TW201250900A - Bonding apparatus, bonding system, bonding method, program, and computer storage medium - Google Patents

Bonding apparatus, bonding system, bonding method, program, and computer storage medium Download PDF

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Publication number
TW201250900A
TW201250900A TW101106986A TW101106986A TW201250900A TW 201250900 A TW201250900 A TW 201250900A TW 101106986 A TW101106986 A TW 101106986A TW 101106986 A TW101106986 A TW 101106986A TW 201250900 A TW201250900 A TW 201250900A
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
bonding
holding member
center portion
Prior art date
Application number
TW101106986A
Other languages
English (en)
Chinese (zh)
Inventor
Keizo Hirose
Shigenori Kitahara
Shintaro Sugihara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201250900A publication Critical patent/TW201250900A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW101106986A 2011-03-04 2012-03-02 Bonding apparatus, bonding system, bonding method, program, and computer storage medium TW201250900A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011047152A JP2012186245A (ja) 2011-03-04 2011-03-04 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Publications (1)

Publication Number Publication Date
TW201250900A true TW201250900A (en) 2012-12-16

Family

ID=46798014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106986A TW201250900A (en) 2011-03-04 2012-03-02 Bonding apparatus, bonding system, bonding method, program, and computer storage medium

Country Status (3)

Country Link
JP (1) JP2012186245A (ja)
TW (1) TW201250900A (ja)
WO (1) WO2012121046A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624892B (zh) * 2014-11-25 2018-05-21 東京威力科創股份有限公司 接合方法、程式、電腦記錄媒體、接合裝置及接合系統

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5959216B2 (ja) * 2012-02-06 2016-08-02 日東電工株式会社 基板搬送方法および基板搬送装置
KR101470921B1 (ko) * 2012-10-16 2014-12-10 주식회사 글로벌스탠다드테크놀로지 기판 합착장치 및 기판 합착 방법
CN103240561B (zh) * 2013-04-28 2014-11-26 南京工业大学 一种悬空金丝球焊用工作台
JP6348500B2 (ja) 2013-09-25 2018-06-27 芝浦メカトロニクス株式会社 吸着ステージ、貼合装置、および貼合基板の製造方法
JP6120749B2 (ja) * 2013-10-25 2017-04-26 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
US10580752B2 (en) 2014-10-17 2020-03-03 Bondtech Co., Ltd. Method for bonding substrates together, and substrate bonding device
JP6407803B2 (ja) * 2015-06-16 2018-10-17 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
WO2018028801A1 (de) 2016-08-12 2018-02-15 Ev Group E. Thallner Gmbh Verfahren und probenhalter zum gesteuerten bonden von substraten
US20220266312A1 (en) * 2019-07-10 2022-08-25 Tokyo Electron Limited Separating apparatus and separating method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175232B2 (ja) * 1991-09-30 2001-06-11 ソニー株式会社 半導体ウェーハの接着方法
JP3661950B2 (ja) * 1994-09-29 2005-06-22 芝浦メカトロニクス株式会社 半導体製造装置
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
JP3751972B2 (ja) * 2003-12-02 2006-03-08 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに表面活性化装置及びこの装置を備えた接合装置
JP5320736B2 (ja) * 2007-12-28 2013-10-23 株式会社ニコン 半導体ウエハ貼り合わせ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624892B (zh) * 2014-11-25 2018-05-21 東京威力科創股份有限公司 接合方法、程式、電腦記錄媒體、接合裝置及接合系統

Also Published As

Publication number Publication date
JP2012186245A (ja) 2012-09-27
WO2012121046A1 (ja) 2012-09-13

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