透過使切割裝置的可移動刀具與研磨墊半成品在切割程序的進行過程中保持進行相對運動的方式，來切割研磨墊半成品。由於可移動刀具並非固定不動，可以減少摩擦所產生的熱量累積，而可移動刀具不會因為熱量累積導致熱變形，因此能使研磨墊具有較均勻的特性。此外，本發明之研磨墊的研磨層切割面具有線狀不完全平行的刀痕，對於某些特定的 研磨製程而言，可解決先前技術中完全平行刀痕所產生的問題。 Based on the above, the polishing pad of the present invention is manufactured by cutting the polishing pad blank by moving the movable tool of the cutting device and the polishing pad semi-finished product in a relative motion during the cutting process. Since the movable tool is not fixed, the accumulation of heat generated by the friction can be reduced, and the movable tool does not thermally deform due to heat accumulation, so that the polishing pad can have a more uniform characteristic. In addition, the abrasive layer of the polishing pad of the present invention cuts the mask in a line that is not completely parallel, for some specific In the case of the grinding process, the problems caused by the completely parallel tool marks in the prior art can be solved.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明實施例之切割裝置的結構示意圖。請參照圖1，本實施例之切割裝置200包括輸入機構210以及可移動刀具220，可移動刀具220例如是循環刀片222，其可用以機械切割方式來切割研磨墊半成品100，而循環刀片222例如是帶狀刀片。在本實施例中，循環刀片222可被轉軸224帶動並沿著轉動方向226進行循環地捲動，其中循環刀片222是沿第一方向D1運動。輸入機構210例如是第一滾輪212，輸入機構210可將研磨墊半成品100沿著第二方向D2傳送。 FIG. 1 is a schematic structural view of a cutting device according to an embodiment of the present invention. Referring to FIG. 1, the cutting apparatus 200 of the present embodiment includes an input mechanism 210 and a movable cutter 220. The movable cutter 220 is, for example, a circulation blade 222, which can cut the polishing pad blank 100 by mechanical cutting, and the circulation blade 222 is, for example, It is a ribbon blade. In the present embodiment, the circulation blade 222 can be rotated by the rotating shaft 224 and cyclically rolled in the rotational direction 226, wherein the circulating blade 222 is moved in the first direction D1. The input mechanism 210 is, for example, a first roller 212, and the input mechanism 210 can transport the polishing pad blank 100 in the second direction D2.
此外，切割裝置200可以選擇性地更包括磨利機構240，磨利機構240例如是砂輪。當可移動刀具220切割研磨墊半成品100後，可移動刀具220的切割端可能會有磨損的情形發生，此時，可透過磨利機構240研磨可移動刀具220並使可移動刀具220的切割端維持銳利的狀態。 Further, the cutting device 200 can optionally further include a sharpening mechanism 240, such as a grinding wheel. After the movable cutter 220 cuts the polishing pad blank 100, the cutting end of the movable cutter 220 may be worn. At this time, the movable cutter 220 may be ground by the sharpening mechanism 240 and the cutting end of the movable cutter 220 may be cut. Maintain a sharp state.
以下將詳細介紹使用切割裝置200製作研磨墊的製造流程。首先，提供研磨墊半成品100，其可用壓出成型法或模鑄法形成。在圖1中所示的研磨墊半成品100的形狀係以方形柱體的形狀為例說明。然而，本發明不限於此。 在其他實施例中，研磨墊半成品100的形狀也可以是圓柱狀或是其他任意形狀。 The manufacturing process for manufacturing the polishing pad using the cutting device 200 will be described in detail below. First, a polishing pad blank 100 is provided which may be formed by extrusion molding or die casting. The shape of the polishing pad blank 100 shown in Fig. 1 is exemplified by the shape of a square cylinder. However, the invention is not limited thereto. In other embodiments, the shape of the polishing pad blank 100 may also be cylindrical or any other shape.
接著，透過第一滾輪212將研磨墊半成品100沿第二方向D2傳送至循環刀片222以進行切割程序，其中循環刀片222沿第一方向D1移動。在切割過程中，循環刀片222與研磨墊半成品100之間會以各自沿著第一方向D1以及第二方向D2進行相對運動的方式，來切割研磨墊半成品100。其中上述第一方向D1與第二方向D2之間具有夾角θ，且夾角θ是介於60至120度角之間(夾角θ例如是介於75至105度角之間，更例如是90度角)。 Next, the polishing pad blank 100 is transferred to the circulation blade 222 in the second direction D2 through the first roller 212 to perform a cutting process in which the circulation blade 222 moves in the first direction D1. During the cutting process, the polishing pad semi-finished product 100 is cut between the circulation blade 222 and the polishing pad blank 100 in such a manner as to be relatively moved in the first direction D1 and the second direction D2. Wherein the first direction D1 and the second direction D2 have an angle θ, and the angle θ is between 60 and 120 degrees (the angle θ is, for example, between 75 and 105 degrees, more preferably 90 degrees). angle).
因應不同需求的研磨墊製品，切割裝置200可以隨之調整並設定適當的切割程序，切割程序例如包括：(一)去除研磨墊半成品100之一部份，例如為去除研磨墊半成品100上下表面不平整的部份，使切割後的研磨墊半成品具有平整的上下表面，此切割後的研磨墊半成品可作為一研磨層；或(二)將研磨墊半成品100以面呈平行之方式切割為至少二片研磨層，例如為將研磨墊半成品100等分切割為二片研磨層，且此二片研磨層具有對應之切割面，或例如為將研磨墊半成品100切割為二片以上的研磨層(例如為五片、十片、二十片，視原研磨墊半成品100及切割後之研磨層的厚度而定)；或(三)同時包括上述兩種切割程序。 The cutting device 200 can adjust and set an appropriate cutting program according to different requirements of the polishing pad. The cutting program includes, for example, (1) removing one part of the polishing pad semi-finished product 100, for example, removing the upper and lower surfaces of the polishing pad semi-finished product 100. The flat portion enables the cut polishing pad semi-finished product to have a flat upper and lower surface, and the cut polishing pad semi-finished product can be used as an abrasive layer; or (2) the polishing pad semi-finished product 100 is cut into at least two in a parallel manner. The sheet polishing layer is, for example, an aliquot of the polishing pad blank 100 into two polishing layers, and the two polishing layers have corresponding cutting faces, or for example, a polishing pad semi-finished product 100 is cut into two or more polishing layers (for example, It is five, ten, twenty, depending on the thickness of the original polishing pad semi-finished product 100 and the polished layer after cutting); or (c) includes both cutting procedures.
本實施例之切割裝置200可以控制研磨墊半成品100以及循環刀片222以進行相對運動的方式，來切割研磨墊 半成品100。由於循環刀片222並非固定不動，可以減少摩擦所產生的熱量累積，而循環刀片222不會因為熱量累積導致熱變形，因此能使研磨墊具有較均勻的特性。 The cutting device 200 of the embodiment can control the polishing pad semi-finished product 100 and the circulation blade 222 to perform relative movement to cut the polishing pad. Semi-finished product 100. Since the circulation blade 222 is not fixed, the accumulation of heat generated by the friction can be reduced, and the circulation blade 222 does not thermally deform due to heat accumulation, so that the polishing pad can have a more uniform characteristic.
在一實施例中，使用切割裝置200製作研磨墊的製造流程可以選擇性地包括一加熱步驟，將待研磨墊半成品100先加熱至軟化狀態，接著才進行切割程序。切割裝置200可以選擇性地包括一加熱機構(未繪示)配置於第一滾輪212中，加熱機構的加熱媒介例如是電熱方式或是熱流體方式。加熱機構也可以是其他適當的加熱裝置，例如是熱風加熱裝置或是紅外線加熱裝置。加熱機構可選擇配置於切割裝置200的第一滾輪212之前，或是額外獨立於切割裝置200。上述加熱步驟可以使研磨墊半成品100的溫度上升並軟化，以使循環刀片222能夠較為輕易地切割研磨墊半成品100。較佳地是，透過加熱步驟將研磨墊半成品100的溫度加熱至接近其玻璃轉換溫度(glass transition temperature,Tg)，使研磨墊半成品100達到較軟化的狀態，將有助於後續切割程序的進行。 In one embodiment, the manufacturing process for making the polishing pad using the cutting device 200 can optionally include a heating step of heating the semi-finished product 100 to be softened to a softened state before proceeding with the cutting process. The cutting device 200 can optionally include a heating mechanism (not shown) disposed in the first roller 212. The heating medium of the heating mechanism is, for example, an electrothermal method or a thermal fluid method. The heating mechanism can also be other suitable heating means, such as a hot air heating device or an infrared heating device. The heating mechanism can be optionally disposed before the first roller 212 of the cutting device 200 or additionally independent of the cutting device 200. The above heating step can raise and soften the temperature of the polishing pad blank 100 so that the circulation blade 222 can relatively easily cut the polishing pad blank 100. Preferably, the temperature of the polishing pad blank 100 is heated to a temperature close to its glass transition temperature (Tg) through a heating step, so that the polishing pad semi-finished product 100 reaches a softer state, which will facilitate the subsequent cutting process. .
在一實施例中，切割裝置200可包括輸出機構250，輸出機構250配置於循環刀片222之後，輸出機構250例如是輸出平台252，用於承接切割後之研磨墊半成品，並將切割後之研磨墊半成品輸出離開循環刀片222。圖1中之輸出機構250雖以輸出平台252為例說明，但本發明不限於此。在其他實施例中，輸出機構250也可以是以第二滾輪(類似第一滾輪)取代輸出平台252，或者是兩者並 存。 In an embodiment, the cutting device 200 can include an output mechanism 250 disposed behind the circulation blade 222. The output mechanism 250 is, for example, an output platform 252 for receiving the cut polishing pad semi-finished product and grinding the cut surface. The pad semi-finished output exits the circulation blade 222. Although the output mechanism 250 in FIG. 1 is described by taking the output platform 252 as an example, the present invention is not limited thereto. In other embodiments, the output mechanism 250 can also replace the output platform 252 with a second roller (like the first roller), or both. Save.
此外，使用切割裝置200製作研磨墊的製造流程可以選擇性地包括一壓紋步驟，例如為使用表面具有壓紋圖樣的第一滾輪212，將研磨墊半成品100在切割程序之前進行壓紋。經此程序切割所得之研磨層具有一切割面及一壓紋面，此切割面可作為後續製成之研磨墊的研磨面，而壓紋面可作為與背膠的貼合面。由於壓紋面具有第一滾輪212所轉印的壓紋圖樣，使貼合面的表面粗糙度增加，有助於研磨層與背膠的黏著性。 Moreover, the manufacturing process for making the polishing pad using the cutting device 200 can optionally include an embossing step, such as embossing the polishing pad blank 100 prior to the cutting process using a first roller 212 having an embossed pattern on the surface. The polishing layer obtained by the cutting process has a cutting surface and an embossing surface, and the cutting surface can be used as a grinding surface of the subsequently produced polishing pad, and the embossed surface can be used as a bonding surface with the adhesive. Since the embossed surface has the embossed pattern transferred by the first roller 212, the surface roughness of the bonding surface is increased to contribute to the adhesion of the polishing layer to the adhesive.
圖2為本發明實施例之研磨墊的研磨層的切割面示意圖。當研磨墊半成品100被上述切割裝置200切割成片狀研磨墊半成品，再經過裁切成為預定形成之研磨墊尺寸，並且經後續製造程序後，可製得研磨墊的研磨層101，如圖2所示。由於切割裝置200的輸入機構210及可移動刀具220皆會相對運動，且輸入機構210(即第一滾輪212)對研磨墊半成品100中心及周圍施加壓力不同，使得研磨層101的切割面(即經過切割裝置200切割研磨墊半成品100所得之上表面及/或下表面)具有多個線狀不完全平行的刀痕106。 2 is a schematic view showing a cutting surface of an abrasive layer of a polishing pad according to an embodiment of the present invention. When the polishing pad semi-finished product 100 is cut into a sheet-shaped polishing pad semi-finished product by the cutting device 200, and then cut into a predetermined polishing pad size, and after a subsequent manufacturing process, the polishing layer 101 of the polishing pad can be obtained, as shown in FIG. Shown. Since the input mechanism 210 and the movable cutter 220 of the cutting device 200 both move relative to each other, and the input mechanism 210 (ie, the first roller 212) applies different pressure to the center and the periphery of the polishing pad blank 100, the cutting surface of the polishing layer 101 (ie, The upper surface and/or the lower surface obtained by cutting the polishing pad blank 100 through the cutting device 200 has a plurality of linearly incompletely parallel blade marks 106.
具體而言，研磨層101的切割面包括中心區域102A及周圍區域102B，在一實施例中，靠近中心區域102A的刀痕106趨近為直線形，而靠近周圍區域102B之刀痕106則趨近為非直線形。特別是，靠近中心區域102A的刀痕106趨***行於圖1所示的第一方向D1，即循環刀片222 的運動方向，而靠近周圍區域102B之刀痕愈趨近不平行於圖1所示的第一方向D1。在另一實施例中，靠近中心區域102A的刀痕106彼此趨***行，靠近周圍區域102B之刀痕106則彼此趨近不平行。然而，研磨層101切割面的刀痕106不限於上述兩種實施例之態樣。在其他實施例中，藉由控制輸入機構210及可移動刀具220個別的移動速度，或控制輸入機構210對研磨墊半成品100施加壓力的分布，使得研磨層101切割面的線狀不完全平行的刀痕106具有不同的態樣。 Specifically, the cutting surface of the polishing layer 101 includes a central region 102A and a surrounding region 102B. In one embodiment, the blade marks 106 near the central region 102A approach a straight line, and the blade marks 106 near the surrounding region 102B tend to Nearly non-linear. In particular, the knife mark 106 near the central region 102A approaches parallel to the first direction D1 shown in FIG. 1, ie, the circulation blade 222. The direction of motion is closer to the first direction D1 shown in FIG. 1 as the knife mark near the surrounding area 102B approaches. In another embodiment, the knife marks 106 near the central region 102A are nearly parallel to each other, and the knife marks 106 near the surrounding area 102B are not parallel to each other. However, the blade mark 106 of the cut surface of the polishing layer 101 is not limited to the above two embodiments. In other embodiments, by controlling the individual moving speeds of the input mechanism 210 and the movable cutter 220, or controlling the distribution of the pressure applied to the polishing pad blank 100 by the input mechanism 210, the linear shape of the cutting surface of the polishing layer 101 is not completely parallel. The knife marks 106 have different aspects.
此外，圖2中的線狀不完全平行的刀痕106雖以連續形式繪示說明，但本發明不限於此，線狀不完全平行的刀痕106亦可以是不連續形式，例如是經過後續挖槽或開孔程序，使線狀不完全平行的刀痕106成為不連續形式。 In addition, although the linear incompletely parallel blade marks 106 in FIG. 2 are illustrated in a continuous form, the present invention is not limited thereto, and the linearly incompletely parallel blade marks 106 may also be in a discontinuous form, for example, after subsequent The grooving or boring procedure causes the linearly incompletely parallel nicks 106 to become discontinuous.
綜上所述，本發明之切割裝置包括可移動刀具，且可移動刀具會沿預定方向運動。研磨墊半成品會透過輸入機構傳送至切割裝置，其中研磨墊半成品與可移動刀具之間會以進行相對運動的方式來切割研磨墊半成品。由於可移動刀具並非固定不動，可以減少摩擦所產生的熱量累積，而可移動刀具不會因為熱量累積導致熱變形，因此能使研磨層具有較均勻的特性。此外，本發明之研磨墊的研磨層切割面具有線狀不完全平行的刀痕，對於某些特定的研磨製程而言，可解決先前技術中完全平行刀痕所產生的問題。 In summary, the cutting device of the present invention includes a movable cutter, and the movable cutter moves in a predetermined direction. The polishing pad semi-finished product is conveyed to the cutting device through the input mechanism, wherein the polishing pad semi-finished product is cut by the relative movement between the polishing pad semi-finished product and the movable tool. Since the movable tool is not fixed, the accumulation of heat generated by the friction can be reduced, and the movable tool does not thermally deform due to heat accumulation, so that the abrasive layer can have a more uniform characteristic. In addition, the abrasive layer of the polishing pad of the present invention cuts the linearly incompletely parallel tool marks, and for certain polishing processes, solves the problems associated with fully parallel tool marks in the prior art.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art does not deviate. In the spirit and scope of the present invention, the scope of protection of the present invention is defined by the scope of the appended claims.
100‧‧‧研磨墊半成品 100‧‧‧ polishing pad semi-finished products
101‧‧‧研磨層 101‧‧‧Abrasive layer
102A‧‧‧中心區域 102A‧‧‧Central area
102B‧‧‧周圍區域 102B‧‧‧ Surrounding area
106‧‧‧刀痕 106‧‧‧Knife marks
200‧‧‧切割裝置 200‧‧‧ cutting device
210‧‧‧輸入機構 210‧‧‧ Input institutions
212‧‧‧第一滾輪 212‧‧‧First wheel
220‧‧‧可移動刀具 220‧‧‧ movable tool
222‧‧‧循環刀片 222‧‧‧Circular blade
224‧‧‧轉軸 224‧‧‧ shaft
226‧‧‧轉動方向 226‧‧‧Rotation direction
240‧‧‧磨利機構 240‧‧‧Marrying institutions
250‧‧‧輸出機構 250‧‧‧Output agency
252‧‧‧輸出平台 252‧‧‧Output platform
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
θ‧‧‧夾角 Θ‧‧‧ angle
圖1為本發明實施例之切割裝置的結構示意圖。 FIG. 1 is a schematic structural view of a cutting device according to an embodiment of the present invention.
圖2為本發明實施例之研磨墊的研磨層的切割面示意圖。 2 is a schematic view showing a cutting surface of an abrasive layer of a polishing pad according to an embodiment of the present invention.
100‧‧‧研磨墊半成品 100‧‧‧ polishing pad semi-finished products
200‧‧‧切割裝置 200‧‧‧ cutting device
210‧‧‧輸入機構 210‧‧‧ Input institutions
212‧‧‧第一滾輪 212‧‧‧First wheel
220‧‧‧可移動刀具 220‧‧‧ movable tool
222‧‧‧循環刀片 222‧‧‧Circular blade
224‧‧‧轉軸 224‧‧‧ shaft
226‧‧‧轉動方向 226‧‧‧Rotation direction
240‧‧‧磨利機構 240‧‧‧Marrying institutions
250‧‧‧輸出機構 250‧‧‧Output agency
252‧‧‧輸出平台 252‧‧‧Output platform
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
θ‧‧‧夾角 Θ‧‧‧ angle
Claims (33)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101136244A TWI562856B (en) | 2012-10-01 | 2012-10-01 | Cutting apparatus, manufacturing method of polishing pad and polishing pad |
| CN201210571872.4A CN103707210B (en) | 2012-10-01 | 2012-12-25 | Dicing device, method for manufacturing polishing pad, and polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101136244A TWI562856B (en) | 2012-10-01 | 2012-10-01 | Cutting apparatus, manufacturing method of polishing pad and polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201414573A true TW201414573A (en) | 2014-04-16 |
| TWI562856B TWI562856B (en) | 2016-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101136244A TWI562856B (en) | 2012-10-01 | 2012-10-01 | Cutting apparatus, manufacturing method of polishing pad and polishing pad |
Country Status (2)
| Country | Link |
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| CN (1) | CN103707210B (en) |
| TW (1) | TWI562856B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526063A (en) * | 2014-11-28 | 2015-04-22 | 芜湖银星汽车零部件有限公司 | Circulating type cutting machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099954A (en) * | 1995-04-24 | 2000-08-08 | Rodel Holdings, Inc. | Polishing material and method of polishing a surface |
| JP2002086388A (en) * | 2000-09-08 | 2002-03-26 | Ichikin Kogyosha:Kk | Cutter apparatus for sheet material |
| US7374474B2 (en) * | 2001-10-09 | 2008-05-20 | Hitachi Chemical Co., Ltd. | Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP |
| JP2005019669A (en) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | Polishing pad, polishing device and method for polishing wafer |
| CN201736264U (en) * | 2010-06-30 | 2011-02-09 | 华中科技大学 | Device for cutting prepreg |
| CN102431053A (en) * | 2011-10-18 | 2012-05-02 | 山东惠发食品有限公司 | Automatic dicing production line |
-
2012
- 2012-10-01 TW TW101136244A patent/TWI562856B/en active
- 2012-12-25 CN CN201210571872.4A patent/CN103707210B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526063A (en) * | 2014-11-28 | 2015-04-22 | 芜湖银星汽车零部件有限公司 | Circulating type cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103707210A (en) | 2014-04-09 |
| TWI562856B (en) | 2016-12-21 |
| CN103707210B (en) | 2016-12-28 |
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