TW201334903A - Device for cutting ceramic by infrared laser and method thereof - Google Patents
Device for cutting ceramic by infrared laser and method thereof Download PDFInfo
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- TW201334903A TW201334903A TW101105228A TW101105228A TW201334903A TW 201334903 A TW201334903 A TW 201334903A TW 101105228 A TW101105228 A TW 101105228A TW 101105228 A TW101105228 A TW 101105228A TW 201334903 A TW201334903 A TW 201334903A
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Abstract
Description
本創作系涉及一種紅外鐳射切割陶瓷的裝置及方法，尤特指可達到快速切割、省時省力，高精密度及避免破壞要求之技術。The present invention relates to an apparatus and method for infrared laser cutting ceramics, and particularly refers to a technology capable of achieving rapid cutting, saving time and labor, high precision and avoiding damage requirements.
陶瓷燒結加工的產品，是二十一世紀精密工業不可或缺的科技，也是未來常態的工業用品，因為它具有高熔點、高硬度、絕緣性佳與耐蝕性優良等特性，可在嚴苛的高溫腐蝕性環境下使用或應用在電氣絕緣的用途，故現已被應用在航太工業、LED基板、襯墊、PC板、醫療器具、管套、軸承等精密用品上，於其加工成型作業，必需經過切割的程式，目前對陶瓷元件切割的方式，尤其是氮化鋁陶瓷，硬度高，以鑽石刀或是鑽石刀加工，因其屬接觸性的切割，會產生較大的應力，會使得陶瓷基板有破碎或、顯性和隱性裂紋，使得成品率降低，原材料的浪費嚴重。Ceramic sintering processing products are indispensable technology for the precision industry in the 21st century, and are also the industrial products of the future. Because of its high melting point, high hardness, good insulation and excellent corrosion resistance, it can be used in harsh conditions. Used in high temperature corrosive environment or used in electrical insulation, it has been applied to aerospace industry, LED substrates, gaskets, PC boards, medical equipment, pipe sleeves, bearings and other precision products. The program must be cut. At present, the cutting method of ceramic components, especially aluminum nitride ceramics, has high hardness and is processed by diamond knife or diamond knife. Because it is contact cutting, it will generate large stress. The ceramic substrate has broken, dominant and hidden cracks, which leads to a decrease in the yield and a serious waste of raw materials.
本創作「紅外鐳射切割陶瓷的裝置及方法」，系提供可任意形狀切割、可保持加工物的完整，避免機具的損耗，提高加工效率，降低成本之優點者。本創作「紅外鐳射切割陶瓷的裝置及方法」，基本上於機臺上設有X、Y、Z軸之移動平臺，前端設有鐳射切割頭之雷射器，而鐳射切割頭系位於切割陶瓷的工作範圍上，該鐳射之波長介於800nm~1200nm間，且於切割同時，加以如氮氣之高壓惰氣流體運作，使具有冷卻、提高切割能力、去除切屑及防止切屑的干擾。The "Infrared Laser Cutting Ceramic Device and Method" is designed to provide the ability to cut in any shape, maintain the integrity of the workpiece, avoid the loss of the machine, improve the processing efficiency, and reduce the cost. The creation "infrared laser cutting ceramic device and method" basically has a moving platform with X, Y and Z axes on the machine table, a laser cutting head laser is arranged at the front end, and the laser cutting head is located in the cutting ceramic. In the working range, the wavelength of the laser is between 800 nm and 1200 nm, and at the same time as cutting, a high pressure inert gas such as nitrogen is operated to cool, improve cutting ability, remove chips and prevent chip interference.
本創作「紅外鐳射切割陶瓷的裝置及方法」，基本上於機臺上設有X、Y、Z軸之移動平臺，前端設有雷射器，於雷射器上設有鐳射切割頭，且此鐳射切割頭系位在雷射器上呈Z軸向的移動，而鐳射切割頭會對外發出生紅外鐳射及噴流氣體，可對工作物進行切割者。The creation "infrared laser cutting ceramic device and method" basically has a moving platform with X, Y and Z axes on the machine table, a laser device at the front end, and a laser cutting head on the laser device, and The laser cutting head is in the Z-axis movement on the laser, and the laser cutting head emits an infrared laser and a jet gas to cut off the workpiece.
本創作「紅外鐳射切割陶瓷的裝置及方法」，使鐳射經過聚焦後照射到材料上，光能轉化為熱能，使被切割材料溫度急速升高，然後使之熔化或汽化。與此同時，與光束同軸的氣流從噴嘴噴出，將熔化或汽化了的材料由切口的底部吹走。隨著鐳射與被切割材料的相對運動，在切割材料上形成切縫從而達到切割的目的。The creation "infrared laser cutting ceramic device and method" causes the laser to be focused and irradiated onto the material, and the light energy is converted into heat energy, so that the temperature of the material to be cut is rapidly increased, and then melted or vaporized. At the same time, a gas stream coaxial with the beam is ejected from the nozzle, blowing the melted or vaporized material away from the bottom of the slit. As the laser and the material being cut move relative to each other, a slit is formed in the cut material to achieve the purpose of cutting.
下面結合附圖和具體實施方式對本創作進行進一步詳細說明。The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
本創作之裝置，請參第一圖所示，系於機台11上設有Y軸移動平臺12，及與Y軸移動平臺12呈九十度角所設之X軸移動平臺17，於機台11位於Y軸移動平臺12另端設有雷射器15，如圖所示，該雷射器15的實施例為懸臂式的設計，于雷射器15前方設有鐳射切割頭16，於平臺12上設有一工作臺面13，而此檯面13上設有可左右動作以調整距離夾固工作物之夾具14，藉Y軸移動平臺12及X移動平臺17可控制位於檯面13上之陶瓷工作物呈X及Y軸的移動供鐳射切割頭進行加工。The device of the creation, as shown in the first figure, is provided with a Y-axis moving platform 12 on the machine table 11, and an X-axis moving platform 17 disposed at a 90-degree angle with the Y-axis moving platform 12, The stage 11 is located at the other end of the Y-axis moving platform 12 and is provided with a laser 15 as shown in the figure. The embodiment of the laser 15 is of a cantilever type, and a laser cutting head 16 is arranged in front of the laser 15 for The platform 12 is provided with a work surface 13 which is provided with a clamp 14 which can move left and right to adjust the distance between the workpieces. The Y-axis moving platform 12 and the X-moving platform 17 can control the ceramic work on the table 13 The movement of the object in the X and Y axes is processed by a laser cutting head.
而雷射器15前方位於工作臺面13移動的範圍上方，設有可僅呈Z軸向移動的鐳射切割頭16，而鐳射切割頭16會對外發出生紅外鐳射及噴流氣體，可對工作物進行切割者。The front of the laser device 15 is located above the range in which the work surface 13 moves, and is provided with a laser cutting head 16 which can move only in the Z-axis direction, and the laser cutting head 16 emits a raw infrared laser and a jet gas to perform work on the workpiece. Cutter.
而鐳射切割頭16可發出紅外鐳射及噴流氣體對工作物垂直切割；藉此，控制X及Y軸平臺17、11的位置及移動，可調整工作臺面13接受鐳射切割頭16依所設定的切割路線，順著鐳射切割頭16所發出的紅外鐳射及噴流氣體，就可獲得切割精密度高、誤差少的要求。而鐳射切割頭16系可依工作物之高度作Z軸向的調整者。The laser cutting head 16 can emit infrared laser and jet gas to cut the workpiece vertically; thereby controlling the position and movement of the X and Y axis platforms 17, 11 and adjusting the work surface 13 to receive the cutting of the laser cutting head 16 according to the setting The route, along with the infrared laser and the jet gas emitted by the laser cutting head 16, can achieve the requirements of high cutting precision and low error. The laser cutting head 16 can be used as a Z-axis adjuster depending on the height of the work object.
另，請參第二圖所示，亦可使陶瓷通過夾具固定於靜止平臺13A之上，靜止平臺13A設有可固定陶瓷之夾具14。鐳射切割頭16設在Z軸移動平臺18可上下移動，而Z軸移動平臺18位在X移動平臺17中，可左右移動，而X軸移動平臺17兩端設位在兩邊之Y軸移動平臺12，而可前後移動，而Y軸移動平臺12則位在機台11兩端所設之固定台19上，兩固定台19則呈一工作空間，此工作空間正可提供鐳射切割頭16在Z軸移動平臺18垂直活動，及靜止平臺13A的使用空間。因此鐳射切割頭16可以在X、Y平面內移動，同時亦可在Z軸方向移動，這樣通過Z軸的移動將聚焦後的鐳射的焦點至於陶瓷的表面，然後通過運動控制器控制鐳射切割頭按預先設定的路徑在、Y平面移動，這樣實現對陶瓷的切割。In addition, as shown in the second figure, the ceramic can also be fixed on the stationary platform 13A by a clamp, and the stationary platform 13A is provided with a fixture 14 for fixing the ceramic. The laser cutting head 16 is arranged to move up and down on the Z-axis moving platform 18, and the Z-axis moving platform 18 is located in the X moving platform 17, which can be moved left and right, and the X-axis moving platform 17 is disposed at both ends of the Y-axis moving platform. 12, but can move back and forth, and the Y-axis moving platform 12 is located on the fixed table 19 provided at both ends of the machine table 11, the two fixed stations 19 are in a working space, the working space is providing the laser cutting head 16 The Z-axis moving platform 18 is vertically movable, and the use space of the stationary platform 13A. Therefore, the laser cutting head 16 can move in the X and Y planes, and can also move in the Z-axis direction, so that the focus of the focused laser is focused on the surface of the ceramic by the movement of the Z-axis, and then the laser cutting head is controlled by the motion controller. It is moved in the Y plane according to the preset path, thus achieving the cutting of the ceramic.
而本創作之鐳射切割頭16結構，可參第三圖所示之實施例實現，其設有上座體21及下座體31，上座體21系連結於鐳射產生器，其內形成有一鐳射室22，鐳射室22設有光學鏡23可將紅外光聚焦成為切割所需之鐳射源，於下座體32設工作空間32，並設有向下之延伸管35，于延伸管35下埠以一固定單元41設有噴頭42，此噴頭42內部呈錐形狀43；於下座體31工作空間32上設有一透明鏡33，系用以保證氣體只由噴頭42出去而不致於進入鐳射室22，且也可保持鐳射的正常運作。The structure of the laser cutting head 16 of the present invention can be realized by the embodiment shown in FIG. 3, which is provided with an upper body 21 and a lower body 31. The upper body 21 is coupled to the laser generator, and a laser chamber is formed therein. 22, the laser chamber 22 is provided with an optical mirror 23 to focus the infrared light into a laser source required for cutting, a working space 32 is disposed in the lower body 32, and a downward extending tube 35 is disposed, and the extension tube 35 is disposed under the extension tube 35. A fixing unit 41 is provided with a spray head 42 having a tapered shape 43 inside. The working space 32 of the lower base 31 is provided with a transparent mirror 33 for ensuring that the gas only exits from the shower head 42 and does not enter the laser chamber 22 . And can also maintain the normal operation of the laser.
其切割方式，就如第四圖所示之示意圖，當陶瓷工作物51進入鐳射頭工作範圍時，同時受到紅外鐳射的切割及氣體之噴流，藉此不僅可使切割精度提高、降低了其誤差，氣體的加持，可冷卻加工溫度，減少熱影區和避免聚焦透鏡受到污染的情形，也延長了機具的使用壽命，大大提高其經濟價值與成本。同時惰性氣體如氮氣最為重要的作用是其為鐳射切割陶瓷的關鍵因素，若不加氮氣則切割不可行或者效率極其低下。The cutting method is as shown in the fourth figure. When the ceramic workpiece 51 enters the working range of the laser head, it is simultaneously subjected to infrared laser cutting and gas jetting, thereby not only improving the cutting precision but also reducing the error thereof. The gas holding can cool the processing temperature, reduce the thermal shadow area and avoid the contamination of the focusing lens, and prolong the service life of the machine, greatly improving its economic value and cost. At the same time, the most important role of inert gas such as nitrogen is that it is a key factor in laser cutting ceramics. If nitrogen is not added, cutting is not feasible or the efficiency is extremely low.
綜上所述，本創作具有產業上的利用價值，符合專利要件；唯，以上所述者，僅為本創作之較佳實施例而已，並非用以限定本創作實施之範圍；故當熟習此技藝所作出等效或輕易的變化者，如增加一些習之的工具或配合其它結構所為的改變，但在不脫離本創作之精神與範圍下所作之均等變化與修飾，皆應涵蓋于本創作之專利範圍內，合先陳明。In summary, the creation has industrial use value and conforms to the patent requirements; however, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the implementation of the present invention; Equivalent or easy changes in the skill of the art, such as the addition of some tools or other changes in the structure, but the equal changes and modifications made without departing from the spirit and scope of this creation should be covered by this creation. Within the scope of the patent, the first Chen Ming.
11．．．機台11. . . Machine
12．．．Y軸移動平臺12. . . Y-axis mobile platform
13．．．工作臺面13. . . working desk
14．．．夾具14. . . Fixture
15．．．雷射器15. . . Laser
16．．．鐳射切割頭16. . . Laser cutting head
17．．．X移動平臺17. . . X mobile platform
18．．．Z軸移動平臺18. . . Z-axis mobile platform
13A．．．靜止平臺13A. . . Stationary platform
21．．．上座體twenty one. . . Upper body
22．．．鐳射室twenty two. . . Laser room
23．．．光學鏡twenty three. . . Optical mirror
31．．．下座體31. . . Lower body
32．．．工作空間32. . . Workspace
33．．．透明鏡33. . . Transparent mirror
34．．．密封圈34. . . Seal ring
35．．．延伸管35. . . Extension tube
36．．．穿孔36. . . perforation
41．．．固定單元41. . . Fixed unit
42．．．噴頭42. . . Nozzle
43．．．錐形狀43. . . Cone shape
51．．．陶瓷工作物51. . . Ceramic work
19．．．固定台19. . . Fixed table
第一圖：本創作的工作機台立體示意圖。The first picture: a three-dimensional schematic diagram of the working machine of the creation.
第二圖：本創作的另一種工作機台的設計立體示意圖。The second picture: a schematic diagram of the design of another working machine of this creation.
第三圖：本創作之鐳射頭結構實施例圖。The third picture: the embodiment of the laser head structure of the present creation.
第四圖：本創作鐳射切割之示意圖。The fourth picture: a schematic diagram of the laser cutting of this creation.
16．．．鐳射切割頭16. . . Laser cutting head
21．．．上座體twenty one. . . Upper body
22．．．鐳射室twenty two. . . Laser room
23．．．光學鏡twenty three. . . Optical mirror
31．．．下座體31. . . Lower body
32．．．工作空間32. . . Workspace
33．．．透明鏡33. . . Transparent mirror
34．．．密封圈34. . . Seal ring
35．．．延伸管35. . . Extension tube
36．．．穿孔36. . . perforation
41．．．固定單元41. . . Fixed unit
42．．．噴頭42. . . Nozzle
43．．．錐形狀43. . . Cone shape
51．．．陶瓷工作物51. . . Ceramic work
Claims (7)
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| TW101105228A TW201334903A (en) | 2012-02-17 | 2012-02-17 | Device for cutting ceramic by infrared laser and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| TW101105228A TW201334903A (en) | 2012-02-17 | 2012-02-17 | Device for cutting ceramic by infrared laser and method thereof |
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| Publication Number | Publication Date |
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| TW201334903A true TW201334903A (en) | 2013-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101105228A TW201334903A (en) | 2012-02-17 | 2012-02-17 | Device for cutting ceramic by infrared laser and method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753026A (en) * | 2014-01-21 | 2014-04-30 | 无锡卓工自动化制造有限公司 | Optical fiber laser cutting head |
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2012
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753026A (en) * | 2014-01-21 | 2014-04-30 | 无锡卓工自动化制造有限公司 | Optical fiber laser cutting head |
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