201240805 六、發明說明： 【發明所屬之技術領域】 本發明係有關於電路基板之製造方法及產σσ ’特別係^曰 種具導熱石墨之基板之製造方法及虞品。 【先前技術】 - 按’ 一般印刷電路基板係在一絕緣板上塗佈一銅箔層，然 後再對該基板進行加工製程如鑽孔、蝕刻、防焊及SMT(表面 黏著技術）等工作，而形成一具有電子零件及電子電路的印刷 電路板。 一印刷電路板在進行驅動一設備的工作時’設於該印刷電 路板上的某些電子零件如電容、電晶體或中央處理器（CPU)等 會產生高熱（溫），若這些電子零件的高熱（溫）沒有被有效地散 熱時’一設備如高亮度LED燈的效能就會降低，更嚴重者， 某些電子零件會燒毀，這使得該設備就不能工作如LED燈不 亮0 為了解決散熱問題，進一步發展有鋁基板者，「鋁基板」 雷名ηιτ紹當基材的基板’紹基板導熱快’但銘材質也導 導係數仍然斤與基板之間設有一絕緣層；由於鋁基板的熱傳 者，、铭基^在進限制，有時已經無法應付愈來愈高的溫度，再 :材=:=程中如㈣也要相當的注意，止 【發明内容】 方法ίϊ:之i:;::提供-種具導熱石墨之基板之製造 本發明之欠目 方法及產品，其具右鲈，槌供種具導熱石墨之基板之製造 、、句殿低的產品加工士 緣是，為了達成上述 。 之基板之製造方法及產^的本發明係提供一種具導熱石墨 片、在該石墨片一伽而/f，其方法包含下列步驟：選取一石墨 序設有一絕緣層及一導電層而形成一 201240805 基板單元、以-力量壓合該基板單元並以_能量波施予該基板 單凡、移除該力量及該能量&;本發明所揭具導熱石墨之基板 之產品包含-石墨片一絕緣層及—導電層，該石墨片一側面 依序設有該絕緣層及該導電層。 以下，兹就本發明-較佳實施例配合圓式做更進一步說明 如后。 第一圖係本發明之製造方法流程圖。 第二圖係本發明之產品之實施例之立體分解示意圖 第三圖係本發明之產品之實施例之剖視示意圖。 第四圖係本發明之產品之一絕緣層之剖視示意圖。 第五及六圖係本發明實施步驟103之示意圖。 【實施方式】 ^ 請參閱第-至六圖，本發明所揭具導熱石墨之基板之製造 方法’其包含下列步驟： 步驟101:選取一石墨片（J2)。 $驟102··在該石墨片（⑴一側面依序設有一絕緣層（⑷ 及一導電層（16)而形成一基板單元（1)。 步驟103:以-力量壓合該基板單元 並以 施予該基板單元（1)。 w反 步驟104 :移除該力量及該能量波。 關於本發明之前述步驟進一步說明如下： ι = Π12)之材質可以選取一般的石墨，也可選取為 三維等方性石墨係在x轴、y軸及z軸方向 均具有較佳的熱傳導效能。 該絕緣層04)係用以絕緣該石墨片（12)及該導電層（ :’該絕緣層（⑷係可以一熱固型可導熱黏膠如一環 以片（12) 一側面，該絕緣層（14)的導熱係數可 以在100〜500w/m-k者。 該導電層（I6)係設為一銅箔層，該導 塗佈方式於該絕緣層（14)，該導電層( 16)係可以 守€層U6)也可以預先製成 201240805 一銅箔膜，然後再放置於該絕緣層（14)。 晴再參閱第四圖’該絕緣層（14)也可以一熱固型可導熱 黏膠（42)塗佈或混合一纖維材如玻璃纖維或碳纖維而 形成一熱固型薄膜，然後再將該熱固型薄膜放置於該石墨片 • ( 12 ) —侧面。 該絕緣層（14)也可以進一步包含混合碳化矽或/及氮化 硼，以增加該絕緣層（14)的導熱率及散熱率。 月1J述步驟101及步驟1 〇2的製程係可以在常溫的環境下完 成而具有較低的製造成本。 請再參閱第五及六圖，該基板單元（D係放置於一設備 (18)之一模具（82)(如第五圖），然後以一壓力產生器（84) 如一氣壓缸或一油壓缸施加一壓力於該基板單元並以一 能量波產生器（86)發生一射頻週波或一超音波施予該基板單 元（1)(如第六圖）。 本發明利用射頻週波或超音波會穿透石墨，其頻率如每秒 振動數萬次（ 20000Hz ~50000Hz)使得該導電層（16)之金 屬振動或產生渦電流，由於振動摩擦或阻抗電流而在短時間 (0.05秒〜6秒）產生數百。c的高溫（8〇〇~90(TC)，而使該絕 緣層（14)再軟化並具有黏性的型態，在該基板單元（丨）被 施加壓力的情況下，該石墨片（12)、該絕緣層（14)及該導 電層（16)可以有效地被組合/貼合，移除該壓力及能量波， 該絕緣層（14)經此壓合及再硬化的製程而無法回復，然後該 石墨片（12)、該絕緣層（14)及該導電層（16)就被完整地 結合了’而形成具較佳導熱及散熱功效的石墨基板。 請再參閱第二及三圖，本發明所揭具導熱石墨之基板之產 品結構’其至少包含該石墨片（12)、該絕緣層（14)及該導 電層（16)。 在該石墨片（12) —側面依序設有該絕緣層（14)及該導 電層而形成該基板單元（1)。 該石墨片（12 )係可以設為一般的石墨或三維等方性石墨。 201240805 該絕緣層（14)係可以一熱固型可導熱黏膠如一環氧樹脂 塗佈於該石墨片（12) —側面。 該導電層（16)係設為一銅箔層，該導電層（16)係可以 塗佈方式於該絕緣層（14)，該導電層（16)也可以預先製成 - 一銅箔膜者而放置於該石墨片（12) —側面。 請再參閱第四圖，該絕緣層（14)也可以一熱固型可導熱 黏膠（42 )塗佈或混合一纖維材（44 )如玻璃纖維或碳纖維而 形成一熱固型薄膜。 該絕緣層（14 )也可以進一步包含混合碳化石夕或/及氮化 哪者。 【圖式簡單說明】 第一圖係本發明之製造方法流程圖。 第二圖係本發明之產品之實施例之立體分解示意圖。 第三圖係本發明之產品之實施例之剖視示意圖。 第四圖係本發明之產品之一絕緣層之剖視示意圖。 第五及六圖係本發明實施步驟103之示意圖。 【主要元件符號說明】 選取一石墨片（1 〇 1 ) 在該石墨片一侧面依序設有一絕緣層及一導電層而形成一基 板單元（102) 以一力量壓合該基板單元並以一能量波施予該基板單元（1〇3) 移除該力量及該能量波（1〇4) 石墨片（12) 基板單元（1 ) 絕緣層（14) 黏膠（42) 導電層（16) 纖維材（44) 5201240805 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a circuit board and a method for producing a substrate having a thermally conductive graphite, and a product for producing σσ'. [Prior Art] - A general printed circuit board is coated with a copper foil layer on an insulating board, and then the substrate is processed by processes such as drilling, etching, solder masking, and SMT (Surface Adhesion Technology). A printed circuit board having electronic components and electronic circuits is formed. When a printed circuit board is used to drive a device, certain electronic components such as capacitors, transistors, or central processing units (CPUs) disposed on the printed circuit board generate high heat (temperature) if these electronic components are When high heat (temperature) is not effectively dissipated, the performance of a device such as a high-brightness LED lamp will decrease. More seriously, some electronic components will burn out, which makes the device unable to work as the LED lamp does not light. Heat dissipation problem, further development of aluminum substrate, "aluminum substrate" Lei Ming ηιτ Shaodang substrate of the substrate 'slow substrate heat conduction fast', but the material also has a conductivity coefficient between the jin and the substrate is provided with an insulating layer; The heat passer, Mingji ^ in the limit, sometimes can not cope with the ever higher temperature, and then: material =: = Cheng Zhongru (4) also pays considerable attention to the end of the [invention] method ϊ: i: ;::Providing the manufacture of a substrate with thermal graphite. The method and product of the present invention have a right-handed cymbal, which is used for the manufacture of a substrate with a heat-conducting graphite, and the product processing of the sentence hall is low, in order to Reach the above . The invention relates to a method for manufacturing a substrate and a method for producing the same, which provides a thermally conductive graphite sheet, wherein the graphite sheet is gamma/f, the method comprises the steps of: selecting a graphite sequence to provide an insulating layer and a conductive layer to form a 201240805 The substrate unit presses the substrate unit with a force and applies the substrate with _ energy wave to remove the force and the energy & the product of the substrate of the thermally conductive graphite of the present invention comprises - graphite sheet The insulating layer and the conductive layer, the insulating layer and the conductive layer are sequentially disposed on one side of the graphite sheet. Hereinafter, the present invention will be further described with respect to the preferred embodiment. The first figure is a flow chart of the manufacturing method of the present invention. The second drawing is a schematic exploded view of an embodiment of the product of the present invention. The third drawing is a schematic cross-sectional view of an embodiment of the product of the present invention. The fourth figure is a schematic cross-sectional view of an insulating layer of one of the products of the present invention. The fifth and sixth figures are schematic views of the implementation of step 103 of the present invention. [Embodiment] ^ Please refer to Figures 1-6, a method for manufacturing a substrate of thermally conductive graphite according to the present invention, which comprises the following steps: Step 101: Select a graphite sheet (J2). $102······························································· The substrate unit (1) is applied. wStep 104: The force and the energy wave are removed. The foregoing steps of the present invention are further described as follows: ι = Π12) The material can be selected from general graphite or three-dimensional. The isotropic graphite has better thermal conductivity in the x-axis, y-axis and z-axis directions. The insulating layer 04) is used to insulate the graphite sheet (12) and the conductive layer (: 'the insulating layer ((4) A heat-curable heat-conductive adhesive such as a ring (12) side, the thermal conductivity of the insulating layer (14) may be 100~500w/mk. The conductive layer (I6) is set to a copper foil. The layer is coated on the insulating layer (14), the conductive layer (16) can be adhered to the layer U6) or the 201240805 copper foil film can be pre-formed and then placed on the insulating layer (14). Please refer to the fourth figure again. 'The insulating layer (14) can also be coated or mixed with a thermosetting heat conductive adhesive (42). The fiber material, such as glass fiber or carbon fiber, forms a thermosetting film, and then the thermosetting film is placed on the graphite sheet (12)-side. The insulating layer (14) may further comprise mixed tantalum carbide or / And boron nitride to increase the thermal conductivity and heat dissipation rate of the insulating layer (14). The process of step 101 and step 1 〇2 can be completed in a normal temperature environment and has a low manufacturing cost. Referring to Figures 5 and 6, the substrate unit (D is placed in a mold (82) of a device (18) (as shown in Figure 5), and then a pressure generator (84) such as a pneumatic cylinder or a hydraulic cylinder Applying a pressure to the substrate unit and applying a radio frequency cycle or an ultrasonic wave to the substrate unit (1) by an energy wave generator (86) (as shown in FIG. 6). The invention utilizes a radio frequency cycle or ultrasonic wave to wear Through graphite, its frequency is tens of thousands of times per second (2000 Hz ~ 50000 Hz), causing the metal of the conductive layer (16) to vibrate or generate eddy current, which is generated in a short time (0.05 sec to 6 sec) due to vibration friction or impedance current. High temperature of hundreds.c (8〇〇~90(TC), And the insulating layer (14) is softened and has a viscous pattern, and the graphite sheet (12), the insulating layer (14) and the conductive layer are applied under pressure of the substrate unit (丨). 16) can be effectively combined/fitted to remove the pressure and energy waves, the insulating layer (14) cannot be recovered by the process of pressing and re-hardening, and then the graphite sheet (12) and the insulating layer ( 14) and the conductive layer (16) is completely combined to form a graphite substrate having better heat conduction and heat dissipation. Please refer to the second and third figures, the product structure of the substrate of the thermally conductive graphite disclosed in the present invention. 'It contains at least the graphite sheet (12), the insulating layer (14) and the conductive layer (16). The insulating layer (14) and the conductive layer are sequentially provided on the side of the graphite sheet (12) to form the substrate unit (1). The graphite sheet (12) can be made of general graphite or three-dimensional isotropic graphite. 201240805 The insulating layer (14) can be coated on the side of the graphite sheet (12) by a thermosetting heat conductive adhesive such as an epoxy resin. The conductive layer (16) is a copper foil layer, and the conductive layer (16) can be applied to the insulating layer (14). The conductive layer (16) can also be made in advance - a copper foil film And placed on the graphite sheet (12) - side. Referring to the fourth figure, the insulating layer (14) may also coat or mix a fiber (44) such as glass fiber or carbon fiber with a thermosetting heat conductive adhesive (42) to form a thermosetting film. The insulating layer (14) may further comprise a mixed carbonized carbide or/and nitride. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of the manufacturing method of the present invention. The second drawing is a perspective exploded view of an embodiment of the product of the present invention. The third drawing is a schematic cross-sectional view of an embodiment of the product of the present invention. The fourth figure is a schematic cross-sectional view of an insulating layer of one of the products of the present invention. The fifth and sixth figures are schematic views of the implementation of step 103 of the present invention. [Description of main component symbols] A graphite sheet (1 〇1) is selected. An insulating layer and a conductive layer are sequentially disposed on one side of the graphite sheet to form a substrate unit (102) to press the substrate unit with a force and Energy wave is applied to the substrate unit (1〇3) to remove the force and the energy wave (1〇4) graphite sheet (12) substrate unit (1) insulating layer (14) adhesive (42) conductive layer (16) Fiber (44) 5