201224462 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種探針測試裝置中的空間轉換器，且 特別是關於一種空間轉換器中的增強板。 【先前技術】 _為了測試晶圓上的積體電路元件，目前市面上是使用探針測 試裝置對其進行測試。於測試時，先藉由探針測試裝置上的探 針與晶圓上的料作翻，並轉制試裝置舰職訊號至積 體電路元件，之後積體電路元件回傳測試結果訊號至探針測試裝 置’以對戦結果訊舰行分析，簡定晶圓上的频電路 之好壞。 大部分的探針測試裝置是使用探針卡對晶圓上的積體電路 兀件進行職，而賴卡肢#由—彈力針塔t_)及一探 針介面板(Probe lnterface Board) ’而與一測試頭_ head)電性連 ，。其中，測試頭所發出_試峨會經由探針介面板、彈力針 =與探針卡後’再經由探針卡上的垂直式探針傳制待測装置 ( emeundertest)。由於測試訊號需經過較長的傳輸路徑，故 輸較尚頻的測試訊號會發生訊號衰竭的現象。 為了改善上狀_，本領_部分 3針測試裝置’即:直接針測式賴針測試裝置。此：針 探針測試裝^包括—探針介面板、—㈣轉換板、盘一 針組。空間轉換板設置於探針介面板的下方且與其電性 =斜垂直式探針組則設置於空間轉換板下方，其包括多個垂直 二ί較^垂直式探針是用以與待測裝置((^__)相接 ΙΓ置裝置，此直接_式的探針 、 w、'试時則試訊號所需經過的傳輸路徑較短，故較不 201224462 會發生訊號衰竭的現象。 ^上述兩麵針測試裝置中’皆需使_㈣轉換板。在探 針:二’Λ間f換ί是與一電路板相焊接’而在直接針測式的探 ，空間轉換板則是與探針介面板相焊接。然而， =行焊接作#時’電路板或探針介面板需承受較高的溫i，這201224462 VI. Description of the Invention: [Technical Field] The present invention relates to a space converter in a probe testing device, and more particularly to a stiffener in a space transformer. [Prior Art] _ In order to test the integrated circuit components on the wafer, it is currently tested on the market using a probe test device. In the test, the probe on the probe test device and the material on the wafer are turned over, and the test device ship signal is transferred to the integrated circuit component, and then the integrated circuit component returns the test result signal to the probe. The test device analyzes the results of the ship and determines the frequency of the frequency circuit on the wafer. Most of the probe test devices use the probe card to work on the integrated circuit components on the wafer, while the Laijia limb #--elastic needle tower t_) and a probe interface board (Probe lnterface Board) Electrically connected to a test head _ head. Among them, the test head sends out the test device (emeundertest) via the probe interface panel, the elastic needle = and the probe card, and then through the vertical probe on the probe card. Since the test signal needs to go through a long transmission path, the test signal with a higher frequency will suffer from signal failure. In order to improve the upper shape, the _partial 3-pin test device is a direct-needle-type test device. This: The needle probe test kit includes a probe interface panel, a (four) conversion panel, and a disc needle set. The space conversion board is disposed under the probe interface panel and is electrically connected to the underside of the space conversion board, and includes a plurality of vertical alignment detectors for detecting the device to be tested. ((^__) is connected to the device, the direct _ type probe, w, 'test time test signal needs to pass a short transmission path, so the signal failure will occur in 201224462. ^The above two In the needle test device, the _(four) conversion board is required. In the probe: the second 'Λf is changed to be soldered to a circuit board' and in the direct needle test type, the space conversion board is the probe The dielectric panel is soldered. However, when the soldering is done as #, the board or probe panel needs to withstand a higher temperature i.
摆3=板或探針介面板之損壞。也因此，有部份廠商選 擇八有彈性的電性細子來作為電路減探針介面板與空間轉換 板的中介元件纟疋’電性接觸子所施加的彈力往往會使空間 換板產生魏’尤其當空間轉換板的面積愈大且厚度愈薄時其 如此一來，便會導致垂直式探針無法與待測裝 因此’在中華民國專利申請號099127029巾，揭露了一增強 此增強板是介於電性接觸子與空間轉換板之間，藉由此^強 板，可使空間轉換板之變形的問題得到—定的㈣。然而，在 利申請號嶋讀中，板為多層喊結構(M秦 C_nC，MLC)，也就是說增強板是由陶竞材料所製成。 =而^紐料的成本往往較為高昂，且喊材料在經過 燒、，。後’，、體積往往會縮小。而且，喊材料的較脆且硬度較 尚，這也不利於後續的加工與研磨。上述的這些因素除了使 增強板的成本增加外’也會f彡響到戦板的精度絲_平坦产。 因此，如何設計出-增強板，其具有較低的成本與較高的又精 度’以成為本佩具魏常知識者值得去思量的—個問題。 【發明内容】 本發明的主要目的在於提供一種增強板、增強板的製造方法 與，用該增強板的空間轉換器，其中該增強板具有較低的成本與 較ifj的精度與強度。 … 201224462 於-I?與其他目的，本發明提供—種增強板，其裝設 把八有夕個電性接觸子的探針測試裝置 今右客個心、導電塾片，基板的材質為金屬且於其上穿 二有二穿孔，_緣層職置於基板的表面上且覆蓋穿孔的孔 壁° =線路是與電性接觸子電性接觸，且導電線路 一側延伸至穿孔的另一側。 芽匕的 於穿之，板中，更包括多個導電塾片，該導電墊片是位 J ϋ處且與導電朗接’且電性接觸子是抵壓在導 電墊片上。導電墊片的顯例如塗佈有防焊油墨。 於上述之增強板中，導電線路是填充穿孔，且電性接觸子是 抵壓在導電線路的上表面。 於上述之增強板中，更包括多個導電墊片、多個延伸電路與 多個接觸塾>|。導電㈣是位於穿孔_σ處且與導電線路相連 接。延伸電路是電性連接於接觸墊片與導電墊片間，且電性接觸 子是抵壓在接觸墊片上。 >於上述之增強板中，基板的材質為鋁、鎂、鈦、或不鏽鋼。 右基板的材質為鋁、鎂、或鈦，則基板的表面則適於經過陽極處 理。 於上述之增強板中’增強板的表面上設置有多個垂直式探 針。相對於導電墊片’垂直式探針是位於增強板的另一侧。 於上述之增強板中，於穿孔内設置有一填塞物，其中填塞物 是被導電線路所圍繞，而此填塞物是由防焊油墨所形成。或者， 填塞物也可為導電材質，例如：銀膠。 基於上述目的與其他目的，本發明提供一種裝設在探針測試裝 II中的空間轉換器，在探針測試裝置中還設有電性接觸子。此空 間轉換器例如是使用到上述之增強板，且空間轉換器還包括一空 201224462 間轉換板。在空間轉換器中，增強板是設置於空間轉換板與電性 接觸子間。另外，電性接觸子的一端是抵接在增強板上而增強 板則電性連接於空間轉換板。 基於上述目的與其他目的，本發明提供一種增強板的製造方 法二其包括下述步驟。首先，提供一金屬材質的基板，且於基板 上設置有多個穿孔。之後，塗佈一絕緣材料於基板的表面上且填 充該穿孔。再來，將絕緣材料的表面平整化。然後，於穿孔所對 應的位置上，對絕緣材料進行鑽孔。之後，形成多個導電線路於 _ 穿孔中，此導電線路是從穿孔的一侧延伸至穿孔的另一側。 於上述之增強板的製造方法中，在絕緣材料的表面平整化 後，還可壓合至少一銅箔於該絕緣材料的表面。 於上述之增強板的製造方法中，該導電線路是由金屬材料填 充穿孔而形成。 ，於上述之增強板的製造方法巾’導電祕是經由下述的步驟 所形成：首先，塗佈-金屬層於賴與穿孔的表面上；之後，餘 刻銅箔與金屬層，以形成多個導電墊片與導電線路，該導電墊片 是位於穿孔的開Π處，且導電墊片與導電線路相連接。而且，於 •導電線路形成後，還可對穿孔進行塞孔，以形成一填塞物，此填 塞物例如是由防焊油墨所形成。而且’導電塾片的周圍還可塗佛 防焊油墨。 由於增強板的材質為金屬，故具有強度高且易於加工 性’因此本發狀·板具錄造精度較高且成本較低的優點。、 【實施方式】 ‘ 為讓本發明之上述目的、特徵和優點更能明顯易懂，下 文將以實施例並配合所附圖式，作詳細說明如下。需注产、 的是，所附圖式中的各元件僅是示意，並未按照各元件= 201224462 實際比例進行繪示。 請參照圖1，圖1所繪示為本發明的第一實施例之探針測試裝 置。此探針測試裝置10包括：一探針介面板12、一空間轉換器 14、一固定框15、一導電彈性機構16、二保護墊片17、與一垂直 式探針組19其中空間轉換器14包括一空間轉換板與一增強 板143。增強板143是位於探針介面板12與空間轉換板141之間， 且增強板143是藉由多個焊织42❿與空間轉換板141電性連接。 此外，增強板143 _顧度大於郎讎板141的機械強度， ，因為增強板I43的設置，雜轉換^ M的整纖械強度得以提 局。此外’增強板143的内部還設有導電線路1435，故探針介面 板12所傳遞下來的測試訊號，在經過導電彈性機構16的電性接 觸子164後’會經由增強板143内部的導電線路⑷5而傳遞到空 間轉換板141。另外，垂直式探針組19包括多健直式探針， 這些垂直式騎m是於_她⑷雜連接，垂直式探針 194的底部則與待測裝置（未繪示）做接觸。 請參照® 2A與圖2B，圖2A所繪示為增強板的剖面示意圖， 圖2B所繪示為圖2A之增強板的上視圖。增強板143包括一基板 1431、一絕緣層1432、與多個導電墊片1433，其中基板1431上 穿設有多個穿孔1434，而絕緣層1432則是設置於基板1431的表 面上且覆蓋穿孔1434的賊。導電墊片1433是設置在絕緣層1432 上且位於穿孔1434關口處，並與電性子164相接觸。而且， 在本實施射，導f墊片1433是呈_狀，且其底部是往下延伸 有-導電線路1435至穿孔1434的另-側。藉由絕緣層1432，可 使導電墊片刚或導電線路娜與基板㈣絕緣。此外，在穿 孔1434 +還填充有-填塞物1436，該填塞物1436為絕緣材質且 被導電線路1435所圍繞，填塞物1436例如是由晴油墨所製成。 201224462 當然，本領域具有通常知識者也可將填塞物1436的材質改成導電 材質，例如：銀膠。這樣一來，填塞物]436便和導電線路1435 一樣具有電性傳導的功能，也就是說在此情況下填塞物1436可被 視為導電線路。Pendulum 3 = damage to the panel or probe panel. Therefore, some manufacturers choose eight flexible electrical thinners as the intermediate components of the circuit-reducing probe panel and the space conversion board. The elastic force exerted by the electrical contacts often causes the space to change. 'Especially when the area of the space conversion board is larger and the thickness is thinner, it will cause the vertical probe to be unable to be mounted with the device to be tested. Therefore, in the Republic of China Patent Application No. 099127029, a reinforcement plate is disclosed. It is between the electrical contact and the space conversion board, and by this, the problem of deformation of the space conversion board can be obtained (4). However, in the reading of the application number, the board is a multi-layered shouting structure (M Qin C_nC, MLC), which means that the reinforcing board is made of Tao Jing material. = The cost of the ^ material is often high, and the material is being burned. After that, the volume tends to shrink. Moreover, shouting materials are more brittle and have a higher hardness, which is not conducive to subsequent processing and grinding. In addition to the above-mentioned factors, the cost of the reinforcing plate is increased, and the precision of the slab is also flattened. Therefore, how to design a-enhanced board, which has lower cost and higher precision, is worthy of consideration for those who have a lot of knowledge. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a reinforcing plate, a method of manufacturing the reinforcing plate, and a space converter using the reinforcing plate, wherein the reinforcing plate has lower cost and accuracy and strength than ifj. 201224462 于-I? and other purposes, the present invention provides a kind of reinforcing plate, which is provided with a probe test device for arranging an electrical contact, a right-handed core, a conductive cymbal, and the substrate is made of metal. And having two perforations thereon, the edge layer is placed on the surface of the substrate and covers the hole wall of the perforation. The line is electrically contacted with the electrical contact, and the other side of the conductive line extends to the perforation. side. The buds are worn, and the plate further includes a plurality of conductive gussets which are located at the J ϋ and are electrically connected to the conductive ” and the electrical contacts are pressed against the conductive pads. The conductive gasket is, for example, coated with a solder resist ink. In the above reinforcing plate, the conductive line is filled with a through hole, and the electrical contact is pressed against the upper surface of the conductive line. In the above reinforcing plate, a plurality of conductive pads, a plurality of extension circuits and a plurality of contact ports >| are further included. Conductive (4) is located at the perforation _σ and is connected to the conductive line. The extension circuit is electrically connected between the contact pad and the conductive pad, and the electrical contact is pressed against the contact pad. > In the above reinforcing plate, the material of the substrate is aluminum, magnesium, titanium, or stainless steel. The material of the right substrate is aluminum, magnesium, or titanium, and the surface of the substrate is suitable for the anode treatment. A plurality of vertical probes are disposed on the surface of the reinforcing plate in the above reinforcing plate. The vertical probe is located on the other side of the stiffener relative to the conductive pad. In the above reinforcing plate, a packing is provided in the perforation, wherein the packing is surrounded by a conductive line, and the packing is formed by a solder resist ink. Alternatively, the tampon may also be a conductive material such as silver glue. Based on the above and other objects, the present invention provides a space transformer mounted in a probe test set II in which an electrical contact is also provided. This space converter is used, for example, to the above-described enhancement board, and the space converter further includes an empty 201224462 conversion board. In the space converter, the stiffener is placed between the space switch and the electrical contacts. In addition, one end of the electrical contact is abutted on the reinforcing plate and the reinforcing plate is electrically connected to the space conversion plate. Based on the above and other objects, the present invention provides a method of manufacturing a reinforcing plate which includes the following steps. First, a substrate made of a metal material is provided, and a plurality of perforations are provided on the substrate. Thereafter, an insulating material is applied on the surface of the substrate and the perforations are filled. Then, the surface of the insulating material is flattened. Then, the insulating material is drilled at the position corresponding to the perforation. Thereafter, a plurality of conductive traces are formed in the vias that extend from one side of the via to the other side of the via. In the above method of manufacturing a reinforcing plate, after the surface of the insulating material is planarized, at least one copper foil may be pressed against the surface of the insulating material. In the above method of manufacturing a reinforcing plate, the conductive path is formed by filling a perforation with a metal material. In the above-mentioned manufacturing method of the reinforcing plate, the conductive property is formed by the following steps: first, the coating-metal layer is on the surface of the lining and the perforation; after that, the copper foil and the metal layer are left to form a large amount. A conductive pad and a conductive line are located at the opening of the through hole, and the conductive pad is connected to the conductive line. Moreover, after the formation of the conductive traces, the perforations can also be plugged to form a wadding which is formed, for example, by solder resist ink. Moreover, solder resist ink can be applied around the conductive film. Since the material of the reinforcing plate is made of metal, it has high strength and is easy to process. Therefore, the hair piece and the plate have the advantages of high recording accuracy and low cost. The above described objects, features and advantages of the present invention will become more apparent from the following description. It is to be noted that the components in the drawings are merely schematic and are not drawn according to the actual ratio of each component = 201224462. Please refer to FIG. 1. FIG. 1 illustrates a probe testing apparatus according to a first embodiment of the present invention. The probe testing device 10 includes: a probe dielectric panel 12, a space converter 14, a fixing frame 15, a conductive elastic mechanism 16, two protective spacers 17, and a vertical probe set 19 The 14 includes a space conversion panel and a reinforcement panel 143. The reinforcing plate 143 is located between the probe interface panel 12 and the space conversion plate 141, and the reinforcing plate 143 is electrically connected to the space conversion plate 141 by a plurality of soldering dies 42. Further, the reinforcing plate 143 is more than the mechanical strength of the slab 141, and the strength of the fiber-reinforced fabric of the miscellaneous conversion is improved because of the setting of the reinforcing plate I43. In addition, the inside of the reinforcing plate 143 is further provided with a conductive line 1435. Therefore, the test signal transmitted from the probe interface panel 12 passes through the conductive contact inside the reinforcing plate 143 after passing through the electrical contact 164 of the conductive elastic mechanism 16. (4) 5 is transmitted to the space conversion board 141. In addition, the vertical probe set 19 includes multiple straight probes, which are connected to the device under test (not shown) at the bottom of the vertical probe 194. Please refer to FIG. 2A and FIG. 2B. FIG. 2A is a schematic cross-sectional view of the reinforcing plate, and FIG. 2B is a top view of the reinforcing plate of FIG. 2A. The reinforcing plate 143 includes a substrate 1431, an insulating layer 1432, and a plurality of conductive pads 1433. The substrate 1431 is provided with a plurality of through holes 1434, and the insulating layer 1432 is disposed on the surface of the substrate 1431 and covers the through holes 1434. Thief. The conductive spacer 1433 is disposed on the insulating layer 1432 and located at the gate of the through hole 1434 and is in contact with the electron 164. Moreover, in the present embodiment, the conductive f-pad 1433 is in the shape of a _, and the bottom portion thereof extends from the other side of the conductive line 1435 to the through hole 1434. The insulating layer 1432 can be used to insulate the conductive pad or the conductive line from the substrate (4). In addition, the through-hole 1434+ is also filled with a tampon 1436 which is an insulating material and is surrounded by a conductive trace 1435 which is made, for example, of a clear ink. 201224462 Of course, those of ordinary skill in the art can also change the material of the packing 1436 into a conductive material, such as silver glue. In this way, the tampon] 436 has the same electrical conduction function as the conductive line 1435, that is, the tampon 1436 can be regarded as a conductive line in this case.
另外，基板1431的材質為鋁，而空間轉換板141的材質為有 機材質或⑦，故基板剛機械·大於如轉換板141的機械強 度，連帶地也使空間轉換器14的整體機械強度得以提高。而且， 由於鋁的材料成本較陶質材料為低，故相較於專利申請號 09912702中的增強板，本實施例之增強板143的成本較低。另外， 相較於陶瓷材料，鋁的延展性較高，具有易於加工的特性，且不 f經過燒結，故增強板143可具有較高的精度且其表面也具有較 尚的平坦度。在本實施例中，導電塾片1433的材質為銅而基板 1431的材質為鋁。然而，本領域具有通常知識者也可將基板My 改為其他的金屬材質’例如：鎂、鈦、或不細。當基板刚的 材質為不鏽鋼時，其強度可更加地提高。。 本領域具有通常知識者也可選擇將基板1431進行陽極處理， 尤其是當基板1431的材質為鋁、鎂、或鈦時。於實施陽極處理後， 基板1431的表面便會形成一氧化層。由於氧化層不具有導電的性 質’故可使基板1431與導電墊片1433及導電線路1434間的絕缝 性更佳。 琢 此外，除了導電墊片1433外，本領域具有通常知識者也可依 情況於增強板143的表面上設置電路。另外，導電墊片丨的月 圍也可進行防焊處理，例如於導電墊片1433的周圍塗佈防焊^ 墨。這樣一來，在進行焊接處理時，導電墊片1433和其他的導雷 墊片1433間較不會發生短路的情形。 以下，將對上述實施例之增強板143的製作過程做較詳細的 201224462 介紹，請參照圖3A〜圖3H。首先，請參照圖3A，提供一由金屬 材質（例如：鋁）所製成的基板1431，此基板1431上設置有多個 穿孔1434。再來，請參照圖3B，於基板1431的表面上塗佈一絕 緣材料2432，此絕緣材料2432例如為樹脂，其是覆蓋在基板刚 的表面且填充穿孔1434。之後，請參照圖3C，利用砂帶（未繪示） 對絕緣材料2432進行研磨，以使絕緣材料2432的表面平整化。 再來，請參照圖3D，於絕緣材料2432的表面壓合有一銅箔2433。 在本實施例中，絕緣材料2432的上、下表面皆壓合有一銅箱 2433，但本領域具有通常知識者也可依情況而只於其 置銅箔2433。 接著，請參照圖3E ’對絕緣材料2432與銅箔2433進行鑽孔， 而鑽孔的位置即為穿孔M34所在的位置。於鑽孔後，在穿孔1434 中僅留下-層覆蓋孔壁的絕緣材料2432。到此，便絲絕緣層⑷2 的製作。 請參照® 3F，形成一金屬層2435 ’其材質例如為銅。此金屬 層2435例如;^使用電鍵或化學鑛的方<，而形成於銅荡μ%的 表面與穿孔1434中絕緣層1432的表面上。接著，請參照圖3G， 對金屬層2435與銅2433進行侧，以形成導電塾片1433及導 電線路1435。之後’請參照目3H，對穿孔1434進行塞孔，亦即 於穿孔1434中形成有一填塞物1436，此填塞物1436不具有導電 的功效，其例如是由防焊油墨所形成。 藉由圖3A〜圖3H所示的製程，可形成如圖2所示的增強板 143 °根據實驗結果’相較於專利巾請號刪27()2中的增強板， 本實施例之戦板143的製程具有較快的生產速度。 另外，在上述之實施例中，增強板143與空間轉換板141是 屬於不同的το件，但本領域具有通常知識者也可將空間轉換板與 201224462 二強板的功能整合在-個元件。請參照圖4A與圖4b，圖4 :不為本發_第二實_之探針職裝置圖4 實施例之增陳關面示_。在本實施射，增触祕為= 即具備空間轉換的功效，故相較於探針測試裝置1〇，本實施 =十測試裝置3G無需設置如圖丨中所示的空_換板14卜此辦 強板343包括一基板3431、一絕緣層地、與多個導電塾片地: 其中基板3431上穿設有多個穿孔3434，而絕緣層地則是設置 =基板3431的表面上且覆蓋穿孔3434的孔壁，且穿孔綱中則 • 設置有一導電線路3435。相較於圖1中的穿孔I434與導電線路 1435，穿孔3434與導電線路期是呈料的形狀，也因為如此， 增強板343才具備空間轉換的功效。 此外，增強板343的表面還設置有多個垂直式探針394，此垂 直式，針394與圖1之垂直式探針194的差別在於：垂直式探針 394疋直接生成在增強板343的表面上（在本實施例中是設置在導 電墊片3433的表面上）’此垂直式探針394例如是使用微機電的 製程技術所完成。 一在圖1與圖4A中，探針測試裝置皆為直接針測式的探針測 攀試裝置，然而本發明之增強板仍可以應用在其他種類的探 針測試裴置上，例如：包含探針卡的探針測試裝置。請參 照圖5，圖5所繪示為本發明的第三實施例之探針測試裝置。在 圖5中，與第一實施例相似的元件將標以相同的符號且不再贅述。 在探針測式裝置5〇中，增強板143是裝設在探針卡51的内部， 而在探針卡51的電路板53上則連接有一彈力針塔58，此彈力針 塔58是作為探針介面板52與電路板53間的傳輸媒介。其中，測 試頭（未繪示）所發出的測試訊號會經由探針介面板52與彈力針 塔％而傳送到探針卡51。 201224462 在上述的第-實施例中，導電塾片1433是設置在 =:處’亦即設置在穿孔1434的正上方，而電性接觸子164(如 則抵壓在導電墊片1433上，因此導電線路咖便必 接觸子164所施加的彈力’這會導致導電線路聰的 使用哥命降低。因此，請參關6，本戦具有通常蝴者可於辦 強板Η3 (如圖2所示）上設置延伸電路1437與接觸糾⑷/ 其中延伸電路1437是位於接觸墊片1438與導電墊片1433之間， 而探針測試裝置1G的雜觸子164舰壓在綱糾刪日上。 藉此，測試訊號經由電性接觸子164傳遞到接觸墊片1438後，再 經由延伸電路1437而傳遞到導電塾片1433。由於電性接觸子164 是抵壓在接難#剛上，導電線路刚（如圖2A所示）無須 承，電性接觸子164所施加的彈力，故可增強導電線路1435的使 用哥命。在圖6巾’為了較清楚地表示，故衡示出—組接觸塾 片1438與延伸電路1437 ’但本領域具有通常知識者應可明白每一 導電墊片1433皆對應到一組接觸墊片1438與延伸電路1437。 請參照圖7,圖7所繪示為本發明的第四實施例之增強板。此 增強板543與圖2A之增強板143之其中一差異在於：增強板543 的導電線路5435是填充整個穿孔5434,也就是說增強板543的穿 孔5434中並未填充有絕緣的填塞物1436。而且，導電線路5435 的表面疋與導電墊片5433的表面齊平。以下，將對此增強板543 的製造方式進行說明。 請參照圖8A與圖8B，圖8A與圖8B所繪示為本發明的第四 實施例之增強板的部分製造過程。由於此增強板543的前端部分 的製造過程與圖3A〜圖3E所示的製造過程相同或相似，故在此便 不再贅述，而直接從鑽孔後的製程步驟做介紹。請參照圖8A，在 完成銅箔2433與絕緣材料2432的鑽孔後，便可將銀膠、銅膏或 201224462 其他金屬材質灌入並填滿整個穿孔5434，待銀膠、銅膏或其他金 屬材質凝固後便形成導電線路5435。之後，請參照圖8B，對銅箔 2433進行蝕刻’以形成導電墊片5433。如此，便完成了增強板543 的製作。 請參照圖9’圖9所繪示為本發明的第五實施例之增強板。此 增強板643與圖2A之增強板143之其中一差異在於：於增強板 643上並未設置任何導電墊片，電性接觸子164 (如圖丨所示）是 抵壓在導電線路6435的上表面6435a。此外，增強板643的穿孔Further, the material of the substrate 1431 is aluminum, and the material of the space conversion plate 141 is an organic material or 7, so that the substrate is mechanically larger than the mechanical strength of the conversion plate 141, and the overall mechanical strength of the space transformer 14 is also improved. . Moreover, since the material cost of aluminum is lower than that of the ceramic material, the cost of the reinforcing plate 143 of the present embodiment is lower than that of the reinforcing plate of the patent application No. 09912702. Further, compared with the ceramic material, aluminum has high ductility, is easy to process, and is not sintered, so that the reinforcing plate 143 can have higher precision and the surface has a flatness. In the present embodiment, the material of the conductive cymbal 1433 is copper and the material of the substrate 1431 is aluminum. However, those having ordinary skill in the art can also change the substrate My to another metal material such as magnesium, titanium, or not. When the material of the substrate is stainless steel, the strength can be further improved. . A person skilled in the art may also choose to subject the substrate 1431 to anodization, especially when the material of the substrate 1431 is aluminum, magnesium, or titanium. After the anode treatment, an oxide layer is formed on the surface of the substrate 1431. Since the oxide layer does not have an electrically conductive property, the gap between the substrate 1431 and the conductive spacer 1433 and the conductive line 1434 can be made more excellent. Further, in addition to the conductive spacer 1433, a person having ordinary skill in the art may also provide a circuit on the surface of the reinforcing plate 143 as appropriate. In addition, the soldering pad can also be solder-proofed for a month, for example, by applying a solder resist to the periphery of the conductive pad 1433. As a result, when the soldering process is performed, the short circuit between the conductive spacers 1433 and the other lightning-guiding pads 1433 is less likely to occur. Hereinafter, the manufacturing process of the reinforcing plate 143 of the above embodiment will be described in more detail 201224462, please refer to FIG. 3A to FIG. 3H. First, referring to Fig. 3A, a substrate 1431 made of a metal material (e.g., aluminum) is provided. The substrate 1431 is provided with a plurality of through holes 1434. Referring to Fig. 3B, an insulating material 2432 is applied to the surface of the substrate 1431. The insulating material 2432 is, for example, a resin which covers the surface of the substrate and fills the through holes 1434. Thereafter, referring to FIG. 3C, the insulating material 2432 is ground by an abrasive tape (not shown) to planarize the surface of the insulating material 2432. Referring to FIG. 3D, a copper foil 2433 is pressed against the surface of the insulating material 2432. In the present embodiment, the upper and lower surfaces of the insulating material 2432 are laminated with a copper box 2433, but those skilled in the art can also place the copper foil 2433 as appropriate. Next, the insulating material 2432 and the copper foil 2433 are drilled with reference to Fig. 3E', and the position of the hole is the position where the perforation M34 is located. After drilling, only the insulating material 2432 covering the walls of the holes is left in the perforations 1434. At this point, the production of the filament insulation layer (4) 2 is made. Please refer to ® 3F to form a metal layer 2435' whose material is, for example, copper. This metal layer 2435 is formed, for example, by using a bond or a square of a chemical ore, on the surface of the copper yt% and the surface of the insulating layer 1432 of the through hole 1434. Next, referring to FIG. 3G, the metal layer 2435 and the copper 2433 are side-mounted to form a conductive bump 1433 and a conductive line 1435. Thereafter, please refer to item 3H to make a hole for the perforation 1434, that is, a tampon 1436 is formed in the perforation 1434. The tampon 1436 has no electrical conductivity, and is formed, for example, by a solder resist ink. According to the process shown in FIG. 3A to FIG. 3H, the reinforcing plate 143 ° shown in FIG. 2 can be formed according to the experimental result. Compared with the reinforcing plate in the patent towel number 27 () 2, the embodiment is The process of plate 143 has a faster production speed. In addition, in the above embodiment, the reinforcing plate 143 and the space conversion plate 141 are different τ pieces, but those skilled in the art can also integrate the functions of the space conversion board and the 201224462 two-strength board into one component. Please refer to FIG. 4A and FIG. 4b. FIG. 4 is a schematic diagram of the embodiment of the probe device of the present invention. In this implementation, the increase in touch is = that is, the effect of space conversion, so compared to the probe test device 1 本, this implementation = ten test device 3G need not set the empty _ change plate 14 as shown in Figure 卜The board 343 includes a substrate 3431, an insulating layer, and a plurality of conductive slabs: wherein the substrate 3431 is provided with a plurality of through holes 3434, and the insulating layer is disposed on the surface of the substrate 3431 and covered. The hole wall of the perforation 3434, and the perforation is provided with a conductive line 3435. Compared with the perforation I434 and the conductive line 1435 in Fig. 1, the perforation 3434 and the conductive line period are in the shape of a material, and because of this, the reinforcing plate 343 has the effect of space conversion. In addition, the surface of the reinforcing plate 343 is further provided with a plurality of vertical probes 394. The vertical type, the needle 394 is different from the vertical probe 194 of FIG. 1 in that the vertical probe 394 is directly generated on the reinforcing plate 343. The surface (in this embodiment is disposed on the surface of the conductive spacer 3433) 'this vertical probe 394 is completed, for example, using a microelectromechanical process technology. In FIG. 1 and FIG. 4A, the probe testing devices are all direct-needle probe testing devices, however, the reinforcing plates of the present invention can still be applied to other types of probe testing devices, for example: Probe test device for probe card. Referring to FIG. 5, FIG. 5 illustrates a probe testing device according to a third embodiment of the present invention. In FIG. 5, elements similar to those of the first embodiment will be denoted by the same reference numerals and will not be described again. In the probe measuring device 5, the reinforcing plate 143 is mounted inside the probe card 51, and on the circuit board 53 of the probe card 51, an elastic needle tower 58 is connected, and the elastic needle tower 58 is used as A transmission medium between the probe interface panel 52 and the circuit board 53. The test signal sent by the test head (not shown) is transmitted to the probe card 51 via the probe media panel 52 and the elastic needle tower %. 201224462 In the above-described first embodiment, the conductive cymbal 1433 is disposed at =: 'that is disposed directly above the through hole 1434, and the electrical contact 164 (if pressed against the conductive pad 1433, therefore The conductive line will contact the elastic force applied by the sub-164. This will lead to a decrease in the use of the conductive circuit. Therefore, please refer to the 6th, and the Beneficial has the usual butterfly to be used on the strong board 3 (as shown in Figure 2). The extension circuit 1437 and the contact correction (4) are disposed. wherein the extension circuit 1437 is located between the contact pad 1438 and the conductive pad 1433, and the mischarge 164 of the probe test device 1G is on the eradication date. The test signal is transmitted to the contact pad 1438 via the electrical contact 164, and then transferred to the conductive pad 1433 via the extension circuit 1437. Since the electrical contact 164 is pressed against the hard disk #, the conductive line is just As shown in FIG. 2A, the elastic force applied by the electrical contact 164 is not required, so that the use of the conductive line 1435 can be enhanced. In Fig. 6, the towel 'for clarity, the balance is shown - the set contact piece 1438 With extension circuit 1437' but the field has the usual The knowledgeable person should understand that each of the conductive pads 1433 corresponds to a set of contact pads 1438 and an extension circuit 1437. Referring to Figure 7, there is shown a reinforcing plate according to a fourth embodiment of the present invention. One difference between 543 and the reinforcing plate 143 of FIG. 2A is that the conductive line 5435 of the reinforcing plate 543 is filled with the entire through hole 5434, that is, the through hole 5434 of the reinforcing plate 543 is not filled with the insulating packing 1436. The surface 疋 of the line 5435 is flush with the surface of the conductive spacer 5433. Hereinafter, the manufacturing method of the reinforcing plate 543 will be described. Referring to FIG. 8A and FIG. 8B, FIGS. 8A and 8B illustrate the present invention. The partial manufacturing process of the reinforcing plate of the fourth embodiment. Since the manufacturing process of the front end portion of the reinforcing plate 543 is the same as or similar to the manufacturing process shown in FIGS. 3A to 3E, it will not be described again here, but directly from the drilling. After the process steps are described, please refer to FIG. 8A. After the copper foil 2433 and the insulating material 2432 are drilled, silver glue, copper paste or other metal materials of 201224462 can be poured into and filled with the entire perforation 5434. Glue, copper paste or other After the metal material is solidified, the conductive line 5435 is formed. Thereafter, referring to FIG. 8B, the copper foil 2433 is etched to form the conductive spacer 5433. Thus, the fabrication of the reinforcing plate 543 is completed. Referring to FIG. 9' The reinforcing plate of the fifth embodiment of the present invention is different from the reinforcing plate 143 of FIG. 2A in that: the conductive plate 643 is not provided with any conductive gasket, and the electrical contact 164 ( As shown in FIG. 4), it is pressed against the upper surface 6435a of the conductive line 6435. In addition, the perforation of the reinforcing plate 643
6434中並未填充有絕緣的填塞物1436。以下，將對此增強板643 的製造方式進行說明。 清參照圖10A與圖10B，圖l〇A與圖10B所繪示為本發明的 實施例之增強板的部分製造過程。由於此增強板643的前端 刀的製錢贿@ 3A〜® 3C所示的製造過軸同或相似，故在 上便^再•述，而直接從絕緣材料的表面平整化後的步驟做介 紹。請參照圖10A，在完成絕緣材料MM的表面平整化後，便可 邑緣材料上2432進行鑽孔。之後’請參照圖1GB，將銀膠、銅 骨或其他金屬材質灌入並填滿整個穿孔6434，待銀膠、銅膏或其 =金，材質凝固後便形成導電線路6435。如此，便完成了增強板 643的製作。 本發明以實施例說明如上，然其並非用以限定本發明 ，之專利㈣範圍。其專利保護範圍#視後附之申請 ^利範圍及料_域岐。凡本領域具有通常知識者， ^脫離本專利精神或範圍内，所作之更動制飾，均屬 人發明所揭示精神下所完成之等效改變或設計，且應包 3在下述之申請專利範圍内。 【圖式簡單說明】 201224462 圖1所％示尨 _ 圄2私认 厅綠示為本發明的第一實施例之探針測試裝置。 if:示為増強板的剖面示意圖。 圖3A〜圖3H^a_ 圖4A所繪-所會不為增強板的製作流程圖。 圖4B所繪二為本發明的第二實施例之探針測試裝置。 圖5所纷為第二實施例之增強板的剖面示意圖。 圖6二3本發明的第三實施例之探針測試裝置。 圖7所繪;為墊片的連接示意圖。 圖8A與圖8 的第四實施例之增強板。 製造過程。、8B所繪示為本發_第四實施例之增強板的部分 示為本發明的第五實施例之增強板。 分製造過程:、圖丨⑽所緣示為本發明的第四實施例之增強板的部 1438 :接觸墊片 15 :固定框 16 :導電彈性機構 164 :電性接觸子 17 :保護墊片 19 :垂直式探針組 194 :垂直式探針 2432 :絕緣材料 2433 :銅箱 2435 :金屬層 343 ·’增強板 3431 :基板 【主要元件符號說明】 10 :探針測試裝置 12 ·探針介面板 14:空間轉換器 141 :空間轉換板 143 :增強板 1431 :基板 1432 :絕緣層 1433 :導電墊片 1434 :穿孔 1435 :導電線路 1436 :填塞物 1437 :延伸電路 201224462 3432 :絕緣層 50 :探針測式裝置 3433 :導電墊片 51 :探針卡 3434 :穿孔 53 :電路板 3435 :導電線路 58 :彈力針塔 394 :垂直式探針 543 :增強板 443 :增強板 5433 :導電墊片 4431 :基板 5434 ··穿孔 4432 :絕緣層 M35 :導電線路 4433 :導電墊片 643 :增強板 4434 :穿孔 6434 :穿孔 4435 :導電線路 6435 :導電線路 4436 :填塞物 6435a :上表面Insulated tampon 1436 is not filled in 6434. Hereinafter, a manufacturing method of the reinforcing plate 643 will be described. Referring to Figures 10A and 10B, Figures 10A and 10B illustrate a partial manufacturing process of a stiffener according to an embodiment of the present invention. Since the manufacturing of the front end of the reinforcing plate 643 is the same or similar to that of the manufacturing of the bribes @3A~3C, it is described in the above, and the steps directly after the surface of the insulating material are flattened are introduced. . Referring to Fig. 10A, after the surface of the insulating material MM is planarized, the hole material 2432 can be drilled. After that, please refer to Figure 1GB. Silver glue, copper or other metal materials are poured into and filled with the entire perforation 6434. After the silver paste, copper paste or its gold, the material is solidified to form a conductive line 6435. Thus, the production of the reinforcing plate 643 is completed. The present invention is described above by way of examples, but it is not intended to limit the scope of the invention, the patent (four). The scope of its patent protection # depends on the application of the attached ^ profit range and material _ domain 岐. Those who have ordinary knowledge in the field, within the spirit or scope of this patent, make the equivalent changes or designs made under the spirit of the invention, and should be included in the following patent application scope. Inside. [Simple description of the drawing] 201224462 Fig. 1 shows the 探针 _ 圄 2 private hall Green is shown as the probe testing device of the first embodiment of the present invention. If: Shows a schematic cross-section of a bare board. 3A to 3H^a_Fig. 4A - a flow chart of the production of the reinforcing plate. Figure 2B depicts a probe testing device in accordance with a second embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing a reinforcing plate of the second embodiment. Figure 6 is a probe testing device of a third embodiment of the present invention. Figure 7 is a drawing; is a schematic diagram of the connection of the gasket. The reinforcing plate of the fourth embodiment of Figs. 8A and 8. Manufacturing process. A part of the reinforcing plate of the fourth embodiment shown in Fig. 8B is a reinforcing plate according to a fifth embodiment of the present invention. Sub-manufacturing process: FIG. 10 is a portion of the reinforcing plate of the fourth embodiment of the present invention: contact pad 15: fixing frame 16: conductive elastic mechanism 164: electrical contact 17: protective spacer 19 : Vertical probe set 194 : Vertical probe 2432 : Insulation material 2433 : Copper box 2435 : Metal layer 343 · 'Enhanced board 3431 : Substrate [Main component symbol description] 10 : Probe test device 12 · Probe interface panel 14: Space converter 141: Space conversion plate 143: Reinforcement plate 1431: Substrate 1432: Insulation layer 1433: Conductive pad 1434: Perforation 1435: Conductive line 1436: Stuffing 1437: Extension circuit 201224462 3432: Insulation layer 50: Probe Measuring device 3433: conductive gasket 51: probe card 3434: perforation 53: circuit board 3435: conductive line 58: elastic needle tower 394: vertical probe 543: reinforcing plate 443: reinforcing plate 5433: conductive spacer 4431: Substrate 5434 ··Perforation 4432: Insulation layer M35: Conductive line 4433: Conductive pad 643: Reinforcing plate 4434: Perforation 6434: Perforation 4435: Conductive line 6435: Conductive line 4436: Stuffing 6435a: Upper surface
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