TW201239375A - Circuit pattern inspection instrument - Google Patents

Circuit pattern inspection instrument Download PDF

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Publication number
TW201239375A
TW201239375A TW101102457A TW101102457A TW201239375A TW 201239375 A TW201239375 A TW 201239375A TW 101102457 A TW101102457 A TW 101102457A TW 101102457 A TW101102457 A TW 101102457A TW 201239375 A TW201239375 A TW 201239375A
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Taiwan
Prior art keywords
electrode
power supply
inspection
pattern
conductive pattern
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TW101102457A
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Chinese (zh)
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TWI427302B (en
Inventor
Hiroshi Hamori
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Oht Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/303Contactless testing of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2825Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

A circuit pattern inspection instrument applying electrodes capacitively coupled to a conductive pattern by non-contact can not detect a defect of a conductive pattern opposite to electrodes. The circuit pattern inspection instrument is equipped with complementary electrodes for detecting a defect toward the conductive pattern opposite to the electrodes of inspection electrode pair.

Description

201239375 六 發明說明: 【發明所屬之技術領域^ 本毛月有關⑨冑能夠以非接觸的方式檢查 上導電㈣的缺陷的電路_檢錄置。成在基板 【先前技術】 梦置係以在玻璃基板上使用液晶的液晶顯示 裝置、或者利用電漿的電漿顯示裝置為主流。在此等 置的製造步驟中’形成在玻璃基板上成為電路配線的導雷 圖案進行有無斷路以及短路的缺陷檢查。 作為導電圖案的檢查方法,例如在曰本專利特開 2004-191381號公報巾,錢少2個檢查騎接近導體二 案,一邊以非接觸方式在與導體圖案電容耦合的狀態下移 動,一邊從一根檢查探針施加交流檢查信號,並利用另—根 檢查探針檢測傳輸導體圖案的交流檢查信號。藉由檢測信號 的波形變化,進行在導電圖案中有無斷路以及短路的檢杳。 使用以非接觸方式電容耦合於上述導體圖案的檢查電極 的檢查裝置,由於與導電圖案相對向的檢查電極的分開距離 越短’或者對向面積越大,耦合電容就變得越大,因此,可 使傳輸時的損失變少’即使施加相同的檢查信號也能夠增大 檢測信號的值。 在檢查電極的分開距離中,在與導體圖案不接觸的範圍内 接近而設定。該分開距離’由於檢查對象的基板越大,基板 101102457 3 201239375 自身的曲撓和扭曲就會敍,因此,根據其减限 離。 叹小足巨 因此^查電極,特別是將檢查用交流信號施加於導 案的供電電極,由於對向的面積越大,施加於導體圖案^ 查信號就變得越大,因此,從感測器電極所得到的檢剛^ 也會變大’能夠減少從外部^_訊成分所造成的影響竣 但是,在增大供電電極的面積的情況下,發生與該供^ %电才蛋 相對向的導體圖案部分即使產生斷路等缺陷也不能適卷地 檢測出的情況。 【發明内容】 依照本發明的實施形態係提供一種電路圖案檢查裴置, 一. 特徵在於,具備有:檢查電極對,將多個導電圖案形成為广 狀的基板作為檢查對象,具有對於上述導電圖案中的第〜= 電圖案,同時對向的第一供電電極以及第一感測器電拖.、、 充電極對,具有以夾持至少上述第一供電電極所對向的部位 部分的導電圖案的方式進行分開,而以在同一導電圖素上相 對向的方式配置的第二供電電極以及第二感測器電極;移動 部,將上述檢查電極對與上述補充電極對一體地保持,在上 述導電圖案的上方以一定的距離分開,而朝與該導電圖索的 行交叉的方向移動;檢查信號供給部,在利用上述移動部所 進行上述檢查電極對和上述補充電極對的移動中,對上述第 一供電電極以及上述第二供電電極供給由交流信號所構成 4 10Π02457 201239375 的檢查化號,並且使該檢查信號依序施加於上述第一供電電 極以及上述第二供電電極對向而電容耦合的各個導電圖 案;以及缺關定部,將合併分別電钟合㈣加上述檢查 信號的上述導電圖案並藉由上述第—感測器電極取得的第 一檢測信號、以及通過上述第二制器電 供電電極所對向的部位部分的導電圖案的導電 付第一檢測信號的檢 事 ’、 比較用叫斷有無_。、事先規^故基準值進行 【實施方式】 以下參照圖式針對本發明的實施方式〆 本發明的電路圖牵於杏驴罢+制 订坪、田說明。 ㈣路圖料錄置,在製造步驟巾 形成在破螭製的基板上多行的導電成為 =和短路的缺陷。作為檢査物件的導 於液日日顯不面板和觸碰式面板等的電路 _ 多行電性分離的導電圖案、或者全部的導2域列成 短路棒所連接的樹齒狀的導電圖案。並且==側由 各導電圖案’只要能夠確㈣案的位置使=板上的 等間隔的配置,也能夠進行檢查。 使不疋平行以及 此外,當後述的檢查部移動時,在相同的導 口 要疋供電電極與感測器電極為可相對向的圖案,即使_ 圖案的中途存在有彎曲或寬度之變化,也 查。在以下的說明中,為了易於理解,心㈣地進行檢 定間隔形成直 101102457 201239375 線行狀的導電圖案作為檢查對象進行說> a月。 圖1是表示具有本發明的補充電極的電路圖案檢查裝置 概略構成的圖式。圖2是表示檢查電極和補充電極的概略構 成的圖式。圖3是表示電路圖案檢查裝置的檢測信號處理部 一構成例的圖式。 如圖1所示,電路圖案檢查裝置i具備有:檢查部2,在 形成於玻璃基板等具有絕緣性的基板1〇()上多行的導電體 圖案101上方,分開既定距離而設置;移動機構3,維持檢 查部2的分開(非接觸)狀態,並在導電體圖案的上方交 叉的方向m移動;驅動控制部4’對移動機構3進行驅動控 制;檢查信號供給部13,將由交流所構成的檢查信號供給 檢查部2 ;檢測信號處理部5 ’對從檢查部2所檢測出的檢 測信號實施後述信號處理;控制部6 ’控制裝置整體;顯示 部8,顯示包含檢查結果的檢查資訊;以及輸入部14,由用 以輸入動作指示或各種資料等的鍵盤或觸碰面板等所構成。 控制部6具備有:缺陷判定部7,根據已進行信號處理的 檢測信號所含有的特徵信號(峰值的變化),判斷導電圖案是 否為缺陷;記憶體9,儲存使用者選擇的設定條件和檢查用 程式等;以及中央處理部(CPU)l〇 ’利用程式或所設定的運 算條件進行運算處理。 記憶體9為一般的記憶體,利用例如R〇M(Read Only Memory ;唯讀記憶體)、RAM(Random Access Memory ;隨 101102457 6 201239375 機存取記憶體试者快閃記憶體料儲存控制用程式、各種 運算用程式以及資料(表格)等。中央處理部(cpu)i〇也可以 利用個人電腦。 如圖2所示,檢查部2由用以檢測導電圖案的缺陷的檢查 電極對2卜以及用以檢測與檢查電極對21相對向部分的導 電圖案的缺陷的補充電極對22所構成。並且,檢查部2分 割成兩個電極基板(第-電極基板)u以及電極基板(第二電 極基板)12。 此等電極基板1卜12由例如水平關節型機器人(scara Robot)-體連接,並同時進行移動。在圖】巾,雖然表示配 置在導電11案的兩端的實例,當然,配置的位置並不限定於 , 兩端,也可以將任意一個或者兩個配置在導電圖案的内侧。 即,只要是與導電圖案與供電電極和感測器電極對向的位 置,既可以在檢查對象的基板上分開地(例如,導電圖案的 兩端)配置,相反地,也可以配置在接近的位置。這是由於 檢查部2藉由電容耦合檢測出檢測信號,因此,當導電圖案 中的電谷因斷路而產生變化時,由於與正常的圖案不同,因 此,會成為檢測信號峰值的變化而出現。 k查電極對21將供電電極(第一供電電極)21a配置於電極 基板12,並且將感測器電極(第—感測器電極)21b配置於電 極基板11。供電電極21a和感測器電極21b以存在於相同 導電圖案上方的方式設置於電極基板u、12上。並且,檢 101102457 201239375 查電極對21可以為一對,也可以設置多對的檢查電極對。 而且,供電電極21a也可以具有跨多個例如兩個導電圖案的 寬度。感測器電極21b,由於個別檢測缺陷的導電圖案,因 此只要不跨在鄰接的導電圖案上,可以為一個導電圖案的寬 度以上。 補充電極對22由供電電極(第二供電電極)22a和感測器電 極(第二感測器電極)22b所構成,以與供電電極21a並列地 設置的方式配置於電極基板12上。供電電極22a和感測器 電極22b以與相同的導電圖案對向、並且夾持與供電電極 21a相對向的導電圖案的部分(作為部分的導電圖案)的方式 隔著間隔,並配置成能夠檢查該部分的導電圖案。較佳為雖 然也可以隔著該部分的導電圖案全部而配置,但可以利用使 感測器電極22b變小’至少使供電電極22a以不與部分的導 電圖案對向的方式分開地配置即可。而且,檢查電極對21 的供電電極21a和補充電極對22都在導電圖案上方相對向 的位置,分開不受電性影響的圖案數以上而配置。 在本實施形態中,由於利用施加藉由電容耦合所產生的檢 查信號,因此,檢查信號供給部13供給至供電電極21a、 22a的檢查信號都為相同電壓值、且相同頻率的交流信號、 或者為矩形波(脈衡)信號。所施加的檢查信號的相位也可以 為同步的,也可以異有相位差。 此等電極基板11、12藉由移動機構3從供電電極2ia、 101102457 8 201239375 22a對於導電圖案101施加檢查信號,且為感測器電極21b、 22b檢測傳輸導電圖案ι〇1的檢查信號作為檢測信號的狀 態’並且在導電圖案上方維持相同分開距離(測定間隙)的狀 態下,以與導電圖案的叉(橫越)的方式移動。而且,也 可以以在電極基板11、12等搭載距離感測器,在移動時計 測到檢查對象的基板的距離,並以追隨該測定值的方式,具 備有使電極的高度(到基板的距離)變化的升降功能。 檢測彳§號處理部5由如下所構成··放大電路18,將由感 測器電極21b所檢測出的檢測信號以及由感測器電極22b 所檢測出的補足檢測信號所構成的使各自的微小類比檢測 信號放大到既定的電壓水準(可判斷優劣的水準);帶通濾波 器19,將由放大電路18所放大檢測信號的雜音成分去除, 並使必要的頻帶通過;整流電路20,將來自帶通濾波器19 的檢測信號進行全波整流;以及平滑電路21,對經過全波 整流的檢測信號進行平滑。再者,進行全波整流的整流電路 20以及對檢測信號進行平滑的平滑電路2丨並非必備者。 檢測信號以及補足檢測信號藉由檢查信號處理部5變換 為經過實施既定的#號處理(放大、雜訊去除等)的缺陷判定 信號,並發送至進行缺陷判定的缺陷判定部7。在缺陷判定 部7中,根據對每個導電圖案的缺陷判定信號判斷有無缺 陷,將在全部的導電圖案101中的判斷結果顯示在顯示部8 的晝面上。 101102457 9 201239375 而且對於將產生缺陷的導電圖案中的缺陷產生位置進行 特疋作為缺陷位置判定手段,另外具備設有沿著該圖案以 =接觸方式在上方移動的同樣的電極對(供電電極以及感測 斋電極)的圖案縱貫移動機構15。此圖案縱貫移動機構為例 如在將移動機構3中的供電電極21a與感測器電極训進行 連接的域(或者臂構件)上設置導轨等,並在該導轨上沿著 圖案方向η移動的機構。 並且,本實施形態的補充電極對22亦可以以能夠與供電 電極2U 77離的方式使電極基板12成為分割構造而具備圖 案縱貫移動機構,從而使補充電極對22具有檢測不良導電 圖案中缺陷位置的功能。即,在進行導電圖案中的缺陷檢查 的情況時,與供電電極21a—體地移動,在將導電圖案中的 缺陷產生位置進行特定的情況下,與供電電極21a分開地移 動。 而且雖然未圖示,但以與相較於感測器電極21 b離開數 個圖案(不$來自從供電電極21a所施加的檢查信號的電性 影響的圖案數)的導電圖案相對向的方式設置有雜訊用感測 器電極。檢測信號處理部5進行從由感測器電極2丨b所檢測 出的檢號將由雜訊用感測器電極所得到的檢測信號,即 雜訊信號減掉的雜訊去除處理。 在以上所說明的本實施形態的電路圖案檢查裝置中,檢測 導電圖案的缺陷的檢查電極對可利用增大與導電圖案對向 101102457 in 201239375 的供電電極的面積’檢測更大的檢測信號,藉此,排除所產 生的雜°孔的影響,並進行缺陷檢查中正確的優劣判定。而 且’對於與檢查電極對的供電電極對向的部分的導電圖案, 利用補充電極對進行缺陷檢測,並進行優劣判定。因此,即 使&大k查電極對的供電電極的對向面積,由於能夠利用補 充電極補足對於檢查電極對的非檢測部位的檢查,所以,能 夠實現正確的缺陷檢查以及優劣判定。 此外’補充電極對由於具備有圖案縱貫移動機構,因此, 對於判定為具有缺陷的導電圖案,能夠同時具有檢測該缺陷 位置的功能。 接著’針對本發明的第一實施形態的變形例進行說明。 在本變形例的構成中,檢查電極對和補充電極對的配置與 上述實施形態的電路圖案檢查裝置的配置不同。其他的構成 部位則與實施形態相同,並省略其說明,在相同的部位附加 相同的元件符號。 圖4表示本變形例中檢查電極對41和補充電極對42的構 成例。檢查電極對41與上述相同地,在電極基板11設有感 測器電極41b,在電極基板12設有供電電極41a。相對與此’ 補充電極42與檢查電極對41相反地,在電極基板丨丨設有 供電電極42a’在電極基板12設有感測器電極42卜即,為 檢查電極對41以及補充電極對42的供電電極與補充電極相 互對調的構成。201239375 6 Description of the invention: [Technical field to which the invention pertains] This is a circuit that can detect the defects of the upper conductive (four) in a non-contact manner. Forming on a substrate [Prior Art] A liquid crystal display device using liquid crystal on a glass substrate or a plasma display device using plasma is mainly used. In the manufacturing steps described above, the defect detection pattern in which the wiring pattern is formed as a circuit wiring on the glass substrate is subjected to the presence or absence of the disconnection and the short circuit. As a method of inspecting a conductive pattern, for example, in the case of the Japanese Patent Application Laid-Open No. 2004-191381, the two less-inspected rides approaching the conductor two are moved in a state of being capacitively coupled to the conductor pattern in a non-contact manner. An inspection probe applies an AC inspection signal and detects an AC inspection signal of the transmission conductor pattern using a further inspection probe. The detection of the presence or absence of an open circuit and a short circuit in the conductive pattern is performed by detecting a change in the waveform of the signal. In the inspection apparatus using the inspection electrode capacitively coupled to the conductor pattern in a non-contact manner, the coupling distance becomes larger due to the shorter separation distance of the inspection electrode opposed to the conductive pattern, or the larger the opposing area, the larger the coupling capacitance becomes. It is possible to reduce the loss during transmission. The value of the detection signal can be increased even if the same inspection signal is applied. In the separation distance of the inspection electrode, it is set close to the range in which the conductor pattern is not in contact. The separation distance' is larger due to the larger substrate of the inspection object, and the distortion and distortion of the substrate 101102457 3 201239375 itself are described, and therefore, according to the reduction limit. Sighing the small foot so that the electrode is inspected, in particular, the AC signal for inspection is applied to the power supply electrode of the guide. As the opposing area is larger, the signal applied to the conductor pattern becomes larger, so the sensing is performed. The detection obtained by the electrode will also become larger, which can reduce the influence of the component from the external component. However, when the area of the power supply electrode is increased, the opposite direction to the supply electrode is generated. Even if a defect such as an open circuit occurs in the conductor pattern portion, it cannot be detected in a suitable manner. According to an embodiment of the present invention, there is provided a circuit pattern inspection device, characterized in that: an inspection electrode pair is provided, and a plurality of conductive patterns are formed into a wide substrate as an inspection object, and the conductive layer is provided The first == electric pattern in the pattern, the opposite first power supply electrode and the first sensor are electrically dragged, and the pair of charging poles have a conductive portion for clamping a portion of the portion opposite to the first power supply electrode Separating the patterns, and the second power supply electrode and the second sensor electrode disposed opposite to each other on the same conductive pixel; and the moving portion integrally holding the pair of inspection electrodes and the pair of complementary electrodes The conductive pattern is separated by a predetermined distance and moved in a direction intersecting the row of the conductive pattern. The inspection signal supply unit moves the inspection electrode pair and the complementary electrode pair by the moving portion. Supplying an inspection signal of 4 10 Π 02457 201239375 composed of an alternating current signal to the first power supply electrode and the second power supply electrode And the inspection signal is sequentially applied to each of the conductive patterns of the first power supply electrode and the second power supply electrode that are capacitively coupled to each other; and the defective portion is combined with the electrical conduction and the fourth conductive signal. Comparing the pattern with the first detection signal obtained by the first sensor electrode and the inspection of the first detection signal by the conduction of the conductive pattern of the portion of the second power supply electrode Use to break the presence or absence of _.实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施(4) Road map material recording, in the manufacturing step towel, a plurality of rows of conductive defects formed on the broken substrate become defects and short circuits. As the inspection object, a circuit such as a panel and a touch panel is displayed. _ A plurality of electrically conductive conductive patterns or all of the conductive domains are arranged in a tree-toothed conductive pattern to which the shorting bars are connected. Further, the == side can be inspected by the respective conductive patterns as long as the positions of the cases can be confirmed to be equal intervals on the board. In addition, when the inspection unit described later moves, the power supply electrode and the sensor electrode are in a pattern that can be opposed to each other at the same guide port, and even if there is a change in curvature or width in the middle of the pattern, check. In the following description, in order to make it easy to understand, the core (4) is subjected to a test interval to form a conductive pattern of a straight line 101102457 201239375. Fig. 1 is a view showing a schematic configuration of a circuit pattern inspection device having a supplementary electrode of the present invention. Fig. 2 is a view showing a schematic configuration of an inspection electrode and a supplementary electrode. Fig. 3 is a view showing a configuration example of a detection signal processing unit of the circuit pattern inspection device. As shown in FIG. 1 , the circuit pattern inspection device 1 includes an inspection unit 2 that is disposed above a predetermined distance on a plurality of rows of conductor patterns 101 formed on an insulating substrate 1 such as a glass substrate; The mechanism 3 maintains the separated (non-contact) state of the inspection unit 2 and moves in the direction m in which the conductor pattern intersects; the drive control unit 4' drives and controls the movement mechanism 3; and the inspection signal supply unit 13 is operated by the exchange unit The inspection signal supply unit 2 and the detection signal processing unit 5' perform signal processing described later on the detection signal detected from the inspection unit 2; the control unit 6' controls the entire apparatus; and the display unit 8 displays inspection information including the inspection result. And the input unit 14 is constituted by a keyboard or a touch panel for inputting an operation instruction or various materials. The control unit 6 includes a defect determination unit 7 that determines whether or not the conductive pattern is a defect based on a characteristic signal (change in peak value) included in the detection signal subjected to signal processing, and stores the setting condition and inspection selected by the user. The program or the like; and the central processing unit (CPU) 〇' use the program or the set arithmetic conditions to perform arithmetic processing. The memory 9 is a general memory, and uses, for example, R〇M (Read Only Memory), RAM (Random Access Memory; with 101102457 6 201239375 machine access memory tester flash memory storage control Program, various calculation programs, data (forms), etc. The central processing unit (cpu) can also use a personal computer. As shown in Fig. 2, the inspection unit 2 is provided with inspection electrode pairs for detecting defects of the conductive pattern. And a complementary electrode pair 22 for detecting a defect of the conductive pattern opposite to the inspection electrode pair 21. The inspection portion 2 is divided into two electrode substrates (first electrode substrate) u and an electrode substrate (second electrode) Substrate) 12. The electrode substrates 1 are connected by, for example, a horizontal scoro robot, and are simultaneously moved. In the figure, the towel shows an example of being disposed at both ends of the conductive case, of course, the configuration The position is not limited to the two ends, and either one or both of them may be disposed inside the conductive pattern. That is, as long as it is opposite to the conductive pattern and the power supply electrode and the sensor electrode. It may be disposed separately on the substrate of the inspection object (for example, both ends of the conductive pattern), or conversely, may be disposed at a close position. This is because the inspection unit 2 detects the detection signal by capacitive coupling, and therefore, When the electric valley in the conductive pattern changes due to an open circuit, it is different from the normal pattern, and thus appears as a change in the peak value of the detection signal. The k-check electrode pair 21 places the power supply electrode (first power supply electrode) 21a on The electrode substrate 12 and the sensor electrode (the first sensor electrode) 21b are disposed on the electrode substrate 11. The power supply electrode 21a and the sensor electrode 21b are disposed on the electrode substrate u, 12 in such a manner as to exist above the same conductive pattern. Further, the test 101102457 201239375 may have a pair of check electrodes 21, and may also be provided with pairs of check electrode pairs. Moreover, the power supply electrode 21a may also have a width spanning a plurality of, for example, two conductive patterns. The sensor electrode 21b Since the conductive pattern of the defect is individually detected, it may be more than the width of one conductive pattern as long as it does not straddle the adjacent conductive pattern. The electrode pair 22 is composed of a power supply electrode (second power supply electrode) 22a and a sensor electrode (second sensor electrode) 22b, and is disposed on the electrode substrate 12 so as to be arranged in parallel with the power supply electrode 21a. The power supply electrode 22a And the sensor electrode 22b is spaced apart from the same conductive pattern and sandwiches a portion of the conductive pattern (as a partial conductive pattern) opposed to the power supply electrode 21a, and is configured to be capable of inspecting the portion Preferably, the conductive pattern may be disposed across all of the conductive patterns of the portion, but the sensor electrode 22b may be made smaller by at least the power supply electrode 22a is separated from the partial conductive pattern. Configuration can be. Further, both the power supply electrode 21a and the complementary electrode pair 22 of the electrode pair 21 are inspected at positions facing each other above the conductive pattern, and are disposed apart from the number of patterns not affected by the electrical properties. In the present embodiment, since the inspection signal generated by the capacitive coupling is applied, the inspection signals supplied from the inspection signal supply unit 13 to the power supply electrodes 21a and 22a are the same voltage value and the AC signal of the same frequency, or It is a rectangular wave (pulse balance) signal. The phase of the applied inspection signal may also be synchronous or may have a different phase difference. The electrode substrates 11, 12 are applied with an inspection signal to the conductive pattern 101 from the power supply electrodes 2ia, 101102457 8 201239375 22a by the moving mechanism 3, and the inspection signal for transmitting the conductive pattern ι1 is detected for the sensor electrodes 21b, 22b as detection The state of the signal 'and moves in a state of crossing (crossing) the conductive pattern in a state where the same separation distance (measurement gap) is maintained above the conductive pattern. In addition, the distance sensor may be mounted on the electrode substrates 11 and 12, and the distance of the substrate to be inspected may be measured during the movement, and the height of the electrode (the distance to the substrate) may be provided so as to follow the measurement value. ) Change the lifting function. The detection processing unit 5 is composed of the following: an amplifying circuit 18, which is composed of a detection signal detected by the sensor electrode 21b and a complementary detection signal detected by the sensor electrode 22b. The analog detection signal is amplified to a predetermined voltage level (the level of which can be judged); the band pass filter 19 removes the noise component of the detection signal amplified by the amplification circuit 18, and passes the necessary frequency band; the rectifier circuit 20 will come from the band The detection signal of the pass filter 19 performs full-wave rectification; and the smoothing circuit 21 smoothes the detection signal subjected to full-wave rectification. Further, the rectification circuit 20 that performs full-wave rectification and the smoothing circuit 2 that smoothes the detection signal are not essential. The detection signal and the complementary detection signal are converted into a defect determination signal subjected to a predetermined #th process (amplification, noise removal, etc.) by the inspection signal processing unit 5, and transmitted to the defect determination unit 7 that performs the defect determination. The defect determination unit 7 determines whether or not there is a defect based on the defect determination signal for each of the conductive patterns, and displays the determination result in all of the conductive patterns 101 on the pupil surface of the display unit 8. 101102457 9 201239375 Further, the position of the defect in the conductive pattern in which the defect is generated is specifically used as the defect position determining means, and the same electrode pair (power supply electrode and sense) which is moved upward along the pattern in the contact mode is provided. The pattern of the self-aligning electrode runs through the moving mechanism 15. The pattern extending mechanism is, for example, a guide rail or the like provided on a domain (or an arm member) that connects the power supply electrode 21a and the sensor electrode in the moving mechanism 3, and is along the pattern direction η on the guide rail. Mobile agency. Further, in the complementary electrode pair 22 of the present embodiment, the electrode substrate 12 may have a pattern-dividing mechanism so that the electrode substrate 12 can be separated from the power supply electrode 2U 77, and the complementary electrode pair 22 can detect defects in the defective conductive pattern. The function of the location. In other words, when the defect inspection in the conductive pattern is performed, the power supply electrode 21a is physically moved, and when the position of the defect in the conductive pattern is specified, the power supply electrode 21a is moved separately. Further, although not shown, the direction opposite to the conductive pattern which is separated from the sensor electrode 21 b by a plurality of patterns (not the number of patterns from the electrical influence of the inspection signal applied from the power supply electrode 21a) A sensor electrode for noise is provided. The detection signal processing unit 5 performs a noise removal process of subtracting the detection signal obtained by the noise sensor electrode from the sensor detected by the sensor electrode 2丨b, that is, the noise signal. In the circuit pattern inspection device of the present embodiment described above, the inspection electrode pair that detects the defect of the conductive pattern can detect a larger detection signal by increasing the area of the power supply electrode of the conductive pattern opposite 101102457 in 201239375. Therefore, the influence of the generated pores is excluded, and the correctness and inferiority determination in the defect inspection are performed. Further, the defect pattern is detected by the complementary electrode pair with respect to the conductive pattern of the portion opposed to the power supply electrode of the inspection electrode pair, and the quality is judged. Therefore, even if & large k checks the opposing area of the power supply electrode of the electrode pair, since the inspection of the non-detection portion of the inspection electrode pair can be complemented by the complementary charging electrode, accurate defect inspection and superiority and poorness determination can be realized. Further, since the complementary electrode pair is provided with the pattern vertical moving mechanism, it is possible to simultaneously have a function of detecting the position of the defective conductive pattern. Next, a modification of the first embodiment of the present invention will be described. In the configuration of the present modification, the arrangement of the inspection electrode pair and the complementary electrode pair is different from the arrangement of the circuit pattern inspection device of the above-described embodiment. The other components are the same as those of the embodiment, and the description thereof will be omitted, and the same components will be denoted by the same reference numerals. Fig. 4 shows an example of the configuration of the inspection electrode pair 41 and the complementary electrode pair 42 in the present modification. The inspection electrode pair 41 is provided with the sensor electrode 41b on the electrode substrate 11 and the power supply electrode 41a on the electrode substrate 12 in the same manner as described above. The sensor electrode 42 is provided on the electrode substrate 12 opposite to the inspection electrode pair 41, and the sensor electrode 42 is provided on the electrode substrate 12, that is, the inspection electrode pair 41 and the complementary electrode pair 42. The power supply electrode and the supplementary electrode are mutually adjusted.

101102457 II 201239375 根據此構成’與檢查電極對41的供電電極41 a對向的導 電圖案的部分,能夠藉由補充電極對42進行檢查。而且, 可設置上述的雜訊用感測器電極,而進行從由感測器電極 42b所得到的檢測信號將雜訊信號減掉的雜訊去除處理。 在本變形例中,也與上述實施方式相同地,藉由增大檢查 電極對的供電電極的面積,可進行更大的檢查信號輸入,而 利用檢測比習知技術更大的檢測信號,藉此排除所產生的雜 訊的影響,而進行在缺陷檢查中的正確地優劣判定。而且, 針對與檢查電極對的供電電極對向部分的導電圖案,利用補 充電極對進行缺陷檢測,並且進行優劣判定。因此,即使增 大檢查電極對的供電電極的對向面積,由於能夠利用補充電 極補足對於檢查電極對的非檢測部位的檢查,因此,能夠實 現正確的缺陷檢查以及優劣判定。 根據本發明的實施形態,可提供一種相對於檢查部的供電 電極設置補充電極對,而施加更大的檢查信號,並且實現從 所得到的檢測信號進行導電圖案正確地優劣判定的電路圖 案檢查裝置。 【圖式簡單說明】 圖1是表示具備有本發明實施形態的補充電極的電路圖 案檢查裝置概略構成的圖式。 圖2是表示檢查電極和補充電極的概略構成的圖式。 圖3是表示電路圖案檢查裝置的檢測信號處理部一構成 101102457 12 201239375 例的圖式。 圖4是作為本發明變形例的電路圖案檢查裝置的檢查電 極和補充電極的構成例的圖式。 【主要元件符號說明】 1 電路圖案檢查裝置 2 檢查部 3 移動機構 4 驅動控制部 5 檢查信號處理部 6 控制部 7 缺陷判定部 8 顯示部 9 記憶體 10 中央處理部 11 第一電極基板 12 第二電極基板 13 檢查信號供給部 14 輸入部 15 圖案縱貫移動機構 18 放大電路 19 帶通濾波器 20 整流電路 101102457 13 201239375 21 平滑電路 21a 第一供電電極 21b 第一感測器電極 22 補充電極對 22a 第二供電電極 22b 第二感測器電極 31 放大電路 32 整流電路 33 濾波器處理電路 34 平滑電路 41 .檢查電極對 41a 供電電極 41b 感測器電極 42 補充電極對 42a 供電電極 42b 感測器電極 100 基板 101 導電體圖案 m 方向 n 方向 101102457 14101102457 II 201239375 According to this configuration, the portion of the conductive pattern opposite to the power supply electrode 41a of the inspection electrode pair 41 can be inspected by the complementary electrode pair 42. Further, the above-described noise sensor electrode can be provided, and the noise removal processing for subtracting the noise signal from the detection signal obtained by the sensor electrode 42b can be performed. Also in the present modification, as in the above-described embodiment, by increasing the area of the power supply electrode of the inspection electrode pair, a larger inspection signal input can be performed, and by detecting a detection signal larger than the conventional technique, This excludes the influence of the noise generated, and performs the correctness and badness judgment in the defect inspection. Further, for the conductive pattern of the opposing portion of the power supply electrode of the pair of inspection electrodes, the defect detection is performed using the complementary charge pair, and the quality is judged. Therefore, even if the opposing area of the power supply electrode of the pair of inspection electrodes is increased, since the inspection of the non-detection portion of the inspection electrode pair can be complemented by the replenishing electrode, accurate defect inspection and superiority and deterioration can be achieved. According to the embodiment of the present invention, it is possible to provide a circuit pattern inspecting apparatus which is provided with a complementary electrode pair with respect to the power supply electrode of the inspection portion, applies a larger inspection signal, and realizes the correctness of the conductive pattern from the obtained detection signal. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a schematic configuration of a circuit pattern inspection apparatus including a supplementary electrode according to an embodiment of the present invention. 2 is a view showing a schematic configuration of an inspection electrode and a supplementary electrode. Fig. 3 is a view showing an example of a configuration of a detection signal processing unit of the circuit pattern inspection device 101102457 12 201239375. Fig. 4 is a view showing a configuration example of an inspection electrode and a supplementary electrode of a circuit pattern inspection device according to a modification of the present invention. [Description of main component symbols] 1 Circuit pattern inspection device 2 Inspection unit 3 Movement mechanism 4 Drive control unit 5 Inspection signal processing unit 6 Control unit 7 Defect determination unit 8 Display unit 9 Memory 10 Central processing unit 11 First electrode substrate 12 Two-electrode substrate 13 inspection signal supply unit 14 input unit 15 pattern vertical movement mechanism 18 amplification circuit 19 band-pass filter 20 rectifier circuit 101102457 13 201239375 21 smoothing circuit 21a first power supply electrode 21b first sensor electrode 22 complementary electrode pair 22a second power supply electrode 22b second sensor electrode 31 amplification circuit 32 rectifier circuit 33 filter processing circuit 34 smoothing circuit 41. inspection electrode pair 41a power supply electrode 41b sensor electrode 42 supplementary electrode pair 42a power supply electrode 42b sensor Electrode 100 substrate 101 conductor pattern m direction n direction 101102457 14

Claims (1)

201239375 七、申請專利範圍: h一種電路圖錄絲4,其特徵在於且備有. 檢查電極對,將行狀形成有多 ,、秀有’ 對象,具有對於上述導電目案的基板作為檢查 第-供電電極以及第-感剛器電極.圖㈣時對向的 補充電極對,具有以夾持至少 部位之部分導電圖案的方式奸;供電電極所對向的 上相對向的方式配置的第二供 f以在同—導電圖案 移動部,將上述檢查電極對心扣及第二感測器電極; 持,在上述導電圖㈣上以_:定;4補充電極對—體地保 電圖案的行交叉的方向移動;的距離分開,而朝與該導 檢查信號供給部,在利用上述移動部所進行之上述檢杳電 極對和上述補充電極對的移動中,對上述第—供電電糾及 上述第二供電電極供給由交流錢所構成的檢查信號,並且 使該檢查信號依序施加於上述第—供電電極以及上述第二 供電電極對向並電容耦合的各個導電圖案;以及 缺陷判定部’將合併有第一檢測信號以及第二檢測信號的 才欢測彳§號,與事先規定的判定基準值進行比較,用以判斷有 無缺陷’該第一檢測信號係分別電容搞合於經施加上述檢查 信號的上述導電圖案’並藉由上述第一感測器電極而取得; 該第二檢測信號係藉由上述第二感測器電極,從包含上述第 一供電電極所對向的部位之部分導電圖案的導電體圖案而 101102457 15 201239375 取得。 2. 如申請專利範圍第1項之電路圖案檢查裝置,其中, 上述移動部係具有一體地保持並在上述導電圖案上方以 一定的距離分開的第一電極基板和第二電極基板, 上述檢查電極對係將上述第一感測器電極配置於上述第 一電極基板,將上述第一供電電極配置於第二電極基板, 上述補充電極對係在與上述第一供電電極的延伸方向相 同的方向並列地設置,從上述第一導電圖案離開相當於不受 電性影響的圖案數的距離,並且隔開上述部分導電圖案的距 離,將上述第二感測器電極以及上述第二供電電極配置於上 述第二電極基板。 3. 如申請專利範圍第1項之電路圖案檢查裝置,其中, 上述移動部係具有一體地保持並在上述導電圖案上方以 一定的距離分開的第一電極基板和第二電極基板, 上述檢查電極對係將上述第一感測器電極配置於上述第 一電極基板,將上述第一供電電極配置於第二電極基板, 上述補充電極對係將上述第二感測器電極配置於上述第 二電極基板,並且將上述第二供電電極配置於上述第一電極 基板。 4. 如申請專利範圍第1項之電路圖案檢查裝置,其中, 上述第二電極基板係由上述第二供電電極的第一配置部 分、與上述第二感測器電極和上述第二供電電極的第二配置 101102457 16 201239375 部分可分離地構成, 而且,具備有設置於上述第二配置部分,在上述導電圖案 上方以-定的距離分開,並朝該導電圖案的圖案方向移動的 圖案縱貫移動部, 對於藉由上述缺陷判定部判定出存在有缺陷的導電圖 案’由利用上述圖案縱貫移動部朝圖案的延伸方向移動的上 Ί U77的上述補充電極對來檢測缺陷的存在位置。 101102457 17201239375 VII. Patent application scope: h A circuit picture recording wire 4, which is characterized by and provided. Check the electrode pair, which will form a row, and have a 'object, which has the substrate for the above-mentioned conductive project as the inspection-power supply The electrode and the first-inductor electrode. In the case of (4), the complementary electrode pair opposite to each other has a portion of the conductive pattern sandwiching at least the portion, and the second electrode is disposed opposite to the opposite direction of the power supply electrode. In the same-conducting pattern moving portion, the inspection electrode is turned on the core and the second sensor electrode; on the conductive pattern (4), the line of the complementary electrode pair body-protection pattern is crossed. When the distance is moved, the distance between the detection electrode supply unit and the auxiliary electrode pair by the moving unit is adjusted to the first power supply circuit. The second power supply electrode supplies an inspection signal composed of the exchange money, and the inspection signal is sequentially applied to the first power supply electrode and the second power supply electrode oppositely and capacitively coupled And the defect determining unit ′ combines the first detection signal and the second detection signal, and compares it with a predetermined determination reference value to determine whether there is a defect. The first detection signal Separating capacitors respectively from the conductive pattern 'applying the inspection signal and obtaining the first sensor electrodes; the second detection signal is from the second sensor electrode, including the first The conductor pattern of a part of the conductive pattern of the portion facing the power supply electrode is obtained by 101102457 15 201239375. 2. The circuit pattern inspection device according to claim 1, wherein the moving portion has a first electrode substrate and a second electrode substrate that are integrally held and separated by a certain distance above the conductive pattern, and the inspection electrode The first sensor electrode is disposed on the first electrode substrate, the first power supply electrode is disposed on the second electrode substrate, and the complementary electrode pair is juxtaposed in the same direction as the extending direction of the first power supply electrode Providing that the second conductive pattern and the second power supply electrode are disposed in the first conductive pattern from a distance corresponding to the number of patterns that are not affected by electrical properties, and the distance between the partial conductive patterns is spaced apart Two-electrode substrate. 3. The circuit pattern inspection device according to claim 1, wherein the moving portion has a first electrode substrate and a second electrode substrate that are integrally held and separated by a certain distance above the conductive pattern, the inspection electrode The first sensor electrode is disposed on the first electrode substrate, the first power supply electrode is disposed on the second electrode substrate, and the complementary electrode pair is disposed on the second electrode a substrate, and the second power supply electrode is disposed on the first electrode substrate. 4. The circuit pattern inspection device according to claim 1, wherein the second electrode substrate is composed of a first arrangement portion of the second power supply electrode, and the second sensor electrode and the second power supply electrode The second configuration 101102457 16 201239375 is partially separably configured, and is provided with a pattern disposed in the second arrangement portion, separated by a predetermined distance above the conductive pattern, and moved longitudinally in a pattern direction of the conductive pattern The portion of the complementary electrode pair that is determined to be defective by the defect determining unit is detected by the complementary electrode pair of the upper jaw U77 that moves in the extending direction of the pattern by the pattern extending portion. 101102457 17
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