CN106425125B - A kind of ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology - Google Patents
A kind of ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology Download PDFInfo
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- CN106425125B CN106425125B CN201610876970.7A CN201610876970A CN106425125B CN 106425125 B CN106425125 B CN 106425125B CN 201610876970 A CN201610876970 A CN 201610876970A CN 106425125 B CN106425125 B CN 106425125B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention discloses a kind of ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology, the following steps are included: S10, the more pulsewidth optical fiber lasers of offer, including nanosecond laser, picosecond laser and femto-second laser, roughing is carried out to the ceramic workpiece being fixed on the worktable using nanosecond laser, while the injection auxiliary gas near Working position；S20, the ceramic workpiece after roughing is finished using picosecond laser or femto-second laser, while the injection auxiliary gas near Working position；S30, default allowance for finish T detect remaining machining allowance t using precision size measuring instrument, as t > T, repeat step S10；As 0 < t≤T, step S20 is repeated；So circulation, until t=0.The present invention near Working position by spraying auxiliary gas, and use picosecond or femtosecond laser are finished again after nanosecond laser roughing, improves the machining accuracy and processing efficiency of ceramic workpiece.
Description
Technical field
The present invention relates to Ceramic manufacturings, and in particular to a kind of ceramic drilling side of compound nanosecond-picosecond-femtosecond laser technology
Method.
Background technique
Ceramics belong to typical hard crisp difficult-to-machine material, and capillary processing is even more a great problem of current processing industry.Pottery
Porcelain hole forming method mainly includes the following three types: the method for (one) tradition machinery drilling, not only ceramic aperture is limited, but also easily exists
The finished surface and hole wall of ceramic material crack, and scrap workpiece；(2) electric discharge machining method, since ceramic material is logical
It is often non-conductive, therefore ceramics need to be modified, and electric spark erosion speed is slow, electrode life is short, processes the efficiency of micropore
It is low, at high cost；(3) laser processing, laser pass through thermal diffusion because having high-energy density and being easy to be oriented to focusing
Mode can make material fusing evaporation make pottery the problems such as realizing the contactless processing with workpiece, avoid tool wear in moment
Porcelain drilling processing field shows advantage.Currently, there are mainly three types of the pulse widths of the laser for ceramic hole machined: nanosecond, skin
Second and femtosecond；Wherein, what is industrially generallyd use is nanosecond laser, and processing efficiency is higher, but rapidoprint heat affected zone
Obviously, easily there is phenomena such as re cast layer, fire check in hole surface and hole wall, seriously affect machining accuracy and quality；And picosecond and fly
The processing efficiency of second laser is not so good as nanosecond laser, but the characteristics of its cold working is suitble to carry out the workpiece after processing finishing and can
Control even is eliminated re cast layer, fire check.
Summary of the invention
The purpose of the present invention is to provide a kind of ceramic boring methods of compound nanosecond-picosecond-femtosecond laser technology, have
High processing efficiency and high manufacturing accuracy.
In order to achieve the above object, the invention adopts the following technical scheme:
A kind of ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology is provided, as shown in Figure 1 comprising following
Step:
S10, more pulsewidth optical fiber lasers are provided, more pulsewidth optical fiber lasers include nanosecond laser, picosecond swash
Light device and femto-second laser carry out roughing to the ceramic workpiece being fixed on the worktable using the nanosecond laser, simultaneously
The injection auxiliary gas near Working position；
Roughing is carried out to ceramic workpiece using the nanosecond laser of more pulsewidth optical fiber lasers, is had high in machining efficiency
Advantage；And it is rough machined and meanwhile near Working position injection auxiliary gas, the temperature of ceramic workpiece Working position can be reduced
Degree, to reach cooling effect, while blowing away the slag near Working position, and hole surface and hole wall caused by reducing because of heat radiation go out
Phenomena such as existing re cast layer, fire check, improve machining accuracy and processing quality.
S20, the ceramics after nanosecond laser roughing are carried out using the picosecond laser or the femto-second laser
Finishing, while the injection auxiliary gas near Working position；
It, can be into using picosecond laser or femto-second laser after carrying out roughing to ceramic workpiece using nanosecond laser
One step improves machining accuracy.
S30, default allowance for finish T detect remaining machining allowance t using precision size measuring instrument, as t > T, repeat
Step S10；As 0 < t≤T, step S20 is repeated；So circulation, until t=0；
In the present invention, allowance for finish T is preset according to the requirement on machining accuracy of ceramic workpiece and precision size measuring instrument, slightly
Remaining machining allowance t is detected using precision size measuring instrument when processing, roughing is continued also according to the comparison of t, T value selection
It is finishing.When roughing for a period of time after, remaining machining allowance t is detected using precision size measuring instrument, as t > T, is repeated
Step S10；Roughing continues to detect remaining machining allowance t using precision size measuring instrument for a period of time afterwards, as 0 < t≤T,
Step S20 is repeated, is so recycled, until t=0.Each rough machined time according to the actual borehole size of ceramic workpiece and
It is fixed.
In the present invention, workbench is the adjustable three-dimensional precise motion platform in position.
The present invention is by using the ceramic boring method of above-mentioned compound nanosecond-picosecond-femtosecond laser technology to ceramic workpiece
Processing drilling is carried out, there is high processing efficiency while machining accuracy is high.
In the present invention, any one of gas in air, oxygen, nitrogen or argon gas is assisted.Wherein, gas is assisted
It is sprayed, can be adjusted according to pressure and spray angle of the practical roughing situation to auxiliary gas by gas assist nozzle,
To obtain good processing effect.
Another program of ceramic boring method as the compound nanosecond-picosecond-femtosecond laser technology of the present invention, this programme exist
It is improved on the basis of above-described embodiment, i.e., is additionally arranged following steps before step S10:
S10 ' ', the surface of ceramic workpiece to be processed is polished directly processing, is subsequently placed in organic solvent and carries out
Ultrasonic cleaning；
Processing is polished directly to the surface of above-mentioned ceramic workpiece to be processed in this programme, then places it in ultrasound
It is cleaned by ultrasonic in solvent, the impurity and pollutant on ceramic workpiece surface can be removed.
S10 ', the ceramic workpiece after ultrasonic cleaning is fixed on the worktable, the ceramic workpiece is adjusted using workbench
Position with find accurately drilling region, then the drilling region is focused with determination using more pulsewidth optical fiber lasers
Working position.
The yet another aspect of ceramic workpiece boring method as the compound nanosecond-picosecond-femtosecond laser technology of the present invention, at this
Further include step S40 after step S30 in the method for drilling holes of scheme:
More pulsewidth optical fiber lasers are closed, ceramic workpiece is placed in organic solvent and is cleaned by ultrasonic.
Wherein, the organic solvent is selected from ethyl alcohol or acetone, can remove laser-textured surface and drill hole inner wall region
Slag etc..
Wherein, the time of the ultrasonic cleaning is 15~30min.
Specifically, the rough machined path is helix from the inside to the outside or from outside to inside.
Alternatively, the rough machined path is several the first concentric circles from the inside to the outside or from outside to inside.
Specifically, the path of the finishing is that diameter is greater than first concentric circles and the circle with first concentric circles
Second concentric circles of heart overlapping.
The nanosecond laser, the picosecond laser and the femto-second laser are electrically connected with laser controller, are led to
The laser controller is crossed to cut between the nanosecond laser, the picosecond laser and the femto-second laser three
It changes.
The invention has the benefit that the present invention is pre- according to the requirement on machining accuracy and precision size measuring instrument of ceramic workpiece
If allowance for finish T, remaining machining allowance t is detected using precision size measuring instrument when roughing, is selected according to the comparison of t, T value
Continue roughing or finishing, until remaining machining allowance t=0.Exist in the process using nanosecond laser progress is rough machined
Working position sprays auxiliary gas nearby to cool down ceramic workpiece and remove the slag in Working position region, slightly adds through nanosecond laser
Use picosecond or femtosecond laser are finished again after work, compared with prior art, improve machining accuracy and processing effect
Rate.
Detailed description of the invention
Fig. 1 is the schematic diagram of the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology of the invention.
Fig. 2 is the ceramics drilling system schematic of the compound nanosecond-picosecond-femtosecond laser technology of the embodiment of the present invention.
Fig. 3 is the schematic diagram of the machining area of the ceramic workpiece of the embodiment of the present invention.
Fig. 4 is a kind of machining path schematic diagram of the ceramic workpiece of the embodiment of the present invention.
Fig. 5 is another machining path schematic diagram of the ceramic workpiece of the embodiment of the present invention.
In Fig. 2~5:
100, workbench；200, ceramic workpiece；300, more pulsewidth optical fiber lasers；310, nanosecond laser；Picosecond 320,
Laser；330, femto-second laser；400, gas assist nozzle；
10, roughing area；20, polishing region；
1, helix；1 ', the first concentric circles；2, the second concentric circles.
Specific embodiment
With reference to the accompanying drawing 1-5 and pass through specific embodiment to further illustrate the technical scheme of the present invention.
Embodiment 1
Using the ceramic hole-drilling system of compound nanosecond-picosecond-femtosecond laser technology as shown in Figure 2 to the pottery of the present embodiment
Porcelain workpiece carries out processing drilling, and boring method is as follows:
By 200 grinding and polishing of ceramic workpiece to be processed, it is placed in alcohol and is cleaned by ultrasonic 15min.It is fixed on after taking-up
On workbench 100, focused by adjusting workbench 100 and more pulsewidth optical fiber lasers 300 to complete to focus and determine machining position
It sets, as shown in figure 3, determining roughing area 10 and polishing region 20.According to the requirement on machining accuracy of ceramic workpiece 200, first use
Nanosecond laser 310 carries out roughing, and machining path is helix 1, according to the reserved finishing of the data of precision size measuring instrument
Surplus T, while passing through gas assist nozzle 400 near Working position and passing to argon gas cooling and blow away slag.Precision size is surveyed
Amount instrument detects remaining 0 < t≤T of machining allowance, and nanosecond laser is switched to picosecond laser by laser controller, mobile simultaneously
Ceramic workpiece 200 to 320 lower section device to hole of picosecond laser is finished, and machining path is the second concentric circles 2, and direction is the inverse time
Needle (as shown in Figure 4).When detecting t=0, more pulsewidth optical fiber lasers 300 are closed by laser controller.By the pottery after processing
Porcelain workpiece 200, which is removed to be again placed in alcohol, is cleaned by ultrasonic 15min, obtains finished product.
Embodiment 2
Using the ceramic hole-drilling system of compound nanosecond-picosecond-femtosecond laser technology as shown in Figure 2 to the pottery of the present embodiment
Porcelain workpiece carries out processing drilling, and boring method is as follows:
By 200 grinding and polishing of ceramic workpiece to be processed, it is placed in acetone and is cleaned by ultrasonic 30min.It is fixed on after taking-up
On workbench 100, focused by adjusting workbench 100 and more pulsewidth optical fiber lasers 300 to complete to focus and determine machining position
It sets, as shown in figure 3, determining roughing area 10 and polishing region 20.According to the requirement on machining accuracy of ceramic workpiece 200, first use
Nanosecond laser 310 carries out roughing, and machining path is several 1 ' of the first concentric circles from outside to inside, is measured according to precision size
The data of instrument reserve allowance for finish T, while passing through gas assist nozzle 400 near Working position and passing to nitrogen cooling and blow
Walk slag.When precision size measuring instrument detects remaining 0 < t≤T of machining allowance, nanosecond laser is switched by laser controller
For picosecond laser, while mobile ceramic workpiece 200 to 320 lower section device to hole of picosecond laser is finished, machining path the
Two concentric circles 2, direction are (as shown in Figure 5) counterclockwise.When checking t=0, more pulsewidth optical fiber are closed by laser controller and are swashed
Light device 300.Ceramic workpiece 200 after processing is removed to be again placed in acetone and is cleaned by ultrasonic 25min, obtains finished product.
Embodiment 3
Using the ceramic hole-drilling system of compound nanosecond-picosecond-femtosecond laser technology as shown in Figure 2 to the pottery of the present embodiment
Porcelain workpiece carries out processing drilling, and boring method is as follows:
By 200 grinding and polishing of ceramic workpiece to be processed, it is placed in acetone and is cleaned by ultrasonic 30min.It is fixed on after taking-up
On workbench 100, focused by adjusting workbench 100 and more pulsewidth optical fiber lasers 300 to complete to focus and determine machining position
It sets, as shown in figure 3, determining roughing area 10 and polishing region 20.According to the requirement on machining accuracy of ceramic workpiece 200, first use
Nanosecond laser 310 carries out roughing, and machining path is several 1 ' of the first concentric circles from outside to inside, is measured according to precision size
The data of instrument reserve allowance for finish T, while passing through gas assist nozzle 400 near Working position and passing to air cooling and blow
Walk slag.When precision size measuring instrument detects remaining 0 < t≤T of machining allowance, nanosecond laser is switched by laser controller
For picosecond laser, while mobile ceramic workpiece 200 to 330 lower section device to hole of femto-second laser is finished, machining path the
Two concentric circles 2, direction are (as shown in Figure 5) counterclockwise.When checking t=0, more pulsewidth optical fiber are closed by laser controller and are swashed
Light device 300.Ceramic workpiece 200 after processing is removed to be again placed in acetone and is cleaned by ultrasonic 30min, obtains finished product.
In above three embodiments, when precision size measuring instrument detects remaining machining allowance t > T, continue to repeat thick
Procedure of processing repeats no more in the above-described embodiments；When precision size measuring instrument detects remaining 0 < t≤T of machining allowance,
Continue to repeat finishing step, repeat no more in the above-described embodiments.
Hole precision on the ceramic workpiece processed using the method for embodiment 1 to 3 is high, and drilling processing efficiency
Height, phenomena such as re cast layer in ceramic workpiece laser processing area, fire check can be eliminated in process.
Above embodiments are only used to illustrate method detailed of the invention, and the invention is not limited to above-mentioned method detaileds, i.e.,
Do not mean that the invention must rely on the above detailed methods to implement.It should be clear to those skilled in the art, right
Any improvement of the invention, the addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, the selection of concrete mode
Deng all of which fall within the scope of protection and disclosure of the present invention.
Claims (6)
1. a kind of ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology, which comprises the following steps:
S10, more pulsewidth optical fiber lasers are provided, more pulsewidth optical fiber lasers include nanosecond laser, picosecond laser and
Femto-second laser carries out roughing to the ceramic workpiece being fixed on the worktable using the nanosecond laser, while processing
Nearby spray auxiliary gas in position；Any one of the auxiliary gas in air, oxygen, nitrogen or argon gas；It is described thick
The path of processing is helix from the inside to the outside or from outside to inside, alternatively, the rough machined path be it is several from the inside to the outside
Or the first concentric circles from outside to inside；
S20, the ceramic workpiece after roughing is finished using the picosecond laser or the femto-second laser, simultaneously
The injection auxiliary gas near Working position；The path of the finishing is that diameter is greater than first concentric circles and with described the
Second concentric circles of the center of circle overlapping of one concentric circles；
S30, default allowance for finish T detect remaining machining allowance t using precision size measuring instrument, as t > T, repeat step
S10；As 0 < t≤T, step S20 is repeated；So circulation, until t=0.
2. the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology according to claim 1, which is characterized in that
It is further comprising the steps of before the step S10:
S10 ' ', the surface of ceramic workpiece to be processed is polished directly processing, is subsequently placed in organic solvent and carries out ultrasound
Cleaning；
S10 ', the ceramic workpiece after ultrasonic cleaning is fixed on the worktable, the position of the ceramic workpiece is adjusted using workbench
It sets to find drilling region accurately, then the drilling region is focused to determine and process using more pulsewidth optical fiber lasers
Position.
3. the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology according to claim 2, which is characterized in that
Further include step S40 after the step S30:
More pulsewidth optical fiber lasers are closed, ceramic workpiece is placed in organic solvent and is cleaned by ultrasonic.
4. the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology according to claim 3, which is characterized in that
The organic solvent is selected from ethyl alcohol or acetone.
5. the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology according to claim 3, which is characterized in that
The time of the ultrasonic cleaning is 15~30min.
6. the ceramic boring method of compound nanosecond-picosecond-femtosecond laser technology according to any one of claims 1 to 5,
It is characterized in that, the nanosecond laser, the picosecond laser and the femto-second laser are electrically connected with laser controller.
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| CN104109860A (en) * | 2014-07-03 | 2014-10-22 | 西安交通大学 | Multi-laser polishing and reinforcing method for surfaces of additive manufacturing metal parts |
| CN105618936B (en) * | 2014-11-21 | 2017-12-01 | 大族激光科技产业集团股份有限公司 | One kind uses laser grooving and scribing glass processing method |
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