TWI615603B - Apparatus for bending substrate, apparatus and method for inspecting bended substrate - Google Patents
Apparatus for bending substrate, apparatus and method for inspecting bended substrate Download PDFInfo
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- TWI615603B TWI615603B TW102135826A TW102135826A TWI615603B TW I615603 B TWI615603 B TW I615603B TW 102135826 A TW102135826 A TW 102135826A TW 102135826 A TW102135826 A TW 102135826A TW I615603 B TWI615603 B TW I615603B
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- 239000000758 substrate Substances 0.000 title claims abstract description 376
- 238000005452 bending Methods 0.000 title claims abstract description 144
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000007689 inspection Methods 0.000 claims description 72
- 238000005259 measurement Methods 0.000 claims description 15
- 238000003384 imaging method Methods 0.000 claims description 12
- 230000001174 ascending effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 description 23
- 238000012360 testing method Methods 0.000 description 19
- 230000002950 deficient Effects 0.000 description 17
- 230000003028 elevating effect Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 230000000630 rising effect Effects 0.000 description 10
- 238000004364 calculation method Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 208000006930 Pseudomyxoma Peritonei Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
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Abstract
本發明提供顯示裝置及其製造方法，根據本發明的基板彎曲裝置，包括：工作臺，形成有通孔；基板吸盤，支撐所板的彎曲物件區域的鄰接面，通過該通孔從該工作臺進出；升降部，使該基板吸盤相對於該工作臺進行上升或下降；以及覆蓋構件，以覆蓋該基板的狀態緊貼於該工作臺，利用該基板吸盤和該工作臺的高度之差彎曲該彎曲物件區域。 The present invention provides a display device and a method for manufacturing the same. The substrate bending device according to the present invention includes: a table having a through hole formed thereon; a substrate suction cup supporting an abutment surface of a curved object region of the plate; Entering and exiting; a lifting section for raising or lowering the substrate sucker relative to the workbench; and a covering member that closely adheres to the workbench in a state of covering the substrate, and uses a difference in height between the substrate sucker and the workbench to bend the Bend the object area.
Description
本發明涉及一種基板彎曲裝置、基板彎曲檢查裝置以及利用該基板彎曲檢查裝置的基板彎曲檢查方法。 The invention relates to a substrate bending device, a substrate bending inspection device, and a substrate bending inspection method using the substrate bending inspection device.
隨著電視機及顯示器等家用顯示裝置，以及筆記本電腦、手機及PMP等可擕式顯示裝置的輕量化及超薄化，廣泛使用各種平板顯示裝置。現在生產或開發的平板顯示裝置有液晶顯示裝置(liquid crystal display：LCD)，電致發光顯示裝置(electro luminescent display：LED)，場發射顯示裝置(field emission display：FED)，等離子顯示裝置(plasma display panel：PDP)，有機發光顯示裝置(Organic Light Emitting Display：OLED)等。 As home display devices such as televisions and monitors, and portable display devices such as notebook computers, mobile phones, and PMPs become lighter and thinner, various flat-panel display devices are widely used. The flat-panel display devices currently produced or developed include liquid crystal display (LCD), electro-luminescent display (LED), field emission display (FED), and plasma display devices (plasma) display panel: PDP), organic light emitting display device (Organic Light Emitting Display: OLED), etc.
近年，為了方便攜帶IT設備，並實現各種顯示形態，研究開發能以曲面狀態彎曲或捲繞成捲筒型進行攜帶或保管的柔性平板顯示裝置。 In recent years, in order to facilitate the carrying of IT equipment and realize various display forms, research and development of flexible flat-panel display devices that can be bent or rolled into a roll shape in a curved state for carrying or storage.
尤其，柔性平板顯示裝置，不僅在平面狀態下，在 曲面狀態下也能穩定地顯示圖像，並且，需要具備即便反復彎曲，其形狀也能恢復原狀態的能力及圖像顯示能力等。 In particular, flexible flat-panel display devices An image can be stably displayed even in a curved state, and it is necessary to have the ability to return to its original shape even if it is repeatedly bent, and the ability to display the image.
因此，在生產產品的過程中，需要對柔性基板反復進行彎曲測試，並進行彎曲區域的光學特性檢查及外觀檢查。 Therefore, in the process of producing a product, it is necessary to repeatedly perform a bending test on the flexible substrate, and perform an optical characteristic inspection and an appearance inspection of the bending region.
因此，本發明所要解決的課題是，提供一種用於彎曲基板的基板彎曲裝置、在彎曲基板的狀態下，檢查彎曲區域的基板彎曲檢查裝置以及利用該基板彎曲檢查裝置的基板彎曲檢查方法。 Therefore, the problem to be solved by the present invention is to provide a substrate bending device for bending a substrate, a substrate bending inspection device for inspecting a bending region in a state where the substrate is bent, and a substrate bending inspection method using the substrate bending inspection device.
本發明的技術課題並不局限於以上所述的技術課題，對於未提及的其他技術課題，本領域的技術人員可通過以下記載將會明確理解。 The technical problem of the present invention is not limited to the technical problem described above, and for other technical problems not mentioned, those skilled in the art can clearly understand through the following description.
為達成本發明的技術課題，根據本發明的一實施例的基板彎曲裝置，包括：工作臺，形成有通孔；基板吸盤，支撐基板的彎曲物件區域的鄰接面，通過該通孔從該工作臺進出；升降部，使該基板吸盤相對於該工作臺進行上升或下降；以及覆蓋構件，以覆蓋該基板的狀態緊貼於該工作臺，利用該基板吸盤和該工作臺的高度之差彎曲該彎曲物件區域。 In order to achieve the technical subject of the present invention, a substrate bending device according to an embodiment of the present invention includes: a table with a through hole formed; a substrate suction cup that supports an abutment surface of a curved object region of the substrate; The table is moved in and out; the lifting section makes the substrate sucker rise or fall relative to the table; and a covering member is closely attached to the table in a state of covering the substrate, and is bent by using the difference between the height of the substrate sucker and the table. The curved object area.
為達成該技術課題，根據本發明的一實施例的基板彎曲檢查裝置，包括：工作臺；基板吸盤，從該工作臺突出，用於支撐基板的彎曲物件區域的鄰接面；覆蓋構件，以覆蓋該基板的狀態緊貼於該工作臺，利用該基板吸盤和該工作臺的高度之差而彎曲該彎曲物件區域；以及攝像部，用於拍攝該彎曲物件區域。 In order to achieve the technical problem, a substrate bending inspection device according to an embodiment of the present invention includes: a table; a substrate sucker protruding from the table to support an abutment surface of a curved object region of the substrate; and a cover member to cover The state of the substrate is closely attached to the table, and the curved object region is bent by utilizing the difference in height between the substrate sucker and the table; and an imaging unit for photographing the curved object region.
為達成該技術課題，根據本發明的一實施例的基板彎曲檢查方法，包括：將基板的彎曲物件區域的鄰接面配置在基板吸盤上的步驟；在容納該基板吸盤的工作臺的上面配置覆蓋該基板的覆蓋構件的步驟；緊貼該覆蓋構件和該工作臺的步驟；以及使該基板吸盤從該工作臺上升，該覆蓋構件朝該基板吸盤的邊角側加壓該彎曲物件區域，從而彎曲該彎曲物件區域的步驟。 In order to achieve the technical problem, a substrate bending inspection method according to an embodiment of the present invention includes: a step of arranging an abutment surface of a curved object region of a substrate on a substrate chuck; and placing a cover on a worktable that houses the substrate chuck. A step of covering the substrate; a step of closely contacting the covering member and the table; and raising the substrate sucker from the table, the covering member presses the curved object area toward the corner side of the substrate sucker, thereby The step of bending the curved object area.
根據本發明至少具有如下效果。 The present invention has at least the following effects.
對基板的局部可通過預定外力反復進行彎曲測試，通過細微地調整彎曲時所需的外力，從而，對彎曲的局部區域能夠有效地施加最小限度的應力變化。 The bending test can be repeatedly performed on a part of the substrate by a predetermined external force, and the external force required for bending can be finely adjusted, so that a minimum stress change can be effectively applied to the bent local area.
並且，進行基板的彎曲測試的同時測量彎曲區域的微細的亮度變化等，同時還可以檢查彎曲區域的微細的破裂等。 In addition, while performing a bending test of the substrate, it is possible to measure minute brightness changes and the like in the bending region, and at the same time, to check fine cracks in the bending region and the like.
根據本發明的效果並不局限於以上所述的內容，在本說明書中包括更多樣的效果。 The effects according to the present invention are not limited to those described above, and more various effects are included in this specification.
1,2,3,4‧‧‧基板彎曲裝置 1,2,3,4‧‧‧‧ substrate bending device
5‧‧‧基板彎曲檢查裝置 5‧‧‧ substrate bending inspection device
10‧‧‧工作臺 10‧‧‧Workbench
11‧‧‧吸引口 11‧‧‧ Attraction
12‧‧‧吸引流路 12‧‧‧ Attraction
13‧‧‧固定器 13‧‧‧ retainer
15‧‧‧通孔 15‧‧‧through hole
16‧‧‧容納槽 16‧‧‧Receiving trough
20,201,202‧‧‧基板吸盤 20,201,202 ‧‧‧ substrate sucker
30‧‧‧升降部 30‧‧‧ Lifting Department
31‧‧‧升降驅動裝置 31‧‧‧ Lifting Drive
32‧‧‧升降銷 32‧‧‧lift pin
40‧‧‧覆蓋構件 40‧‧‧ cover member
50‧‧‧攝像檢查部 50‧‧‧ Camera Inspection Department
51‧‧‧圖像取得部 51‧‧‧Image Acquisition Department
52‧‧‧運算部 52‧‧‧ Computing Department
53‧‧‧顯示部 53‧‧‧Display
52a‧‧‧圖像加工部 52a‧‧‧Image Processing Department
52b‧‧‧亮度測定部 52b‧‧‧Brightness Measurement Department
52c‧‧‧外觀檢查部 52c‧‧‧Appearance Inspection Department
52d‧‧‧處理部 52d‧‧‧Processing Department
S‧‧‧基板 S‧‧‧ substrate
S1‧‧‧安裝區域 S1‧‧‧Installation area
S2‧‧‧彎曲物件區域 S2‧‧‧ Curved Object Area
S3‧‧‧突出區域 S3‧‧‧ prominent area
圖1是根據本發明的第一實施例的基板彎曲裝置的概略俯視圖。 FIG. 1 is a schematic plan view of a substrate bending apparatus according to a first embodiment of the present invention.
圖2是根據本發明的第一實施例的基板彎曲裝置的概略側截面圖。 FIG. 2 is a schematic side sectional view of a substrate bending apparatus according to a first embodiment of the present invention.
圖3是配置在基板吸盤的基板的示意圖。 FIG. 3 is a schematic diagram of a substrate arranged on a substrate chuck.
圖4及圖5是根據本發明的第一實施例的基板彎曲裝置的概略動作圖。 4 and 5 are schematic operation diagrams of a substrate bending apparatus according to a first embodiment of the present invention.
圖6是根據本發明的第一實施例的基板吸盤的概略側視圖。 Fig. 6 is a schematic side view of a substrate chuck according to a first embodiment of the present invention.
圖7是根據本發明的其他實施例的基板吸盤的概略側視圖。 FIG. 7 is a schematic side view of a substrate chuck according to another embodiment of the present invention.
圖8是根據本發明的第二實施例的基板彎曲裝置的概略截面圖。 FIG. 8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.
圖9是根據本發明的第三實施例的基板彎曲裝置的概略俯視圖。 FIG. 9 is a schematic plan view of a substrate bending apparatus according to a third embodiment of the present invention.
圖10是根據本發明的第四實施例的基板彎曲裝置的概略截面圖。 FIG. 10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.
圖11是根據本發明的第二實施例的基板彎曲裝置的概略截面圖。 11 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.
圖12是根據本發明的實施例的基板彎曲檢查裝置的攝影部的框圖。 FIG. 12 is a block diagram of a photographing section of a substrate bending inspection apparatus according to an embodiment of the present invention.
圖13是根據本發明的實施例的基板彎曲檢查方法的順序圖。 FIG. 13 is a sequence diagram of a substrate bending inspection method according to an embodiment of the present invention.
圖14至圖16是利用根據本發明的實施例的基板彎曲檢查裝置的基板彎曲檢查過程的動作示意圖。 14 to 16 are schematic diagrams of operations of a substrate bending inspection process using a substrate bending inspection apparatus according to an embodiment of the present invention.
本發明的優點、特徵以及為達成這些的方法可通過附圖及後述的實施例將會明確地理解。但是，本發明並不局限於以下所述的實施例，可體現為各種不同的形態。本實施例是為使本發明更加完整，並對本發明所屬領域的技術人員提供發明範疇而提供的。本發明僅通過申請專利範圍而決定。為了明確說明，可擴張表示附圖中構成元件的大小及相對大小。 The advantages and features of the present invention and the method for achieving these will be clearly understood from the drawings and embodiments described later. However, the present invention is not limited to the embodiments described below, and can be embodied in various forms. This embodiment is provided to make the present invention more complete and to provide a scope of the invention to those skilled in the art to which the present invention belongs. The invention is determined solely by the scope of the patent application. For clarity, the sizes and relative sizes of the constituent elements in the drawings are extensible.
參考本發明的理想的概略圖的俯視圖及介面圖說明本說明書中所記載的實施例。因此，可根據製造技術及/或允許誤差等變形示例圖的形態。並且，本發明的實施例並不局限於圖示的特定形態，還包括因製造工程而產生的形態變化。所以，圖中所示的區域具有概略的屬性，並且，圖中所示的區域的形態是舉例說明元件的區域的特定形態而已，並不用來限定本發明的範疇。 Embodiments described in this specification will be described with reference to a top view and an interface diagram of an ideal schematic diagram of the present invention. Therefore, the shape of the example figure may be modified according to manufacturing technology and / or tolerance. In addition, the embodiment of the present invention is not limited to the specific form shown in the drawings, and also includes a form change caused by a manufacturing process. Therefore, the area shown in the figure has a rough attribute, and the form of the area shown in the figure is only a specific form illustrating the area of the element, and is not intended to limit the scope of the present invention.
圖1是根據本發明的第一實施例的基板彎曲裝置的概略俯視圖，圖2是根據本發明的第一實施例的基板彎曲裝置的概略側截面圖，圖3是配置在基板吸盤的基板的示意圖。 1 is a schematic plan view of a substrate bending device according to a first embodiment of the present invention, FIG. 2 is a schematic side sectional view of a substrate bending device according to a first embodiment of the present invention, and FIG. 3 is a schematic view of a substrate disposed on a substrate chuck. schematic diagram.
如圖1及圖2所示，根據本發明的基板彎曲裝置1包括：工作臺10、基板吸盤20、升降部30以及覆蓋構件40。 As shown in FIGS. 1 and 2, the substrate bending apparatus 1 according to the present invention includes a table 10, a substrate chuck 20, a lifting portion 30, and a cover member 40.
工作臺10是用於安裝基板S及覆蓋構件40的平板，覆蓋構件40用於彎曲基板S，在該工作臺的中央形成有供基板吸盤20上升及下降的通孔15。 The table 10 is a flat plate on which the substrate S and a cover member 40 are mounted. The cover member 40 is used to bend the substrate S. A through hole 15 is formed in the center of the table for the substrate chuck 20 to rise and fall.
並且，工作臺可以具備用於固定覆蓋構件40的吸附單元。吸附單元，包括：多個吸引口11，以預定間隔形成在通孔15的兩側；吸引流路12，形成在工作臺10的內側，並與多個吸引口11連通。吸引流路12與真空泵(省略圖示)連接而可朝吸引口11側提供真空壓力。 In addition, the table may include an adsorption unit for fixing the cover member 40. The adsorption unit includes a plurality of suction ports 11 formed at both sides of the through hole 15 at a predetermined interval, and a suction flow path 12 formed at an inner side of the table 10 and communicating with the plurality of suction ports 11. The suction flow path 12 is connected to a vacuum pump (not shown) and can provide vacuum pressure to the suction port 11 side.
如圖3所示，基板吸盤20形成為其上面幅度比基板S的幅度或長度窄，可以支撐基板S的局部。以下，為方便說明，將基板S分為安裝區域S1、彎曲物件區域S2以及突出區域S3三個區域進行說明。 As shown in FIG. 3, the substrate chuck 20 is formed such that the width of the substrate chuck 20 is narrower than the width or length of the substrate S, and can support a part of the substrate S. In the following, for convenience of explanation, the substrate S will be divided into three regions: a mounting region S1, a curved object region S2, and a protruding region S3.
彎曲物件區域S2是位於基板吸盤20的邊角，而利用基板吸盤20的邊角進行彎曲的區域，安裝區域S1是位於彎曲物件區域S2的鄰接面中的一側的區域，是位於基板吸盤20的上面的區域，突出區域S3是位於彎曲物件區域S2的鄰接面中的另一側的區域，是位於基板吸盤20的外側的區域。 The curved object area S2 is an area located at the corner of the substrate chuck 20 and is bent by the corners of the substrate chuck 20. The mounting area S1 is an area located at one side of the abutting surface of the curved object area S2 and is at the substrate chuck 20. The upper region, the protruding region S3 is a region located on the other side of the abutment surface of the curved object region S2, and is a region located outside the substrate chuck 20.
如圖3所示，各基板S的彎曲物件區域S2位於基板吸盤20的兩側邊角時，兩側彎曲物件區域S2之間的區域可定義為安裝區域S1，以彎曲物件區域S2為中心位於安裝區域S1的相反側的區域可定義為突出區域S3。 As shown in FIG. 3, when the curved object area S2 of each substrate S is located at the corners of both sides of the substrate chuck 20, the area between the curved object areas S2 on both sides can be defined as the mounting area S1, and the curved object area S2 is located at the center An area on the opposite side of the mounting area S1 may be defined as a protruding area S3.
一方面，基板吸盤20設置為可通過通孔15進出工作臺10的上部，使得工作臺10的上面和基板吸盤20的上面位於相同的平面，上升前和下降後的基板吸盤20成為容納于通孔15的狀態。 On the one hand, the substrate chuck 20 is provided through the through hole 15 to enter and exit the upper part of the table 10, so that the upper surface of the table 10 and the upper surface of the substrate chuck 20 are on the same plane. State of the hole 15.
升降部30形成於基板吸盤20的下部，可包括用於支撐基板吸盤20的升降銷32和使升降銷32上升及下降的升降驅動裝置31。 The lifting portion 30 is formed at a lower portion of the substrate chuck 20 and may include a lifting pin 32 for supporting the substrate chuck 20 and a lifting driving device 31 for raising and lowering the lifting pin 32.
升降驅動裝置31使升降銷32上升及下降，從而可使基板吸盤20從工作臺10進出。並且，升降驅動裝置31可控制升降銷32的升降高度及/或升降速度。 The elevating drive device 31 raises and lowers the elevating pin 32 so that the substrate chuck 20 can be moved in and out from the table 10. In addition, the lifting driving device 31 can control the lifting height and / or lifting speed of the lifting pin 32.
作為升降驅動裝置31可使用利用液壓的變化升降升降銷32的液壓缸。 As the elevating driving device 31, a hydraulic cylinder that elevates the elevating pin 32 using a change in the hydraulic pressure can be used.
利用液壓缸的升降驅動裝置31可微細地控制升降銷32的升降高度及/或升降速度。由此，可以提供各種各樣的彎曲環境，通過微細調整液壓量，對彎曲物件區域S2可有效地誘導最小限度的應力變化。 The elevation driving device 31 of the hydraulic cylinder can finely control the elevation height and / or elevation speed of the elevation pin 32. As a result, various bending environments can be provided. By finely adjusting the amount of hydraulic pressure, a minimum stress change can be effectively induced in the curved object region S2.
並且，當對經彎曲的彎曲物件區域S2施加很強的復原力時，也能通過調整液壓量，對基板吸盤20提供對應於復原力 的很強的上升力。 In addition, when a strong restoring force is applied to the curved bent object region S2, the substrate sucker 20 can also be provided with a restoring force by adjusting the amount of hydraulic pressure. Strong ascending force.
覆蓋構件40是隨著基板吸盤20的上升而上升並彎曲基板S的構成原件，覆蓋安裝於基板吸盤20的基板S，可位於工作臺10上面。 The cover member 40 is an original component that rises and bends the substrate S as the substrate chuck 20 rises. The cover member 40 covers the substrate S mounted on the substrate chuck 20 and may be positioned on the table 10.
覆蓋構件40優選構成為覆蓋基板S的部分在基板吸盤20上升的過程中進行伸長，而在基板20下降而回到通孔15內的過程中恢復到原狀態，為此，覆蓋構件40可由伸長及恢復穩定性出色的材料的薄膜構成。 The cover member 40 is preferably configured so that the portion covering the substrate S is stretched during the ascent of the substrate chuck 20, and is restored to the original state during the process of the substrate 20 descending and returned to the through hole 15. For this reason, the cover member 40 may be extended by And a thin film of a material with excellent recovery stability.
以下，說明根據本發明的第一實施例的基板彎曲裝置的動作。圖4及圖5是根據本發明的第一實施例的基板彎曲裝置的概略動作圖。 The operation of the substrate bending device according to the first embodiment of the present invention will be described below. 4 and 5 are schematic operation diagrams of a substrate bending apparatus according to a first embodiment of the present invention.
如圖4所示，基板吸盤20可位於通孔15內以便基板吸盤20的上面與工作臺10的上面位於同一平面。以下，將其稱為基板吸盤20的原位置(home)。 As shown in FIG. 4, the substrate chuck 20 may be located in the through hole 15 so that the upper surface of the substrate chuck 20 and the upper surface of the table 10 are on the same plane. Hereinafter, this will be referred to as the home position of the substrate chuck 20.
彎曲物件的基板S配置於基板吸盤20的上面。如上所述，基板S可配置為彎曲物件區域S2位於基板吸盤20的邊角，安裝區域S1位於基板吸盤20的上面，突出區域S3位於基板吸盤20的外側(參照圖3)。 The substrate S of the curved object is arranged on the substrate chuck 20. As described above, the substrate S may be configured such that the curved object region S2 is located at a corner of the substrate chuck 20, the mounting region S1 is located above the substrate chuck 20, and the protruding region S3 is located outside the substrate chuck 20 (see FIG. 3).
配置在基板吸盤20上的基板S上面可配置覆蓋構件40。覆蓋構件40的面積可對應於工作臺10的面積，覆蓋基板S的前面及形成在工作臺10的吸引口11，可安裝於工作臺10上面。 A cover member 40 may be disposed on the substrate S disposed on the substrate chuck 20. The area of the cover member 40 may correspond to the area of the table 10. The front surface of the cover substrate S and the suction port 11 formed on the table 10 may be mounted on the table 10.
基板S及覆蓋構件40依次配置在基板吸盤20及工 作臺10上之後，可通過形成於工作臺10的吸引口11及吸引流路12進行真空排氣。由此，在覆蓋構件40和工作臺10之間形成真空壓力，從而，覆蓋構件40的兩側能以基板S為中心緊貼於工作臺10。 The substrate S and the cover member 40 are sequentially arranged on the substrate chuck 20 and the substrate. After the workbench 10 is put on, vacuum exhaust can be performed through the suction port 11 and the suction flow path 12 formed in the workbench 10. Thereby, a vacuum pressure is formed between the cover member 40 and the table 10, and both sides of the cover member 40 can be closely adhered to the table 10 with the substrate S as the center.
如圖5所示，覆蓋構件40緊貼固定於工作臺10之後，升降驅動裝置31使升降銷32上升而可以使基板吸盤20上升。 As shown in FIG. 5, after the cover member 40 is closely fixed to the table 10, the elevating driving device 31 raises the elevating pin 32 to raise the substrate chuck 20.
通過基板吸盤20的上升，在基板吸盤20的上面和工作臺10的上面之間產生高度差，覆蓋構件40的兩側以緊貼於工作臺10的狀態下覆蓋中央的基板S的部分隨著基板吸盤20的上升而伸長。 As the substrate chuck 20 rises, a height difference is generated between the upper surface of the substrate chuck 20 and the upper surface of the table 10. The two sides of the cover member 40 are in close contact with the table 10 and the portion covering the central substrate S follows. The substrate chuck 20 rises and extends.
由覆蓋構件40的伸長而產生的彈性反作用力可以將基板S朝基板吸盤20側加壓。 The elastic reaction force generated by the elongation of the cover member 40 can press the substrate S toward the substrate chuck 20 side.
並且，通過緊貼於工作臺10的兩側和覆蓋基板S的中央部的高度之差，覆蓋構件40將基板S的突出區域S3緊貼在基板吸盤20的側面側，並將基板S的彎曲物件區域朝基板吸盤20的邊角側加壓，從而可沿邊角彎曲彎曲物件區域S2。 Then, the cover member 40 closely adheres the protruding area S3 of the substrate S to the side surface of the substrate chuck 20 and closely bends the substrate S by the difference in height between the sides of the table 10 and the center of the cover substrate S. The object area is pressed toward the corner side of the substrate chuck 20, so that the object area S2 can be bent along the corners.
升降驅動裝置31使升降銷32上升到事先輸入的升降高度為止之後，使升降銷32再次下降而將基板吸盤20恢復到原(home)位置。 The elevating drive device 31 raises the elevating pin 32 to a previously inputted elevating height, and then lowers the elevating pin 32 again to return the substrate chuck 20 to the home position.
當基板吸盤20恢復到原位置時，如圖4所示，覆蓋構件40通過自身彈性可恢復到最初安裝在工作臺10及基板S上面的平平的狀態。 When the substrate chuck 20 is returned to the original position, as shown in FIG. 4, the cover member 40 can be restored to the flat state originally mounted on the table 10 and the substrate S by its own elasticity.
隨著覆蓋構件40恢復到初期狀態，基板S也可通過自身彈力恢復到最初安裝在基板吸盤20上面的平平的狀態。 As the cover member 40 returns to the initial state, the substrate S can also return to the flat state originally mounted on the substrate chuck 20 by its own elastic force.
然後，如圖5所示，升降驅動裝置31使基板吸盤20再次上升而彎曲基板S的彎曲物件區域S2之後，如圖4所示，使基板吸盤20再次恢復到原位置而恢復到平平的狀態，通過反復該過程，可以進行對基板S的彎曲測試。 Then, as shown in FIG. 5, after the lift driving device 31 raises the substrate chuck 20 again to bend the curved object region S2 of the substrate S, as shown in FIG. 4, the substrate chuck 20 is returned to the original position again and returned to a flat state. By repeating this process, a bending test of the substrate S can be performed.
以下，說明根據本發明的實施例的基板吸盤。 Hereinafter, a substrate chuck according to an embodiment of the present invention will be described.
圖6是根據本發明的一實施例的基板吸盤的概略側視圖。 FIG. 6 is a schematic side view of a substrate chuck according to an embodiment of the present invention.
如圖6所示，根據本發明的一實施例的基板吸盤201可利用多孔吸盤。 As shown in FIG. 6, the substrate chuck 201 according to an embodiment of the present invention may use a porous chuck.
多孔吸盤是利用真空壓力吸附固定基板的真空吸盤，一般，利用以SiC粉末為主原料的多孔性陶瓷而製造。因此，多孔吸盤，在其表面形成多個氣孔，並利用通過氣孔提供的真空壓力，能夠吸附固定安裝在表面的基板等。 The porous chuck is a vacuum chuck that adsorbs and fixes a substrate by using vacuum pressure. Generally, the porous chuck is manufactured by using a porous ceramic whose main material is SiC powder. Therefore, the porous chuck can form a plurality of air holes on its surface, and can use a vacuum pressure provided through the air holes to suck and fix a substrate or the like mounted on the surface.
如本實施例，作為基板吸盤201使用多孔性多孔吸盤時，通過向基板吸盤201的上面提供真空壓力而可以穩定地支撐基板S。 As in this embodiment, when a porous porous chuck is used as the substrate chuck 201, the substrate S can be stably supported by applying a vacuum pressure to the upper surface of the substrate chuck 201.
通過形成在基板吸盤201的側面的多個氣孔也能向側面提供真空壓力，因此，在彎曲過程中，可通過覆蓋構件40將被折疊到基板吸盤201的側面的突出區域S3緊貼固定於基板吸盤201的側面。 The plurality of air holes formed in the side surface of the substrate chuck 201 can also provide vacuum pressure to the side. Therefore, during the bending process, the protruding area S3 folded to the side surface of the substrate chuck 201 can be closely fixed to the substrate through the cover member 40 The side of the suction cup 201.
在彎曲過程中，可同時將位於基板吸盤201的上面的基板S的安裝區域S1和位於基板吸盤201的側面的基板S的突出區域緊貼固定於基板吸盤201，因此，安裝區域S1和突出區域S3之間的彎曲物件區域S2利用基板吸盤201的邊角而可以更加穩定地保持被彎曲的狀態。 During the bending process, the mounting area S1 of the substrate S located on the upper surface of the substrate chuck 201 and the protruding area of the substrate S located on the side of the substrate chuck 201 can be closely fixed to the substrate chuck 201. Therefore, the mounting area S1 and the protruding area The curved object region S2 between S3 can use the corners of the substrate chuck 201 to maintain the curved state more stably.
根據本實施例的基板吸盤201，在上升後恢復到原位置的過程中，使得彎曲物件區域S2及突出區域S33恢復到與安裝區域S1相同的平面，而可以切斷從表面的氣孔所提供的真空壓力。 According to the substrate chuck 201 of this embodiment, in the process of returning to the original position after rising, the curved object region S2 and the protruding region S33 are restored to the same plane as the mounting region S1, and the air holes provided from the surface can be cut off. Vacuum pressure.
圖7是根據本發明的其他實施例的基板吸盤的概略側視圖。 FIG. 7 is a schematic side view of a substrate chuck according to another embodiment of the present invention.
如圖7所示，根據本實施例的基板吸盤202形成為用於安裝基板S的上面的邊角具有預定曲率的曲面。 As shown in FIG. 7, the substrate chuck 202 according to the present embodiment is formed as a curved surface having a predetermined curvature at the corners of the upper surface for mounting the substrate S.
因此，在彎曲基板時，彎曲物件區域S2緊貼於具有預定曲率的基板吸盤202的邊角，並可根據邊角的曲率進行彎曲。 Therefore, when the substrate is bent, the bent object region S2 is closely attached to the corner of the substrate chuck 202 having a predetermined curvature, and can be bent according to the curvature of the corner.
並且，對彎曲物件區域S2以特定曲率進行彎曲測試時，可利用根據本實施例的基板吸盤202。 Moreover, when the bending test is performed on the curved object region S2 with a specific curvature, the substrate chuck 202 according to the present embodiment can be used.
並且，將根據本實施例的基板吸盤202形成為曲率互不相同的多個基板吸盤202，邊改變邊角的曲率，邊可進行彎曲測試。 In addition, the substrate chuck 202 according to the present embodiment is formed into a plurality of substrate chucks 202 having different curvatures, and a bending test can be performed while changing corner curvatures.
例如，對相同的基板S進行最初彎曲測試時，在多個基板吸盤202中，將具有曲率最大的邊角的基板吸盤202安裝在基板彎曲裝置，然後，依次替換為具有曲率小的邊角的基板吸盤 202並進行彎曲測試。 For example, when the same substrate S is subjected to an initial bending test, the substrate chuck 202 having the corner with the largest curvature is mounted on the substrate bending device among the plurality of substrate chucks 202, and then replaced with the one having the corner with the small curvature in order. Substrate sucker 202 and perform a bending test.
通過如所述的彎曲測試，可以累積根據基板S的彎曲次數的界限曲率的數據。 By the bending test as described above, the data of the limit curvature according to the number of bending times of the substrate S can be accumulated.
根據本實施例的基板吸盤202也可以使用該多孔吸盤，此時，通過將安裝區域S1和突出區域S3分別緊貼固定於基板吸盤202的上面及側面，從而，彎曲物件區域S2可通過邊角的曲率穩定地保持彎曲狀態。 The porous chuck can also be used for the substrate chuck 202 according to this embodiment. At this time, the mounting area S1 and the protruding area S3 are respectively closely fixed to the upper surface and the side of the substrate chuck 202, so that the curved object area S2 can pass through the corner The curvature remains stable in a bent state.
以下，說明根據本發明的其他實施例的基板彎曲裝置。 Hereinafter, a substrate bending device according to another embodiment of the present invention will be described.
為方便說明，對與第一實施例的相似的部分標注相同的符號，並省略與第一實施例共同的部分的說明。 For convenience of explanation, the same reference numerals are given to the similar parts as those of the first embodiment, and the description of the parts common to the first embodiment is omitted.
圖8是根據本發明的第二實施例的基板彎曲裝置的概略截面圖。 FIG. 8 is a schematic cross-sectional view of a substrate bending apparatus according to a second embodiment of the present invention.
如圖8所示，根據本發明的基板彎曲裝置2可以具備多個基板吸盤20。 As shown in FIG. 8, the substrate bending device 2 according to the present invention may be provided with a plurality of substrate chucks 20.
根據本實施例的基板彎曲裝置2中，2個以上的基板吸盤20以預定間隔隔開排列成一列，或4個以上的基板吸盤20以預定間隔隔開排列成N*M列。 In the substrate bending device 2 according to this embodiment, two or more substrate chucks 20 are arranged in a row at a predetermined interval, or four or more substrate chucks 20 are arranged in a N * M column at a predetermined interval.
在工作臺10上可以以預定間隔形成多個通孔15以與多個基板吸盤20相對應。 A plurality of through holes 15 may be formed on the table 10 at predetermined intervals to correspond to the plurality of substrate chucks 20.
覆蓋構件40可以配置一個來覆蓋基板S及工作臺10 的前面，或者，以覆蓋各基板吸盤20的附近的大小，多個覆蓋構件分別配置在各基板吸盤20。 One covering member 40 may be arranged to cover the substrate S and the table 10 Alternatively, a plurality of covering members are arranged on each substrate chuck 20 so as to cover the vicinity of each substrate chuck 20.
升降銷32為了支撐各基板吸盤20而可以具備多個，升降驅動裝置31控制各升降銷32同時上升或下降，或者，可單獨控制各升降銷32的上升高度及/或上升速度。 A plurality of lifting pins 32 may be provided to support the substrate chucks 20, and the lifting driving device 31 controls each lifting pin 32 to rise or fall at the same time, or may individually control the rising height and / or rising speed of each lifting pin 32.
如圖8所示，根據本實施例的基板彎曲裝置2可以使用如下方式，即利用多個基板吸盤20可一次彎曲多個基板S。 As shown in FIG. 8, the substrate bending apparatus 2 according to the present embodiment can use a manner in which a plurality of substrates S can be bent at a time by using a plurality of substrate chucks 20.
或者，根據本實施例的基板彎曲裝置2還可以使用如下方式，即利用多個基板吸盤20在多個地點一次彎曲一個基板S。 Alternatively, the substrate bending apparatus 2 according to the present embodiment may also use a method in which a plurality of substrate chucks 20 are used to bend one substrate S at a plurality of locations at a time.
此時，升降驅動裝置31統一控制各升降銷32的上升高度及/或上升速度，從而能以相同的形態進行多個地點的彎曲。 At this time, the lifting drive device 31 controls the lifting height and / or the lifting speed of each lifting pin 32 in a unified manner, so that bending can be performed at a plurality of locations in the same form.
或者，升降驅動裝置31單獨控制各升降銷32的上升高度及/或上升速度而能以不同的形態進行多個地點的彎曲。當將基板吸盤20的上升高度及/上升速度控制為互不相同時，會導致基板S扭曲。因此，進行對基板S的彎曲測試的同時可以進行對基板S的扭曲測試。 Alternatively, the lifting drive device 31 can individually control the lifting height and / or the lifting speed of each lifting pin 32 to perform bending at a plurality of locations in different forms. When the rising height and / or rising speed of the substrate chuck 20 are controlled to be different from each other, the substrate S is distorted. Therefore, it is possible to perform a twist test on the substrate S while performing a bend test on the substrate S.
圖9是本發明的第三實施例的基板彎曲裝置的概略俯視圖。 9 is a schematic plan view of a substrate bending device according to a third embodiment of the present invention.
如圖9所示，根據本實施例的基板彎曲裝置3，在工作臺10的兩側可進一步包括固定器13。 As shown in FIG. 9, according to the substrate bending device 3 of this embodiment, the fixtures 13 may be further included on both sides of the table 10.
在工作臺10的兩側可至少具備一對固定器13，從 而，可將覆蓋構件40的兩端固定在工作臺10。 There may be at least a pair of holders 13 on both sides of the table 10, from In addition, both ends of the cover member 40 may be fixed to the table 10.
覆蓋構件40通過從形成在工作臺10的多個吸引口11提供的真空壓力緊貼於工作臺10，但是，在基板吸盤20上升的過程中，對覆蓋構件40的兩側施加向基板吸盤20側拉的張力。因此，覆蓋構件40和工作臺10之間的真空壓力弱于張力時，基板吸盤20上升的過程中，會發生覆蓋構件40被拉到基板吸盤20側的情況。 The cover member 40 is in close contact with the table 10 by vacuum pressure provided from the plurality of suction ports 11 formed in the table 10, but the substrate chuck 20 is applied to both sides of the cover member 40 while the substrate chuck 20 is rising. Side tension. Therefore, when the vacuum pressure between the cover member 40 and the table 10 is weaker than the tension, the cover member 40 may be pulled to the substrate chuck 20 side while the substrate chuck 20 is rising.
根據本實施例的基板彎曲裝置3，將覆蓋構件40的兩端用固定器13固定在工作臺10，從而，基板吸盤20上升而覆蓋構件40伸長的狀態下，也能將覆蓋構件40更加穩定地固定在工作臺10。 According to the substrate bending device 3 of the present embodiment, both ends of the cover member 40 are fixed to the table 10 with the holders 13, so that the cover member 40 can be stabilized even when the substrate chuck 20 is raised and the cover member 40 is extended. The ground is fixed on the workbench 10.
圖10是根據本發明的第四實施例的基板彎曲裝置的概略截面圖。 FIG. 10 is a schematic cross-sectional view of a substrate bending apparatus according to a fourth embodiment of the present invention.
如圖10所示，根據本實施例的基板彎曲裝置4，在工作臺10可以形成容納基板吸盤20的容納槽16。 As shown in FIG. 10, according to the substrate bending device 4 of this embodiment, a receiving groove 16 for receiving the substrate chuck 20 may be formed on the table 10.
容納槽16的深度對應於基板吸盤20的高度，若基板吸盤20被安裝在容納槽16的底面，則基板吸盤20的上面可位於與工作臺10的上面相同的平面。 The depth of the accommodating groove 16 corresponds to the height of the substrate chuck 20. If the substrate chuck 20 is mounted on the bottom surface of the accommodating groove 16, the upper surface of the substrate chuck 20 may be located on the same plane as the upper surface of the table 10.
並且，升降銷32貫穿容納槽16的底面而支撐基板吸盤20，可從容納槽16上升及下降基板吸盤20。 In addition, the lift pin 32 penetrates the bottom surface of the accommodation groove 16 to support the substrate chuck 20, and can raise and lower the substrate chuck 20 from the accommodation groove 16.
根據本實施例的基板彎曲裝置4，當基板吸盤20位於原位置時，容納槽16的底面支撐基板吸盤20。 According to the substrate bending device 4 of this embodiment, when the substrate chuck 20 is located at the original position, the bottom surface of the receiving groove 16 supports the substrate chuck 20.
從而，減輕升降銷32及升降驅動裝置31持續支撐基板吸盤20的負擔，原位置通過容納槽16的底面保持預定，因此，即便基板吸盤20反復升降，也能使從工作臺10上升的基板吸盤20保持規定高度。 Therefore, the burden of the lifting pin 32 and the lifting driving device 31 to continuously support the substrate chuck 20 is reduced, and the original position is kept predetermined by the bottom surface of the accommodation groove 16. Therefore, even if the substrate chuck 20 is repeatedly raised and lowered, the substrate chuck that is raised from the table 10 can be raised 20 Maintain the required height.
如上所述，根據本發明的各種實施例的基板彎曲裝置，利用基板吸盤20的邊角對彎曲物件區域S2的特定區域以相同的外力反復集中實施彎曲測試。 As described above, according to the substrate bending device of various embodiments of the present invention, the corners of the substrate chuck 20 are used to repeatedly and collectively perform a bending test on a specific region of the curved object region S2 with the same external force.
並且，控制基板吸盤20的上升速度、上升高度及上升力等而可以造成各種各樣的彎曲環境，通過微細調整彎曲所需的外力，可對彎曲區域僅有效地施加最小限度的應力變化。 In addition, by controlling the rising speed, rising height, and rising force of the substrate chuck 20, various bending environments can be created. By finely adjusting the external force required for bending, only minimal stress changes can be effectively applied to the bending area.
以下，說明根據本發明的實施例的基板彎曲檢查裝置。 Hereinafter, a substrate bending inspection device according to an embodiment of the present invention will be described.
圖11是根據本發明的實施例的基板彎曲檢查裝置的概略截面圖，圖12是根據本發明的實施例的基板彎曲檢查裝置的攝像部的框圖。 FIG. 11 is a schematic cross-sectional view of a substrate bending inspection apparatus according to an embodiment of the present invention, and FIG. 12 is a block diagram of an imaging section of the substrate bending inspection apparatus according to an embodiment of the present invention.
如圖11所示，根據本發明的實施例的基板彎曲檢查裝置5包括工作臺10、基板吸盤20、升降部30、覆蓋構件40及攝像檢查部50。 As shown in FIG. 11, a substrate bending inspection device 5 according to an embodiment of the present invention includes a table 10, a substrate chuck 20, a lifting portion 30, a cover member 40, and an imaging inspection portion 50.
根據本實施例的基板彎曲檢查裝置5利用該基板彎曲裝置，由於工作臺10、基板吸盤20、升降部30及覆蓋構件40的說明與所述內容重疊，因此，在此省略對其的詳細說明。 The substrate bending inspection device 5 according to this embodiment uses the substrate bending device, and since the description of the table 10, the substrate chuck 20, the lifting portion 30, and the cover member 40 overlaps with the above description, detailed descriptions thereof are omitted here. .
如圖11所示，根據本發明的基板彎曲檢查裝置15 的攝像檢查部50可包括圖像取得部51、運算部52及顯示部53。 As shown in FIG. 11, a substrate bending inspection device 15 according to the present invention The imaging inspection unit 50 may include an image acquisition unit 51, a calculation unit 52, and a display unit 53.
圖像取得部51是為拍攝基板S的彎曲物件區域S2的構成原件，可包括CCD(Charge Coupled Device)相機和用於測定彎曲物件區域S2的亮度的亮度計。 The image acquisition unit 51 is an original component for capturing the curved object region S2 of the substrate S, and may include a CCD (Charge Coupled Device) camera and a luminance meter for measuring the brightness of the curved object region S2.
圖像取得部51設置為指向彎曲基板S的彎曲物件區域S2的位置。例如，如圖11所示，設置在基板吸盤20的邊角部分的上部而指向垂直下方，或者傾斜地設置在工作臺11的上部而指向彎曲彎曲物件區域S2的位置。 The image acquisition unit 51 is provided so as to point to the curved object region S2 of the curved substrate S. For example, as shown in FIG. 11, it is provided on the upper part of the corner portion of the substrate chuck 20 and points vertically downward, or it is provided obliquely on the upper part of the table 11 and points to the position of the curved object region S2.
圖像取得部51設置成可向XYZ軸移動，沿基板吸盤20的邊角移動的同時掃描並拍攝彎曲物件區域S2，或者拍攝在基板吸盤20的一側邊角被彎曲的一側彎曲物件區域S2之後移動而指向基板吸盤20的另一側邊角，然後，可以拍攝在基板吸盤20的另一側邊角被彎曲的另一側彎曲物件區域S2。 The image acquisition unit 51 is provided so as to be movable toward the XYZ axis, and scan and photograph the curved object region S2 while moving along the corners of the substrate chuck 20, or the curved object region on the side where the corner of the substrate chuck 20 is curved After S2, it moves to point to the other corner of the substrate chuck 20, and then, the other side curved object region S2 where the other corner of the substrate chuck 20 is bent can be photographed.
或者，圖像取得部51可包括分別指向基板吸盤20的兩側邊角部分的一對攝像頭。從而可以同時取得通過基板吸盤20的兩側邊角彎曲的彎曲物件區域S2的兩側圖像。 Alternatively, the image acquisition unit 51 may include a pair of cameras that respectively point to corner portions on both sides of the substrate chuck 20. Thereby, images of both sides of the curved object region S2 bent by the corners of both sides of the substrate chuck 20 can be obtained at the same time.
如圖12所示，運算部52可以包括圖像加工部52a、亮度測定部52b、外觀檢查部52c以及處理部52d。 As shown in FIG. 12, the calculation unit 52 may include an image processing unit 52 a, a brightness measurement unit 52 b, an appearance inspection unit 52 c, and a processing unit 52 d.
圖像加工部52a接受從圖像取得部51拍攝的圖像，並加工成易檢查的圖像。 The image processing unit 52 a receives an image captured from the image acquisition unit 51 and processes it into an image that can be easily inspected.
例如，將從圖像取得部51接受的所拍攝的圖像轉換為數位圖像，或者在攝像圖像中僅將彎曲物件區域S2的圖像分離 到檢查區域之後進行排列，或者進行去除因照明等而發生的噪音等的加工過程。 For example, the captured image received from the image acquisition unit 51 is converted into a digital image, or only the image of the curved object region S2 is separated from the captured image Arrange after the inspection area, or perform processing to remove noise and other noise caused by lighting.
亮度測定部52b從圖像加工部52a接受經加工的圖像而測定彎曲物件區域S2的亮度。 The brightness measurement unit 52b receives the processed image from the image processing unit 52a, and measures the brightness of the curved object region S2.
當基板S被彎曲時，由於形成在基板S的電路圖也一起彎曲，因此，電路的電阻變大等電路特性發生變化，由此，所顯示的圖像的亮度會發生變化。 When the substrate S is bent, the circuit pattern formed on the substrate S is also bent together. Therefore, the circuit characteristics such as the resistance of the circuit increases, and the brightness of the displayed image changes.
亮度測定部52b可以測定彎曲物件區域S2的彎曲前後的亮度變化及/或彎曲物件區域S2的彎曲中的亮度變化。 The brightness measurement unit 52b can measure the brightness change before and after the bending of the curved object region S2 and / or the brightness change during the bending of the curved object region S2.
為了正確地測定亮度，圖像取得部51具備亮度計，該亮度計與亮度測定部52b連接，可以測定彎曲物件區域S2的亮度及亮度變化。 In order to accurately measure the brightness, the image acquisition unit 51 includes a brightness meter connected to the brightness measurement unit 52b, and can measure the brightness and brightness change of the curved object region S2.
另外，外觀檢查部52c從圖像加工部52a接受經加工的圖像，並檢查彎曲物件區域S2是否有缺陷。 In addition, the appearance inspection unit 52c receives the processed image from the image processing unit 52a, and checks whether the curved object region S2 is defective.
外觀檢查部52c在彎曲物件區域S2的圖像中可以檢測在表面或內部存在的破損及/或形成在基板S的電路的短路及斷線等的不良要素。 The appearance inspection unit 52c can detect defects existing on the surface or the inside of the curved object region S2, and / or defective elements such as a short circuit or disconnection of a circuit formed on the substrate S.
外觀檢查部52c存儲作為不良判斷的基準的參考圖像，比較參考圖像和從圖像加工部52a傳遞而來的圖像，從而可以檢查彎曲物件區域S2所存在的不良要素。 The appearance inspection unit 52c stores a reference image serving as a reference for determining a defect, and compares the reference image with an image transmitted from the image processing unit 52a, so that a defective element existing in the curved object region S2 can be checked.
參考圖像是沒有不良要素的基板圖像，也可為在圖像取得部51拍攝的彎曲物件區域與彎曲物件區域S2相同地點的 圖像。 The reference image is a substrate image having no defective elements, and may be the same location of the curved object region and the curved object region S2 captured by the image acquisition unit 51. image.
另外，處理部52d連接於亮度測定部52b和外觀檢查部52c，根據亮度測定部52b和外觀檢查部52c的測定/檢查結果可以判斷基板S是否為不良。 The processing unit 52d is connected to the brightness measurement unit 52b and the appearance inspection unit 52c, and can determine whether the substrate S is defective based on the measurement / inspection results of the brightness measurement unit 52b and the appearance inspection unit 52c.
處理部52d分析從亮度測定部52b傳送的彎曲物件區域S2的彎曲前後及/或彎曲中的亮度及亮度變化量等，並可以判斷對應基板S的亮度及亮度變化量是否保持在正常範圍內。並且存儲對檢查物件基板S的亮度及亮度變化量而蓄積資料，從而可以按照彎曲程度運算平均亮度變化量。 The processing unit 52d analyzes the brightness, the brightness change amount, and the like before and / or during the bending of the curved object region S2 transmitted from the brightness measurement unit 52b, and can determine whether the brightness and the brightness change amount of the corresponding substrate S remain within a normal range. In addition, the brightness and the amount of change in the brightness of the inspection object substrate S are stored to store data, so that the average amount of change in brightness can be calculated according to the degree of bending.
並且，處理部52d基於從外觀檢查部52c傳遞而來的彎曲物件區域S2中所存在的不良要素的資訊，可以判斷對應基板S是否為不良。 In addition, the processing unit 52d can determine whether the corresponding substrate S is defective based on the information of the defective elements existing in the curved object region S2 transmitted from the appearance inspection unit 52c.
處理部52d綜合彎曲物件區域S2記憶體在的破損與否、破損尺寸、電路的短路/斷線與否等不良要素而可以判斷對應基板S是否為不良。 The processing unit 52d can determine whether or not the corresponding substrate S is defective by comprehensively considering the defective elements such as the damage of the memory in the curved object region S2, the broken size, and the short circuit or disconnection of the circuit.
顯示部53可以連接於圖像取得部51及運算部52，並可以顯示彎曲物件區域S2的圖像及彎曲物件區域S2的亮度、亮度變化量、不良要素等資訊。 The display unit 53 may be connected to the image acquisition unit 51 and the calculation unit 52 and may display an image of the curved object region S2 and information such as the brightness, the amount of change in brightness, and defective elements of the curved object region S2.
具體而言，顯示部53可以顯示彎曲物件區域S2的彎曲前後的圖像、彎曲中的圖像等，在各狀態下，亮度測定部52b可以顯示所測定的亮度及亮度變化量，在各狀態下，可將外觀檢測部52c檢測的不良要素顯示在彎曲物件區域S2的圖像上。 Specifically, the display unit 53 may display an image before and after the bending of the curved object region S2, an image during the bending, and the like. In each state, the brightness measuring unit 52b may display the measured brightness and the amount of change in brightness. Next, the defective element detected by the appearance detection unit 52c can be displayed on the image of the curved object region S2.
並且，顯示部53可以顯示在處理部52d判斷的基板S是否為不良的資訊。 In addition, the display unit 53 may display information on whether the substrate S judged by the processing unit 52d is defective.
由此，根據本發明的實施例的基板彎曲檢查裝置5，對基板S反復進行彎曲測試的同時，可以同時進行彎曲物件區域S2的破損及亮度等光學檢查。 Therefore, according to the substrate bending inspection device 5 according to the embodiment of the present invention, it is possible to perform optical inspections such as breakage and brightness of the curved object region S2 while repeating the bending test on the substrate S.
而且，利用基板吸盤20的邊角對彎曲物件區域S2的特定區域以相同的外力可反復集中進行彎曲測試，因此，可以確保彎曲測試及檢查的可靠性。 Furthermore, the corner test of the substrate chuck 20 can be used to repeatedly perform a bending test on a specific region of the bending object region S2 with the same external force. Therefore, the reliability of the bending test and inspection can be ensured.
以下，說明利用根據本發明的實施例的基板彎曲檢查裝置的基板彎曲檢查方法。 Hereinafter, a substrate bending inspection method using a substrate bending inspection apparatus according to an embodiment of the present invention will be described.
圖13是根據本發明的實施例的基板彎曲檢查方法的順序圖，圖14至圖16是利用根據本發明的實施例的基板彎曲檢查裝置的基板彎曲檢查過程的動作圖。 13 is a sequence diagram of a substrate bending inspection method according to an embodiment of the present invention, and FIGS. 14 to 16 are operation diagrams of a substrate bending inspection process using a substrate bending inspection apparatus according to an embodiment of the present invention.
如圖13所示，根據本發明的實施例的基板彎曲檢查方法，包括：基板配置步驟(S101)；覆蓋構件的配置步驟(S102)；基板及覆蓋構件的吸附步驟(S103)；基板吸盤的上升步驟(S104)；彎曲物件區域的攝像步驟(S105)；彎曲物件區域的亮度及外觀檢查步驟(S106)；基板吸盤的下降步驟(S107，S110)；判斷反復彎曲次數的步驟(S108)以及計數步驟(S109)。 As shown in FIG. 13, a substrate bending inspection method according to an embodiment of the present invention includes: a substrate disposing step (S101); a covering member disposing step (S102); a substrate and a covering member suction step (S103); Ascending step (S104); imaging step (S105) of the curved object area; brightness and appearance inspection step (S106) of the curved object area; step of lowering the substrate chuck (S107, S110); step of judging the number of repeated bending (S108); and Counting step (S109).
基板配置步驟(S101)是將要進行彎曲檢查的對向基板S配置在基板吸盤20的步驟，如圖14所示，可將基板S的局部配置在基板吸盤20上。此時，基板S可以配置成彎曲物件區 域S2位於基板吸盤20的邊角部分，彎曲物件區域S2的鄰接面中的一側被定義為配置於基板吸盤20上的安裝區域S1，而在彎曲物件區域S2的鄰接面中的另一側可以定義為朝基板吸盤20的外側突出的突出區域(圖3)。 The substrate arranging step (S101) is a step of arranging the opposite substrate S to be subjected to the bending inspection on the substrate chuck 20. As shown in FIG. 14, a part of the substrate S may be disposed on the substrate chuck 20. At this time, the substrate S may be configured as a curved object area The region S2 is located at a corner portion of the substrate sucker 20. One side of the abutting surface of the curved object region S2 is defined as the mounting region S1 disposed on the substrate sucker 20, and the other side of the abutting surface of the curved object region S2. It can be defined as a protruding area protruding toward the outside of the substrate chuck 20 (FIG. 3).
基板配置步驟(S101)以後進行的覆蓋構件的配置步驟(S102)是將覆蓋構件40配置成覆蓋基板S的前面的步驟，如圖15所示，覆蓋構件40可配置成其中央部覆蓋基板S，而從中央部延長的兩側覆蓋工作臺10。 The cover member arranging step (S102) performed after the substrate arranging step (S101) is a step of arranging the cover member 40 so as to cover the front surface of the substrate S. As shown in FIG. 15, the cover member 40 may be disposed so that the central portion covers the substrate S. The workbench 10 is covered on both sides extending from the center.
覆蓋構件40可以利用伸長及恢復穩定性出色的材料的薄膜。 As the cover member 40, a thin film of a material having excellent elongation and recovery stability can be used.
基板及覆蓋構件的吸附步驟(S103)是將基板S固定在基板吸盤20，並將覆蓋構件40固定在工作臺10的步驟，如圖15所示，基板吸盤20，朝上面提供吸引力而在基板S和基板吸盤20的上面之間形成真空壓力，從而可以將基板S固定在基板吸盤20，工作臺10，朝上面提供吸引力而在覆蓋構件40的兩側和工作臺10的上面之間形成真空壓力，從而將覆蓋構件40固定在工作臺10。 The step of adsorbing the substrate and the cover member (S103) is a step of fixing the substrate S to the substrate chuck 20 and fixing the cover member 40 to the table 10, as shown in FIG. A vacuum pressure is formed between the substrate S and the upper surface of the substrate chuck 20, so that the substrate S can be fixed to the substrate chuck 20, the table 10, and provides an attractive force toward the upper side between the both sides of the cover member 40 and the upper surface of the table 10 A vacuum pressure is applied to fix the cover member 40 to the table 10.
基板吸盤的上升步驟(S104)是通過基板吸盤20的上升而彎曲基板S的步驟，如圖16所示，升降驅動裝置31使支撐基板吸盤20的升降銷32上升，從而可以在基板吸盤20的上面和工作臺10的上面之間形成高度差。 The ascending step of the substrate chuck (S104) is a step of bending the substrate S by the ascent of the substrate chuck 20. As shown in FIG. 16, the elevating driving device 31 raises the elevating pin 32 supporting the substrate chuck 20, so that the A height difference is formed between the upper surface and the upper surface of the table 10.
基板S的安裝區域S1支撐在基板吸盤20而進行上 升，在覆蓋構件40的兩側緊貼於工作臺10的上面的狀態下，覆蓋基板S的中央部通過基板吸盤20進行上升。 The mounting area S1 of the substrate S is supported by the substrate chuck 20 When the two sides of the cover member 40 are in close contact with the upper surface of the table 10, the center portion of the cover substrate S is raised by the substrate chuck 20.
通過緊貼於工作臺10的兩側和覆蓋基板S的中央部的高度差，覆蓋構件40朝基板吸盤20的側面側緊貼基板S的突出區域S3，朝基板吸盤20的邊角側加壓基板S的彎曲物件區域S2，從而，可沿邊角彎曲彎曲物件區域S2。 Due to the height difference between the two sides of the table 10 and the central portion of the cover substrate S, the cover member 40 abuts the protruding area S3 of the substrate S toward the side surface of the substrate chuck 20 and presses the corner side of the substrate chuck 20 The curved object region S2 of the substrate S can be bent along the corners.
向基板吸盤20的側面也提供吸附力時，由於知道緊貼於基板吸盤20的側面側的基板S的突出區域S3也固定於基板吸盤20，因此彎曲物件區域S2可以穩定地保持彎曲狀態。 When the suction force is also applied to the side surface of the substrate chuck 20, since it is known that the protruding area S3 of the substrate S that is in close contact with the side surface of the substrate chuck 20 is also fixed to the substrate chuck 20, the curved object region S2 can be stably maintained in a bent state.
升降驅動裝置31控制升降銷32的上升速度及高度，而可以提供各種各樣的彎曲環境。 The elevating drive device 31 controls the ascent speed and height of the elevating pin 32 and can provide various bending environments.
在彎曲物件區域的攝像步驟(S105)中，如圖14至16所示，指向基板吸盤20的邊角部分的圖像取得部51可以拍攝彎曲物件區域S2。 In the imaging step (S105) of the curved object region, as shown in FIGS. 14 to 16, the image acquisition section 51 directed to the corner portion of the substrate chuck 20 can capture the curved object region S2.
圖像取得部51可以包括用於拍攝彎曲物件區域S2的CCD相機以及用於測定彎曲物件區域S2的亮度的亮度計。 The image acquisition unit 51 may include a CCD camera for capturing the curved object region S2 and a luminance meter for measuring the brightness of the curved object region S2.
CCD相機可以攝像彎曲前後及彎曲中的彎曲物件區域S2的圖像，亮度計也可以測定彎曲前後及彎曲中的彎曲物件區域S2的亮度。 The CCD camera can capture images of the curved object region S2 before and after bending and during bending, and the luminance meter can also measure the brightness of the curved object region S2 before and after bending and during bending.
圖像取得部51設置成可向XYZ軸移動，沿基板吸盤20的邊角移動的同時掃描並拍攝彎曲物件區域S2，或者拍攝在基板吸盤20的一側邊角被彎曲的一側彎曲物件區域S2之後移動而 指向基板吸盤20的另一側邊角，然後，可以拍攝在基板吸盤20的另一側邊角被彎曲的另一側彎曲物件區域S2。 The image acquisition unit 51 is provided so as to be movable toward the XYZ axis, and scan and photograph the curved object region S2 while moving along the corners of the substrate chuck 20, or the curved object region on the side where the corner of the substrate chuck 20 is curved Move after S2 and Point at the other side corner of the substrate chuck 20, and then, the other side curved object region S2 where the other side corner of the substrate chuck 20 is bent can be photographed.
或者，圖像取得部51具備分別指向基板吸盤20的兩側邊角部分的一對攝像頭，從而可以同時取得通過基板吸盤20的兩側邊角彎曲的彎曲物件區域S2的兩側圖像。 Alternatively, the image acquisition unit 51 includes a pair of cameras directed to the corner portions of both sides of the substrate chuck 20, and can simultaneously obtain images of both sides of the curved object region S2 bent by the corners of both sides of the substrate chuck 20.
在彎曲物件區域的亮度及外觀檢查步驟(S106)中，運算部52加工圖像取得部51所攝像及測定的彎曲物件區域S2的圖像及亮度資訊，並將加工的資訊可通過顯示部53顯示。 In the brightness and appearance inspection step (S106) of the curved object region, the computing unit 52 processes the image and brightness information of the curved object region S2 captured and measured by the image acquisition unit 51, and passes the processed information to the display unit 53. display.
運算部52可以包括圖像加工部52a、亮度測定部52b、外觀檢查部52c及處理部52d。 The calculation unit 52 may include an image processing unit 52a, a brightness measurement unit 52b, an appearance inspection unit 52c, and a processing unit 52d.
圖像加工部52a將從圖像取得部51接受的攝像圖像轉換為數位圖像，或者在攝像圖像中僅將彎曲物件區域S2的圖像分離到檢查區域之後進行排列，或者進行去除因照明等而發生的噪音等的加工過程，接受從圖像取得部51攝像的攝像圖像，並將其加工成容易檢查的圖像。 The image processing unit 52a converts the captured image received from the image acquisition unit 51 into a digital image, or separates the image of the curved object region S2 into the inspection region in the captured image and arranges it, or removes the cause A processing process such as noise caused by lighting or the like receives a captured image captured from the image acquisition unit 51 and processes it into an image that can be easily inspected.
亮度測定部52b接受從圖像加工部52a加工的圖像或圖像取得部51的亮度計測定的亮度資訊，而可以測定彎曲物件區域S2的彎曲前後的亮度變化及/或彎曲物件區域S2的彎曲中的亮度變化。 The brightness measurement unit 52b receives the brightness information measured by the image processed by the image processing unit 52a or the brightness meter of the image acquisition unit 51, and can measure the brightness change before and after the bending of the curved object region S2 and / or the brightness of the curved object region S2. Changes in brightness during bending.
外觀檢查部52c從圖像加工裝置52a接受經加工的圖像，並在彎曲物件區域S2的圖像可以檢測出表面或內部所存在的破損及/或形成在基板S的電路的短路及斷線等的不良要素。 The visual inspection unit 52c receives the processed image from the image processing device 52a, and can detect damage on the surface or inside of the curved object region S2 and / or short circuit or disconnection of the circuit formed on the substrate S. And other undesirable elements.
處理部52d綜合亮度測定部52b和外觀檢查部52c的測定/檢查結果而可以判斷基板S是否為不良。 The processing unit 52d can determine whether the substrate S is defective by combining the measurement / inspection results of the brightness measurement unit 52b and the appearance inspection unit 52c.
即，處理部52d分析從亮度測定部52b接受的彎曲物件區域S2的彎曲前後及/或彎曲中的亮度及亮度變化量等，並可以判斷對應基板S的亮度及亮度變化量是否保持在正常範圍內，綜合彎曲物件區域S2記憶體在的破損與否、破損尺寸、電路的短路/斷線與否等不良要素而可以判斷對應基板S是否為不良。 That is, the processing unit 52d analyzes the brightness and the amount of brightness change of the curved object region S2 before and after bending and / or the bending received from the brightness measurement unit 52b, and can determine whether the brightness and the amount of brightness change of the corresponding substrate S are maintained within the normal range In addition, it is possible to determine whether the corresponding substrate S is defective by comprehensively considering the defective elements such as the damage of the memory in the curved object area S2, the size of the damage, and the short circuit / break of the circuit.
顯示部53可以顯示圖像取得部51所攝像的彎曲物件區域S2的圖像及亮度，並可以顯示通過運算部52加工的彎曲物件區域S2的圖像、彎曲物件區域S2的亮度、亮度變化量、不良要素等資訊。 The display unit 53 can display the image and brightness of the curved object region S2 captured by the image acquisition unit 51, and can display the image of the curved object region S2 processed by the computing unit 52, the brightness of the curved object region S2, and the amount of brightness change. , Bad elements, and more.
具體而言，顯示部53可以顯示彎曲物件區域S2的彎曲前後的圖像、彎曲中的圖像等，在各狀態下，亮度測定部52b可以顯示所測定的亮度及亮度變化量，在各狀態下，並將外觀檢測部52c檢測的不良要素可顯示在彎曲物件區域S2的圖像上。 Specifically, the display unit 53 may display an image before and after the bending of the curved object region S2, an image during the bending, and the like. In each state, the brightness measuring unit 52b may display the measured brightness and the amount of change in brightness. Then, the defective elements detected by the appearance detection unit 52c can be displayed on the image of the curved object region S2.
並且，顯示部53可以顯示在處理部52d判斷的基板S是否為不良的資訊。 In addition, the display unit 53 may display information on whether the substrate S judged by the processing unit 52d is defective.
在基板吸盤下降步驟(S107，S110)，使上升的基板吸盤20下降到原位置，從而解除基板S的彎曲狀態。 In the substrate chuck lowering step (S107, S110), the raised substrate chuck 20 is lowered to the original position, and the bending state of the substrate S is released.
當升降驅動裝置31使升降銷32下降而將基板吸盤20恢復到原位置時，覆蓋構件40及基板S通過自身彈力恢復到最初安裝在工作臺10或基板S上面的平平的狀態。 When the elevating drive device 31 lowers the elevating pin 32 to return the substrate chuck 20 to the original position, the cover member 40 and the substrate S are restored to the flat state originally mounted on the table 10 or the substrate S by their own elastic force.
然後，在判斷反復彎曲次數的步驟(S108)，可以比較基板吸盤20的升降次數和所設定的反復彎曲次數。 Then, in the step of determining the number of repeated bending (S108), the number of times of raising and lowering of the substrate chuck 20 and the set number of repeated bending can be compared.
基板吸盤20的升降次數對應於基板S的彎曲次數，基板吸盤20的升降次數未達到已設定的反復彎曲次數時，使基板吸盤20再次上升而反復進行該基板吸盤上升步驟(S104)、彎曲物件區域攝像步驟(S105)、彎曲物件區域的亮度及外觀檢查步驟(S106)以及基板吸盤下降步驟(S107)。 The number of times the substrate chuck 20 rises and lowers corresponds to the number of times the substrate S is bent. When the number of times the substrate chuck 20 rises and falls does not reach the set number of repeated bending times, the substrate chuck 20 is raised again and the substrate chuck raising step (S104) is repeated. The area imaging step (S105), the brightness and appearance inspection step (S106) of the curved object area, and the substrate chuck lowering step (S107).
計數步驟(S109)是計算基板S的彎曲次數的步驟，將最初N值設定為1，在最初彎曲基板S之後的判斷反復彎曲次數的步驟(S108)，若判斷為N值未達到已設定的反復彎曲次數，則將N值各增加1而計算基板S的彎曲次數。 The counting step (S109) is a step of calculating the number of bending times of the substrate S. The initial N value is set to 1, and the step of determining the number of repeated bending times after the first bending of the substrate S (S108). If it is determined that the N value has not reached the set value The number of times of bending is repeated, and the N value is increased by 1 each to calculate the number of times of bending of the substrate S.
在反復彎曲基板S後，若N值達到已設定的反復彎曲次數，則最後基板吸盤20下降(S110)，而結束基板彎曲檢查。 After the substrate S is repeatedly bent, if the N value reaches the set number of repeated bending times, the substrate chuck 20 is finally lowered (S110), and the substrate bending inspection is ended.
由此，根據本發明的實施例的基板彎曲檢查方法，對基板S反復進行彎曲測試的同時，可以同時進行彎曲物件區域S2的破損及亮度等的光學檢查。 Therefore, according to the substrate bending inspection method of the embodiment of the present invention, it is possible to perform optical inspections such as damage to the curved object region S2 and the like while repeating the bending test on the substrate S.
並且，利用基板吸盤20的邊角，對彎曲物件區域S2的特定區域用相同的外力反復集中進行彎曲測試，從而可以確保彎曲測試及檢查的可靠性。 In addition, the corners of the substrate chuck 20 are used to repeatedly and collectively perform a bending test on a specific area of the curved object region S2 with the same external force, thereby ensuring the reliability of the bending test and inspection.
以上，雖參照附圖說明了本發明的實施例，但是，本發明並不限定於所述實施例，可以製造為不同的形態，本發明所屬領域的技術人員應理解在不改變本發明的技術思想或必要特 徵的情況下可以實施為其他的具體形態。因此，以上所述的實施例在所有方面用來舉例說明而已，並不限定本發明。 Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the embodiments, and can be manufactured in different forms. Those skilled in the art to which the present invention pertains should not change the technology of the present invention. Thought or necessity In the case of signing, it can be implemented in other specific forms. Therefore, the embodiments described above are used for illustration in all aspects and do not limit the present invention.
1‧‧‧基板彎曲裝置 1‧‧‧ substrate bending device
10‧‧‧工作臺 10‧‧‧Workbench
11‧‧‧吸引口 11‧‧‧ Attraction
12‧‧‧吸引流路 12‧‧‧ Attraction
15‧‧‧通孔 15‧‧‧through hole
20‧‧‧基板吸盤 20‧‧‧ substrate sucker
30‧‧‧升降部 30‧‧‧ Lifting Department
31‧‧‧升降驅動裝置 31‧‧‧ Lifting Drive
32‧‧‧升降銷 32‧‧‧lift pin
40‧‧‧覆蓋構件 40‧‧‧ cover member
S‧‧‧基板 S‧‧‧ substrate
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| CN105807212B (en) | 2016-05-26 | 2018-03-13 | 深圳市华星光电技术有限公司 | Circuit board testing device and circuit board detection method |
| KR102535154B1 (en) | 2016-09-05 | 2023-05-22 | 삼성디스플레이 주식회사 | Bending apparatus and method for manufacturing display device |
| CN109983321B (en) * | 2016-11-25 | 2022-06-24 | Ａｇｃ株式会社 | Base material evaluation method and bent glass evaluation device |
| CN107036525B (en) * | 2017-05-23 | 2019-06-28 | 京东方科技集团股份有限公司 | Flexible screen bending detection device and method, flexible screen |
| CN107162399B (en) * | 2017-07-19 | 2020-07-03 | 安徽云融信息技术有限公司 | Glass processing system and processing method |
| KR20190014262A (en) * | 2017-07-31 | 2019-02-12 | 주식회사 아바코 | Apparatus for Bending Flexible Substrate |
| WO2020194635A1 (en) * | 2019-03-27 | 2020-10-01 | シャープ株式会社 | Inspection device |
| CN110864969B (en) * | 2019-11-29 | 2022-06-21 | 昆山国显光电有限公司 | Bending stiffness testing method and device and testing method of display panel |
| CN112485109B (en) * | 2020-11-06 | 2023-04-07 | 昆山国显光电有限公司 | Testing device and system for display panel |
| CN112504823B (en) * | 2021-02-04 | 2021-05-28 | 浙江荷清柔性电子技术有限公司 | Flexible chip bending capability testing device, testing method and flexible carrier |
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| CN101726442B (en) * | 2008-10-24 | 2011-09-21 | 中国科学院金属研究所 | In situ evaluation system and method of reliability of thin-film materials on flexible electronic substrate |
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