201213812 六、發明說明： 【發明所屬之技術領域】 本發明係與探針卡結構有關，更詳而言之是指—種高頻探 針、探針單元及探針卡。 【先前技術】 按，用以檢測電子產品之各精密電子元件間的電性連接是 _ 科實的方法’是以—麟卡作為—制減該細電子物件 之間的測試訊麟輸介面，而為制有祕輸高觸試訊號， 所選用的騎卡必須具有與檢峨及制電子物件相匹配的 阻抗，如此方能準確地反應出通電測試結果。 影響探針卡、檢峨及制電子物件彼此間的阻抗能否匹 配的因素有許多，且因探針卡結構之差異而有不同因素產生。 已知影響阻抗值的變數例如有：設置在職訊號傳輪路徑上的 • ㈣銲接點數量，數目越多者將使得阻抗值增加而不利於訊號 傳輸；又如相鄰探針之間的距離，亦是影響阻抗能否匹配的因 素之-，在精準距離控制的情況τ，有助於阻抗匹配的設定， 反之將有害於阻抗匹配結果。 以-種多針機f式探針卡為例，其位於不_層的訊號 針與其接地路徑(例如金屬線)之間是以固化的黑膠作為電性 隔離使用，並據以作為有效距離的控制，以賊得良好阻抗匹 配效果。鮮針層水平式探針卡輯，如频方式製作，依 201213812 序包括：先將訊號針預先擺放於一結合在電路板的絕緣座上 (通常是以固化的黑膠製成），接著塗覆呈黏祠流質狀的零 膠，在該黏稠黑膠固化之前’再將金屬線擺放其上，該金屬線 隨著黑膠的固化而穩固地被包覆住，並與訊號針保持一距離。 然而，該習知以固化後的黑膠作為電性隔離訊號針與金屬線的 方法’容易因黑膠在流質狀至固化的過程中所伴隨的體積收縮 變化，導致金屬線最終的位置未能與訊號針保持在預設的距 離’易言之，將有損於阻抗匹配的結果。 又以中華民國申請號數096100746「高頻探針」為例，其 說明書之圖式第五圖揭露金屬針(即訊號針)與金屬線之間藉 由絕緣層而彼此電性絕緣。前述絕緣層即是以黑膠作為材料製 成，惟如上述，黑膠在固化過程中容易因體積變化而導致最終 厚度無法達到預期的設計值，致使阻抗匹配不佳。 【發明内容】 有於此，本發明之主要目的在於提供一種高頻探針、探 針單το及探針卡，具有精準控觀號針與金屬線之間距離的效 果，以獲得良好的阻抗匹配，並提升電性傳輸能力。 緣以達成上述目的，本發明所提供之高頻探針包含一訊號 針、-金屬線與-間隔件，其中，間隔件是以絕緣材料製成具 有-固定高度的固體，其設置於該訊號針與該金屬線之間，使 付訊號針與金屬線彼此間保有棚定高度之距離。 201213812 本發明另提供-讎解元，包含料第—訊麟之第— 訊號針層、具有第二訊號針之第二訊號針層、具有第一金屬線 與接地針之接地電⑽設置在該第—赠針層及該第二訊號 針層之間’以及第-間隔件以絕緣材料製作成具有—固定高度 之固體’且擺設於該第—訊號針與該第—金屬線之間。 本發明再提供-麵針卡，包括±狀冑親針、接地針 與電路板，其中’冑頻探針之訊號針與金屬線—端各別電性連 接至電路板的下表面’觸;針肋接觸並傳輸職訊號予一待 測電子物件，而接地針則是與該金屬線電性連接至接地電位。 【實施方式】 為能更清楚地說明本發明，兹舉較佳實施例並配合圖示詳 細說明如后。請配合第-至三圖所示，本發明一車交佳實施例之 探針卡1包括-電路板10、-絕緣座14、複數高頻探針16、 一間隔件18、至少一接地針20、一以銅箔22為例之導電件以 及-絕緣包覆體24 ’為便於說明，錄各構件之組裝順序說 明如下： 電路板10具有一下表面12’且該下表面12定義有一接點 區121與一連接區122 ’於該接點區121内設有訊號電路接點 121a與接地電路接點i21b。 絕緣座14在本實施例中是以具有絕緣特性之黑膠塗佈於 電路板10之連接區122 ’且經固化呈塊狀體。絕緣座14在其 201213812 一侧端則具有一支撐部14a。 每间頻探針16在本實施例中是由一訊號針⑹與一金 屬線162構成，高頻探針岭置於電路板H)之絕緣座14下 方，其中，訊號針⑹依序包含—針尖⑹b、一身部⑹c及 針尾161a，針尖161b及身部咖之間為―針先段⑹。， 針尾⑹a及身糊c之間為一尾段⑹d，訊號針⑹的身部 ⑹c係擺放魏_ 14之織卩14a上，紐尾腿與電路 板H)之訊號電路接‘點121a電性連接，針尖祕則用以接觸 一待測電子物件(圖未示），據以將來自檢測機(.圖未示)的測試 訊號傳輸至該待測電子物件。 間隔件18係在探針卡1的製作過程中，另以絕緣材料預 製成/、有疋形狀、體積及厚度的固體，例如板狀的固體， 在本實施财，間隔件18的厚度係以介於·m至觸⑽ ，間為佳’俾利控制製程，並降低誤差，該間隔件18在完成 减針161的裝配後，隨之被疊放在訊號針⑹的身部⑹。； 接著，將金屬線162與接地針2〇分_擺放於間隔件18上 且將金屬、線162 -端與電路板1〇之接地電路接點電性連 接，再於鋪設該銅箱22以接觸該金屬線162及接地針2〇後， 促使接地針2〇被紐雜至接地驗，，塗覆流質黑膠， 並待固化後即構成該絕緣包覆體24，且包覆體24與絕緣座Μ 連接成-體。另說_是，上述各構件在設置的難中，於完 成每-道步驟後’旋即於適當處塗佈黑膠以穩固構件。、& 201213812 上述即為本實施例探針卡！之結構敘述，必須再說明的是: 金屬線162是位在與該訊號針⑹重疊的位置上，且其等 之間是以該不可變形的間隔件18作為雜隔離，故不受㈣ 體24在固化過程中的體積收縮變化之影響，而始終保有預設 的固定距離，換言之，訊號針161與金屬線162將共同構成具 有良好阻抗匹配的高頻探針16，進而促使探針卡i整體的阻 抗值迠與檢測機及待測電子物件之間維持良好的阻抗匹配； 其次，本實施例中的間隔件18與訊號針161身部16]^接 觸的面積係小於絕緣座Μ與訊號針⑹身部101c接觸的面 積，如此，方有利於包覆體24完全地包覆住高頻探針16、間 隔件18及接地針20 ; 再者，如第一圖所示，訊號針161在其針尖161b至身部 161c之間為一段裸露的針先段161e，俾使得該段之訊號針i6i 略具彈性以促使針尖161b更能確實地接觸待測電子物件。 另一提的是，上述訊號針161自針尾161a到絕緣座14之 間的區段，即尾段161d，可再搭配有該金屬線162，如第四圖 所示，並於該金屬線162外部包覆一絕緣層163作為金屬線 162與訊號針161之間的電性隔離用，最後以一絕緣套筒164 將金屬線162與訊號針161包覆住，用以限制金屬線162與訊 號針161之間的間距，據以促使訊號針161亦達到阻抗匹配的 效果。同樣地，第五圖揭示將絕緣層163包覆於訊號針16ι外 部’亦可收阻抗匹配之效。 201213812 以下再就本㈣之高麵針㈣構之其他可變化形態敛 述於後’並重新賦予標號以辦述實施例區別，其中： 第六圖所示實施例之間隔件26係覆蓋訊號針28，銅箱3〇 緊接著鋪設在絕緣的職件％上，岭屬線％及接地針％ 則再擺放於銅箔30上以i幸忐雪,卜4、击& „ 邮雜連接目的，:t触佈黑膠並 待固化而形成絕緣包覆體36。 第七圖所示實施例係揭示先將金屬線％與接地針4〇分開 地》又置於絕緣座42上’接著擺放銅箱μ以雜連接金屬線 38 ”接地針4G ’之後擺上絕緣的_件*，並於間隔件 擺設完成後始將訊號針48放置在與金屬線％重㈣位置上， 最後塗佈黑膠並待固化而形成絕緣包覆體5〇。 第八、九圖所示實施例揭示訊號針52擺放於絕緣座54 後，雖同樣絕緣的間隔件56作為訊號針52與金屬線別 及接地針60的隔離並保持固^距離用，惟不同的是，本實施 烟以電性連接金祕58與接地㈣_料鱗鋼箱，而 疋-銲墊62，如第九圖所示，金屬線％具有— 致其-端接近接地針6G，復為該銲塾62所連結，金屬線％ 另-端維持連接至接地電位。#然，亦可選擇具有彎折段的接 地針而與金屬線連結。 第十圖所示實施例概與第八圖結構近似，不同處在於連接 至接地電位者，為長度延伸穿純緣座64之接地針66。 本案所有實施例的接地針結構可以選擇使用第八圖的接 201213812 地針6〇或者第十圖的接地針66，兩 針是否有延伸穿出絕緣座6 0、在於接地 結構均會吨頻汽接地針6G或接地針66的 雷位1的金_性連接，即電性連接至接地 電^，所社述兩種接地針結構均是可以使用的。 72 2一圖顯示訊號針68是以絕緣的間隔件％而與金屬線 保持預設的固定距離，但該圖更進-步地指出接地針74可 以^在與金雜72㈣高度位置，辨金麟72與接地針 74疋分屬不_層，並轉線Μ作為電性連接。 第十二圖揭示一種以上述技術基礎衍生的探針單元80,包 括依序於-絕緣座81上設置包含至少一第一訊號針轉成的 第訊號針層’於第一訊號針層上設置-第-間隔件S3，第 二間隔件83上設置一導電件科，導電件84上擺設有包含至 少-第-金屬線85、至少—第二金屬線％與―接地針87構 成的接地電位層’接著放置_第二間隔件88於該接地電位層 再將匕3至J 一第二訊號針89所構成的第二訊號針層設 置於第一間隔件88上’且’前述第-金屬線85與第-訊號針 82鄰〇又第一金屬線86與第二訊號針矽鄰設以形成前文敛 述的高頻探針。 上述配置方式不僅不會造成各金屬線干涉不同針層之訊 號針的问頻峨傳遞效果’更具餅低針層數，以及使得針層 ^十更田變化之效。因應待測電子物件的設計需求，探針單元 8〇可以選擇設計高頻探針或者-般的訊號針，所謂-般的訊 201213812 號針是指第一訊號針82沒有鄰設第一金屬線85或者第二訊號 針89沒有鄰設第二金屬線％。以第一訊號針層與接地電位層 為例’高頻探針或者一般的訊號針可以同時設置或者依照設計 需求作僅製作高頻探針或者一般的訊號針。 第十三圖所揭示之探針單元90具有與上述探針單元8〇相 同的功效，惟不同處在於：本實施例之導電件91係設置在包 含第一金屬線92、第二金屬線93與接地針94構成的接地電 位層與第二間隔件95之間。 值得一提的是，上述第十二圖及十三圖所揭示的探針單元 得以複數個方式疊設而構成一種多針層懸臂式探針卡。 本發明主要技術在於訊號針與金屬線之間設置該具有一 定形狀、體積及厚度的間隔件，據以改善習知以黏稠流質狀黑 膠作為電性隔離使用時潛在固化變形，導致訊號針與金屬線之 間距離未能保持在預設值内而有損阻抗匹配之缺失。如第一圖 所示，間隔件18係設置在絕緣座Μ垂直下方的區域中，以在 訊號針161的身部161c擺放於絕緣座14上，再藉由間隔件 18設置在161的身部161c上，取代習知使用黑膠作為電性隔 離導致的缺點。當然以第七圖所述，則是金屬線38擺放於絕 緣座42上’再依序擺放間隔件46及訊號針48，與第一圖實 施例相同處係間隔件設置在訊號針的身部上，訊號針的身部擺 放於絕緣座上。 以上所述僅為本發明較佳可行實施例而已’舉凡應用本發 201213812 明說明書及申請專利範圍所為之等效結構及製作方法變化，理 應包含在本發明之專利範圍内。201213812 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a probe card structure, and more particularly to a high frequency probe, a probe unit and a probe card. [Prior Art] According to the method for detecting the electrical connection between the precision electronic components of the electronic product, the method of "the real method" is to reduce the test interface between the fine electronic objects. In order to have a secret high-touch test signal, the selected riding card must have an impedance matching the inspection and electronic objects, so as to accurately reflect the power-on test result. There are many factors that affect the matching of the impedance between the probe card, the inspection and the electronic object, and different factors are caused by the difference in the structure of the probe card. The variables that are known to affect the impedance value are, for example, the number of solder joints set on the path of the in-service signal. (4) The number of solder joints will increase the impedance value and facilitate the signal transmission; and the distance between adjacent probes, It is also a factor that affects whether the impedance can be matched. In the case of precise distance control, τ helps the impedance matching setting, and vice versa will be detrimental to the impedance matching result. Taking a multi-needle machine f-type probe card as an example, the signal pin located between the non-layer and its grounding path (such as a metal wire) is used as an electrical isolation using the cured vinyl, and is used as an effective distance. The control gives the thief a good impedance matching effect. Fresh needle layer horizontal probe card series, such as frequency production, according to the 201213812 sequence: first put the signal pin in advance on a circuit board insulation (usually made of cured vinyl), then Applying a zero-adhesive glue in the form of a viscous liquid, and placing the wire on it before the viscous gelatin cures, the wire is firmly covered with the curing of the black glue and held with the signal pin a distance. However, the conventional method of using the cured black rubber as a method of electrically isolating the signal pin and the metal wire is easy to change due to the volume shrinkage accompanying the gelatin in the liquid to solidification process, resulting in the final position of the metal wire being failed. Keeping the signal pin at a preset distance' is easy to say, which will detract from the result of impedance matching. Taking the Republic of China application number 096100746 "high-frequency probe" as an example, the fifth figure of the specification discloses that the metal pin (ie, the signal pin) and the metal wire are electrically insulated from each other by an insulating layer. The foregoing insulating layer is made of black rubber as the material. However, as described above, the black rubber is liable to cause the final thickness to fail to reach the desired design value due to volume change during the curing process, resulting in poor impedance matching. SUMMARY OF THE INVENTION In view of this, the main object of the present invention is to provide a high frequency probe, a probe single το and a probe card, which have the effect of accurately controlling the distance between the needle and the wire to obtain a good impedance. Match and improve electrical transmission capabilities. In order to achieve the above object, the high frequency probe provided by the present invention comprises a signal pin, a metal wire and a spacer, wherein the spacer is made of an insulating material and has a fixed height solid, which is disposed on the signal. Between the needle and the metal wire, the signal needle and the metal wire are kept at a height of a shelf height. 201213812 The present invention further provides a 雠解元, including a material--Xinlin's first-signal pin layer, a second signal pin layer having a second signal pin, and a grounding electric (10) having a first metal wire and a grounding pin disposed therein The first and the second signal layer are formed between the needle layer and the second signal layer and the first spacer is made of an insulating material and has a fixed height solid and is disposed between the first signal pin and the first metal wire. The invention further provides a face pin card, comprising: a ± pin-shaped pin, a ground pin and a circuit board, wherein the signal pin of the chirp probe and the wire end are electrically connected to the lower surface of the circuit board; The pin rib contacts and transmits the job signal to an electronic object to be tested, and the ground pin is electrically connected to the ground potential. [Embodiment] In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. Please refer to the first to third figures, the probe card 1 of the preferred embodiment of the present invention includes a circuit board 10, an insulating seat 14, a plurality of high frequency probes 16, a spacer 18, and at least one grounding pin. 20. A conductive member exemplified by a copper foil 22 and an insulating covering body 24' are illustrated for convenience of explanation. The assembly sequence of the components is as follows: The circuit board 10 has a lower surface 12' and the lower surface 12 defines a joint. The area 121 and a connection area 122' are provided with a signal circuit contact 121a and a ground circuit contact i21b in the contact area 121. In the present embodiment, the insulating holder 14 is coated with a black rubber having an insulating property on the connecting portion 122' of the circuit board 10 and cured to form a block. The insulating seat 14 has a support portion 14a at its 201213812 side. In this embodiment, each frequency probe 16 is composed of a signal pin (6) and a metal wire 162. The high frequency probe ridge is placed under the insulating seat 14 of the circuit board H), wherein the signal pin (6) is sequentially included - The needle tip (6) b, the body portion (6) c and the needle tail 161a, and the needle tip 161b and the body coffee are the first needle segment (6). The needle tail (6) a and the body paste c are a tail section (6) d, the body of the signal needle (6) (6) c is placed on the weave 14a of the Wei _ 14 , and the signal circuit of the tail leg and the circuit board H) is connected to the point 121a. The sexual connection, the tip of the needle is used to contact an electronic object to be tested (not shown), and the test signal from the detecting machine (not shown) is transmitted to the electronic object to be tested. The spacer 18 is pre-formed with an insulating material in the manufacturing process of the probe card 1, and has a solid shape, a volume and a thickness, for example, a plate-like solid. In the present embodiment, the thickness of the spacer 18 is With the interval from m to touch (10), it is better to control the process and reduce the error. After the assembly of the needle reduction 161 is completed, the spacer 18 is then stacked on the body (6) of the signal pin (6). Then, the metal wire 162 and the grounding pin 2 are divided and placed on the spacer 18, and the metal, the wire 162 - end is electrically connected to the ground circuit contact of the circuit board 1 , and the copper box 22 is laid. After contacting the metal wire 162 and the grounding pin 2〇, the grounding pin 2 is urged to be grounded to the grounding test, and the fluid black rubber is applied, and after the curing, the insulating covering body 24 is formed, and the covering body 24 is formed. Connected to the insulator seat to form a body. In other words, the above-mentioned respective members are coated with black glue to stabilize the member after the completion of each step. , & 201213812 The above is the probe card of this embodiment! The description of the structure must be repeated: the metal wire 162 is located at a position overlapping the signal pin (6), and the non-deformable spacer 18 is isolated as a miscellaneous, so that it is not affected by the (four) body 24 The effect of volume shrinkage during the curing process, while maintaining a predetermined fixed distance, in other words, the signal pin 161 and the metal wire 162 together constitute a high frequency probe 16 with good impedance matching, thereby promoting the overall probe card i The impedance value 维持 maintains a good impedance matching between the detector and the electronic object to be tested. Secondly, the area of the spacer 18 in the embodiment that contacts the body of the signal pin 161 is smaller than that of the insulating seat and the signal pin. (6) The area in contact with the body 101c, so that the covering body 24 completely covers the high frequency probe 16, the spacer 18 and the grounding pin 20; further, as shown in the first figure, the signal pin 161 is Between the needle tip 161b and the body portion 161c is a bare needle first segment 161e, so that the signal pin i6i of the segment is slightly elastic to urge the needle tip 161b to more reliably contact the electronic object to be tested. In addition, the section of the signal pin 161 from the needle tail 161a to the insulating seat 14, that is, the tail section 161d, can be further matched with the metal wire 162, as shown in the fourth figure, and the metal wire 162 is An insulating layer 163 is externally coated as an electrical isolation between the metal wire 162 and the signal pin 161. Finally, the metal wire 162 and the signal pin 161 are covered by an insulating sleeve 164 for limiting the metal wire 162 and the signal. The spacing between the pins 161 is such that the signal pin 161 also achieves an impedance matching effect. Similarly, the fifth figure reveals that the insulating layer 163 is wrapped around the outer portion of the signal pin 16' to achieve impedance matching. 201213812 The following is a further description of the other variants of the high-profile needle (four) configuration of the present invention, and the reference numerals are used to distinguish the embodiment, wherein: the spacer 26 of the embodiment shown in the sixth figure covers the signal needle. 28, the copper box 3〇 is then placed on the insulation part%, the ridge line % and the grounding pin% are placed on the copper foil 30 to i fortunately snow, Bu 4, hit & „ postal connection The purpose is to: t-coat the black rubber and to be cured to form the insulating covering body 36. The embodiment shown in the seventh figure discloses that the metal wire % is separated from the grounding pin 4 》 and then placed on the insulating seat 42. Place the copper box μ to connect the metal wire 38 ”” grounding pin 4G′ and put the insulated _ piece*, and after the spacer is finished, place the signal pin 48 at the position of the metal wire with the weight (4), and finally apply The black rubber is cured and formed to form an insulating coating 5〇. The embodiment shown in the eighth and ninth embodiments shows that after the signal pin 52 is placed on the insulating seat 54, the equally insulating spacer 56 serves as a signal pin 52 for isolating the metal wire and the grounding pin 60 and maintaining the distance therebetween. The difference is that the implementation of the cigarette is electrically connected to the gold secret 58 and the grounding (four) _ scale steel box, and the 疋-pad 62, as shown in the ninth figure, the metal wire % has - the end is close to the grounding pin 6G The composite wire 62 is connected, and the metal wire %-end is maintained connected to the ground potential. #然, you can also choose a grounding pin with a bent section to connect with the metal wire. The embodiment shown in the tenth embodiment is similar to the structure of the eighth embodiment except that it is connected to the ground potential and is a grounding pin 66 extending through the pure edge 64. The grounding pin structure of all the embodiments of the present invention can be selected by using the grounding pin 66 of the 201213812 grounding pin or the grounding pin 66 of the tenth figure, whether the two needles extend through the insulating seat 60, and the grounding structure will be ton-frequency steam. The gold-like connection of the grounding pin 6G or the grounding pin 66 of the lightning position 1, that is, the electrical connection to the grounding electrical device, can be used for both grounding pin structures. 72 2 shows that the signal pin 68 is kept at a predetermined fixed distance from the metal wire by the insulating spacer %, but the figure further indicates that the grounding pin 74 can be at the height position of the gold hybrid 72 (four). Lin 72 and grounding pin 74 are divided into non-layers, and the turns are electrically connected. The twelfth embodiment discloses a probe unit 80 derived from the above-mentioned technology, comprising: sequentially arranging a signal layer formed by inserting at least one first signal pin on the insulating seat 81 to be disposed on the first signal pin layer a first spacer S3, a second conductive member 83 is provided with a conductive member, and the conductive member 84 is provided with a ground potential including at least a first-metal line 85, at least a second metal line % and a ground pin 87. The layer 'subsequently placed _ the second spacer 88 on the ground potential layer and then the second signal pin layer formed by the 匕3 to J and the second signal pin 89 is disposed on the first spacer 88' and the aforementioned first metal The line 85 is adjacent to the first signal pin 82, and the first metal line 86 and the second signal pin are adjacent to each other to form a high frequency probe as described above. The above configuration method not only does not cause the interfering effect of the signal lines of the signal pins of the different needle layers by the respective metal wires, but also the effect of changing the needle layer and changing the needle layer. Depending on the design requirements of the electronic object to be tested, the probe unit 8〇 can choose to design a high-frequency probe or a general-purpose signal pin. The so-called general-purpose 201213812 pin means that the first signal pin 82 has no adjacent first metal wire. 85 or the second signal pin 89 is not adjacent to the second metal wire %. Taking the first signal pin layer and the ground potential layer as an example, the high-frequency probe or the general signal pin can be set at the same time or only the high-frequency probe or the general signal pin can be made according to the design requirements. The probe unit 90 disclosed in the thirteenth embodiment has the same function as the probe unit 8A described above, except that the conductive member 91 of the present embodiment is disposed to include the first metal wire 92 and the second metal wire 93. It is between the ground potential layer formed by the grounding pin 94 and the second spacer 95. It is worth mentioning that the probe units disclosed in the above-mentioned twelfth and thirteenth drawings can be stacked in a plurality of ways to form a multi-needle cantilever type probe card. The main technique of the present invention is to provide the spacer with a certain shape, volume and thickness between the signal pin and the metal wire, thereby improving the potential curing deformation when the viscous fluid black plastic is used as the electrical isolation, resulting in the signal pin and The distance between the wires is not maintained within the preset value and the loss of impedance matching is lost. As shown in the first figure, the spacer 18 is disposed in a region vertically below the insulating seat to be placed on the insulating seat 14 at the body portion 161c of the signal pin 161, and is disposed on the body of the 161 by the spacer 18. The portion 161c replaces the conventional use of black glue as a disadvantage caused by electrical isolation. Of course, as shown in the seventh figure, the metal wire 38 is placed on the insulating seat 42. The spacer 46 and the signal pin 48 are placed in sequence, and the spacer is disposed on the signal pin in the same manner as in the first embodiment. On the body, the body of the signal pin is placed on the insulating seat. The above description is only for the preferred embodiment of the present invention, and the equivalent structure and manufacturing method of the present invention are intended to be included in the scope of the present invention.
11 201213812 【圖式簡單說明】 第一圖為本發明一較佳實施例之剖視圖。 第二圖為本發明上述較佳實施例之俯視圖。 第二圖為第二圖之3-3方向剖視圖。 第四圖為一剖視圖’揭示訊號針之尾段搭配金屬線且金屬線外 部包覆絕緣層。 第五圖為一剖視圖，揭示訊號針之尾段搭配金屬線且訊號針尾 段外部包覆絕緣層。 第六圖為本發明另一較佳實施例之剖視圖。 第七圖為本發明又一較佳實施例之剖視圖。 第八圖為本發明再一較佳實施例之俯視圖。 第九圖為第八圖之9-9方向剖視圖。 第十圖類同第八圖，揭示接地針直接連接至接地電位。 第十圖為一剖視圖，揭示金屬線與接地針分屬不同斜與 第十二圖為一剖視圖，揭示一種探針單元。 第十三圖為一剖視圖，揭示另一種探針單元。 12 201213812 【主要元件符號說明】 1探針卡 10電路板 12下表面 121接點區 121a訊號電路接點 121b接地電路接點 122連接區 14絕緣座 16高頻探針 • 161訊號針 161c身部 162金屬線 18間隔件 24絕緣包覆體 26間隔件 32金屬線 _ 38金屬線 44銅箔 50絕緣包覆體 56間隔件 60接地針 66接地針 72金屬線 80探針單元 14a支撐部 161a針尾 161b針尖 161d尾段 161e針先段 163絕緣層 164絕緣套筒 20接地針 22銅箔 28訊號針 30銅箔 34接地針 36絕緣包覆體 40接地針 42絕緣座 46間隔件 48訊號針 52訊號針 54絕緣座 58金屬線 58a彎折段 62銲墊 64絕緣座 68訊號針 70間隔件 73導線 74接地針 13 201213812 81絕緣座 84導電件 87接地針 90探針單元 91導電件 94接地針 82第一訊號針 83第一間隔件 85第一金屬線 86第二金屬線 88第二間隔件 89第二訊號針 92第一金屬線 93第二金屬線 95第二間隔件11 201213812 BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a preferred embodiment of the present invention. The second figure is a plan view of the above preferred embodiment of the present invention. The second figure is a cross-sectional view taken along line 3-3 of the second figure. The fourth figure is a cross-sectional view showing that the end of the signal pin is matched with a metal wire and the outer portion of the wire is covered with an insulating layer. The fifth figure is a cross-sectional view showing that the tail of the signal pin is matched with a metal wire and the outer end of the signal pin is covered with an insulating layer. Figure 6 is a cross-sectional view showing another preferred embodiment of the present invention. Figure 7 is a cross-sectional view showing still another preferred embodiment of the present invention. Figure 8 is a plan view of still another preferred embodiment of the present invention. The ninth drawing is a cross-sectional view in the 9-9 direction of the eighth drawing. The tenth figure is similar to the eighth figure, revealing that the grounding pin is directly connected to the ground potential. The tenth view is a cross-sectional view showing that the metal wire and the grounding pin are differently inclined and the twelfth drawing is a cross-sectional view, revealing a probe unit. Figure 13 is a cross-sectional view showing another probe unit. 12 201213812 [Description of main components] 1 probe card 10 circuit board 12 lower surface 121 contact area 121a signal circuit contact 121b ground circuit contact 122 connection area 14 insulation seat 16 high frequency probe • 161 signal pin 161c body 162 metal wire 18 spacer 24 insulating covering 26 spacer 32 metal wire _ 38 metal wire 44 copper foil 50 insulating covering 56 spacer 60 grounding pin 66 grounding pin 72 metal wire 80 probe unit 14a support portion 161a needle tail 161b tip 161d tail section 161e needle first section 163 insulation layer 164 insulation sleeve 20 grounding pin 22 copper foil 28 signal needle 30 copper foil 34 grounding pin 36 insulation coating body 40 grounding pin 42 insulation seat 46 spacer 48 signal pin 52 signal Needle 54 insulation seat 58 metal wire 58a bending section 62 pad 64 insulation seat 68 signal pin 70 spacer 73 wire 74 grounding pin 13 201213812 81 insulating seat 84 conductive member 87 grounding pin 90 probe unit 91 conductive member 94 grounding pin 82 First signal pin 83 first spacer 85 first metal wire 86 second metal wire 88 second spacer 89 second signal pin 92 first metal wire 93 second metal wire 95 second spacer
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