TW201411136A - 異方導電性部件 - Google Patents

異方導電性部件 Download PDF

Info

Publication number
TW201411136A
TW201411136A TW102128936A TW102128936A TW201411136A TW 201411136 A TW201411136 A TW 201411136A TW 102128936 A TW102128936 A TW 102128936A TW 102128936 A TW102128936 A TW 102128936A TW 201411136 A TW201411136 A TW 201411136A
Authority
TW
Taiwan
Prior art keywords
elastic socket
movable member
hole
electrode
elastic
Prior art date
Application number
TW102128936A
Other languages
English (en)
Chinese (zh)
Inventor
Masafumi Okuma
Original Assignee
Clover Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clover Technology Co Ltd filed Critical Clover Technology Co Ltd
Publication of TW201411136A publication Critical patent/TW201411136A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
TW102128936A 2012-08-24 2013-08-13 異方導電性部件 TW201411136A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012184831 2012-08-24
JP2012193687A JP5156973B1 (ja) 2012-08-24 2012-09-04 異方導電性部材

Publications (1)

Publication Number Publication Date
TW201411136A true TW201411136A (zh) 2014-03-16

Family

ID=48013533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102128936A TW201411136A (zh) 2012-08-24 2013-08-13 異方導電性部件

Country Status (3)

Country Link
JP (1) JP5156973B1 (ja)
TW (1) TW201411136A (ja)
WO (1) WO2014030536A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI749564B (zh) * 2020-05-25 2021-12-11 奇翼醫電股份有限公司 導電凸點電極結構

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY174175A (en) * 2013-07-11 2020-03-12 Johnstech Int Corporation Testing apparatus and method for microcircuit and wafer level ic testing
US10067164B2 (en) 2015-08-24 2018-09-04 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
JP6515003B2 (ja) * 2015-09-24 2019-05-15 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
CN107102181B (zh) 2017-07-07 2019-10-15 京东方科技集团股份有限公司 测试探针、测试装置及测试方法
WO2019078271A1 (ja) * 2017-10-19 2019-04-25 株式会社エンプラス 電気部品用ソケット
KR102095353B1 (ko) * 2019-11-27 2020-03-31 주식회사 오킨스전자 테스트 러버 소켓용 탄성 보조 부재 및 이를 구비한 테스트 러버 소켓과, 그 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05182729A (ja) * 1991-12-26 1993-07-23 Yamaichi Electron Co Ltd 電気部品用接触子
JP3708623B2 (ja) * 1996-03-30 2005-10-19 株式会社エンプラス 電気的接続装置
JP2003167001A (ja) * 2001-11-29 2003-06-13 Yamaichi Electronics Co Ltd 電子部品用ソケットのコンタクトプローブ及びこれを用いた電子部品用ソケット
JP2010060316A (ja) * 2008-09-01 2010-03-18 Masashi Okuma 異方性導電部材および異方導電性を有する測定用基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI749564B (zh) * 2020-05-25 2021-12-11 奇翼醫電股份有限公司 導電凸點電極結構

Also Published As

Publication number Publication date
JP5156973B1 (ja) 2013-03-06
WO2014030536A1 (ja) 2014-02-27
JP2014059147A (ja) 2014-04-03

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