TW201203632A - Light emitting device - Google Patents

Light emitting device Download PDF

Info

Publication number: TW201203632A
Authority: TW; Taiwan
Prior art keywords: light; emitting; wiring portion; emitting device; emitting elements
Prior art date: 2010-04-16

Application number

TW100113292A

Other languages

English (en)

Chinese (zh)

Inventor

Haruaki Sasano

Original Assignee

Nichia Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-04-16

Filing date

2011-04-15

Publication date

2012-01-16

2011-04-15 Application filed by Nichia Corp filed Critical Nichia Corp

2012-01-16 Publication of TW201203632A publication Critical patent/TW201203632A/zh

Links

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Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Led Device Packages (AREA)
Led Devices (AREA)

TW100113292A 2010-04-16 2011-04-15 Light emitting device TW201203632A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2010095237A JP2013140823A (ja)	2010-04-16	2010-04-16	発光装置

Publications (1)

Publication Number	Publication Date
TW201203632A true TW201203632A (en)	2012-01-16

Family

ID=44798581

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW100113292A TW201203632A (en)	2010-04-16	2011-04-15	Light emitting device

Country Status (3)

Country	Link
JP (1)	JP2013140823A (ja)
TW (1)	TW201203632A (ja)
WO (1)	WO2011129203A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8564000B2 (en) *	2010-11-22	2013-10-22	Cree, Inc.	Light emitting devices for light emitting diodes (LEDs)
US9300062B2 (en)	2010-11-22	2016-03-29	Cree, Inc.	Attachment devices and methods for light emitting devices
US9490235B2 (en)	2010-11-22	2016-11-08	Cree, Inc.	Light emitting devices, systems, and methods
KR20140097284A (ko)	2011-11-07	2014-08-06	크리,인코포레이티드	고전압 어레이 발광다이오드(led) 장치, 기구 및 방법
CN102543985B (zh) *	2011-12-09	2013-11-20	日月光半导体制造股份有限公司	半导体封装件及其半导体基板结构
US9735198B2 (en)	2012-03-30	2017-08-15	Cree, Inc.	Substrate based light emitter devices, components, and related methods
US10134961B2 (en)	2012-03-30	2018-11-20	Cree, Inc.	Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en)	2012-03-30	2019-03-05	Cree, Inc.	Light emitter components and methods having improved electrical contacts
CN204375793U (zh) *	2012-04-06	2015-06-03	西铁城电子株式会社	Led发光装置
JP6583764B2 (ja)	2014-09-12	2019-10-02	パナソニックＩｐマネジメント株式会社	発光装置、及び照明装置
JP6695114B2 (ja) *	2015-08-31	2020-05-20	シチズン電子株式会社	発光装置
DE102016103819A1 (de) *	2016-03-03	2017-09-07	Heraeus Deutschland GmbH & Co. KG	Anschlussträger, optoelektronisches Bauteil und Verfahren zur Herstellung eines Anschlussträgers oder eines optoelektronischen Bauteils
USD823492S1 (en)	2016-10-04	2018-07-17	Cree, Inc.	Light emitting device
JP6324553B2 (ja) *	2017-01-25	2018-05-16	シチズン時計株式会社	Ｌｅｄパッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW200845423A (en) *	2006-12-04	2008-11-16	Alps Electric Co Ltd	Light emitting device and projector
JP5119917B2 (ja) *	2007-12-28	2013-01-16	日亜化学工業株式会社	発光装置

2010
- 2010-04-16 JP JP2010095237A patent/JP2013140823A/ja active Pending
2011
- 2011-04-01 WO PCT/JP2011/058423 patent/WO2011129203A1/ja active Application Filing
- 2011-04-15 TW TW100113292A patent/TW201203632A/zh unknown

Also Published As

Publication number	Publication date
JP2013140823A (ja)	2013-07-18
WO2011129203A1 (ja)	2011-10-20

Publication	Publication Date	Title
TWI565099B (zh)	2017-01-01	發光裝置
TW201203632A (en)	2012-01-16	Light emitting device
JP5842813B2 (ja)	2016-01-13	発光装置および発光装置の製造方法
JP2010526425A (ja)	2010-07-29	半導体発光装置、並びに、これを用いた光源装置及び照明システム
JP5598323B2 (ja)	2014-10-01	発光装置および発光装置の製造方法
TW200931684A (en)	2009-07-16	Light-emitting element and light-emitting device using the same
JP6583764B2 (ja)	2019-10-02	発光装置、及び照明装置
JPWO2007023807A1 (ja)	2009-02-26	発光装置とそれを用いたバックライトおよび液晶表示装置
JP6107415B2 (ja)	2017-04-05	発光装置
US9893038B2 (en)	2018-02-13	Light-emitting device having first and second wiring patterns
JP2008071955A (ja)	2008-03-27	発光装置
US11605765B2 (en)	2023-03-14	LED module
JP2012142428A (ja)	2012-07-26	発光装置および発光装置の製造方法
JP5724573B2 (ja)	2015-05-27	発光装置
JP5703663B2 (ja)	2015-04-22	発光装置および発光装置の製造方法
JP2014195046A (ja)	2014-10-09	発光装置及びそれを備える照明装置
JP6426332B2 (ja)	2018-11-21	発光装置