TW201346230A - Light-emitting property measuring apparatus and light-emitting property measuring method - Google Patents
Light-emitting property measuring apparatus and light-emitting property measuring method Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
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- G—PHYSICS
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- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/08—Arrangements of light sources specially adapted for photometry standard sources, also using luminescent or radioactive material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
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- G01J3/0254—Spectrometers, other than colorimeters, making use of an integrating sphere
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- G—PHYSICS
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- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/08—Arrangements of light sources specially adapted for photometry standard sources, also using luminescent or radioactive material
- G01J2001/083—Testing response of detector
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
- G01J2001/4446—Type of detector
- G01J2001/446—Photodiode
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Abstract
Description
本發明係有關於量測發光元件之發光特性的發光特性量測裝置及方法。 The present invention relates to a light-emitting characteristic measuring device and method for measuring the light-emitting characteristics of a light-emitting element.
以下將引用揭示專利、專利申請案、專利公報、科學文獻等，其係為了更加充份說明本發明之先前技術，而在此援用該等之內容。 The disclosure of patents, patent applications, patent publications, scientific publications, etc
由於發光二極體(LED：Light Emitting Diode)或雷射二極體(LD：Laser Diode)等發光元件，具有壽命長、發光效率高、耗電量少、體積小等優點，因此近年廣泛用於各種領域。例如，由於發光二極體具有耗電量少的優點，因此大幅增加了許多機會，作為取代白熾燈泡的照明裝置使用。又，作為小型之同調(coherent)光源，雷射二極體廣泛應用於各種機器，如：光碟機之拾波器(pick up)、影印機或雷射印表機等。 Light-emitting elements such as LEDs (Light Emitting Diodes) or Laser Diodes (LDs) have advantages such as long life, high luminous efficiency, low power consumption, and small size. In various fields. For example, since the light-emitting diode has the advantage of low power consumption, many opportunities are greatly increased, and it is used as a lighting device that replaces an incandescent light bulb. Moreover, as a small coherent light source, laser diodes are widely used in various types of machines, such as pickups for disc drives, photocopiers, or laser printers.
如一般所知，該等光源元件，係經由包含：用以在半導體基板上形成pn接面之成膜製程、將形成了pn接面之半導體基板加工成晶片狀的加工製程等一連串之製程而製造，之後在最終檢查製程，量測發光特性。在此，所謂的發光元件之發光特性，係例如：由發光元件所射出之光線的光量，或是波長特性、光譜等的特性。在以下的專利文獻1、2，揭露了量測發光元件的發光特性的既有量測方法。 As is generally known, the light source elements are passed through a series of processes including a film forming process for forming a pn junction on a semiconductor substrate, and a process for processing a semiconductor substrate on which a pn junction is formed into a wafer. Manufacture, and then in the final inspection process, measure the luminescence characteristics. Here, the light-emitting characteristics of the light-emitting element are, for example, the amount of light emitted by the light-emitting element, or the characteristics of wavelength characteristics, spectrum, and the like. In the following Patent Documents 1 and 2, a conventional measurement method for measuring the light-emitting characteristics of the light-emitting element is disclosed.
具體而言，於日本專利特開2008-076126號公報，揭示了一種方法，係於積分球內部配置發光元件而使發光元件發光，藉此量測發光元件所射出之光線的光量。日本特開2011-226869號公報，則揭示了一種方法，係將發光元件配置於反射筒部內以反射發光元件所射出的光，同時在以擴散板擴散反射筒部所發出的光以後，以光接收元件接收光，藉此以檢查發光元件的發光量。 In particular, Japanese Laid-Open Patent Publication No. 2008-076126 discloses a method of measuring the amount of light emitted by a light-emitting element by arranging a light-emitting element inside the integrating sphere and causing the light-emitting element to emit light. Japanese Laid-Open Patent Publication No. 2011-226869 discloses a method in which a light-emitting element is disposed in a reflective cylindrical portion to reflect light emitted from the light-emitting element, and at the same time, after diffusing the light emitted from the cylindrical portion by the diffusion plate, the light is emitted. The receiving element receives light, thereby checking the amount of light emitted by the light emitting element.
然而，近年來，如前文所述，由於對發光二極體或雷射二極體等發光元件的需求急速增加，因此希望能有效率地進行發光元件之最終檢查。又，由於最終檢查所需時間若拉長，則會導致發光元件的成本隨之增加，因此從降低成本的觀點來看，也冀望能有效率地進行發光元件的最終檢查。 However, in recent years, as described above, since the demand for a light-emitting element such as a light-emitting diode or a laser diode is rapidly increasing, it is desirable to perform the final inspection of the light-emitting element efficiently. Further, since the time required for the final inspection is lengthened, the cost of the light-emitting element increases, so that the final inspection of the light-emitting element can be efficiently performed from the viewpoint of cost reduction.
上述日本特開2008-076126號公報及日本特開2011-226869號公報所揭露之量測方法，基本上係一個個地分別量測積分球或反射筒部內部所配置之發光元件的發光特性。因此，若要使用此等量測方法以量測複數之發光元件的發光特性，則需要重覆進行以下動作：把1個發光元件配置於積分球等的內部，並在量測過發光特性後，再將結束量測的發光元件從積分球等取出，同時還要將下一個進行量測的新的發光元件配置於積分球等的內部；因此量測上很費時。就此，即便能夠縮短量測時間，倘若量測精度降低，則檢查也就失去意義，因此有必要在維持量測精度之同時，縮短量測時間。 The measuring method disclosed in Japanese Laid-Open Patent Publication No. 2008-076126 and JP-A-2011-226869 basically measures the light-emitting characteristics of the light-emitting elements disposed inside the integrating sphere or the reflecting cylinder portion one by one. Therefore, in order to measure the light-emitting characteristics of a plurality of light-emitting elements by using the above-described measurement methods, it is necessary to repeat the operation of disposing one light-emitting element inside an integrating sphere or the like and measuring the light-emitting characteristics. Then, the light-emitting element whose measurement is finished is taken out from the integrating sphere or the like, and the next new light-emitting element to be measured is placed inside the integrating sphere or the like; therefore, the measurement is time consuming. In this regard, even if the measurement time can be shortened, if the measurement accuracy is lowered, the inspection loses its meaning, so it is necessary to shorten the measurement time while maintaining the measurement accuracy.
本發明之一實施形態之發光特性量測裝置，係在於量測發光元件之發光特性的發光特性量測裝置，具有：光學積分器，其具有一入射口，並接收由該入射口對該複數之發光元件所輸出之光線，而將所接收之該光線均質化，前述入射口可以接受來自排列著的複數之發光元件所輸出之該光線；光接收裝置，接收該光學積分器所均質化之該光線；以及控制處理裝置，使該複數之發光元件擇一地依序發光，同時依照該發光元件相對於該光學積分器之該入射口的位置，而修正依序得自該光接收裝置之光接收結果。 An illuminating characteristic measuring apparatus according to an embodiment of the present invention is an illuminating characteristic measuring apparatus for measuring an illuminating characteristic of a luminescent element, comprising: an optical integrator having an entrance port and receiving the plurality of incident ports The light outputted by the light-emitting element homogenizes the received light, the entrance port can receive the light output from the plurality of arranged light-emitting elements, and the light receiving device receives the homogenization of the optical integrator And the control processing device is configured to sequentially illuminate the plurality of illuminating elements sequentially, and according to the position of the illuminating element relative to the incident port of the optical integrator, the correction is sequentially obtained from the light receiving device. Light reception result.
前述發光特性量測裝置，亦可更具有：平台裝置，該平台裝置可使該複數之發光元件沿著排列方向移動。該控制處理裝置，亦可控制該平台裝置，以該光學積分器之該入射口可導入光線之數量的發光元件為單位，使該複數之發光元件沿著該排列方向移動。 The illuminating characteristic measuring device may further include: a platform device that moves the plurality of illuminating elements in the arranging direction. The control processing device may also control the platform device to move the plurality of light-emitting elements in the arrangement direction by the number of light-emitting elements that can be introduced into the entrance of the optical integrator.
該控制處理裝置，亦可修正依序得自該光接收元件之光接收結果，以使其相同於：在配置於該光學積分器之該入射口之中心位置的該發光元件發光的情況，得自該光接收裝置的光接收結果。 The control processing device may correct the light receiving result sequentially obtained from the light receiving element so as to be identical to the case where the light emitting element disposed at the center of the entrance port of the optical integrator emits light. The result of light reception from the light receiving device.
該光接收裝置，亦可具有：分光器，將該光學積分器所均質化之該光線加以分光，光接收器，接收該分光器所分光之該光線。 The light receiving device may further include: a beam splitter that splits the light homogenized by the optical integrator, and the light receiver receives the light split by the splitter.
該控制處理裝置，亦可使用預先求得之高維修正函數或修正表，以修正依序得自該光接收元件的光接收結果。 The control processing means may also use a high maintenance positive function or correction table obtained in advance to correct the light reception result sequentially obtained from the light receiving element.
本發明之一實施形態之發光特性量測方法，其在於量測發光元件之發光特性之發光特性量測方法，具有：配置步驟，配置複數之發光元件，以使所射出的光線入射至光學積分器所具有之入射口，該入射口可以接受來自排列著的該複數之發光元件所輸出之光線；以及修正步驟，使該複數之發光元件擇一地依序發光，同時依照該發光元件相對於該光學積分器之該入射口的位置，而修正依序接收該光學積分器所均質化之光線所得之光接收結果。 An illuminating characteristic measuring method according to an embodiment of the present invention, characterized in that the illuminating characteristic measuring method for measuring the illuminating characteristics of the illuminating element has a arranging step of arranging a plurality of illuminating elements so that the emitted ray is incident on the optical integral The entrance port of the device, the entrance port can receive the light output from the plurality of arranged light-emitting elements; and the correcting step is to sequentially illuminate the plurality of light-emitting elements in an orderly manner, according to the light-emitting element The position of the entrance port of the optical integrator corrects the light receiving result obtained by sequentially receiving the light homogenized by the optical integrator.
前述發光特性量測方法，亦可更具有移動步驟，對於使該複數之發光元件可以沿著排列方向移動的平台裝置加以控制，以該光學積分器之入射口可以導入光線之數量的發光元件為單位，使該複數之發光元件沿著該排列方向移動。 The illuminating characteristic measuring method may further have a moving step for controlling the platform device for moving the plurality of illuminating elements in the arranging direction, and the illuminating elements of the number of rays that can be introduced into the entrance of the optical integrator are The unit moves the plurality of light-emitting elements in the arrangement direction.
前述發光特性量測方法，亦可更具有另一修正步驟，當配置於該光學積分器之入射口的中心位置之該發光元件發光時，將依序得自該光接收元件之光接收結果加以修正，以使其與該光學積分器所均質化的光線相同。 The illuminating characteristic measuring method may further have another correcting step. When the illuminating element disposed at the center of the entrance port of the optical integrator emits light, the light receiving result obtained from the light receiving element is sequentially obtained. Corrected so that it is the same as the light homogenized by the optical integrator.
前述發光特性量測方法，亦可更具有又一修正步驟，使用預先求得之高維修正函數或修正表，以修正依序得自該光接收元件的光接收結果。 The illuminating characteristic measuring method may further have a further correcting step of using a high maintenance positive function or a correction table obtained in advance to correct the light receiving result sequentially obtained from the light receiving element.
1‧‧‧發光特性量測裝置 1‧‧‧Lighting characteristics measuring device
11‧‧‧平台裝置 11‧‧‧ platform device
11a‧‧‧平台 11a‧‧‧ platform
12‧‧‧電源裝置 12‧‧‧Power supply unit
13‧‧‧電源接點部 13‧‧‧Power Contact Department
13a‧‧‧支撐板 13a‧‧‧Support board
14‧‧‧積分球 14‧‧·Score
14a‧‧‧入射口 14a‧‧‧Inlet port
14b‧‧‧本體部 14b‧‧‧ Body Department
14c‧‧‧射出口 14c‧‧‧shots
15‧‧‧光接收裝置 15‧‧‧Light receiving device
15a‧‧‧分光器 15a‧‧ ‧ splitter
15b‧‧‧光接收器 15b‧‧‧Light Receiver
16‧‧‧控制處理裝置 16‧‧‧Control processing device
C1‧‧‧控制信號 C1‧‧‧ control signal
C2‧‧‧控制訊號 C2‧‧‧ control signal
D1‧‧‧移動方向 D1‧‧‧ moving direction
D2‧‧‧昇降方向 D2‧‧‧ Lifting direction
F‧‧‧光纖 F‧‧‧Fiber
L‧‧‧發光元件 L‧‧‧Lighting elements
OP‧‧‧開口部 OP‧‧‧ openings
P‧‧‧接腳 P‧‧‧ pin
Q1‧‧‧檢測結果 Q1‧‧‧ test results
R1‧‧‧光接收訊號 R1‧‧‧Light receiving signal
S11~S17‧‧‧步驟 S11~S17‧‧‧Steps
第1圖係顯示本發明一實施形態之發光特性量測裝置的主要部位結構的圖。 Fig. 1 is a view showing the configuration of a main part of a light-emitting characteristic measuring apparatus according to an embodiment of the present invention.
第2A圖及第2B圖係示意顯示本發明一實施形態之發光特性量測裝置所具備的電源接點部的立體圖。 2A and 2B are perspective views showing a power supply contact portion of the light-emitting characteristic measuring device according to the embodiment of the present invention.
第3A圖、第3B圖及第3C圖，係顯示本發明一實施形態之發光特性量測裝置所具備的積分球之外觀的圖。 3A, 3B, and 3C are views showing the appearance of an integrating sphere provided in the light-emitting characteristic measuring device according to the embodiment of the present invention.
第4圖係顯示本發明一實施形態之發光特性量測方法的流程圖。 Fig. 4 is a flow chart showing a method of measuring a light-emitting characteristic according to an embodiment of the present invention.
第5A圖及第5B圖係顯示本發明一實施形態之發光特性量測裝置於量測時，發光元件與接腳之接觸狀態的圖。 5A and 5B are views showing a state in which the light-emitting element and the pin are in contact with each other when the light-emitting characteristic measuring device according to the embodiment of the present invention is measured.
第6A圖及第6B圖係顯示本發明一實施形態之發光特性量測裝置的量測結果之一例的圖。 6A and 6B are views showing an example of measurement results of the light-emitting characteristic measuring device according to the embodiment of the present invention.
第7圖係顯示本發明一實施形態之發光特性量測裝置之量測時間之一例的圖。 Fig. 7 is a view showing an example of the measurement time of the light-emitting characteristic measuring device according to the embodiment of the present invention.
以下參考圖式，說明本發明之實施形態。本發明之實施形態的以下說明，僅係用以具體說明隨附之申請專利範圍所界定之發明及其均等物，其目的並不在於對申請專利範圍所指定之發明及其均等物加以限定，本技術領域具有通常知識者，應能藉此內容明瞭此事。 Embodiments of the present invention will be described below with reference to the drawings. The following description of the embodiments of the present invention is intended to be construed as the description of the claims Those skilled in the art will be able to clarify this matter.
第1圖係顯示本發明一實施形態之發光特性量測裝置的主要部位結構的圖。如第1圖所示，本實施形態之發光特性量測裝置1具有：平台(stage)裝置11、電源裝置12、電源接點部13、積分球14、光接收裝置15、及控制處理裝置16。平台裝置11具備平台11a。平台11a上載置有複數之發光元件L。發 光特性量測裝置1，量測平台11a上所排列的複數之發光元件L的發光特性。積分球14是光學積分器之一種形態。 Fig. 1 is a view showing the configuration of a main part of a light-emitting characteristic measuring apparatus according to an embodiment of the present invention. As shown in Fig. 1, the light-emitting characteristic measuring device 1 of the present embodiment includes a stage device 11, a power supply device 12, a power supply contact portion 13, an integrating sphere 14, a light receiving device 15, and a control processing device 16. . The platform device 11 is provided with a platform 11a. A plurality of light-emitting elements L are placed on the stage 11a. hair The optical characteristic measuring device 1 measures the light-emitting characteristics of the plurality of light-emitting elements L arranged on the stage 11a. The integrating sphere 14 is a form of an optical integrator.
在此，作為量測對象之發光元件L，係發光二極體(LED)或雷射二極體(LD)等。發光元件L，係以光線的射出面朝向平台11a上方的狀態而排列於平台11a上。又，於本實施形態，為使說明簡明，因此將發光元件L設定為：於平台11a上，沿著平台11a之移動方向D1，隔開固定間隔而直線狀排列(一維排列)。又，上述發光元件L之發光特性，係意指例如發光元件L所射出之光線之光量或波長特性(光譜)等特性。 Here, the light-emitting element L to be measured is a light-emitting diode (LED), a laser diode (LD), or the like. The light-emitting element L is arranged on the stage 11a in a state in which the light-emitting surface faces upward of the stage 11a. Further, in the present embodiment, in order to simplify the description, the light-emitting elements L are arranged linearly (one-dimensionally arranged) on the stage 11a along the moving direction D1 of the stage 11a at regular intervals. Further, the light-emitting characteristics of the light-emitting element L mean, for example, characteristics such as the amount of light or the wavelength characteristic (spectrum) of the light emitted from the light-emitting element L.
平台裝置11具備平台11a，該平台11a構成為可於移動方向D1及昇降方向D2移動。平台裝置11係根據由控制處理裝置16所輸出之控制信號C1，而使平台11a沿著移動方向D1或昇降方向D2移動。平台裝置11具備檢測平台11a在移動方向D1及昇降方向D2上之位置的編碼器(省略圖示)，並將其檢測結果Q1輸出至控制處理裝置16。 The platform device 11 is provided with a stage 11a that is configured to be movable in the moving direction D1 and the lifting direction D2. The platform unit 11 moves the stage 11a in the moving direction D1 or the lifting direction D2 based on the control signal C1 outputted by the control processing unit 16. The platform device 11 includes an encoder (not shown) that detects the position of the platform 11a in the moving direction D1 and the lifting direction D2, and outputs the detection result Q1 to the control processing device 16.
電源裝置12根據控制處理裝置16所輸出之控制訊號C2，而將用以使平台11a上所載置之發光元件L發光的電流或電壓(以下僅稱為電流)供給至電源接點部13。具體而言，電源裝置12具備可以個別供應電流之複數之輸出端子(通道)，根據來自控制處理裝置16的控制訊號C2而依次切換供應電流之通道，藉此而對電源接點部13供應電流，以擇一地使發光元件L依序發光。 The power supply device 12 supplies a current or a voltage (hereinafter simply referred to as a current) for causing the light-emitting element L mounted on the stage 11a to emit light to the power supply contact portion 13 based on the control signal C2 output from the control processing device 16. Specifically, the power supply device 12 includes a plurality of output terminals (channels) that can supply a plurality of currents individually, and sequentially switches a supply current channel based on the control signal C2 from the control processing device 16, thereby supplying current to the power supply contact portion 13. Alternatively, the light-emitting elements L are sequentially illuminated.
電源接點部13配置於平台裝置11上方，將來自電源裝置12的電流供應至載置於平台11a上的發光元件L。第2A圖及第2B圖係示意顯示本發明一實施形態之發光特性量測裝置所具備的電源接點部的立體圖。第2A圖係電源接點部13之頂面立體圖，第2B圖係電源接點部13之背面立體圖。如第2圖及第2B圖所示，電源接點部13具備：支撐板13a、以及設於支撐板13a背面的複數對(於第1圖、第2A圖及第2B圖所示之例為5對)接腳P；該電源接點部13配置於：在平台11a上昇時接腳P可接觸到平台11a上的發光元件L之位置。 The power contact portion 13 is disposed above the platform device 11, and supplies current from the power supply device 12 to the light-emitting element L placed on the stage 11a. 2A and 2B are perspective views showing a power supply contact portion of the light-emitting characteristic measuring device according to the embodiment of the present invention. Fig. 2A is a top perspective view of the power contact portion 13, and Fig. 2B is a rear perspective view of the power contact portion 13. As shown in FIGS. 2 and 2B, the power supply contact portion 13 includes a support plate 13a and a plurality of pairs provided on the back surface of the support plate 13a (examples shown in FIGS. 1 , 2A, and 2B are 5 pairs) Pins P; The power contact portion 13 is disposed at a position where the pin P can contact the light-emitting element L on the stage 11a when the stage 11a rises.
支撐板13a係將設置於背面之接腳P的根部加以支撐的平板構件，其中央部形成有矩形形狀的開口部OP，該開口部OP係用以使發光元件L所射出之光線穿透。又，此開口部OP之形狀及大小形成為與積分球14之入射口14a的形狀及大小幾乎相同，支撐板13a則係以該開口部OP的長邊沿著平台11a之移動方向D1的方式配置。接腳P則係例如鋁(A1)或銅(Cu)等金屬所形成之針狀構件，藉由與發光元件L接觸，而將來自電源裝置12的電流供應至發光元件L。 The support plate 13a is a flat plate member that supports the root portion of the pin P provided on the back surface, and has a rectangular opening portion OP formed in the center portion thereof for penetrating the light emitted from the light-emitting element L. Further, the shape and size of the opening OP are formed to be almost the same as the shape and size of the entrance port 14a of the integrating sphere 14, and the support plate 13a is disposed such that the long side of the opening OP is along the moving direction D1 of the stage 11a. . The pin P is a needle-shaped member formed of a metal such as aluminum (A1) or copper (Cu), and a current from the power supply device 12 is supplied to the light-emitting element L by being in contact with the light-emitting element L.
具體而言，接腳P係於支撐板13a之背面側，以成對之接腳的前端部靠近彼此的方式，而沿著開口部OP之長邊，設置有複數對。又，雖然於第1圖、第2A圖及第2B圖中圖示為5對接腳P，但接腳P之數量可為任意(例如數十對左右)。藉由於平台11a上昇時，成對之接腳P的前端部分別接觸形成於發光元件L的一對電極墊(省略圖示)，而成為可以將來自電源裝置12之電流供應至發光元件L的狀態。 Specifically, the pin P is attached to the back side of the support plate 13a, and the front ends of the paired pins are close to each other, and a plurality of pairs are provided along the long sides of the opening OP. Further, although the pair of pins P are illustrated in FIGS. 1 , 2A, and 2B, the number of the pins P may be arbitrary (for example, tens of pairs or so). When the stage 11a rises, the front end portions of the pair of pins P respectively contact the pair of electrode pads (not shown) formed on the light-emitting element L, so that the current from the power supply device 12 can be supplied to the light-emitting element L. status.
積分球14係使入射之光在空間上積分並均質化者，以相對於電源接點部13而定位的狀態，配置於電源接點部13之上方。第3A圖、第3B圖及第3C圖，係顯示本發明一實施形態之發光特性量測裝置所具備的積分球之外觀的圖。第3A圖係正面圖，第3B圖係右側視圖，第3C圖係底面圖。如第3A圖、第3B圖及第3C圖所示，積分球14係由以下各部份所構成：光線所入射之入射口14a、使從入射口14a所入射之光在空間上積分並均質化之本體部14b、以及將本體部14b所均質化之光射出之射出口14c。 The integrating sphere 14 is configured such that the incident light is spatially integrated and homogenized, and is placed above the power supply contact portion 13 in a state of being positioned with respect to the power supply contact portion 13. 3A, 3B, and 3C are views showing the appearance of an integrating sphere provided in the light-emitting characteristic measuring device according to the embodiment of the present invention. Fig. 3A is a front view, Fig. 3B is a right side view, and Fig. 3C is a bottom view. As shown in FIGS. 3A, 3B, and 3C, the integrating sphere 14 is composed of the following portions: the incident opening 14a into which the light is incident, spatially integrating and homogenizing the light incident from the incident opening 14a. The main body portion 14b and the ejection opening 14c from which the light homogenized by the main body portion 14b is emitted.
入射口14a係一開口，於仰視觀察下係矩形形狀，其所具備之大小，得以將平台11a上的複數之發光元件L所發出的光線導入至本體部14b；藉由將四角環形狀之構件形成為由本體部14b之底部往下方突出之狀態，而使入射口14a實體化。又，於本實施形態為使說明簡明，入射口14a的大小設定為：可將與設於電源接點部13部之接腳P的對數同數之5個發光元件L所發出的光線導入本體部14b之大小。 The entrance port 14a is an opening and has a rectangular shape in a bottom view, and is sized to introduce light emitted by the plurality of light-emitting elements L on the platform 11a to the body portion 14b; by means of a four-corner ring-shaped member The entrance port 14a is formed in a state of being protruded downward from the bottom of the main body portion 14b. Further, in the present embodiment, in order to simplify the description, the size of the entrance port 14a is set so that the light emitted from the five light-emitting elements L of the same number as the number of pairs of the pins P provided in the power supply contact portion 13 can be introduced into the body. The size of the portion 14b.
本體部14b係球形構件，其所具備之內壁，係以對於發光元件L所射出的光具有很高的反射率、同時擴散性優異之材料所形成；將來自入射口14a所入射之光線反覆地以內壁擴散及反射，而於空間上積分並均質化。射出口14c設於本體部14b之背面側，將本體部14b均質化之光線往外部射出。於此射出口14c可安裝光纖F(請參考第1圖)，該光纖F係用以將在本體部14b所均質化的光導引至外部。 The main body portion 14b is a spherical member, and the inner wall of the main body portion 14b is formed of a material having high reflectance and high diffusibility for light emitted from the light-emitting element L; and the light incident from the entrance port 14a is repeated. The ground diffuses and reflects on the inner wall, and is spatially integrated and homogenized. The ejection opening 14c is provided on the back side of the main body portion 14b, and the light that is homogenized by the main body portion 14b is emitted to the outside. The optical fiber F (see FIG. 1) for guiding the light homogenized in the main body portion 14b to the outside can be attached to the ejection opening 14c.
此積分球14相對於電源接點部13而定位，以使入射口14a配置在形成於電源接點部13之支撐板13a的開口部OP上方。又，於第1圖所示之例中，圖示著積分球14與電源接點部13分離配置之狀態，但亦可以係以積分球14之入射口14a不接觸電源接點部13之接腳P的方式，而插設至形成於電源接點部13之支撐板13a的開口部OP。 The integrating sphere 14 is positioned with respect to the power supply contact portion 13 such that the entrance port 14a is disposed above the opening portion OP formed in the support plate 13a of the power supply contact portion 13. Further, in the example shown in Fig. 1, the integrating sphere 14 and the power supply contact portion 13 are shown separated from each other. However, the inlet port 14a of the integrating sphere 14 may not be in contact with the power contact portion 13. The foot P is inserted into the opening OP formed in the support plate 13a of the power contact portion 13.
於下文中，舉出積分球14之具體大小之一例。積分球14之入射口14為：短邊長度約10mm、長邊長度約20mm之大小。又，積分球14之本體部14b為直徑約50mm之大小。於使用此種大小之積分球14的情形，假設發光元件L之大小為0.5mm平方左右之大小，則積分球14之入射口14可以對本體部14b導入30~40個左右之發光元件L所發出的光。 Hereinafter, an example of the specific size of the integrating sphere 14 will be cited. The entrance port 14 of the integrating sphere 14 is such that the length of the short side is about 10 mm and the length of the long side is about 20 mm. Further, the body portion 14b of the integrating sphere 14 has a diameter of about 50 mm. In the case of using the integrating sphere 14 of such a size, assuming that the size of the light-emitting element L is about 0.5 mm square, the entrance port 14 of the integrating sphere 14 can introduce about 30 to 40 light-emitting elements L to the main body portion 14b. The light emitted.
光接收裝置15透過光纖F而連接於積分球14的射出口14c，接收積分球14所均質化的光線並輸出光接收訊號R1(光接收結果)。具體而言，光接收裝置15具備分光器15a及光接收器15b，以分光器15a將積分球14所均質化的光線加以分光，以光接收器15b接收分光後的光線，藉此以輸出上述光接收訊號R1。又，分光器15a所分光之波長或開始分光的時間點，係由控制處理裝置16所控制。再者，可以使用光電二極體(PD：PhotoDiode)等光接收元件作為光接收器15b。 The light receiving device 15 is connected to the injection port 14c of the integrating sphere 14 via the optical fiber F, receives the light homogenized by the integrating sphere 14, and outputs the light receiving signal R1 (light receiving result). Specifically, the light receiving device 15 includes a spectroscope 15a and a light receiver 15b, and splits the light homogenized by the integrating sphere 14 by the spectroscope 15a, and receives the split light by the optical receiver 15b, thereby outputting the above-mentioned light. The light receives the signal R1. Further, the wavelength of the light split by the spectroscope 15a or the time point at which the splitting is started is controlled by the control processing means 16. Further, a light receiving element such as a photodiode (PD: PhotoDiode) can be used as the light receiver 15b.
控制處理裝置16輸出控制訊號C1、C2而控制平台裝置11及電源裝置12，同時根據光接收裝置15所輸出的光接收訊號R1以量測發光元件L的發光 特性。具體而言，控制處理裝置16輸出控制訊號C1以控制平台裝置11，以可由積分球14之入射口14a進行光線導入之數量的發光元件L(在此係5個發光元件L)為單位，使平台11a上的發光元件L沿著移動方向D1移動。又，輸出控制訊號C1以控制平台裝置11，使平台11a昇降。 The control processing device 16 outputs the control signals C1 and C2 to control the platform device 11 and the power supply device 12, and simultaneously measures the light emission of the light-emitting element L according to the light receiving signal R1 outputted by the light receiving device 15. characteristic. Specifically, the control processing device 16 outputs a control signal C1 to control the platform device 11 so that the number of light-emitting elements L (here, five light-emitting elements L) that can be introduced by the entrance port 14a of the integrating sphere 14 is used as a unit. The light emitting element L on the stage 11a moves in the moving direction D1. Further, the control signal C1 is output to control the platform device 11 to raise and lower the platform 11a.
又，控制處理裝置16對電源裝置12輸出控制訊號C2，使排列在平台11a上的發光元件L中有接觸電源接點部13之接腳P的發光元件L，擇一而依序地發光。然後，依照發光元件L相對於積分球14之入射口14a的位置，而將從發光裝置15依序輸出的光接收訊號R1加以修正。之所以要進行這樣的修正，是由於積分球14之入射口14a的暈影(vignetting)之量會相對於發光元件L之位置而變化，所以若不修正就無法進行精度良好之量測。 Further, the control processing device 16 outputs the control signal C2 to the power supply device 12 so that the light-emitting elements L arranged on the stage 11a have the light-emitting elements L that are in contact with the pins P of the power supply contact portion 13, and sequentially emit light sequentially. Then, the light receiving signal R1 sequentially output from the light-emitting device 15 is corrected in accordance with the position of the light-emitting element L with respect to the entrance port 14a of the integrating sphere 14. The reason for this correction is that the amount of vignetting of the entrance port 14a of the integrating sphere 14 changes with respect to the position of the light-emitting element L. Therefore, if the correction is not performed, the measurement with high accuracy cannot be performed.
具體而言，在配置於積分球14之入射口14a之中心位置下方的發光元件L發光時，控制處理裝置16修正由光接收元件L依序得到的光接收結果，使其與從光接收裝置15所得到的光接收結果相同。也就是說，由於在光接收元件L配置於入射口14a之中心位置的下方時，光接收元件L所射出的光線幾乎都由入射口14a入射至本體部14b，如此暈影的量會最小，因此進行上述修正。 Specifically, when the light-emitting element L disposed under the center position of the entrance port 14a of the integrating sphere 14 emits light, the control processing device 16 corrects the light reception result sequentially obtained by the light-receiving element L to be made with the slave light-receiving device. The light reception results obtained by 15 are the same. That is, since the light emitted from the light receiving element L is almost always incident on the body portion 14b by the entrance port 14a when the light receiving element L is disposed below the center position of the entrance port 14a, the amount of vignette is minimized. Therefore, the above correction is made.
控制處理裝置16使用預先求得的高維之修正函數(例如，4維之修正函數)或修正表，以修正發光裝置15所依序輸出的光接收訊號R1。又，修正函數或修正表，例如可用以下步驟求得。首先，將發光特性為已知之基準發光元件載置於平台11a，一邊變更發光元件的位置，一邊依序取得來自發光裝置15的光接收訊號R1。然後，藉由求取使下述二者相等的修正係數或修正，以製作修正函數或修正表：於各個位置取得之光接收訊號R1、以及發光元件L配置於積分球14之入射口14a的中心位置下方時得自光接收裝置15之光接收訊號R1。 The control processing device 16 corrects the light receiving signal R1 sequentially output by the light-emitting device 15 by using a high-dimensional correction function (for example, a four-dimensional correction function) or a correction table obtained in advance. Further, the correction function or the correction table can be obtained, for example, by the following steps. First, a reference light-emitting element having a known light-emitting property is placed on the stage 11a, and the light-receiving signal R1 from the light-emitting device 15 is sequentially obtained while changing the position of the light-emitting element. Then, a correction function or a correction table is prepared by obtaining correction coefficients or corrections that are equal to each other: the light receiving signal R1 obtained at each position and the light emitting element L disposed at the entrance port 14a of the integrating sphere 14 The light receiving signal R1 from the light receiving device 15 is located below the center position.
接著，針對上述結構之發光特性量測裝置1的動作加以說明。第4圖係顯示本發明一實施形態之發光特性量測方法的流程圖。在量測之前，進行將作為量測對象的複數之發光元件L載置至平台11a上的操作。具體而言，進行如 下之載置操作：沿著移動方向D1，使複數之發光元件L隔著一定間隔而直線狀排列。 Next, the operation of the light-emitting characteristic measuring device 1 having the above configuration will be described. Fig. 4 is a flow chart showing a method of measuring a light-emitting characteristic according to an embodiment of the present invention. Before the measurement, an operation of placing the plurality of light-emitting elements L as the measurement targets on the stage 11a is performed. Specifically, proceed as The lower placing operation: linearly arranging a plurality of light-emitting elements L at regular intervals along the moving direction D1.
一旦以上操作結束並下達量測開始之指示，控制處理裝置16就對平台裝置11輸出控制訊號C1，進行如下處理：將應於一開始就進行量測之複數之發光元件L(5個發光元件L)，配置於預先制定之量測準備位置。具體而言，進行如下處理：沿著移動方向D1移動平台11a，以使應於一開始就進行量測的5個發光元件L，分別位於設在電源接點部13的5對接腳P之下方(量測準備位置)(步驟S11：第1步驟)。 Once the above operation is completed and the measurement start instruction is issued, the control processing device 16 outputs the control signal C1 to the platform device 11 to perform the following processing: a plurality of light-emitting elements L (5 light-emitting elements) to be measured at the beginning. L), configured in a pre-defined measurement preparation position. Specifically, the following processing is performed: the stage 11a is moved along the moving direction D1 so that the five light-emitting elements L to be measured at the beginning are located below the five pairs of pins P provided in the power supply contact portion 13, respectively. (Measurement preparation position) (Step S11: First step).
平台11a結束移動後，由控制處理裝置16對平台裝置11再度輸出控制訊號C1，進行使平台11a上昇的處理。一旦進行此處理，配置於量測準備位置的5個發光元件L就隨著平台11a的上昇一起上昇，如第5A圖、第5B圖所示，會成為如下狀態：應於一開始就量測的5個發光元件L，分別接觸設在電源接點部13的5對接腳P(步驟S12：第1步驟)。第5A圖、第5B圖係顯示本發明一實施形態之發光特性量測裝置於量測時，發光元件與接腳之接觸狀態的圖。第5A圖係正面圖，第5B圖係右側視圖。 After the platform 11a has finished moving, the control device 16 again outputs the control signal C1 to the platform device 11 to perform a process of raising the platform 11a. When this processing is performed, the five light-emitting elements L disposed at the measurement preparation position rise together with the rise of the stage 11a, and as shown in FIGS. 5A and 5B, the following state is obtained: measurement should be performed from the beginning. The five light-emitting elements L are respectively in contact with the five pairs of pins P provided in the power supply contact portion 13 (step S12: first step). Figs. 5A and 5B are views showing a state in which the light-emitting element and the pin are in contact with each other when the light-emitting characteristic measuring device according to the embodiment of the present invention is measured. Figure 5A is a front view and Figure 5B is a right side view.
以上的處理一旦結束，就由控制處理裝置16對電源裝置12輸出控制訊號C2，進行以下處理：使應於一開始量測的5個發光元件L擇一地依序發光(步驟S13：第2步驟)。例如，進行如下處理：在第5A圖所示之與接腳P接觸的5個發光元件之中，由位於最右側的發光元件L朝向位於左側的發光元件L，依此順序擇一地依序使其發光。 When the above processing is completed, the control processing device 16 outputs the control signal C2 to the power supply device 12, and performs the following processing: sequentially illuminating the five light-emitting elements L to be measured at the beginning (step S13: second) step). For example, a process is performed in which, among the five light-emitting elements that are in contact with the pin P shown in FIG. 5A, the light-emitting element L located on the rightmost side faces the light-emitting element L located on the left side, and sequentially in this order. Make it glow.
藉由發光元件L之發光而由發光元件L所射出的光線，透過積分球14之入射口14a入射至本體部14b而於空間上積分並均質化以後，由射出口14c射出。由積分球14之射出口14c所射出之光，藉由光纖F而導向光接收裝置15，由分光器15a分光後，以光接收器15b接收光。藉此，由光接收裝置15輸出光接收訊號R1。 The light emitted from the light-emitting element L by the light-emitting element L is incident on the body portion 14b through the entrance port 14a of the integrating sphere 14 to be spatially integrated and homogenized, and then emitted from the injection port 14c. The light emitted from the exit 14c of the integrating sphere 14 is guided to the light receiving device 15 by the optical fiber F, and is split by the spectroscope 15a, and then received by the optical receiver 15b. Thereby, the light receiving signal R1 is output by the light receiving device 15.
每次使發光元件L發光時，就會輸出來自光接收裝置15的光接收訊號R1，依序輸入至控制處理裝置16。依序輸入至控制處理裝置16的光接收訊號R1，使用預先求得之修正函數或修正表受到修正。具體而言，使用修正函數或修正表修正，以使下述二者相同：依序輸入控制處理裝置16的光接收訊號R1、以及配置於積分球14之入射口14a的中心位置下方的發光元件L發光時由光接收裝置15所得之光接收結果(步驟S14：第2步驟)。 Each time the light-emitting element L is caused to emit light, the light-receiving signal R1 from the light-receiving device 15 is output, and sequentially input to the control processing device 16. The light receiving signal R1 sequentially input to the control processing device 16 is corrected using a correction function or a correction table obtained in advance. Specifically, the correction function or the correction table correction is used to make the following two the same: sequentially input the light receiving signal R1 of the control processing device 16 and the light emitting element disposed under the center position of the entrance port 14a of the integrating sphere 14 The light reception result obtained by the light receiving device 15 at the time of L light emission (step S14: second step).
一旦結束以上修正，控制處理裝置16就針對單位數量之發光元件L(應於一開始量測的5個發光元件L)之發光是否已結束，進行判斷(步驟S15)。若判斷單位數量之發光元件L的發光尚未結束(判斷結果為「NO」的情形)，控制處理裝置16就反覆步驟S13、S14之處理。相對於此，若判斷單位數量之發光元件L的發光已結束(判斷結果為「YES」的情形)，控制處理裝置16就針對平台11a上所載置的所有發光元件L之發光是否已結束，進行判斷(步驟S16)。 When the above correction is completed, the control processing device 16 determines whether or not the light emission of the unit number of light-emitting elements L (the five light-emitting elements L to be measured at the beginning) has been completed (step S15). When it is determined that the light emission of the unit number of light-emitting elements L has not ended (the determination result is "NO"), the control processing means 16 repeats the processing of steps S13, S14. On the other hand, when it is determined that the light emission of the unit number of light-emitting elements L has been completed (the determination result is "YES"), the control processing means 16 determines whether or not the light emission of all the light-emitting elements L mounted on the stage 11a has ended. A judgment is made (step S16).
若判斷載置於平台11a上的所有發光元件L之發光尚未結束(於步驟S16判斷結果為「NO」的情形)，控制處理裝置16就對平台裝置11輸出控制訊號C1，使平台11a下降，讓發光元件L由接腳P離開(步驟S17)。然後，控制處理裝置16就對平台裝置11輸出控制訊號C1，將應該於下一批量測的複數之發光元件L(5個發光元件L)配置於量測準備位置，進行此等發光元件L之發光特性的量測(步驟S11~S14)。相對於此，若判斷載置於平台11a上的所有發光元件L之發光都結束(步驟S16之判斷結果為「YES」的情形)，就結束第4圖所示之一連串處理。 If it is determined that the illumination of all the light-emitting elements L placed on the stage 11a has not been completed (in the case where the determination result is "NO" in step S16), the control processing means 16 outputs the control signal C1 to the platform device 11 to lower the platform 11a. The light-emitting element L is caused to leave by the pin P (step S17). Then, the control processing device 16 outputs the control signal C1 to the platform device 11, and arranges the plurality of light-emitting elements L (five light-emitting elements L) to be measured in the next batch at the measurement preparation position, and performs the light-emitting elements L. The measurement of the light emission characteristics (steps S11 to S14). On the other hand, when it is judged that the light emission of all the light-emitting elements L placed on the stage 11a is completed (the determination result of step S16 is "YES"), one of the series of processes shown in FIG. 4 is ended.
第6A圖及第6B圖係顯示本發明一實施形態之發光特性量測裝置的量測結果之一例的圖。第6A圖係顯示不進行修正之情形的量測結果的圖，第6B圖係顯示進行了修正之情形的量測結果的圖。又，第6A圖及第6B圖所示之圖表，係以移動方向D1上的位置為橫軸，以光接收訊號R1的相對強度為縱軸。在此，橫軸之原點係積分球14之入射口14a的中心位置，縱軸係於配置在積分球14之入射口14a的中心位置下方的發光元件L發光時，相對於由光接收裝 置15所取得之光接收訊號R1的相對強度。 6A and 6B are views showing an example of measurement results of the light-emitting characteristic measuring device according to the embodiment of the present invention. Fig. 6A is a diagram showing the measurement results in the case where no correction is performed, and Fig. 6B is a diagram showing the measurement results in the case where the correction is performed. Further, in the graphs shown in FIGS. 6A and 6B, the position in the moving direction D1 is the horizontal axis, and the relative intensity of the light receiving signal R1 is the vertical axis. Here, the origin of the horizontal axis is the center position of the entrance port 14a of the integrating sphere 14, and the vertical axis is when the light-emitting element L disposed below the center position of the entrance port 14a of the integrating sphere 14 emits light, with respect to the light receiving device. The relative intensity of the light receiving signal R1 obtained by 15 is set.
參考第6A圖，可知由光接收裝置15所輸出之光接收訊號R1(不進行修正之情況下的量測結果)的強度，係配置於原點之發光元件L發光的情況最高，而隨著發光之發光元件L之位置自原點偏離，而緩緩地變小。這是由於隨著自原點偏離，於積分球14之入射口14a的暈影的量會變大，入射至積分球14之本體部14b的光線量會減少的緣故。 Referring to Fig. 6A, it is understood that the intensity of the light receiving signal R1 (measurement result when no correction is performed) outputted by the light receiving device 15 is the highest in the case where the light-emitting element L disposed at the origin is illuminated, and The position of the light-emitting element L is deviated from the origin and gradually becomes smaller. This is because the amount of vignetting at the entrance port 14a of the integrating sphere 14 becomes larger as it deviates from the origin, and the amount of light incident on the body portion 14b of the integrating sphere 14 is reduced.
相對於此，若對於由光接收裝置15所輸出之光接收訊號R1進行前述修正，則如第6B圖所示，量測結果之強度，不論位於何處，都會大致固定。具體而言，可以使配置於自原點偏離之位置的發光元件L發光時所得之光接收訊號R1，與配置於原點之發光元件L發光時所得之光接收訊號R1幾乎相同。 On the other hand, when the above-described correction is performed on the light receiving signal R1 outputted from the light receiving device 15, as shown in FIG. 6B, the intensity of the measurement result is substantially fixed regardless of the location. Specifically, the light receiving signal R1 obtained when the light emitting element L disposed at a position deviated from the origin can be made almost the same as the light receiving signal R1 obtained when the light emitting element L disposed at the origin is illuminated.
如上所述，於本實施形態，使用具備後述大小之入射口14a的積分球14，而使複數之發光元件L擇一地依序發光，同時依照發光元件L相對於積分球14之入射口14a的位置，修正依序得自光接收裝置15的光接收訊號R1；該入射口14a之大小係：來自排列著的複數之發光元件L的光線可以入射之大小。因此，能以良好之精度，量測複數之發光元件L的發光特性。 As described above, in the present embodiment, the integrating sphere 14 having the entrance port 14a of a size to be described later is used, and the plurality of light-emitting elements L are selectively emitted in order, while the entrance port 14a of the light-emitting element L with respect to the integrating sphere 14 is used. The position is corrected by the light receiving signal R1 obtained from the light receiving device 15 in sequence; the size of the entrance port 14a is such that the light from the plurality of arranged light-emitting elements L can be incident. Therefore, the light-emitting characteristics of the plurality of light-emitting elements L can be measured with good precision.
又，於本實施形態，以可用積分球14之入射口14a導入光線之數量的發光元件L(於本實施形態為5個發光元件L)為單位，進行發光特性之量測與平台11a之移動。因此，相較於習知技術，可以降低平台11a之移動次數，能有效率地量測複數之發光元件L的發光特性。 Further, in the present embodiment, the measurement of the light-emitting characteristics and the movement of the stage 11a are performed in units of the light-emitting elements L (the five light-emitting elements L in the present embodiment) in which the number of light rays introduced into the entrance port 14a of the integrating sphere 14 is used. . Therefore, compared with the prior art, the number of movements of the stage 11a can be reduced, and the light-emitting characteristics of the plurality of light-emitting elements L can be efficiently measured.
具體而言，假設使發光元件L移動而使其接觸電源接點部13之接腳P所需之時間(搬送時間)為T1，而使1個發光元件L發光以量測發光特性所需之時間(量測時間)為T2。若平台11a移動一次所進行量測之發光元件L的數量(單位數)為n(n為1以上之整數)，則量測n個發光元件L之發光特性所需之時間(單位數量測時間)Ta係以下述式(1)表示。 Specifically, it is assumed that the time required for the light-emitting element L to move to contact the pin P of the power contact portion 13 (transport time) is T1, and one light-emitting element L is illuminated to measure the light-emitting characteristics. The time (measurement time) is T2. When the number (unit number) of the light-emitting elements L measured by the movement of the stage 11a is n (n is an integer of 1 or more), the time required for measuring the light-emitting characteristics of the n light-emitting elements L (unit number measurement time) Ta is represented by the following formula (1).
Ta=T1+n．T2...(1) Ta=T1+n. T2...(1)
若載置於平台11a上的發光元件L之總數為N個，則為了量測N個發光元件L所需之時間Tb由下述式(2)表示。 If the total number of the light-emitting elements L placed on the stage 11a is N, the time Tb required for measuring the N light-emitting elements L is expressed by the following formula (2).
Tb=N．Ta/n...(2) Tb=N. Ta/n...(2)
第7圖係顯示本發明一實施形態之發光特性量測裝置的量測時間之一例的圖。又，於第7圖中，搬送時間T1為100msec，量測時間T2為10msec，並顯示著單位數量n為1、5、10之情況下的量測時間。如第7圖所示，不論單位數量n多少，搬送時間T1都是100msec。再者，由於量測時間T2為10msec，因此在單位數量n為1、5、10之情況下的量測所需時間，分別為10、50、100msec。 Fig. 7 is a view showing an example of measurement time of the light-emitting characteristic measuring device according to the embodiment of the present invention. Further, in Fig. 7, the transport time T1 is 100 msec, the measurement time T2 is 10 msec, and the measurement time when the unit number n is 1, 5, and 10 is displayed. As shown in Fig. 7, the transport time T1 is 100 msec regardless of the number of units n. Furthermore, since the measurement time T2 is 10 msec, the time required for measurement in the case where the number of units n is 1, 5, and 10 is 10, 50, and 100 msec, respectively.
如此一來，單位數量n為1、5、10之情況下的單位數量量測時間Ta，由上述式(1)算來，分別會是110、150、200msec，平均每一個的時間，係單位數量量測時間Ta除以單位數量n而求得，分別會是110、30、20msec。由於搬送時間T1比量測時間T2長，所以在單位數量n小的情況下(例如：單位數量n為1的情形)，平均每一個的時間大多會被搬送時間T1所佔去。相對於此，若單位數量n變大，搬送時間T1就會由n個發光元件L所分攤，平均每一個的時間內所佔的搬送時間T1就會變小，因此可以縮短量測時間。 In this case, the unit quantity measurement time Ta in the case where the number of units n is 1, 5, and 10 is calculated by the above formula (1), and is 110, 150, and 200 msec, respectively, and the average time of each unit is The quantity measurement time Ta is obtained by dividing the unit number n by 110, 30, and 20 msec, respectively. Since the transport time T1 is longer than the measurement time T2, when the unit number n is small (for example, when the number of units n is 1), the average time per time is mostly taken up by the transport time T1. On the other hand, when the unit number n is increased, the transport time T1 is distributed by the n light-emitting elements L, and the transport time T1 occupied by the average time is reduced, so that the measurement time can be shortened.
於上述實施形態，為簡化說明，而以量測一維排列之發光元件L為例，進行了說明；但本發明亦可量測二維排列之發光元件L。 In the above embodiment, the light-emitting element L in which the one-dimensional array is arranged has been described as an example for simplification of description. However, the present invention can also measure the light-emitting element L which is two-dimensionally arranged.
又，於上述之實施形態，積分球14之開口部14a係由本體部14b底部往下方突出之狀態，但開口部14a，不一定要從本體部14b的底部往下方突出。例如，亦可藉由在本體部14b的底面形成缺口以設置開口部14a。又，積分球14之入射口14a由底面觀察所見之形狀，並不限於四角形，亦可為橢圓形。 Further, in the above-described embodiment, the opening portion 14a of the integrating sphere 14 is protruded downward from the bottom of the main body portion 14b, but the opening portion 14a does not necessarily protrude downward from the bottom portion of the main body portion 14b. For example, the opening portion 14a may be provided by forming a notch on the bottom surface of the main body portion 14b. Further, the shape of the entrance opening 14a of the integrating sphere 14 as seen from the bottom surface is not limited to a square shape, and may be an elliptical shape.
又，於上述之實施形態，所說明的發光特性量測裝置，係以光接收裝置15具備分光器15a及光接收器15b，且可以量測光接收元件L所射出之光線的光 譜的為例；而在不需要量測光譜的情形，亦可省略分光器15a。又，在此情形，亦可設置為將光接收裝置15或光接收器15b直接安裝於積分球14之射出口14c的結構。 Further, in the above-described embodiment, the light-emitting characteristic measuring apparatus includes the light-receiving device 15 including the spectroscope 15a and the light receiver 15b, and can measure the light of the light emitted from the light-receiving element L. The spectrum is taken as an example; and in the case where the measurement spectrum is not required, the spectroscope 15a may be omitted. Further, in this case, the light receiving device 15 or the light receiver 15b may be directly attached to the ejection opening 14c of the integrating sphere 14.
本發明，提供一種發光特性量測裝置及方法，可以以良好的精度，有效率地量測複數之發光元件的發光特性。 The present invention provides a light-emitting characteristic measuring device and method which can efficiently measure the light-emitting characteristics of a plurality of light-emitting elements with good precision.
根據本發明的實施形態，對於具有能使所排列之複數之發光元件的光線得以入射之大小之入射口的光學積分器，配置有複數之發光元件，以使所射出的光會入射至光學積分器的入射口，而使複數之發光元件擇一地依序發光，同時依序接收光學積分器所均質化了的光線而得的光接收結果，依照相對於光學積分器之入射口的發光元件之位置而進行修正，所以能以良好的精度，有效率地量測複數之發光元件的發光特性。 According to an embodiment of the present invention, a plurality of light-emitting elements are disposed in an optical integrator having an entrance port having a size at which light of a plurality of arranged light-emitting elements can be incident, so that the emitted light is incident on the optical integral. The entrance of the device, and the plurality of light-emitting elements are sequentially sequentially illuminated, and simultaneously receive the light receiving result of the light homogenized by the optical integrator, according to the light-emitting element with respect to the entrance of the optical integrator Since the position is corrected, the light-emitting characteristics of the plurality of light-emitting elements can be efficiently measured with good precision.
於本說明書中「前、後、上、下、右、左、垂直、水平、下、橫、行及列」等顯示方向之用語，係針對本發明之裝置中的該等方向而言。因此，於本發明說明書中之該等用語，於本發明之裝置應作相對性解釋。 The terms "front, back, up, down, right, left, vertical, horizontal, lower, horizontal, row, and column" in the present specification are used in the direction of the device of the present invention. Therefore, the terms used in the description of the present invention should be interpreted relative to the device of the present invention.
所謂之「構成為」之用語，意指係為了實行本發明之功能而構成，或於顯示裝置之結構、要件、部份時使用。 The phrase "consisting of" means that it is constructed to carry out the functions of the present invention, or is used in the structure, elements, and parts of a display device.
再者，於請求項中，以「手段功能用語(means plus function)」所表達的語詞，涵括為了實行本發明所包含之功能而可利用之所有結構。 Further, in the claims, the words expressed by "means plus function" include all the structures usable for carrying out the functions included in the present invention.
用語「部(unit)」，係用以敘述裝置之構件(component)、區塊(section)及部份(parts)而使用，包含為實行所要之功能而構成或所程式化之硬體及/或軟體。該硬體之典型例，包含裝置(device)及電路，但並不限定於此。 The term "unit" is used to describe the components, sections, and parts of a device, and includes hardware and/or programmed to perform the desired functions and/or Or software. A typical example of the hardware includes a device and a circuit, but is not limited thereto.
以上，針對本發明之較佳實施形態進行說明以示例證，然而這僅係本發明之例示，並不能視為本發明之限定，可在不超出本發明之精神或範圍的情況下 進行追加、削除、置換及其他變更。亦即，本發明並不受前述實施形態所限定，而係由以下之專利申請範圍來限定。 The preferred embodiments of the present invention have been described by way of example only, and are not intended to be construed as limiting the scope of the invention. Add, remove, replace, and other changes. That is, the present invention is not limited by the foregoing embodiments, but is defined by the scope of the following patent application.
1‧‧‧發光特性量測裝置 1‧‧‧Lighting characteristics measuring device
11‧‧‧平台裝置 11‧‧‧ platform device
11a‧‧‧平台 11a‧‧‧ platform
12‧‧‧電源裝置 12‧‧‧Power supply unit
13‧‧‧電源接點部 13‧‧‧Power Contact Department
14‧‧‧積分球 14‧‧·Score
14a‧‧‧入射口 14a‧‧‧Inlet port
15a‧‧‧分光器 15a‧‧ ‧ splitter
15b‧‧‧光接收器 15b‧‧‧Light Receiver
16‧‧‧控制處理裝置 16‧‧‧Control processing device
C1‧‧‧控制信號 C1‧‧‧ control signal
C2‧‧‧控制訊號 C2‧‧‧ control signal
D1‧‧‧移動方向 D1‧‧‧ moving direction
D2‧‧‧昇降方向 D2‧‧‧ Lifting direction
F‧‧‧光纖 F‧‧‧Fiber
L‧‧‧發光元件 L‧‧‧Lighting elements
P‧‧‧接腳 P‧‧‧ pin
Q1‧‧‧檢測結果 Q1‧‧‧ test results
R1‧‧‧光接收訊號 R1‧‧‧Light receiving signal
Claims (16)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012015707A JP5461595B2 (en) | 2012-01-27 | 2012-01-27 | Luminescence characteristic measuring apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201346230A true TW201346230A (en) | 2013-11-16 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102102262A TW201346230A (en) | 2012-01-27 | 2013-01-21 | Light-emitting property measuring apparatus and light-emitting property measuring method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5461595B2 (en) |
| KR (1) | KR20130087421A (en) |
| CN (1) | CN103267628A (en) |
| TW (1) | TW201346230A (en) |
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|---|---|---|---|---|
| KR101675543B1 (en) * | 2015-06-17 | 2016-11-11 | (주) 동국이노텍 | Cell metabolism measurement apparatus based on microplate |
| CN106768875A (en) * | 2016-11-21 | 2017-05-31 | 深圳市晶锐光电有限公司 | A kind of semiconductor light-splitting method |
| KR102073558B1 (en) * | 2018-07-17 | 2020-02-05 | 재단법인 한국기계전기전자시험연구원 | Illuminance sensor tester |
| CN110333051B (en) * | 2019-09-03 | 2019-12-17 | 江西德瑞光电技术有限责任公司 | test equipment and method for semiconductor laser chip |
| CN113008522A (en) * | 2021-03-08 | 2021-06-22 | 苏州长光华芯光电技术股份有限公司 | Laser life aging testing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3133938B2 (en) * | 1996-03-08 | 2001-02-13 | シャープ株式会社 | Apparatus for measuring electro-optical characteristics of semiconductor devices |
| JP2008076126A (en) * | 2006-09-20 | 2008-04-03 | Oputo System:Kk | Photometric device and method |
| CN200959025Y (en) * | 2006-10-09 | 2007-10-10 | 深圳市量子光电子有限公司 | LED testing operation platform |
| CN201429464Y (en) * | 2009-04-09 | 2010-03-24 | 张九六 | Automatic test spectrometer for united LED |
| JP5286571B2 (en) * | 2009-05-22 | 2013-09-11 | 大塚電子株式会社 | Total luminous flux measuring apparatus and total luminous flux measuring method |
| JP5547969B2 (en) * | 2010-01-04 | 2014-07-16 | 日置電機株式会社 | Photometric device |
-
2012
- 2012-01-27 JP JP2012015707A patent/JP5461595B2/en not_active Expired - Fee Related
-
2013
- 2013-01-21 TW TW102102262A patent/TW201346230A/en unknown
- 2013-01-23 CN CN2013100248977A patent/CN103267628A/en active Pending
- 2013-01-24 KR KR1020130008084A patent/KR20130087421A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013156080A (en) | 2013-08-15 |
| JP5461595B2 (en) | 2014-04-02 |
| KR20130087421A (en) | 2013-08-06 |
| CN103267628A (en) | 2013-08-28 |
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