TW201134671A - Laminate plate, use therefor, and production method thereof - Google Patents

Laminate plate, use therefor, and production method thereof Download PDF

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Publication number
TW201134671A
TW201134671A TW099140830A TW99140830A TW201134671A TW 201134671 A TW201134671 A TW 201134671A TW 099140830 A TW099140830 A TW 099140830A TW 99140830 A TW99140830 A TW 99140830A TW 201134671 A TW201134671 A TW 201134671A
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
component
woven fabric
particles
laminated board
Prior art date
Application number
TW099140830A
Other languages
Chinese (zh)
Other versions
TWI436893B (en
Inventor
Hiroumi Shimizu
Takayuki Suzue
Akiyoshi Nozue
Teruo Nakagawa
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of TW201134671A publication Critical patent/TW201134671A/en
Application granted granted Critical
Publication of TWI436893B publication Critical patent/TWI436893B/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is a laminate plate provided with a nonwoven layer containing a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 400 volume parts of inorganic filler per 100 volume parts of thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μ m, (B) at least one inorganic component selected from a group consisting of boehmite particles having an average particle diameter (D50) of 1.5 to 15 μ m and inorganic particles which have an average particle diameter (D50) of 1.5 to 15 μ m, and contain crystalline water having a release initiation temperature of 400 DEG C or higher or do not contain crystalline water, and (C) a fine particle component comprised of aluminum oxide particles having an average particle diameter (D50) of 1.5 or less, and wherein a mixing ratio (volume ratio) of (A) the gibbsite type aluminum hydroxide particle, (B) the inorganic component, and (C) the fine particle component is 1:0.1 to 3:0.1 to 3.

Description

201134671 六、發明說明： 【發明所屬之技術領域】 本發明係有關於各種電子機器用的積層板、貼有金屬 猪的積層板、印刷配線板、電路基板、led背光模电及上 述積層板的製造方法’尤其有關於一種適合用來搭载發光 二極體⑴咖Emitting Diode，LED)等發熱零件之積層 板。 【先前技術】 自先前以來，提供有-種積層板，其係在不織布層的 基材中含有樹脂組成物之㈣布層的表面，積層在織布基 材中含有樹脂組成物之表材層而一體& (例如參照曰本專 利申請公開編號2__27267小此種積層板藉由在其表面 形成導體圖案’而加工為用於搭載電氣電子零件之印刷配 線板’又’藉由利用該導體圖案形成電路而加工為電路基 板0 而，在最近’作為搭載在積層板之電氣電子零件， 有時使用發熱較多之電氣電子零件，或者增加發熱之電氣 ^子零件的搭載密度，A了對應此種情形，期望—種高散 …、性的積層板。若使用高散熱性的積層板，則自電氣電子 :件產生之熱易於經由積層板散去，冑而實現電氣電子零 件的長壽命化。 【發明内容】 況而開發出來，其目的在於提供 孔加工性之高散熱性積層板以及 本發明係鑒於上述情 種不會損壞耐熱性或鑽 201134671 該積層板的製造方法。並且’本發明的目的在於提供一種 问散熱性之貼有金屬箔的積層板、印刷配線板、電路基板、 LED背光模組及LED照明裝置。 本發明的積層板，其具備含有熱硬化性樹脂組成物之 不織布層，該積層板的特徵在於： 在上述熱硬化性樹脂組成物中，相對於熱硬化性樹脂 100體積份，含有無機充填材8〇〜4〇〇體積份， 上述無機充填材，含有： (A)具有2〜15 μιη的平均粒徑（Dm)之三水鋁石型 氫氧化鋁粒子； 15 μιη μιη的 (Β)至少一種無機成分，其選自由具有 的平均粒徑（Dm)之勃姆石粒子、及具有丨5〜15 平均粒徑（Dw)且含有游離開始溫度為4〇〇£)(：以上的結 水或者不含結晶水之無機粒子所組成之群組；以及 # m以下的平均粒徑 (C)微粒子成分，其由具有1.5 (D50)之氧化鋁粒子所構成； 成 並且’上述三水銘石型氫氧化㈣子（A)、上述無機 分（B)及上述微粒子成分（c)之調配比（體積比）為 〇.1〜3 : 0.1〜3 〇 較佳是在上述不織布層的表面形成織布層。 較佳是在上述熱硬化性樹脂中含有環氧樹脂。 、較佳是在上述熱硬化性樹脂中含有酚化合物來作為上 述環氧樹脂的硬化劑成分。 較佳是在上述熱硬化性樹脂中含有環氧乙稀基酿樹 201134671 脂、自由基聚合性不飽和單體及聚合引發劑。 較佳是上述不織布層的不織布基材的黏合劑係環氧化 合物。 較佳是在上述織布層中含有氫氧化鋁。 本發明的貼有金屬箔的積層板，其特徵在於：係在上 述積層板的至少一個表面，設置金屬箔而構成。 本發明的印刷配線板，其特徵在於：係在上述積層板 的至少一個表面，設置導體圖案而構成。 本發明的電路基板，其特徵在於：係在上述積層板的 至少一個表面，設置電路而構成。 本發明的LED背光模組，其特徵在於：係在上述積層 板的至少一個表面，構裝LED而構成。 本發明的LED照明裝置，其特徵在於：係在上述積層 板的至少一個表面，構裝LED而構成。 本發明的積層板的製造方法’其一邊連續地搬送不織 布基材’ 一邊將熱硬化性樹脂組成物浸潰至上述不織布基 材中’並且一邊連續地搬送該不織布基材，一邊在其兩個 表面將織布積層’且利用輥來壓接該積層物並進行加熱， 藉此使上述熱硬化性樹脂組成物硬化，從而形成不織布層 和織布層’該積層板的製造方法的特徵在於： 在上述熱硬化性樹脂組成物中’相對於熱硬化性樹脂 100體積份’含有無機充填材80〜400體積份， 上述無機充填材，含有： (A)具有2〜15 μιη的平均粒徑（D5Q)之三水鋁石型 201134671 氫氧化鋁粒子； (B) 至少一種無機成分，其選自由具有15〜丨 的平均粒徑（〇5°)之勃姆石粒子、及具有1.5〜15 μπι的 平句粒彳k ( 〇5〇)且含有游離開始溫度為4〇〇。〇以上的結晶 水或者不含結晶水之無機粒子所組成之群組；以及 (C) 微粒子成分’其由具有15 以下的平均粒 徑（Dw)之氧化鋁粒子所構成； 並且，上述二水鋁石型氫氧化鋁粒子（A)、上述無機 成刀（B)及上述微粒子成分（c)之調配比（體積比）為 1 : 0.1 〜3 : 〇. 1 〜3。 [功效] 藉由本發明的積層板，不會損壞耐熱性或鑽孔加工 性’可提高散熱性。 藉由本發明的貼有金屬箔的積層板、印刷配線板、電 路基板、LED背光模組及LED照明裝置，可提高散熱性。 本發明的積層板的製造方法可連續地製造積層板，與 批式相比’可提高生產性。 【實施方式】 以下’說明本發明的實施形態。 如第1 (a)圖所示，本發明的積層板A，係形成為具 備不織布層1，其含有熱硬化性樹脂組成物。不織布層工， 可由在不織布基材中含有熱硬化性樹脂組成物之預浸材料 (Prepreg)的硬化物等形成。 作為不織布基材，例如，可使用選自玻璃不織布或玻 201134671 ::戈成樹知不織布或紙之任—種’該合成樹脂不 織布或紙疋使用芳族聚酿胺纖維或聚醋纖維、聚 (尼龍）等合成樹脂纖維而構成。不織布基材的厚二 10〜3 Ο Ο μηι，但並不限宗# A " 不限疋於此。作為不織布基材的黏合劑， 較佳是使用熱強度優異的環氧化合物。此處，黏合劑縣 用於黏結並固定纖維之點結劑，該纖維是用以構成不心 基材。作為黏合劑之環氧化合物，可使用環氧矽烷等。又， 黏合劑，較佳是相對於構成不織布基材之纖維1〇〇質量 份，調配5〜25質量份。 熱硬化性樹脂組成物，含有熱硬化性樹脂與無機充填 材。作為熱硬化性樹脂，例如，可使用在常溫下為液態之 熱硬化性樹脂。又，作為熱硬化性樹脂，可使用樹脂成分 與硬化劑成分之混合物。作為樹脂成分，可使用環氧樹脂、 不飽和聚酯樹脂及乙烯基酯樹脂等自由基聚合型熱硬化性 樹脂等。 作為具體的熱硬化性樹脂，可例示使用環氧樹脂來作 為樹脂成分之熱硬化性樹脂。在該情形下’可使用選自雙 紛A型、雙紛F型、甲盼紛駿清漆蜇（cresol novolak)、 本盼酌·酸·清漆型（phenolic novolac)、聯苯型 '萘型、芴 型、二苯并吡喃型、二環戊二烯及蒽型等之群組中的至少 一種環氧樹脂。又，可使用二氰二胺或酚化合物作為環氧 樹脂的硬化劑成分，但較佳是使用酚化合物，以提高積層 板的耐熱性。作為該酚化合物，可使用選自丙烯酚、苯酚 酚醛清漆、烷基酚酚醛清漆、含三嗪構造的苯酚酚醛清漆、 201134671 雙酚A酚醛清漆、含二環戊二烯構造的酚樹脂、新酚型酚 (xylok phenol)、β烯改性酚、聚乙稀苯酚類含萘構造的 驗系硬化劑及含苟構造的紛系硬化劑#之群组中的至少一 種。又，相對於環氧樹脂100質量份，齡化合物的硬化劑 成分可調配為30〜120質量份。 作為具體的熱硬化性樹脂的另—例，可使用環氧乙稀 基酯樹脂作為樹脂成分，在該情形下，可使用自由基聚合 性不飽和單體和聚合引發劑作為硬化劑成分。 作為用於獲得環氧乙稀基酯樹脂所使用之環氧樹脂， 對構造並無特別限制，例如，可以列舉：雙紛型環氧樹脂、 ㈣清漆型環氧樹腊、脂環式環氧樹脂、縮水甘油醋類、 縮水甘油醋類、縮水甘油胺類、雜環式環氧樹脂及溴化環 氧樹脂等。上述雙紛型環氧樹脂，可以列舉：雙紛A型環 氧樹脂、雙酚F型環氧樹脂及雙酚s型環氧樹脂等。上： 祕清漆型環氧樹脂，可以列舉：㈣㈣清漆型環氧樹 脂、甲㈣藤清漆型環氧樹月旨、雙⑲清漆型環氧樹 脂、二環戊二烯酚醛清漆型環氧樹脂等。上述脂環式環氧 樹脂，可以列舉·· 3,4_環氧基_6_甲基環己基f醋_3,4_環氧 基-6-甲基環己烷羧酸鹽、3,4_環氧基環己基甲酯-3,4•環氧 基環己烷羧酸鹽及h環氧基乙基_3,4環氧環己烷等。：： 縮水甘油醋類’可以列舉：鄰苯二甲酸二縮水甘油酉旨、四 虱鄰苯二甲酸二縮水甘油酯及二聚酸縮水甘油酯 r 工述 、 7油胺類’可以列舉··四縮水甘油基二氨基二笨基甲 烷'三縮水甘油基對氨基苯酚及Ν，Ν·二縮水甘油基笨胺等。 201134671 式環氧樹脂，可以列舉…縮水甘油基Μ 二内酉！職三縮水甘$基異氰尿酸醋等。 脂、二脂，可以列舉:四;_ "環氧樹 %氧樹脂、溴化曱酚酚醛清漆型環氧樹 臭化本酚酚醛清漆型環氧樹脂等。 在上述環氧樹脂中’尤其自阻燃性優異之方面而言， 較佳是使用溴化環氧招 以㈣日。進而’亦可使用使含誠的橡 1 σ與此等環氧樹脂的環氧基的-部分反應而得之 =樹1。此種使含叛基的橡膠狀聚合物反應而得之環氧 树月曰、’在提高所獲得之貼有銅的積層板等積層板的耐衝擊 陡或冲孔加工性、層間密接性之方面，尤其較佳。 上述含幾基的橡膠狀聚合物，可以列舉：使其他單體 根據尚要而與含缓基的翠體及共輕二稀系單體共聚而構 之橡膠狀聚合物’或者，向使共耗二稀系單體與其他單體 八聚之聚口物^人缓基後之橡膠狀聚合物等。幾基可位於 刀子末端側鏈之任一者’該羧基的量較佳是一分子中1 〜5個’更佳是1.5〜3個。 上述共輕二烯系單體有··丁二稀、異戊二烯及氯丁二 稀等。又，根據需要而使用之其他單體有丙料、苯乙婦、 甲基苯乙烯及自化苯乙稀等，但自與所獲得之反應物的自 由基聚合性不飽和單體之相溶性之方面而言，較佳是使丙 婦腈以Η)〜40重量％與橡膠狀聚合物共聚，更佳是使丙稀 腈以1 5〜3 0重量％共聚。 再者’在製造環氧乙婦基g旨樹脂時，可使環氧樹脂、 201134671 含羧基的橡膠狀聚合物以及乙烯性不飽和一元酸各成分同 時反應，並且，亦可在使環氧樹脂與含羧基的橡膠狀=合 物反應後，再使乙烯性不飽和一元酸反應。此時，用以獲 得環氧乙烯基酯樹脂之環氧樹脂、含羥基的橡膠狀聚合物 以及乙烯性不飽和-元酸之反應比率，並無特別限制，但 較佳是相對於環氧樹脂的環氧基I 1當量，含㈣的橡膠 狀聚合物與乙烯性不飽和一元酸之總羧基在〜1 1當量 之範圍内，尤其自獲得貯存穩定性優異之樹脂之方面而 言’較佳是在0.9〜1.〇當量之範圍内。 又’在％氧乙烯基酯樹脂之製造中，作為用來與環氧 樹月曰反應之乙烯性不飽和一元酸，例如可列舉：（甲基） 丙烯酸、丁烯酸、桂皮酸、丙烯酸二聚物、蘋果酸單曱酯、 蘋果酸單丁酯及山梨酸等’其中甲基丙烯酸較佳。 上述自由基聚合性不飽和單體，係在一個分子中至少 /、有個自由基聚合性不飽和基"此種自由基聚合性不飽 和單體，例如可以列舉：鄰苯二甲酸二丙烯酯、苯乙烯、 甲基苯乙烯、鹵化苯乙烯、（曱基）丙烯酸、甲基丙烯酸甲 酯、曱基丙烯酸乙酯、丙烯酸丁酯、二乙烯基苯、乙二醇 二（曱基）丙烯酸酯、丙二醇二（甲基）丙烯酸酯、三羥 甲基丙烧三（曱基）丙歸酸酯、季戊四醇三（曱基）丙稀 酸醋及季戊四醇四（曱基）丙烯酸酯，可使用其中的一種 或兩種以上。 再者，關於自由基聚合性不飽和單體的調配量，較佳 是相對於環氧乙烯基酯樹脂與自由基聚合性不飽和單體之 201134671201134671 VI. Description of the Invention: [Technical Field] The present invention relates to a laminate for various electronic devices, a laminated board with metal pigs attached thereto, a printed wiring board, a circuit board, a led backlight module, and the above laminated board. The manufacturing method is particularly directed to a laminate suitable for mounting a heat-generating component such as a light-emitting diode (1). [Prior Art] Since the prior art, there has been provided a laminated board comprising a surface of a (4) cloth layer of a resin composition in a substrate of a non-woven layer, and a surface layer containing a resin composition in the woven fabric substrate And the integrated & (for example, refer to the patent application publication No. 2__27267, such a laminate is processed into a printed wiring board for mounting electrical and electronic parts by forming a conductor pattern on the surface thereof] and by using the conductor pattern In the case of the electric and electronic components mounted on the laminate, the mounting density of the electrical and electronic components that generate heat or the heat is increased. In the case of a high-heat-dissipating laminated board, the heat generated from the electric and electronic parts is easily dissipated through the laminated board, thereby prolonging the life of the electric and electronic parts. SUMMARY OF THE INVENTION The present invention has been developed to provide a highly heat-dissipating laminated board having a hole processability and the present invention is not damaged in view of the above-mentioned circumstances. Heat or drill 201134671 The method for manufacturing the laminated board. And an object of the present invention is to provide a metal foil-clad laminated board, a printed wiring board, a circuit board, an LED backlight module, and an LED lighting device. The laminated board is provided with a non-woven fabric layer containing a thermosetting resin composition, and the laminated resin is characterized in that the thermosetting resin composition contains an inorganic filler 8 in an amount of 100 parts by volume based on the thermosetting resin. 〜4〇〇体积份, the above inorganic filler, comprising: (A) gibbsite-type aluminum hydroxide particles having an average particle diameter (Dm) of 2 to 15 μm; 15 μιη μηη (Β) at least one inorganic a component selected from the group consisting of boehmite particles having an average particle diameter (Dm) and having an average particle diameter (Dw) of 〜5 to 15 and containing a free starting temperature of 4 ) (): above or not a group consisting of inorganic particles containing water of crystallization; and an average particle diameter (C) of less than #m, which is composed of alumina particles having 1.5 (D50); and the above-mentioned Sanshui Mingshi hydrogen Oxidation (4) The blending ratio (volume ratio) of the sub-particle (A), the inorganic component (B), and the fine particle component (c) is 〇.1 to 3: 0.1 to 3 Å. Preferably, a woven fabric layer is formed on the surface of the nonwoven fabric layer. Preferably, the thermosetting resin contains an epoxy resin. Preferably, the thermosetting resin contains a phenol compound as a curing agent component of the epoxy resin. Preferably, it is in the above thermosetting resin. The epoxy resin, the radically polymerizable unsaturated monomer, and the polymerization initiator are contained. Preferably, the non-woven fabric of the non-woven fabric layer is an epoxy compound. Preferably, the woven fabric layer is used. The aluminum foil-attached laminated board according to the present invention is characterized in that a metal foil is provided on at least one surface of the laminated board. A printed wiring board according to the present invention is characterized in that a conductor pattern is provided on at least one surface of the laminated board. A circuit board according to the present invention is characterized in that an electric circuit is provided on at least one surface of the laminated board. The LED backlight module of the present invention is characterized in that an LED is formed on at least one surface of the laminated board. An LED lighting device according to the present invention is characterized in that an LED is mounted on at least one surface of the laminated board. In the method for producing a laminated board of the present invention, the nonwoven fabric substrate is continuously conveyed while the nonwoven fabric substrate is continuously impregnated into the nonwoven substrate, and the nonwoven substrate is continuously conveyed. The manufacturing method of the laminated board is characterized in that the surface is woven with a woven fabric and the laminated product is pressure-bonded by a roll to heat the thermosetting resin composition to form a nonwoven fabric layer and a woven fabric layer. In the thermosetting resin composition, '100 parts by volume with respect to the thermosetting resin' contains 80 to 400 parts by volume of the inorganic filler, and the inorganic filler contains: (A) an average particle diameter of 2 to 15 μm ( D5Q) gibbsite type 201134671 aluminum hydroxide particles; (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter of 15 to 〇 (〇 5°), and having 1.5 to 15 μπι The flat sentence 彳k ( 〇5〇) and contains a free starting temperature of 4〇〇. a group of the above-mentioned crystal water or inorganic particles containing no crystal water; and (C) a microparticle component which is composed of alumina particles having an average particle diameter (Dw) of 15 or less; The mixing ratio (volume ratio) of the alumina-type aluminum hydroxide particles (A), the inorganic forming blade (B), and the fine particle component (c) is 1: 0.1 to 3: 〇. 1 to 3. [Efficacy] With the laminated board of the present invention, heat dissipation can be improved without impairing heat resistance or drilling processability. The heat dissipation can be improved by the metal foil-clad laminate, the printed wiring board, the circuit board, the LED backlight module, and the LED lighting device of the present invention. The method for producing a laminated board of the present invention can continuously produce a laminated board, and productivity can be improved as compared with the batch type. [Embodiment] Hereinafter, embodiments of the present invention will be described. As shown in Fig. 1 (a), the laminated board A of the present invention is formed to have a nonwoven fabric layer 1 containing a thermosetting resin composition. The nonwoven fabric layer may be formed of a cured product of a prepreg (prepreg) containing a thermosetting resin composition in a nonwoven fabric substrate. As the nonwoven fabric substrate, for example, any one selected from the group consisting of glass non-woven fabrics or glass 201134671: Ge Chengshu Zhizhizhi or paper can be used. The synthetic resin non-woven fabric or paper pulp is made of aramid fiber or polyester fiber, poly ( It is composed of a synthetic resin fiber such as nylon). Non-woven substrate thickness 2 10~3 Ο Ο μηι, but not limited to # A " Not limited to this. As the binder of the nonwoven fabric substrate, an epoxy compound excellent in thermal strength is preferably used. Here, the binder county is used for bonding and fixing the binder of the fiber, and the fiber is used to constitute an unsatisfactory substrate. As the epoxy compound of the binder, epoxy decane or the like can be used. Further, the binder is preferably blended in an amount of 5 to 25 parts by mass based on 1 part by mass of the fiber constituting the nonwoven fabric substrate. The thermosetting resin composition contains a thermosetting resin and an inorganic filler. As the thermosetting resin, for example, a thermosetting resin which is liquid at normal temperature can be used. Further, as the thermosetting resin, a mixture of a resin component and a curing agent component can be used. As the resin component, a radical polymerization type thermosetting resin such as an epoxy resin, an unsaturated polyester resin or a vinyl ester resin can be used. As the specific thermosetting resin, a thermosetting resin using an epoxy resin as a resin component can be exemplified. In this case, 'can be selected from double-type A, double-F type, cresol novolak, phenolic novolac, biphenyl type naphthalene type, At least one epoxy resin in the group of quinone, dibenzopyran, dicyclopentadiene, and fluorene. Further, dicyandiamide or a phenol compound may be used as the hardener component of the epoxy resin, but it is preferred to use a phenol compound to improve the heat resistance of the laminate. As the phenol compound, a phenol novolak selected from an acryl phenol, a phenol novolak, an alkylphenol novolac, a triazine structure, a 201134671 bisphenol A novolac, a phenol resin containing a dicyclopentadiene structure, and a new one can be used. At least one of a group of a phenolic phenol, a β-ene modified phenol, a polyethylene phenolic naphthalene-containing sclerosing agent, and a sulphur-containing sclerosing agent #. Further, the curing agent component of the aged compound can be adjusted to be 30 to 120 parts by mass based on 100 parts by mass of the epoxy resin. As another example of the specific thermosetting resin, an epoxy vinyl ester resin can be used as the resin component. In this case, a radical polymerizable unsaturated monomer and a polymerization initiator can be used as the curing agent component. The epoxy resin used for obtaining the epoxy resin is not particularly limited, and examples thereof include a double-type epoxy resin, (iv) a varnish-type epoxy resin wax, and an alicyclic epoxy resin. Resins, glycidinated vinegars, glycidol vinegars, glycidylamines, heterocyclic epoxy resins, and brominated epoxy resins. Examples of the above-mentioned double-type epoxy resin include a double-type A-type epoxy resin, a bisphenol F-type epoxy resin, and a bisphenol s-type epoxy resin. Top: The secret varnish type epoxy resin can be listed as follows: (4) (4) varnish type epoxy resin, A (four) rattan varnish type epoxy tree moon, double 19 varnish type epoxy resin, dicyclopentadiene novolac type epoxy resin, etc. . The alicyclic epoxy resin may, for example, be 3,4-epoxy-6-methylcyclohexyl f-vinegar_3,4-epoxy-6-methylcyclohexanecarboxylate, 3. 4_Epoxycyclohexylmethyl ester-3,4•epoxycyclohexanecarboxylate and h-epoxyethyl-3,4 epoxycyclohexane. :: Glycid vinegar's can be exemplified by phthalic acid diglycidyl phthalate, tetradecyl phthalic acid diglycidyl ester and dimer acid glycidyl ester r, and 7 oleylamines. Tetraglycidyl diaminodiphenylmethane 'triglycidyl p-aminophenol and hydrazine, hydrazine diglycidyl amide and the like. 201134671 type epoxy resin, can be listed... glycidyl hydrazine Μ 酉! The job is three shrinking water, such as isocyanuric acid vinegar and so on. Fats and diesters can be listed as follows: _ " Epoxy resin % Oxygen resin, brominated phenolic phenolic varnish type epoxy tree Stinky phenol novolak type epoxy resin. In the above epoxy resin, it is preferable to use brominated epoxy for (four) days, particularly in terms of excellent flame retardancy. Further, it is also possible to use a mixture of the rubbery group 1 σ and the epoxy group of the epoxy resin to obtain the tree 1. Such an epoxy resin, which is obtained by reacting a rubber-like polymer containing a ruthenium-based polymer, has a high impact resistance, punching workability, and interlayer adhesion in a laminate which is obtained by laminating a copper-clad laminate. In particular, it is especially preferred. The rubber-like polymer containing a plurality of groups may be a rubbery polymer which is obtained by copolymerizing other monomers with a slow-based emerald and a light-diluted monomer, or A rubber-like polymer obtained by absorbing a mixture of a divalent monomer and another monomer, and a rubbery polymer. The base may be located at any one of the side chain ends of the knife. The amount of the carboxyl group is preferably from 1 to 5 in one molecule, more preferably from 1.5 to 3. The above-mentioned co-light diene monomer may be dibutyl, isoprene or chloroprene. Further, other monomers used as needed include acrylic acid, styrene, methyl styrene, and styrene, but are compatible with the radically polymerizable unsaturated monomer of the obtained reactant. On the other hand, it is preferred to copolymerize the acrylonitrile to the rubbery polymer in an amount of from 40 to 40% by weight, and more preferably to copolymerize the acrylonitrile in an amount of from 15 to 30% by weight. Furthermore, when the epoxy resin is used as the resin, the epoxy resin, the rubbery polymer of 201134671 and the ethylenically unsaturated monobasic acid can be simultaneously reacted, and the epoxy resin can also be used. After reacting with the carboxyl group-containing rubbery compound, the ethylenically unsaturated monobasic acid is further reacted. In this case, the reaction ratio of the epoxy resin for obtaining an epoxy vinyl ester resin, the rubber-containing polymer having a hydroxyl group, and the ethylenically unsaturated-carboxylic acid is not particularly limited, but is preferably relative to the epoxy resin. The epoxy group I 1 equivalent, the total carboxyl group of the rubbery polymer containing (4) and the ethylenically unsaturated monobasic acid is in the range of 〜1 1 equivalent, especially from the viewpoint of obtaining a resin excellent in storage stability. It is in the range of 0.9 to 1. 〇 equivalent. Further, in the production of the oxyacetate resin, as the ethylenically unsaturated monobasic acid to be reacted with the epoxy resin, the (meth)acrylic acid, crotonic acid, cinnamic acid, acrylic acid may be mentioned. A polymer, a monodecyl malate, a monobutyl malate, a sorbic acid, etc., wherein methacrylic acid is preferred. The radically polymerizable unsaturated monomer is at least one radical polymerizable unsaturated group in one molecule. Such a radical polymerizable unsaturated monomer may, for example, be propylene terephthalate. Ester, styrene, methyl styrene, halogenated styrene, (mercapto) acrylic acid, methyl methacrylate, ethyl methacrylate, butyl acrylate, divinyl benzene, ethylene glycol bis(indenyl) acrylate Ester, propylene glycol di(meth)acrylate, trimethylolpropane tris(indenyl)propionate, pentaerythritol tris(decyl)acrylic acid vinegar, and pentaerythritol tetrakis(mercapto)acrylate, which can be used One or two or more. Further, the amount of the radically polymerizable unsaturated monomer is preferably relative to the epoxy vinyl ester resin and the radical polymerizable unsaturated monomer.

合計量100質量份’為25曾晋A,、，L 質里伤以上、45質量份以下 比例0其原因在於：若為25皙晉 質置伤以上，則所獲得的埶硒 化性樹脂組成物，相對於不镞t ^ 旳.、、、硬 ^ A 於不織布基材或織布基材之浸潰性 較良好’又’若為45質量份以τ 日丨/± 、 量伤以下，則使用該熱硬化性樹月t 組成物而獲得的積層板，其 丹尺寸穩疋性優異，且高耐孰 亦優異。 ”、、性 上述聚合引發劑，可以列舉以下有機過氧化物：過氧 化曱乙酮、過氣化甲其_ 異丁酮及過氧化環己酮等過氧化鲷 類；過氧化苯甲醢、過氧化異丁基等過氧化二酿類；里丙 苯過氧化氫、第三丁基過氧化氫等過氧化氣類；過氧化二 異丙苯、過氧化二-第三丁基等過氧化二炫基類；Μ-二· 第三丁基過氧基-3,3,5_三甲基環己酮、2,2_雙(過氧化叔丁 基）丁烷等過氧化縮_類；過苯甲酸第三丁酯、過氧化第三 丁基-2-已酸乙酯等過酸烷基酯類；過氧化二碳酸雙（心第三 丁基環已基）醋、過氧化異丁基碳酸第三丁醋等過碳酸鹽類 等，可使用其中的一種或兩種以上。藉由使用此種有機過 氧化物’熱硬化性樹脂組成物經加熱硬化。 關於聚合引發劑調配至熱硬化性樹脂之調配量，並無 特別限制’但較佳是相對於環氧乙烯基酯樹脂與自由基聚 合性不飽和單體之合計量1〇〇質量份，在〇 5〜5 〇質量份 左右之範圍内。尤其自熱硬化性樹脂組成物的清漆壽命或 硬化性之方面而言，更佳是在0·9〜2 0質量份之範圍内。 作為無機充填材，可使用：具有2〜15 μπ1的平均粒徑 (Dm)之二水铭石型氫氧化鋁粒子（Α) ，·至少—種無機 201134671 成匀（B )，其選自由具有15〜15 的平均粒徑（〇5〇) 之勃姆石（boehmite)粒子、及具有15〜15 μηι的平均粒徑 (D^)且含有游離開始溫度為4〇〇它以上之結晶水或者不 含結晶水之無機粒子所組成之群組；以及微粒子成分（c)， 其由具有1.5 μιη以下的平均粒徑（〇5〇)之氧化鋁粒子所 構成。再者，在本說明書中，無機充填材的平均粒徑，係 指下述粒徑：以利用雷射繞射式粒度分佈測定裝置測定而 得之粉體群的全部體積為100%，求出累積曲線，該累積曲 線為50%之點的粒徑。 三水鋁石型氫氧化鋁粒子（Α)，係以al(〇h)34 AL2〇3 • 3H2〇表示之鋁化合物，係平衡性良好地對積層板a賦予 熱導性、阻燃性及鑽孔加工性之成分β又’三水鋁石型氫 氧化鋁粒子（Α)的平均粒徑（Dm)為2〜15 μιη，較佳是 3〜10 μιη。在三水鋁石型氫氧化鋁粒子（Α)的平均粒徑 (Dm)超過15 μιη之情形下，鑽孔加工性會降低，在未達 2 μπι之情形下，熱導性會降低，並且，生產性亦降低。又， 使用平均粒徑（Dw)為2〜1〇 μιη之第i三水鋁石型氫氧 化鋁與平均粒徑（Dm)為10〜15 μιη之第2三水鋁石型氳 氧化鋁之調配物，作為三水鋁石型氫氧化銘粒子（Α)，可 藉由更密實地將充填材進行充填，而進而提高散熱性，因 此較佳。 無機成分（Β)，係選自由勃姆石粒子、以及包含游離 開始溫度為400°C以上的結晶水或者不含結晶水之無機粒 子所組成之群組中的至少一種。勃姆石粒子，係以 12 201134671 (ALOOH)或（AL2〇 H2〇 )表不之鋁化合物系 低積層板A的耐熱性即 係無須降 姆石叙早…“ 導性和阻燃性之成分。勃 姆石粒子的平均粒徑（ 切 六紅也 CD5Q)為I·5〜15μΐη，較佳是3〜1〇 μπι。在勃姆石粒子的平 10 的千均叔徑（Dm)超過15 pm之情形下， 鑽孔加工性降低，右去、去 Γ 5陣之情形下，熱導性降低， 並且，生產性亦降低。 - 含有游離開始溫度為彻。C以上之結晶水或者不含社 =之無機粒子’係無須降低電路基板的耐熱性 ； _ 或 作為此種無機粒子的具體例，可 列舉.乳化欽（益任S 士、 t- 一技 …、、、。日日水）、氧化鎂（無結晶水）及結晶 性一乳切（無結晶水）等無機氧化物；氮化删（無結晶 水）I化！S (無結晶水）及氮化梦（無結晶水 氮化物；碳化矽Γ盔紝曰^、姑 寺…、機 (”、、、、'〇日日水）專無機碳化物；以及滑石Γ游 離開始溫度為95代）、高嶺土（游離開始溫度為·〜1000 )等天…'礦物等。此等無機粒子’既可單獨使用 組合兩種以上#田甘； 。八中，結晶性二氧化矽、滑石、高韻 土及黏土等的熱導性優 、守汪馒呉，自此方面考慮，尤其較佳。再 者、”σ Ba水的游離開始溫度，可藉由熱解重量分析 ^henn〇gravimetric Analysis，tga)或者差示掃描熱量 (Differentlal Scanning 匸）來測定。 無機粒子的平均粒徑（D5。）為15〜15叫，較佳是3〜1〇 μίΠ。在無機粒子的平均粒徑（D5。）超過15μίη之情形下， 存在鑽孔加工性陷^ & 彺降低之虞。再者，游離開始溫度的上限並 無特別設定，例如lOOOt：。The total amount of 100 parts by mass is 25, and the ratio of 45 mass parts or less is less than 45 parts by weight. The reason is that if it is 25 or more, the obtained selenium-based resin composition is The impregnation property of the non-woven fabric substrate or the woven fabric substrate is relatively good with respect to 镞t ^ 旳., , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The laminate obtained by using the thermosetting tree t-component has excellent Dan dimensional stability and high scratch resistance. The above-mentioned polymerization initiator may, for example, be an organic peroxide: perylene oxide such as methyl ethyl ketone peroxide, pervaporated methyl isobutyl ketone or cyclohexanone peroxide; benzammonium peroxide; Peroxidation of isobutyl peroxide, etc.; peroxybenzene, hydrogen peroxide, tributyl hydroperoxide and other peroxidation gases; dicumyl peroxide, di-tertiary peroxide, etc. Dioxyl group; Μ-di·t-butylperoxy-3,3,5-trimethylcyclohexanone, 2,2-bis(t-butylperoxy)butane, etc. ; peracid alkyl esters such as tert-butyl benzoate and tributyl-2-hexanoic acid peroxide; bis (percento-tertiary butylcyclohexyl) vinegar, peroxidation One or two or more kinds of percarbonate such as butyl carbonate and the like may be used. By using such an organic peroxide, the thermosetting resin composition is cured by heating. The amount of the thermosetting resin is not particularly limited, but is preferably relative to the epoxy vinyl ester resin and the radical polymerizable unsaturated monomer. The amount of 1 part by mass is measured in the range of about 5 to 5 parts by mass of the crucible. Especially in terms of the varnish life or hardenability of the thermosetting resin composition, it is more preferably 0. 9 to 2 0. As an inorganic filler, it is possible to use: hydrated aluminum hydroxide particles (Α) having an average particle diameter (Dm) of 2 to 15 μπ1, at least one type of inorganic 201134671 (B) It is selected from boehmite particles having an average particle diameter of 15 to 15 (〇5〇), and having an average particle diameter (D^) of 15 to 15 μm and containing a free starting temperature of 4 Å. a group consisting of the above crystal water or inorganic particles containing no crystal water; and a fine particle component (c) composed of alumina particles having an average particle diameter of 1.5 μm or less (〇5〇). In the present specification, the average particle diameter of the inorganic filler refers to a particle diameter obtained by measuring the total volume of the powder group measured by a laser diffraction type particle size distribution analyzer by 100%. The cumulative curve is the particle size at a point of 50%. The gibbsite-type aluminum hydroxide The particle (Α) is an aluminum compound represented by al(〇h)34 AL2〇3 • 3H2〇, which imparts thermal conductivity, flame retardancy, and drilling processability to the laminated plate a. The average particle diameter (Dm) of the gibbsite-type aluminum hydroxide particles (Α) is 2 to 15 μηη, preferably 3 to 10 μηη. The average particle size of the gibbsite-type aluminum hydroxide particles (Α) When the diameter (Dm) exceeds 15 μm, the drilling processability is lowered, and in the case where the diameter is less than 2 μm, the thermal conductivity is lowered and the productivity is also lowered. Further, the average particle diameter (Dw) is used. 2~1〇μιη of the i-gibbsite type aluminum hydroxide and the second gibbsite type lanthanum alumina having an average particle diameter (Dm) of 10 to 15 μηη as a gibbsite hydrogen It is preferable to oxidize the ingot particles (Α) by filling the filler more densely to further improve heat dissipation. The inorganic component (Β) is at least one selected from the group consisting of boehmite particles and inorganic particles containing crystal water having a free onset temperature of 400 ° C or higher or inorganic water containing no crystal water. Boehmite particles, which are based on 12 201134671 (ALOOH) or (AL2〇H2〇), are not known to be aluminum alloys. The heat resistance of low-layered sheets A is that they do not need to be reduced in stone... "Conductive and flame retardant components" The average particle diameter of the boehmite particles (cut Liuhong also CD5Q) is I·5~15μΐη, preferably 3~1〇μπι. The thousand-thousand untwisted diameter (Dm) of the flat 10 of the boehmite particles exceeds 15 In the case of pm, the drilling processability is lowered, and the thermal conductivity is lowered in the case of going to the right and going to Γ5, and the productivity is also lowered. - The crystallization water having a free starting temperature is more than C. The inorganic particles of the company are not required to reduce the heat resistance of the circuit board; _ or as a specific example of such inorganic particles, emulsification (Essence of S, T-Technology, ..., Nippon Water) , inorganic oxides such as magnesium oxide (no crystal water) and crystalline one-milk cut (no crystal water); nitriding (no crystal water) I! S (no crystal water) and nitriding dream (no crystal water nitrogen) Compound; carbonized 矽Γ helmet 纴曰 ^, Gu Temple..., machine (",,,, '〇日日水) special inorganic carbide; Γ talc and 95 run from the starting temperature generation), kaolin (~ 1000-free starting temperature) of days ... 'minerals. These inorganic particles ' can be used alone or in combination of two or more types. In the eighth, the thermal conductivity of crystalline cerium oxide, talc, high rhyme soil and clay is excellent, and it is especially preferable from this point of view. Furthermore, the free starting temperature of σ Ba water can be determined by thermogravimetric analysis (then) or differential scanning calorimetry (Differentlal Scanning 匸). The average particle size of inorganic particles (D5.) It is 15 to 15, preferably 3 to 1 〇μίΠ. In the case where the average particle diameter (D5.) of the inorganic particles exceeds 15 μίη, there is a problem that the drilling processability is reduced and the enthalpy is lowered. The upper limit of the starting temperature is not specifically set, for example, lOOt:.

S 13 201134671 又’作為無機成分（B)，為了減少在鑽孔加工時之鑽 頭磨耗’莫氏硬度須比氧化鋁的莫氏硬度12更小，較佳是 ， 疋6 ·0以下，最佳為5.0以下。例如，上述無機 成分（B)的莫氏硬度係氧化鈦（銳鈦礦型）為5.5〜6.0, 氧化鈦（金紅石）為7〇〜75，氧化鎂為25，結晶性二氧 化石夕為7.0,氮化蝴& 2.〇,氣化料7〇,氮化石夕為95, 滑石為1.0，培燒高嶺土為2 〇，黏土為2 〇。 微粒子成4(C)，係、對所獲得之積層板賦予高熱導性 之成刀。，構成微粒子成分（c )之氧化銘粒子，其平均粒徑 ^D50)為1>5 μιη以下，較佳是〇 4〜〇 8 。在微粒子成 刀（C)的平均粒徑超過15㈣之情形下，難以充分的調 配量充填至積層板A，並且，鑽孔加工性亦降低。又，在 微粒子成分（C )的平均粒徑過小之情形下，存在積層板a 的熱傳導率不充分之虞。又，雖然氧化紹粒子的莫氏硬度 為12’但由於平均粒徑（〇5〇)為丨$ _以下，因此，不 會損壞鑽孔加工性。 上述三水鋁石型氫氧化鋁粒子（Α)、上述無機成分（Β) 及上述微粒子成分（C)之調配比（體積比）為丨：〇丨〜3 : 0.1〜3’較佳是1:〇1〜2:〇1〜2，更佳是1:〇1〜1: 0.1丨。相對於二水紹石型氫氧化鋁粒子（A)的調配量1， 在無機成分（B)的調配量超過3之情形下，所獲得之積層 板A的鑽孔加工性或散熱性降低，在未達〇1之情形下， 耐熱性降低。又，相對於三水鋁石型氫氧化鋁粒子（a )的 調配量1，在微粒子成分（c)的調配量超過3之情形下， 201134671 鑽孔加工性降低，在未達〇·1之情形下，存在熱傳導率降 低’或者難以尚調配無機充填材’從而有成形性惡化之虞。 相對於熱硬化性樹脂1 00體積份，無機充填材的調配 比例為80〜400體積份’較佳是90〜400體積份，更佳是 100〜400體積份。在無機充填材的調配比例未達8〇體積 份之情形下’所獲得之積層板Α的熱傳導率降低，在超過 400體積份之情形下，鑽孔加工性降低，並且，積層板a 的製造性（樹脂浸潰性、成形性）亦降低。又，尤其在三 水銘石型氫氧化鋁粒子（A )的調配比例過多之情形下，具 體而言’在超過100體積份之情形下，由於較多地產生結 晶水而存在耐熱性降低之傾向。再者，在將調配勃姆石粒 子 '及含有游離開始溫度為400。〇以上之結晶水、或者不 含結晶水之無機粒子而組成之成分作為無機成分（B )之情 形下，無機粒子的調配比例，較佳是無機充填材總量中的 50體積％以下，更佳是30體積％以下，尤其較佳是2〇體 積％以下》 熱硬化性樹脂組成物，係利用以下公知之製備方法製 備而構成.即，在液態等之上述熱硬化性樹脂中，調配含 有上述三水鋁石型氫氧化鋁粒子（A)、無機成分（B)及 微粒子成分（C)之無機充填材，並使用分散器、球磨機及 輥等’使各無機充填材的粒子分散。再者，在熱硬化性樹 月曰組成物中，可根據需要而調配熱硬化性樹脂的硬化催化 劑等各種添加劑。X，亦可考慮到熱硬化性樹脂組成物的 黏度調整或浸潰至不織布基材之浸潰性等，而根據需要來 15 201134671 調配有機溶劑等溶劑、減黏劑及偶合劑等加工助劑。 用於形成不織布層1之預浸材料，可利用以下方法獲 得：即’將熱硬化性樹脂組成物浸潰至上述不織布基材， 之後，藉由加熱乾燥等，使浸潰至不織布基材之熱硬化性 樹脂組成物達到半硬化狀態（B階段狀態）^在用於形成 不織布層1之預浸材料中，相對於預浸材料總量熱硬化 性樹脂組成物的含量可為4〇〜95質量％，但並不限定於此。 並且’在製造本發明的積層板A時，在重疊一片或者 複數片之用於形成不織布層！之預浸材料後，藉由將該預 浸材料加熱加壓成形，而使預浸材料中的熱硬化性樹脂硬 化。又，本發明的貼有金屬箔的積層板，藉由在不織布層 1的表面設置銅羯或鎳羯等金屬猪3’而可將積層板A形成 為-種作為絕緣層<一面或者兩面貼有金屬箔之積層板。 在該It形下’在將用於形成不織布層丨之預浸材料與金屬 结3重疊後由加熱加壓成形’而使不織布層1與金屬 羯3積層一體化。在製造積層板八以及貼有金屬落的積層 板時的加熱加壓成形條件’可根據熱硬化性樹脂的種類等 而作適當地設定，例如，可將溫度設為8〇〜25〇乞，壓力 設為0·05〜o.98kPa(5〜100kgf/m2) ’時間設為2〇〜綱 分鐘。 又’本發明的印刷配線板，可藉由在上述積層板A的 表面设置導體圖案而形成。在該情形下，可藉由在上述貼 有金屬㈣㈣板上實施添加法或以法等電路加工處理 或通孔加工而加工成為印刷配線板。又，本發明的電路基 201134671 板可藉由在上述積層板A設置電氣電子電路而形成。在該 情形下，可使用由上述貼有金屬箔的積層板形成之印刷配 線板的導體圖案來形成電氣電子電路。又’本發明的led 搭載用電路基板，可藉由在上述積層板A設置LED搭載用 電氣電子電路而形成。在該情形下，可將上述電路基板的 電氣電子電路形成為LED搭載用電氣電子電路。 第K b )圖係表示本發明的積層板a的其他實施形態。 該積層板A，係形成為具備含有熱硬化性樹脂組成物之不 織布層1以及含有熱硬化性樹脂組成物之織布層2，即所 謂的複合積層板。複合積層板，在散熱性方面，比上述積 層板（僅由不織布層i形成絕緣層，不使用織布之積層板） 差，但在價格低廉、尺寸穩定性及力學物性方面十分優異。 不織布層1與上述相同，可藉由在不織布基材中含有熱硬 化性樹脂組成物之預浸材料的硬化物等形成。又，織布層 2’可藉由在織布基材中含有熱硬化性樹脂組成物之預浸材 料的硬化物等形成。 在此種複合積層板之情形下，不織布層丨，可與上述 相同的方式來形成，但較佳是相對於熱硬化性樹脂1〇〇體 積份，無機充填材的調配比例為150〜4〇〇體積份。在無機 充填材的調配比例未達150體積份之情形下，存在所獲得 之積層板A的熱傳導率降低之虞，在超過4〇〇體積份之情 形下，存在鑽孔加工性降低，或積層板A的製造性（樹脂 浸潰性、成形性）降低之虞。 作為用於形成織布層2之織布基材，例如，可使用選 17 201134671 自玻璃布或者使用芳族聚醯胺纖維或聚酯纖維、聚醯胺纖 維（尼龍）等合成樹脂纖維之合成樹脂布的任一種。織布 基材的厚度可為50〜5 00 μιη，但並不限定於此。 作為用於形成織布層2之熱硬化性樹脂組成物，既可 與用於形成不織布層i之上述熱硬化性樹脂組成物相同， 亦可不同’在要使其不同之情形下，可改變所使用之熱硬 化性樹脂或無機充填材的種類、相對於熱硬化性樹脂之無 機充填材的含量等《尤其較佳是可使用自用於形成不織布 層1之上述熱硬化性樹脂組成物中去除無機充填材後之熱 硬化性樹脂組成物，亦即，具備上述熱硬化性樹脂及其他 根據需要而調配之溶劑或添加劑之熱硬化性樹脂組成物。 藉此，可提高將熱硬化性樹脂組成物浸潰至織布基材之浸 潰性。在織布層2中含有無機充填材之情形下，為了提高 積層板的耐追蹤性，較佳是使用氫氧化鋁來作為無機充填 材。藉此，可認為氫氧化鋁的結晶水能阻礙積層板表面的 熱分解以及碳化，從而可認為能提高積層板的耐追蹤性。 又，為了提高積層板的耐追蹤性’較佳是相對於織布層2 中的熱硬化性樹脂100體積份，氫氧化鋁為25〜15〇體積 份。又，較佳是使用平均粒徑（Dm)為2〜15 μιη之氫氧 化鋁。 用於形成織布層2之預浸材料，可藉由以下方法而獲 得.即，將熱硬化性樹脂組成物浸潰至上述織布基材，之 後，藉由加熱乾燥等，使浸潰至織布基材中之熱硬化性樹 脂組成物達到半硬化狀態（Β階段狀態）。在用於形成織 201134671 布層2之預浸材料中，相對於預浸材料的總量，熱硬化性 樹脂組成物的含量可為40〜95質量％，但並不限定於此。 • 而且，在將複合積層板形成為第丨（b)圖所述之本發 日月#積層S ABf ’在將用於形成不織布I丨之預浸材料與 用於形成織布層2之預浸材料重疊後’藉由對該重疊之預 浸材料加熱加壓成形，而使各預浸材料中的熱硬化性樹脂 硬化，從而形成不織布層1及織布層2，並且藉由此等 熱硬化性樹脂之硬化，使不織布層丨與織布層2黏接而積 層一體化。此處，不織布層丨以及織布層2，可分別由一 片或由複數片預浸材料重疊而形成。又，在不織布層1的 兩個表面可形成織布層2。又，使用該複合積層板之貼有 金屬箔的積層板，可藉由進而在織布層2的表面設置銅箔 或鎳箔等金屬箔3,而形成為一種以複合積層板為絕緣層 之一面或者兩面貼有金屬箔的積層板。在該情形下，在將 用於形成不織布層1之預浸材料、用於形成織布層2之預 /又材料及金屬箔3重疊後，藉由加熱加壓成形，而使不織 布層1、織布層2及金屬箔3積層一體化。加熱加壓成形 條件與上述相同。 複合積層板可連續地生產。第2圖係表示兩面貼有金 屬箔之複合積層板的製造方法的一例。作為不織布基材之 玻璃不織布，係玻璃纖維製成的紙，係可連續供給之長形 物，只要在内部或表面具有空隙，並可浸潰熱硬化性樹脂 組成物，則並無特別限定。玻璃不織布的厚度通常為〇〇3 〜0.4 mm，但並不限定於該厚度。又，作為織布基材之玻 201134671 璃織布，係玻璃纖維製成的玻璃製織布，係可連續供給之 長形物’只要在内部或表面具有空隙，並可浸潰熱硬化性 樹脂組成物，則並無特別限定。玻璃織布的厚度通常為 0.015〜0.25 mm，但並不限定於該厚度。 並且，首先，將上述熱硬化性樹脂組成物浸漬至作為 不織布基材之玻璃不織布。繼而，在浸潰有熱硬化性樹脂 組成物之玻璃不織布的兩個表面，連續地積層浸潰有熱硬 化性樹脂之玻璃織布，利用輥來壓接該積層物並加熱來製 造複合型積層板。此處，浸潰有熱硬化性樹脂組成物之玻 璃不織布，可使用—片或者重疊複數片使用。又，浸潰有 熱硬化性樹脂之玻璃織布，係浸潰上述說明之熱硬化性樹 脂或熱可塑性樹脂組成物而構成之上述玻璃製織布。玻璃 織布的厚度通常為0.015〜0 25 mm，但並不限定於該厚 度。又，浸潰有熱硬化性樹脂之玻璃織布，亦可使用一片 或者重疊複數片使用。進而，亦可在其一面或者兩面的表 層積層金屬箔。作為金屬箔，只要係可連續供給之長形的 金屬製箔，則並無特別限定，可列舉銅箔、鎳箔等。金屬 治的厚度通常為〇, 012〜0.07 mm，但並不限定於該厚度。 如第2圖所示’將上述熱硬化性樹脂組成物n浸潰至 連續供給之玻璃不織布1〇中而構成之兩片浸潰有熱硬化 性樹脂之玻璃不織布丨2、連續供給之兩片浸潰有熱硬化性 樹脂之玻璃織布9以及連續供給之兩片金屬箔13,係以下 述方式積層：即，以浸潰有熱硬化性樹脂之玻璃不織布12 為核心，在其兩側（上下）配置浸潰有熱硬化性樹脂之玻 201134671 。之後，利用層S 13 201134671 In addition, as the inorganic component (B), in order to reduce the bit wear during drilling, the Mohs hardness must be smaller than the Mohs hardness of 12, preferably 疋6 · 0 or less. It is 5.0 or less. For example, the Mohs hardness of the inorganic component (B) is from 5.5 to 6.0 in terms of titanium oxide (anatase type), from 7 to 75 in titanium oxide (rutile), and from 25 in magnesium oxide. 7.0, nitriding butterfly & 2. 〇, gasification material 7 〇, nitride rock eve is 95, talc is 1.0, calcined kaolin is 2 〇, clay is 2 〇. The microparticles are formed into 4 (C), which is a tool for imparting high thermal conductivity to the obtained laminate. The oxidized crystal particles constituting the fine particle component (c) have an average particle diameter ^D50) of 1 > 5 μηη or less, preferably 〇 4 to 〇 8 . In the case where the average particle diameter of the fine particle forming blade (C) exceeds 15 (four), it is difficult to sufficiently fill the laminated sheet A with a sufficient amount of the casting, and the drilling workability is also lowered. Further, when the average particle diameter of the fine particle component (C) is too small, the thermal conductivity of the laminated sheet a may be insufficient. Further, although the Mohs hardness of the oxidized particles is 12', the average particle diameter (?5?) is 丨$_ or less, so that the drilling processability is not impaired. The mixing ratio (volume ratio) of the gibbsite-type aluminum hydroxide particles (Α), the inorganic component (Β), and the fine particle component (C) is 丨: 〇丨~3: 0.1 to 3' is preferably 1 :〇1~2:〇1~2, more preferably 1:〇1~1: 0.1丨. In the case where the compounding amount of the inorganic component (B) exceeds 3, the obtained drilling sheet A has a reduced drilling processability or heat dissipation property, and the amount of the raw material (B) is less than 3. In the case where the crucible 1 is not reached, the heat resistance is lowered. In addition, with respect to the blending amount 1 of the gibbsite-type aluminum hydroxide particles (a), when the blending amount of the fine particle component (c) exceeds 3, the drilling processability of 201134671 is lowered, and it is not reached. In this case, there is a possibility that the thermal conductivity is lowered or it is difficult to adjust the inorganic filler to deteriorate the formability. The blending ratio of the inorganic filler is from 80 to 400 parts by volume, preferably from 90 to 400 parts by volume, more preferably from 100 to 400 parts by volume, based on 100 parts by volume of the thermosetting resin. In the case where the proportion of the inorganic filler is less than 8 parts by volume, the thermal conductivity of the obtained laminated sheet is lowered, and in the case of more than 400 parts by volume, the drilling processability is lowered, and the manufacture of the laminated sheet a The properties (resin impregnation, formability) are also lowered. In addition, in the case where the blending ratio of the aluminum sulphate-type aluminum hydroxide particles (A) is too large, in particular, in the case of more than 100 parts by volume, heat resistance is lowered due to a large amount of crystal water. tendency. Furthermore, the boehmite particles will be blended and the free starting temperature will be 400. In the case where the component composed of the above-mentioned crystal water or inorganic particles containing no crystal water is used as the inorganic component (B), the blending ratio of the inorganic particles is preferably 50% by volume or less based on the total amount of the inorganic filler. It is preferably 30% by volume or less, and particularly preferably 2% by volume or less. The thermosetting resin composition is prepared by the following known production method. That is, in the above-mentioned thermosetting resin such as a liquid, the formulation is contained. The gibbsite-type aluminum hydroxide particles (A), the inorganic component (B), and the inorganic filler of the fine particle component (C) are dispersed by using a disperser, a ball mill, a roll, or the like to "particles of each inorganic filler." In addition, various additives such as a curing catalyst for a thermosetting resin can be blended in the thermosetting tree composition. X, in consideration of the viscosity adjustment of the thermosetting resin composition or the impregnation property of the impregnated base material, etc., and if necessary, 15 201134671 is formulated with a solvent such as an organic solvent, a viscosity reducing agent, and a coupling agent. . The prepreg for forming the nonwoven fabric layer 1 can be obtained by dipping the thermosetting resin composition to the nonwoven fabric substrate, and then dipping it to the nonwoven fabric substrate by heat drying or the like. The thermosetting resin composition reaches a semi-hardened state (B-stage state). In the prepreg for forming the nonwoven fabric layer 1, the content of the thermosetting resin composition may be 4 〇 to 95 with respect to the total amount of the prepreg material. % by mass, but is not limited to this. And, when manufacturing the laminated board A of the present invention, one or a plurality of sheets are overlapped to form a non-woven layer! After the prepreg, the thermosetting resin in the prepreg is hardened by heat-press molding the prepreg. Further, in the metal foil-clad laminate of the present invention, the laminated sheet A can be formed as an insulating layer by one or both sides by providing a metal pig 3' such as copper iridium or nickel iridium on the surface of the nonwoven fabric layer 1. A laminate of metal foil is attached. In the It shape, the non-woven fabric layer 1 and the metal crucible 3 are laminated by laminating the prepreg for forming the nonwoven fabric layer and the metal junction 3, followed by heat and pressure forming. The heating and press forming conditions in the production of the laminated board 8 and the laminated board to which the metal is attached can be appropriately set depending on the type of the thermosetting resin, for example, the temperature can be set to 8 〇 to 25 〇乞. The pressure is set to 0.05 to o.98 kPa (5 to 100 kgf/m2). The time is set to 2 〇 to ang. Further, the printed wiring board of the present invention can be formed by providing a conductor pattern on the surface of the laminated board A. In this case, it can be processed into a printed wiring board by performing an additive method, a circuit processing such as a method, or a through hole processing on the metal (four) (four) plate. Further, the circuit board 201134671 of the present invention can be formed by providing an electric and electronic circuit on the above laminated board A. In this case, an electric and electronic circuit can be formed using a conductor pattern of a printed wiring board formed of the above-described metal foil-clad laminate. Further, the LED mounting circuit board of the present invention can be formed by providing an LED mounting electric and electronic circuit on the laminated board A. In this case, the electric and electronic circuit of the above circuit board can be formed as an electric and electronic circuit for mounting LEDs. Fig. Kb) shows another embodiment of the laminated board a of the present invention. The laminated board A is formed of a non-woven fabric layer 1 containing a thermosetting resin composition and a woven fabric layer 2 containing a thermosetting resin composition, that is, a composite laminated board. The composite laminated board is inferior to the above-mentioned laminated board (the insulating layer is formed only by the non-woven layer i and the laminated board which does not use a woven fabric) in terms of heat dissipation, but is excellent in low cost, dimensional stability, and mechanical properties. The nonwoven fabric layer 1 can be formed by a cured product of a prepreg containing a thermosetting resin composition in a nonwoven fabric substrate, as described above. Further, the woven fabric layer 2' can be formed by a cured product of a prepreg containing a thermosetting resin composition in the woven fabric substrate. In the case of such a composite laminate, the non-woven layer may be formed in the same manner as described above, but preferably, the ratio of the inorganic filler to the volume of the thermosetting resin is 150 to 4 〇. 〇 Volume. In the case where the proportion of the inorganic filler is less than 150 parts by volume, there is a possibility that the thermal conductivity of the obtained laminated sheet A is lowered, and in the case of more than 4 parts by volume, there is a decrease in drilling workability, or lamination The manufacturability (resin impregnation property, moldability) of the board A is lowered. As the woven fabric substrate for forming the woven fabric layer 2, for example, the synthesis of synthetic resin fibers such as a glass cloth or an aromatic polyamide fiber or a polyester fiber or a polyamide fiber (nylon) can be used. Any of the resin sheets. The thickness of the woven base material may be 50 to 500 μm, but is not limited thereto. The thermosetting resin composition for forming the woven fabric layer 2 may be the same as the above-mentioned thermosetting resin composition for forming the nonwoven fabric layer i, or may be different from the case where it is to be different. The type of the thermosetting resin or the inorganic filler to be used, the content of the inorganic filler in the thermosetting resin, and the like are particularly preferably used in the above-mentioned thermosetting resin composition for forming the nonwoven fabric layer 1 The thermosetting resin composition after the inorganic filler, that is, the thermosetting resin composition containing the above-mentioned thermosetting resin and other solvents or additives formulated as needed. Thereby, the impregnation property of impregnating the thermosetting resin composition to the woven fabric substrate can be improved. In the case where the woven fabric layer 2 contains an inorganic filler, in order to improve the tracking resistance of the laminate, aluminum hydroxide is preferably used as the inorganic filler. Therefore, it is considered that the crystal water of the aluminum hydroxide can inhibit the thermal decomposition and carbonization of the surface of the laminated sheet, and it is considered that the tracking resistance of the laminated board can be improved. Further, in order to improve the tracking resistance of the laminated sheet, it is preferable that the aluminum hydroxide is 25 to 15 parts by volume with respect to 100 parts by volume of the thermosetting resin in the woven fabric layer 2. Further, it is preferred to use aluminum hydroxide having an average particle diameter (Dm) of 2 to 15 μm. The prepreg for forming the woven fabric layer 2 can be obtained by immersing the thermosetting resin composition on the woven fabric substrate, and then dipping it by heat drying or the like. The thermosetting resin composition in the woven base material is in a semi-hardened state (in the Β stage state). In the prepreg for forming the woven fabric layer 201134671, the content of the thermosetting resin composition may be 40 to 95% by mass based on the total amount of the prepreg, but is not limited thereto. • Moreover, the composite laminate is formed into the pre-dip material of the present invention, which is used to form the nonwoven fabric, and the prepreg, which is used to form the woven fabric layer 2, as described in the drawing (b). After the immersion materials are overlapped, the thermosetting resin in each prepreg is cured by heat-press molding the superposed prepreg, thereby forming the nonwoven fabric layer 1 and the woven fabric layer 2, and by such heat The curing of the curable resin causes the non-woven fabric layer to adhere to the woven fabric layer 2 to be integrated. Here, the non-woven fabric layer and the woven fabric layer 2 may be formed by laminating one sheet or a plurality of sheets of prepreg, respectively. Further, the woven fabric layer 2 can be formed on both surfaces of the non-woven fabric layer 1. Further, by using a metal foil-clad laminate of the composite laminate, a metal foil 3 such as a copper foil or a nickel foil can be further provided on the surface of the woven fabric layer 2 to form a composite laminate as an insulating layer. A laminate of metal foil on one or both sides. In this case, after the prepreg for forming the nonwoven fabric layer 1, the pre-material for forming the woven fabric layer 2, and the metal foil 3 are overlapped, the nonwoven fabric layer is formed by heat and pressure molding. The woven fabric layer 2 and the metal foil 3 are laminated in one layer. The conditions of the heat and pressure forming were the same as described above. Composite laminates can be produced continuously. Fig. 2 is a view showing an example of a method of manufacturing a composite laminate in which metal foil is attached to both sides. The glass non-woven fabric which is a non-woven fabric substrate is a paper which is a glass fiber which is continuously supplied, and is not particularly limited as long as it has a void inside or on the surface and can impregnate the thermosetting resin composition. The thickness of the glass non-woven fabric is usually 〇〇3 to 0.4 mm, but is not limited to this thickness. In addition, as a woven fabric substrate, glass woven fabric 201134671 is a glass woven fabric made of glass fiber, which is a continuously supplyable elongated material 'as long as it has voids inside or on the surface, and can be impregnated with thermosetting resin. The composition is not particularly limited. The thickness of the glass woven fabric is usually 0.015 to 0.25 mm, but is not limited to this thickness. Further, first, the thermosetting resin composition is immersed in a glass nonwoven fabric as a nonwoven fabric substrate. Then, on both surfaces of the glass nonwoven fabric impregnated with the thermosetting resin composition, a glass woven fabric impregnated with a thermosetting resin is continuously laminated, and the laminate is pressure-bonded by a roll and heated to produce a composite laminate. board. Here, the glass non-woven fabric impregnated with the thermosetting resin composition may be used as a sheet or a plurality of sheets. Further, the glass woven fabric impregnated with the thermosetting resin is a glass woven fabric formed by impregnating the thermosetting resin or the thermoplastic resin composition described above. The thickness of the woven fabric is usually from 0.015 to 0 25 mm, but is not limited to this thickness. Further, the glass woven fabric impregnated with the thermosetting resin may be used in one piece or in a plurality of sheets. Further, a metal foil may be laminated on the surface of one or both sides. The metal foil is not particularly limited as long as it is an elongated metal foil which can be continuously supplied, and examples thereof include a copper foil and a nickel foil. The thickness of the metal is usually 〇, 012 to 0.07 mm, but is not limited to this thickness. As shown in Fig. 2, two sheets of the glass non-woven fabric 2 in which the thermosetting resin composition n is impregnated into the continuously supplied glass non-woven fabric 1 is impregnated with the thermosetting resin, and two sheets are continuously supplied. The glass woven fabric 9 impregnated with the thermosetting resin and the two metal foils 13 continuously supplied are laminated in such a manner that the glass non-woven fabric 12 impregnated with the thermosetting resin is centered on both sides ( Top and bottom) is equipped with glass impregnated with thermosetting resin 201134671. After using the layer

璃織布9，進而在其兩表層配置金屬羯 壓輥14壓接該積層之 壓接物15中的熱硬化性樹脂組成物The woven fabric 9 and the thermosetting resin composition in which the laminated pressure-sensitive adhesive 15 is bonded to the two layers by the metal nip rolls 14

引該經壓接之壓接物15而行進， 將壓接物15加熱至該壓接物15 或者熱硬化性樹脂組成物U的黏度等，適當地調整。又， 加熱硬化之溫度或時間等條件，並無特別限定，可根據所 使用之熱硬化性樹脂組成物丨丨的成分調配或欲硬化之硬 化程度，適當地設定。在切斷後，亦可進而加熱（後硬化）， 以促進該積層板A之硬化。 在上述說明中’浸潰有熱硬化性樹脂之玻璃不織布12 的片數為兩片’浸潰有熱硬化性樹脂之玻璃不織布12的片 數亦可為一片，也可為三片以上。又，在上述說明中，金 屬箔13的片數為兩片，亦可為一片，並且，在浸潰有熱硬 化性樹脂之玻璃不織布12為複數片之情形下，在浸潰有熱 硬化性樹脂之玻璃不織布之間，亦可進而積層金屬箔。又， 不織布基材及織布基材並不限定於使用玻璃纖維而構成之 基材’亦可為使用其他材質的纖維而構成之基材。進而， 若熱硬化性樹脂組成物包含濕潤分散劑，且相對於無機充 填材’該濕潤分散劑的調配量為〇.〇5〜5質量％，則無機充 21 201134671 填材在浸潰有熱硬化性樹脂之破璃織布9或浸潰有熱硬化 性樹脂之玻璃不織布12令，係均勻地分散，因此，難以產 生翹曲，並且焊錫耐熱性提高。 使用如上所述的複合積層板而構成之本發明的印刷配 線板，可藉由在上述複合積層板的表面設置導體圖案而形 成。在該情形下，可藉由在上述貼有金屬箔的積層板上實 施添加法或消去法等電路加工處理或通孔加工而加工為印 刷配線板。又，使用複合積層板而構成之本發明的電路基 板，可藉由在上述複合積層板上設置電氣電子電路而形 成。在該情形下，可使用由上述貼有金屬箔的積層板所形 成之印刷配線板的導體圖案來形成電氣電子電路。又，使 用複合積層板而構成之本發明的LED搭載用電路基板，可 藉由在上述複合積層板A設置LED搭載用電氣電子電路而 形成。在該情形下，可將上述電路基板的電氣電子電路形 成為LED搭載用電氣電子電路。 而且’本發明的積層板（包含複合積層板）A，係在不 織布層1中，高充填地調配有無機充填材，因此，可提高 熱傳導率，易於使積層板八整體立即擴散熱’從而散熱性 提高。因此’由本發明的積層板A所形成之貼有金屬箔的 積層板、印刷配線板及電路基板，亦能發揮同樣的作用效 果，藉由在此等貼有金屬箔的積層板、印刷配線板及電路 基板上格載LED等發熱電氣電子零件’而易於使電氣電子 零件所產生之熱’傳導至高熱導性之貼有金屬箔的積層 板、印刷配線板及電路基板並擴散，最終，貼有金屬Γ ν 22 客 201134671 積層板、印刷配線板及電路基板的散熱性提高，從而可顯 者地降低電氣電子零件的熱劣化，實現電氣電子零件的長 壽命化。又，本發明的LED搭載用電路基板，藉由搭载 LED ’而易於使LED所產生之熱，傳導並擴散，最終，led 搭載用電路基板的散熱性提高，從而可顯著地降低led的 熱劣化，實現LED的長壽命化。 又，在本發明的積層板A中，於構成不織布層1之樹 脂組成物中調配有三水鋁石型氫氧化鋁粒子（A )，並且以 特定量調配有平均粒徑較小的微粒子成分（C )，因此，可 抑止積層板A在鑽孔加工時的鑽頭刃的磨耗。因此，可使 鑽頭長舞命化。又，即便應用鑽孔加工以形成通孔，在所 形成之孔的内面亦難以形成凹凸，從而可平滑地形成該孔 的内面。因此，當在孔的内面實施通孔鍍敷而形成通孔之 It开v下，亦可賦予該通孔較高的導通可靠性。又，藉由調 配熱導性優異的微粒子成分，可顯著提高積層板的熱 導性。再者，由於調配較小粒徑的微粒子成分（c )，因此 不會顯著降低積層板的鑽孔加工性。又，藉由調配上述無 機成分（B )，無須使耐熱性及鑽孔加工性顯著降低，便能 賦予熱導性。 本發明的積層板A，可較佳地用作如搭載在液晶顯示 器中之LED背光模組的印刷配線基板或者LED照明裝置用 電路基板等這類的要求高散熱性之用途。此種LED搭载用 途需要高散熱基板，理想的是熱傳導率為〇9W/m.K以上 的阿散熱基板，較佳是1&gt;5 w/m · κ以上的高散熱基板。具 23 201134671 體而δ，作為LED的用途之一，可列舉如第3圖所示般搭 載在液晶顯示器中之直下式等的LED背光模組20。第3 圖的LED背光模組2〇，係配列多個LED組件23而構成’ 該LED組件23係在上述積層板A或者由上述積層板八所 形成之電路基板21上，構裝複數個（在第3圖中為3個） LED22而構成，該LED背光模組2〇,藉由配設在液晶面板 的背面’而作為液晶顯示器等的背光來使用。又，如第4 (a)圖、第4(b)圖所示’使用本發明的積層板a，亦可 形成如搭載在液晶顯示器般之邊緣型Led背光模組20»第 4 (a)圖、第4 ( b)圖的LED背光模組2〇，係藉由一對 LED組件23構成，該一對LED組件23係在上述積層板A 或者由上述積層板A所形成之長條狀電路基板21上構裝複 數個LED22而構成，該LED背光模組20藉由將各LED組 件23配設在導光板24等的上下（或者左右），而可作為 液晶顯不器等的背光來使用。邊緣型LED背光模組2〇與 直下式LED背光模組2〇相比，LED係以高密度設置因 此’較佳是使用如本發明的積層板A般之高散熱性積層 板。在自先前以來廣泛普及之類型之液晶顯示器中，作為 液晶顯示器的背光，廣泛使用冷陰極管（c〇ld Cath〇de Fluorescent Lamp，CFL)方式之背光，而近年來，如上所 述之LED背光模組被積極地開發，其原因在於上述 背光模組具有以下優點：與冷陰極管方式之背光相比，能 夠擴展色域’因此可提高畫質，並且，就未使用汞之方面 而言’環境負荷較小’進而亦可實現薄型化。LED組件與 24 201134671 冷陰極營相比，通常耗電率較大，因此發熱量多。藉由使 用本發明的積層板A來作為此種要求高散熱性之電路基板 21，可大幅度改善散熱問題。因此’可提高led的發光效 率。 又’亦可使用本發明的積層板A來形成LED照明裝 置。LED照明裝置，可先在上述積層板A或者由上述積層 板A所形成之電路基板上，構裝複數個led，並且並具備 使該LED發光之供電部等’以此方式來形成led照明裝置。 [實施例] 以下利用實施例具體地說明本發明。 (實施例1〜14、比較例1〜3 ) 在含有作為樹脂成分之雙酚A型環氧樹脂、作為硬化 劑成分之二氰二胺（Dicyandiamide ’ DICY )系硬化劑之熱 硬化性樹脂清漆中，相對於熱硬化性樹脂丨〇〇體積份，按 表1所示之調配量（單位為體積份）調配無機充填材並使 其均勻地分散。作為（A)成分，使用了三水鋁石型氫氧化 紹粒子（住友化學（股）（Sumit〇m〇 chemical Co.，Ltd.)製造， Dso: 5.4 μηΟ及三水鋁石型氫氧化鋁粒子（住友化學（股） 製造，D50 : 12.6 μπ〇。作為（Β)成分，使用了勃姆石粒 子（D50: 3.0 μπι)。作為（c)成分，使用了氧化鋁粒子 (住友化學（股）製造，Da : 〇 5 μιη，氧化鋁）。再者，相 對於熱硬化性樹脂100體積份之無機充填材的調配量係 相對於除去熱硬化性樹脂清漆的溶劑後之固體成分（雙酚 25 201134671 A型環氧樹脂（樹脂成分）與二氰_ 齓一胺系硬化劑（硬化劑成分） 的合計量）100體積份之無機充填材的調配量。 將調配有上述無機充填材之熱硬化性樹脂清漆，浸潰 至（每平方公尺）克重為60 g/m2、厚度為4〇〇 μηΐ2玻璃不 織布（寶翎（股）（Japan Vilene)製造之玻璃不織布中，黏合 劑係環氧残等，相對於玻璃纖維⑽f量份，黏合劑的 調配量為5〜25質量份）中’獲得不織布層用預浸材料。 繼而，將兩片不織布層用預浸材料重疊，分別在其兩 外表面載置厚度為0.018mm之銅箔，獲得積層體。將該積 層體夾持在兩片金屬板之間，藉由在溫度為18〇它，壓力 為0.3 kpa ( 30 kgf/m2)之條件下加熱成型，而獲得厚度為 1·〇 mm的貼有銅箔的積層板。 對所獲得之貼有銅箔的積層板，按照以下評價方法， 评熱傳導率、烘箱耐熱性試驗、鑽孔加工性以及阻燃性。 其結果不於下述表1。 〈熱傳導率〉 藉由水中置換法來測定所獲得之貼有銅箔的積層板的 密度，又’藉由DSC (示差掃描熱量測定法）來測定比熱， 進而’藉由雷射閃光法（laser flash method )來測定熱擴 散率。 繼而，根據下式計算熱傳導率。 熱傳導率（W/m· Κ)=密度（kg/m3) X比熱（kJ/kg. κ) X熱擴散率（m2/S) xlOOO 〈烘箱耐熱試驗〉The pressure-bonded pressure-sensitive adhesive 15 is introduced to travel, and the pressure-sensitive adhesive 15 is heated to the viscosity of the pressure-sensitive adhesive 15 or the thermosetting resin composition U, and the like. Further, the temperature and the time of the heat curing are not particularly limited, and may be appropriately set depending on the degree of hardening or the degree of hardening of the thermosetting resin composition 丨丨 to be used. After the cutting, it is further heated (post-hardening) to promote the hardening of the laminated sheet A. In the above description, the number of the glass non-woven fabrics 12 impregnated with the thermosetting resin is two. The number of the glass non-woven fabrics 12 impregnated with the thermosetting resin may be one or three or more. Further, in the above description, the number of the metal foils 13 is two or one, and in the case where the glass non-woven fabric 12 impregnated with the thermosetting resin is a plurality of sheets, it is thermally hardenable in the impregnation. A metal foil may be laminated between the glass non-woven fabrics of the resin. Further, the nonwoven fabric substrate and the woven base material are not limited to the base material formed by using glass fibers. The base material may be a base material formed using fibers of other materials. Further, if the thermosetting resin composition contains a wetting dispersant and the amount of the wetting dispersant is 〇. 5 to 5 mass% with respect to the inorganic filler, the inorganic filler 21 201134671 is filled with heat in the impregnation The woven fabric 9 of the curable resin or the glass non-woven fabric 12 impregnated with the thermosetting resin is uniformly dispersed, so that warping is less likely to occur, and solder heat resistance is improved. The printed wiring board of the present invention constructed using the composite laminated board as described above can be formed by providing a conductor pattern on the surface of the composite laminated board. In this case, it can be processed into a printed wiring board by performing circuit processing such as addition or erasing or through-hole processing on the laminated metal foil-clad laminate. Further, the circuit board of the present invention constructed using a composite laminate can be formed by providing an electric and electronic circuit on the composite laminate. In this case, an electric and electronic circuit can be formed using the conductor pattern of the printed wiring board formed by the above-mentioned metal foil-clad laminate. In addition, the LED mounting circuit board of the present invention, which is formed by using a composite laminated board, can be formed by providing an LED mounting electric and electronic circuit on the composite laminated board A. In this case, the electrical and electronic circuit of the circuit board can be formed into an electrical and electronic circuit for mounting LEDs. Further, the laminated board (including the composite laminated board) A of the present invention is provided with the inorganic filling material in the high-filling layer in the non-woven fabric layer 1, so that the thermal conductivity can be improved, and the laminated board 8 can be easily diffused immediately. Sexual improvement. Therefore, the metal foil-clad laminate, the printed wiring board, and the circuit board formed by the laminated board A of the present invention can exhibit the same effects, and the laminated board and the printed wiring board to which the metal foil is attached can be used. And the heat-generating electrical and electronic parts such as LEDs on the circuit board are mounted, and it is easy to conduct the heat generated by the electric and electronic parts to the metal foil-clad laminate, the printed wiring board, and the circuit board, and finally spread. Metal Γ 22 22 22 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Moreover, the LED mounting circuit board of the present invention can easily conduct and diffuse heat generated by the LED by mounting the LED ', and finally, the heat dissipation property of the LED mounting circuit board is improved, and the thermal deterioration of the LED can be remarkably reduced. To achieve long life of LED. Further, in the laminated board A of the present invention, the gibbsite-type aluminum hydroxide particles (A) are blended in the resin composition constituting the nonwoven fabric layer 1, and fine particle components having a small average particle diameter are blended in a specific amount ( C) Therefore, it is possible to suppress the wear of the drill blade of the laminated board A during the drilling process. Therefore, the drill bit can be prolonged. Further, even if drilling is applied to form the through hole, it is difficult to form irregularities on the inner surface of the formed hole, and the inner surface of the hole can be formed smoothly. Therefore, when the through hole is plated on the inner surface of the hole to form the through hole, it is possible to impart a high conduction reliability to the through hole. Further, by disposing the fine particle component having excellent thermal conductivity, the thermal conductivity of the laminated plate can be remarkably improved. Further, since the fine particle component (c) having a smaller particle diameter is blended, the drilling processability of the laminated plate is not significantly lowered. Further, by disposing the above inorganic component (B), it is possible to impart thermal conductivity without significantly lowering heat resistance and drilling processability. The laminated board A of the present invention can be preferably used as a printed wiring board or a circuit board for an LED lighting device such as an LED backlight module mounted in a liquid crystal display device, which is required to have high heat dissipation properties. Such a LED mounting device requires a high heat dissipation substrate, and is preferably a heat dissipation substrate having a thermal conductivity of 〇9 W/m·K or more, and preferably a high heat dissipation substrate of 1 &gt; 5 w/m · κ or more. As an example of the use of the LED, the LED backlight module 20 such as a direct type mounted on a liquid crystal display as shown in Fig. 3 can be cited. The LED backlight module 2A of FIG. 3 is configured by arranging a plurality of LED modules 23 to constitute 'the LED unit 23' on the laminated board A or the circuit board 21 formed by the laminated board eight, and a plurality of them are mounted ( In the third drawing, three LEDs 22 are formed, and the LED backlight module 2 is used as a backlight of a liquid crystal display or the like by being disposed on the back surface of the liquid crystal panel. Further, as shown in FIGS. 4(a) and 4(b), the use of the laminated board a of the present invention can also form an edge type Led backlight module 20 as mounted on a liquid crystal display. 4 (a) The LED backlight module 2 of FIG. 4(b) is constituted by a pair of LED assemblies 23 which are attached to the laminated board A or the strip formed by the laminated board A. A plurality of LEDs 22 are formed on the circuit board 21, and the LED backlight module 20 can be disposed as a backlight of a liquid crystal display or the like by disposing the LED modules 23 on the upper and lower sides (or left and right) of the light guide plate 24 or the like. use. The edge type LED backlight module 2 is more densely disposed than the direct type LED backlight module 2, and thus it is preferable to use a high heat dissipation laminated board such as the laminated board A of the present invention. In a liquid crystal display of a type widely used in the past, as a backlight of a liquid crystal display, a backlight of a c阴极ld Cath〇de Fluorescent Lamp (CFL) method is widely used, and in recent years, an LED backlight as described above The module has been actively developed because the above-described backlight module has the advantage of being able to expand the color gamut as compared with the backlight of the cold cathode tube type, thereby improving the image quality and, in terms of not using mercury. The environmental load is small, and the thickness can be reduced. Compared with the 24 201134671 cold cathode battalion, the LED module usually has a higher power consumption rate and therefore generates more heat. By using the laminated board A of the present invention as such a circuit board 21 requiring high heat dissipation, the heat dissipation problem can be greatly improved. Therefore, the luminous efficiency of led can be improved. Further, the laminated board A of the present invention can also be used to form an LED lighting device. In the LED lighting device, a plurality of LEDs may be mounted on the laminated board A or the circuit board formed by the laminated board A, and a power supply unit for causing the LED to emit light or the like may be formed in this manner to form a LED lighting device. . [Examples] Hereinafter, the present invention will be specifically described by way of examples. (Examples 1 to 14 and Comparative Examples 1 to 3) A thermosetting resin varnish containing a bisphenol A type epoxy resin as a resin component and a dicyandiamide 'DICY hardener as a curing agent component In the above, the inorganic filler was blended and uniformly dispersed with respect to the volume of the thermosetting resin crucible in accordance with the blending amount (unit: part by volume) shown in Table 1. As the component (A), gibbsite-type hydrazine hydroxide particles (manufactured by Sumit〇m〇chemical Co., Ltd.), Dso: 5.4 μηΟ and gibbsite-type aluminum hydroxide were used. Particles (manufactured by Sumitomo Chemical Co., Ltd., D50: 12.6 μπ〇. As a (Β) component, boehmite particles (D50: 3.0 μπι) were used. As (c) component, alumina particles were used (Sumitomo Chemical Co., Ltd.) (manufactured by Da: 〇5 μιη, alumina). Further, the amount of the inorganic filler in an amount of 100 parts by volume relative to the thermosetting resin is a solid component (bisphenol) relative to the solvent from which the thermosetting resin varnish is removed. 25 201134671 A type of epoxy resin (resin component) and dicyandiamide-based hardener (hardener component)) 100 parts by volume of inorganic filler. The heat of the above inorganic filler will be formulated. Curable resin varnish, impregnated to (g/m2) gram weight 60 g/m2, thickness 4 〇〇μηΐ2 glass non-woven fabric (Japan Vilene) glass non-woven fabric, adhesive ring Oxygen residue, etc., relative to glass The dimension of the (10)f component is 5 to 25 parts by mass of the binder, and the prepreg material for the non-woven fabric layer is obtained. Then, the two non-woven fabric layers are overlapped with the prepreg, and the thickness is placed on the outer surfaces of the two nonwoven fabrics respectively. 0.018 mm of copper foil to obtain a laminate. The laminate is sandwiched between two metal plates and heated by a temperature of 18 Torr and a pressure of 0.3 kPa (30 kgf/m2). A copper foil-clad laminate having a thickness of 1·〇mm was obtained. The obtained laminate with copper foil was evaluated for thermal conductivity, oven heat resistance test, drilling processability, and flame retardancy according to the following evaluation methods. The results are not shown in Table 1. <Thermal Conductivity> The density of the obtained copper foil-clad laminate was measured by the underwater displacement method, and the specific heat was measured by DSC (differential scanning calorimetry). Further, 'the thermal diffusivity is measured by a laser flash method. Then, the thermal conductivity is calculated according to the following formula. Thermal conductivity (W/m· Κ) = density (kg/m3) X specific heat (kJ/kg) κ) X thermal diffusivity (m2/S) xlOOO < oven heat test >

S 26 201134671 在設定為200〜24(rc之附有空氣循環裝置之恒溫槽 中，將使用所獲得之貼有銅箔的積層板，遵照JIS C 648! 製作而構成之試驗片處理一小時，此時，測定於銅箔及積 層板上產生脹疵及剝落之溫度。再者，關於烘箱耐熱試驗 的評價，用作LED搭載用基板時，較佳是至少在22〇艽以 上，若未達220°C，則存在耐熱性不足之虞。 〈錯孔加工性〉 藉由因鑽孔加工而磨耗之鑽頭刃的大小（面積），相 對於鑽孔加工前鑽頭刃的大小（面積）之比例（百分率）， 求出下述鑽頭刃的磨耗率，並進行評價，該鑽頭刀的磨耗 率係將二片所獲得之貼有銅箔的積層板重疊，用鑽頭（鑽 頭徑為0.5 mm、偏轉角為35〇)以6〇〇〇〇轉/min穿設3〇〇〇 個孔後之磨耗率。並且，將磨耗率為9〇%以下之情況表示 為〇’將磨耗率小於99%、大於9G%之情況表示為△，將 磨耗率為99%以上之情況表示為χ。再者，可謂係鑽頭刃的 磨耗率越小，則鑽頭刀的損失越小，鑽孔加工性越高◊又， 鑽頭刀只要殘留10%即可使用，若如上所般穿設3〇〇〇個孔 後之鑽頭刀的的磨耗率為9〇%以下，則無需頻繁地更換鑽 頭。 〈阻燃性〉 將所獲得之貼有銅箔的積層板切割為特定大小，遵照 UL-94燃燒試驗法來進行燃燒試驗，並進行判定。並且， 將UL94-V0之情況表示為〇，將UL94-VI之情況表示為χβ [表 1] ^S 26 201134671 In a thermostat with an air circulation device set to 200 to 24 (the coiled copper plate is used, the test piece made in accordance with JIS C 648! is used for one hour. In this case, the temperature at which the copper foil and the laminate are swelled and peeled off is measured. Further, when the evaluation of the heat resistance test of the oven is used as the substrate for mounting the LED, it is preferably at least 22 Å or more. At 220 ° C, there is a lack of heat resistance. <Wrong hole workability> The ratio of the size (area) of the drill bit worn by the drilling process to the size (area) of the drill bit before drilling (Percentage), the wear rate of the following drill blade was determined and evaluated. The wear rate of the drill blade was obtained by superimposing the two laminated copper foil-clad laminates, and the drill was used (the drill diameter was 0.5 mm, partial deviation). The corner angle is 35 〇) The wear rate after 3 孔 holes are punched at 6 rpm/min, and the case where the wear rate is 9 〇 or less is expressed as 〇', the wear rate is less than 99%, The case of more than 9G% is expressed as Δ, and the wear rate is 99% or more. In other words, it can be said that the smaller the wear rate of the drill bit is, the smaller the loss of the drill bit is, and the higher the drilling processability is. The bit cutter can be used as long as 10% remains, if worn as above. When the wear rate of the drill bit after the hole is set to 9〇% or less, it is not necessary to change the drill frequently. <Flame retardancy> The obtained laminated plate with the copper foil is cut to a specific size, and The UL-94 combustion test method was used to carry out the combustion test, and the judgment was made. Further, the case of UL94-V0 was expressed as 〇, and the case of UL94-VI was expressed as χβ [Table 1] ^

S 27 201134671 錄CO 省零 C3 i—i C3 C? τ—Η CD LO 04 〇 KO 寸 〇&gt; CD ι Η CO Ο CZ5 οα CD Ο 1 ( X 〇 Ο m &lt;Z&gt; 〇&gt; Η CZ5 Ο »—&lt; &lt;=&gt; &lt;=&gt; eo CD LO 寸 cr&gt; cr&gt; ι-H CO 寸· ο csi &lt;3 〇 餐一1 LO (NJ L〇 οα CD CD g t--H 05 CD cz&gt; OJ CD CO 〇 〇 實施 例14 CD &lt;z&gt; ο τ-Η &lt;3 Ο ι—Η CD CD OJ cr&gt; 导 CD CD CNI 寸· ο CN1 οα CO OO 〇 〇 實施 例13 CD 103.7 卜 CO ο 1-Η 142.6 C5 LO CO g ι—I 卜 CO CD (Νϊ &lt;&gt;α OT 〇 〇 實施 例12 CD 88.9 88.9 122.2 o &lt;〇 CO C? cr&gt; r- &lt; CO &lt;=&gt; οα οα L〇 〇 〇 實施 1例11 CD g § 〇 Q 03 CD 〇 T~ &lt; OO c&gt;d OJ Cn3 〇 〇 實施 例10 CD r~H CO 卜 ΟΟ i 1 CO 卜 o in CNI c=&gt; o 1—( CO oi C3 C&lt;J Csl r-H 〇 〇 〇 ο g C2&gt; CO CS3 g t—1 寸 CvJ &lt;〇 C&lt;I Csl OT CO 〇 〇 辑〇〇 CD 卜 c〇 c〇 66.7 66.7 〇&gt; 〇 CSJ o CD i—l CO oi ¢=5 C&lt;J &lt;N1 CO CO 〇 〇 CZ5 g S S 〇 OO ι H 〇 cz&gt; t- H « &lt; oi o OJ CNI 寸 CO 〇 〇 镡CO ίΚ ^ C3 CO CO LO CO CO in CO CO lO § ι—H c=&gt; 〇 ，--H OO t &lt; o C&lt;! CO LO 〇 〇 鸯LO m oi ID 52.5 1 LO 03 (Nl LO OO (ΝΪ o m ι—H cr&gt; o ι—H 卜 ι 1 c=&gt; CsJ 03 s 〇 〇 CT) 寸 CD oa 〇&gt; ，&quot;H c=&gt; o r· 1 卜 τ-Η S 03 OO LO 〇 〇 辑CO 03 寸 οα 寸 OO OO 1 H c=&gt; cr&gt; T- &lt; LO ι i C5 OO oa LO LO 〇 〇 餐οα 私軍 ΙΟ i—Η CO 31.5 LD CO ι H ίΛ CO r-H § o c=&gt; r—&lt; 寸 i-H S C&gt;J CO LO 〇 〇 省μ IK ^ οο (SI oa § o c=&gt; r—« oa f—H &lt;=&gt; C&lt;l CsJ CO 寸 〇 〇 比較例編號 (Α)三水鋁石型氫 氧化鋁粒子 (Ds〇:5. 4 ywm) (Α)三水鋁石型氫 氧化鋁粒子 (D5〇:12. 6 μιη) (B)勃姆石粒子 (Ds〇:3. 0 jum) (c)氧化鋁粒子 (Ds〇:0.5 izm) 無機充填材的合計 量 *4° if 寒$ ^ ^ ^ 蟛€ ΦΊ 熱傳傳導率（W/m*K) /-~N P M ^ 媒3 鑽孔加工性 (磨耗率）（¾) 鑽孔加工性（評價） 阻燃性（UL-94) 實施例、 难奪枳域本 翥_戚与率崩荽器_ 2 ^ 盎·彰Μ迴噠:&amp;齧s甶 00 201134671 (實施例15〜2 Ο、比較例4〜6 ) 作為實施例1〜14以及比較例1〜3中的（Β )成分， 使用了滑石（日本滑石（股）（Nippon Talc Co.，Ltd.)製造， D50 : 5 μιη )來代替勃姆石粒子。除此之外，與實施例1〜 14以及比較例1〜3相同。關於所獲得之貼有銅箔的積層 板，進行與上述相同之評價。其結果示於下述表2。 [表2] 實施例、比較例編號 實施 例15 實施 例16 實施 例17 實施 例18 實施 例19 實施 例20 比較 例4 比較 例5 比較 例6 不織 布層 無 機 (A)三水鋁石型氫氧化 銘粒子（D5〇:5.4 /zm) 31.5 49 0 0 0 0 25 50 0 用熱 硬化 充 填 (A)三水鋁石型氫氧化 銘粒子（D5d:12. 6 /zm) 31.5 49 60 70 80 100 25 100 100 性樹 脂組 成物 的調 配量 材 (B)滑石（D5〇:5 /zm) 13.5 21 60 90 80 100 10 100 100 (C)氧化鋁粒子 (Dm:0. 5 &quot;m) 13.5 21 60 70 110 200 10 200 250 無機充填材的合計量 90 140 180 230 270 400 70 450 450 (體 積 份） 熱硬化性樹脂(樹脂成分和硬 化劑成分的合計量） 100 100 100 100 100 100 100 100 100 評 價 鱗導率(W/m_K) 1.0 1.5 1.8 2.0 2.3 3.1 0.7 3.5 3.6 烘箱而撒陡（1小時）（°C) 220 220 220 220 220 220 220 210 200 結 鑽?性 (%) 71 74 79 83 90 92 65 100 100 果 鑽胁工性（浦） 〇 〇 〇 〇 〇 Δ 〇 X X 赚(UL-94) 〇 〇 〇 〇 〇 〇 〇 〇 〇 (實施例21〜26、比較例7〜9 ) 作為實施例1〜14以及比較例1〜3中的（Β )成分， 使用了二氧化石夕（電氣化學工業（股）（Denki Kagaku KogyoS 27 201134671 Record CO Province Zero C3 i-i C3 C? τ-Η CD LO 04 〇KO inch 〇> CD ι Η CO Ο CZ5 οα CD Ο 1 ( X 〇Ο m &lt;Z&gt;〇&gt; Η CZ5 Ο »—&lt;&lt;=&gt;&lt;=&gt; eo CD LO inch cr&gt;cr&gt; ι-H CO inch · ο csi &lt;3 〇餐一1 LO (NJ L〇οα CD CD g t-- H 05 CD cz&gt; OJ CD CO 〇〇 Example 14 CD &lt;z&gt; ο τ-Η &lt;3 Ο ι—Η CD CD OJ cr&gt; Guide CD CD CNI inch · ο CN1 οα CO OO 〇〇 Example 13 CD 103.7 卜CO ο 1-Η 142.6 C5 LO CO g ι—I 卜 CO CD (Νϊ &lt;&gt;α OT 〇〇Example 12 CD 88.9 88.9 122.2 o &lt;〇CO C? cr&gt; r- &lt; CO &lt;=&gt; οα οα L〇〇〇Implementation 1 case 11 CD g § 〇Q 03 CD 〇T~ &lt; OO c&gt;d OJ Cn3 〇〇Example 10 CD r~H CO ΟΟ i 1 CO 卜 o In CNI c=&gt; o 1—( CO oi C3 C&lt;J Csl rH 〇〇〇ο g C2&gt; CO CS3 gt—1 inch CvJ &lt;〇C&lt;I Csl OT CO 〇〇 〇〇 CD 〇c〇 C〇66.7 66.7 〇&gt; 〇CSJ o CD i-l CO oi ¢=5 C&lt;J &lt;N1 CO CO 〇〇CZ5 g SS 〇OO ι H 〇cz&gt; t- H « &lt; oi o OJ CNI inch CO 〇〇镡CO Κ ^ C3 CO CO LO CO CO in CO CO lO § ι—H c=&gt; 〇,--H OO t &lt; o C&lt;! CO LO 〇〇鸯LO m oi ID 52.5 1 LO 03 (Nl LO OO (ΝΪ om ι—H cr&gt; o ι—H ι 1 c=&gt; CsJ 03 s 〇〇CT) inch CD oa 〇 &gt;,&quot;Hc=&gt; or· 1 ττΗ S 03 OO LO COCO 03 inch οα inch OO OO 1 H c=&gt;cr&gt; T- &lt; LO ι i C5 OO oa LO LO 〇〇 meal οα 私军ΙΟ i—Η CO 31.5 LD CO ι H ίΛ CO rH § oc=&gt;r—&lt; inch iH S C&gt;J CO LO 〇〇μ IK ^ οο (SI oa § oc= &gt; r—« oa f—H &lt;=&gt;C&lt;l CsJ CO inch 〇〇Comparative example number (Α) gibbsite type aluminum hydroxide particles (Ds〇: 5. 4 ywm) (Α) three Boehmite-type aluminum hydroxide particles (D5〇: 12.6 μιη) (B) Boehmite particles (Ds〇: 3. 0 jum) (c) Alumina particles (Ds〇: 0.5 izm) Inorganic filler Total amount *4° if cold $ ^ ^ ^ 蟛€ ΦΊ Heat transfer rate (W/m*K) /-~NPM ^ Medium 3 Drilling processability (wear rate) (3⁄4) Drilling processability (evaluation)Flammability (UL-94) Example, Difficult to 枳 翥 翥 戚 戚 率 率 率 _ _ _ _ & & & & & & & 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 4 to 6) As the (Β) component in Examples 1 to 14 and Comparative Examples 1 to 3, talc (manufactured by Nippon Talc Co., Ltd., D50: 5 μιη) was used instead. Boehmite particles. Other than the above, it is the same as Examples 1 to 14 and Comparative Examples 1 to 3. Regarding the obtained laminated plate with the copper foil attached, the same evaluation as above was carried out. The results are shown in Table 2 below. [Table 2] Examples, Comparative Examples No. Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Comparative Example 4 Comparative Example 5 Comparative Example 6 Non-woven layer inorganic (A) gibbsite-type hydroxide Ming particles (D5〇: 5.4 /zm) 31.5 49 0 0 0 0 25 50 0 Filled with heat hardening (A) gibbsite type hydroxide particles (D5d: 12.6 /zm) 31.5 49 60 70 80 100 25 100 100 resin composition of the material (B) talc (D5 〇: 5 / zm) 13.5 21 60 90 80 100 10 100 100 (C) alumina particles (Dm: 0. 5 &quot; m) 13.5 21 60 70 110 200 10 200 250 Total amount of inorganic fillers 90 140 180 230 270 400 70 450 450 (parts by volume) Thermosetting resin (total amount of resin component and hardener component) 100 100 100 100 100 100 100 100 100 Evaluation of the scaly conductivity (W/m_K) 1.0 1.5 1.8 2.0 2.3 3.1 0.7 3.5 3.6 Oven and steep (1 hour) (°C) 220 220 220 220 220 220 220 210 200 Drilling (%) 71 74 79 83 90 92 65 100 100 Fruit Danger Duty (Pu) 〇〇〇〇〇Δ 〇XX Earn (UL-94) 〇〇〇〇〇〇〇〇〇 (Examples 21 to 26, and Comparative Examples 7 to 9) As the (Β) component of Examples 1 to 14 and Comparative Examples 1 to 3, the use of the sulphur dioxide (Electrical Chemical Industry) (Denki Kagaku Kogyo)

Kabushiki Kaisha，DENKA)製造，D5。： 5 μιη)來代替勃姆Made by Kabushiki Kaisha, DENKA), D5. : 5 μιη) instead of Bom

S 29 201134671 石粒子。除此之外，與實施例1〜14以及比較例1〜3相同。 關於所獲得之貼有銅箔的積層板，進行與上述相同之評 價。其結果示於下述表3。 [表3] 實施例、比較例編號 實施 例21 實施 例22 實施 例23 實施 例24 實施 例25 實施 例26 比較 例7 比較 例8 比較 例9 不織 布層 無 機 (A)三水鋁石型氫氧化 銘粒子（Dsd:5· 4 ym) 31.5 49 0 0 0 0 25 50 0 用熱 硬化 充 填 (A)三水鋁石型氫氧化 銘粒子（1&gt;5〇:12.6 /zm) 31.5 49 60 70 80 100 25 100 100 性樹 脂組 材 (B)二氧化矽（D5〇:5 //m) 13.5 21 60 90 80 100 10 100 100 成物 的調 (C)氧化鋁粒子 (Ds〇:0. 5 /zm) 13.5 21 60 70 110 200 10 200 250 配量 (體 積 份） 無機充填材的合計量 90 140 180 230 270 400 70 450 450 熱硬化性樹脂（樹脂成分與 硬化劑成分的合計量） 100 100 100 100 100 100 100 100 100 評 價 熱傳導率(W/nrK) 0.9 1.1 1.5 1.7 1.9 2.8 0.6 3.4 3.2 烘箱耐熱性（1小時）（°C) 220 220 220 220 220 220 220 210 200 結 鑽孔加工性（磨耗率）（％) 77 81 80 84 88 91 71 100 100 果 鑽孔加工性（評價） 〇 〇 〇 〇 〇 Δ 〇 X X 阻燃性（UL-94) 〇 〇 〇 〇 〇 〇 〇 〇 〇 (實施例27〜32、比較例10) 作為實施例9中的（C )成分，使用了平均粒徑不同之 複數種氧化鋁粒子。除此之外，與實施例9相同。關於所 獲得之貼有銅箔的積層板，進行與上述相同之評價。其結 果示於下述表4。S 29 201134671 Stone particles. Other than the above, it is the same as Examples 1 to 14 and Comparative Examples 1 to 3. Regarding the obtained laminated sheet with the copper foil attached, the same evaluation as above was carried out. The results are shown in Table 3 below. [Table 3] Examples, Comparative Examples No. Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Comparative Example 7 Comparative Example 8 Comparative Example 9 Non-woven layer inorganic (A) gibbsite-type hydroxide Ming particles (Dsd: 5· 4 ym) 31.5 49 0 0 0 0 25 50 0 Filled with heat hardening (A) gibbsite type hydroxide particles (1 &gt; 5〇: 12.6 /zm) 31.5 49 60 70 80 100 25 100 100 resin group (B) cerium oxide (D5 〇: 5 / m) 13.5 21 60 90 80 100 10 100 100 The adjusted (C) alumina particles (Ds 〇: 0. 5 / Zm) 13.5 21 60 70 110 200 10 200 250 Dosage (part by volume) Total amount of inorganic filler 90 140 180 230 270 400 70 450 450 Thermosetting resin (total amount of resin component and hardener component) 100 100 100 100 100 100 100 100 100 Evaluation of thermal conductivity (W/nrK) 0.9 1.1 1.5 1.7 1.9 2.8 0.6 3.4 3.2 Oven heat resistance (1 hour) (°C) 220 220 220 220 220 220 220 210 200 Knot drilling processability (wearing) Rate) (%) 77 81 80 84 88 91 71 100 100 Fruit drilling processability (evaluation) 〇〇〇〇〇Δ 〇XX Flame retardancy (UL-94) 〇〇〇〇〇〇〇〇〇 (Examples 27 to 32, Comparative Example 10) As the component (C) in Example 9, a plurality of aluminas having different average particle diameters were used. particle. Other than this, it is the same as that of the embodiment 9. Regarding the obtained laminated sheet with the copper foil attached, the same evaluation as above was carried out. The results are shown in Table 4 below.

S 30 201134671S 30 201134671

(貫施例33〜46、比較例11〜13 ) 與實施例1〜14以及比較例1〜3相同，在熱硬化性樹 脂清漆^ φ » ’相對於熱硬化性樹脂100體積份，按表5所示 —西己 —里調配無機充填材，並使其均勻地分散。將調配有 31 201134671 該無機充填材之熱硬化性樹脂清漆與上述說明相同地浸潰 至玻璃不織布中’獲得不織布層用預浸材料。另一方面， 藉由將上述熱硬化性樹脂清漆不調配充填材地浸潰至（每 平方公尺）克重為200 g/m2、厚度為18〇 μηι的玻璃布（織 布）（日東纺（股）(Nitto Boseki Co., Ltd.)製造的 7628)中， 獲知織布層用預浸材料。並且，將兩片不織布層用預浸材 料重疊’在其兩外表面，分別依次載置一片織布層用預浸 材料以及厚度為〇ol8mm的銅箔，獲得積層體。將該積層 體夾持在兩片金屬板之間，藉由在溫度為18(TC，壓力為 〇.3kPa(3〇kgf/m2)之條件下加熱成型，而獲得厚度為j 〇 mm的貼有鋼箔的複合積層板。關於所獲得之貼有銅箔的複 。積層板，進行與上述相同之評價。其結果示於下述表5。 32 201134671 比較 例13 CD CD 〇 〇 τ^Η 100.0 250.0 〇 LO CD ◦ r~H LO CO C3 Ο 03 ο CZ5 τ-Ή X 〇 比較 例12 50.0 100.0 100.0 200.0 〇 LO 寸 Ο ο LO CO 〇&gt; cz&gt; (Nl CO cr&gt; &lt; 〇 比較 例11 CD ΙΟ CsJ CD ΙΟ οα C5 cS &lt;zi ο &lt;=&gt; 卜 &lt;=i CD CNI Csl Οί 寸 〇 〇 實施 例46 CZ3 &lt;=&gt; 100.0 100.0 CD cr&gt; o 03 〇 ο ο t· &lt; LO 〇6 &lt;N1 CO oo 〇 〇 CT) d 103.7 103.7 142.6 s CO ο ο CO CD oa CO 寸 oo 〇 〇 實施 例44 c=&gt; cr&gt; CT) ΟΟ ΟΟ 〇6 oo 122.2 &lt;=&gt; ο &lt;=&gt; ι—Ι 卜 οά &lt;=&gt; 03 (Nl CO oo 〇 〇 實施 例43 cr&gt; ci 80.0 O CD OO 110.0 CSI ο ο LO C^* CD OO CNI oa oo 〇 〇 實施 例42 o cr&gt; τ-Η CO OO ，、&lt; CO CD LO oa CD ο »&quot; Η CO C&lt;J cr&gt; oa &lt;NI S 〇 〇 «yP — CD CD ο ο &lt;=&gt; cz&gt; 70.0 n C&lt;i &lt;=&gt; ο ι«Η t—H oi OJ LO 〇 〇 實施 例40 &lt;=&gt; CD ο- cd CO 66.7 66.7 &lt;z&gt; ο C5 CN3 o CsJ (Nl CO 〇 〇 實施 例39 &lt;=&gt; C3 60.0 60.0 60.0 o oo τ-Η &lt;=&gt; ο 1—Η 1 &lt; o oa 03 〇 〇 實施 例38 o Q CO CO LO 53.3 53.3 § 1 &lt; C3 CD 卜 1—i CD &lt;NI C&lt;I LO CO 〇 〇 實施 例37 52.5 ΙΛ c&gt;i LO 22.5 to csi 03 CD LO i 4 ο ο 1—Η CO CD 03 C&lt;J CO CO 〇 〇 CO V? CO 49.0 CD ai 寸 21.0 〇 导 r-H ο ◦ ι-Η 寸 1—H CD &lt;NJ Csi OO LO 〇 〇 實施 例35 42.0 cz&gt; oi 寸 〇 od 18.0 &lt;z&gt; C&lt;i cz&gt; ο oa 〇 C&lt;I oa 〇 〇 實施 例34 31.5 LO t 1 CO 13.5 in CO t—H § ο ο j—i 1 t o c&gt;a cvj CO LO 〇 〇 實施 例33 28.0 28.0 CD &lt;&gt;i i—H CD oi CD &lt;r? τ-Η CD CZ) 〇&gt; CN! oa s 〇 〇 實施例、比較例編號 S#co K 〇0 · 'Ί ^ ^ q2 J 一㈣一 (B)勃姆石粒子 (Ds〇:3. 0 ^m) (c)氧化鋁粒子 (Ds〇:0. 5 無機充填材 的合計量 Aim 咬 ·ΰΐ 每Φ •ul 21 ^ $铼 哿Φ犮 癍噠伞 熱傳導率（W/irK) 烘箱耐熱性 (1 小時）（°c) 鑽孔加工性 (磨耗率）（％) 鑽孔加工性 (評價） 阻燃性（UL-94) 锾_戚与荜璁荽睬♦!韜 ^ 評價 結果 1 CO m 201134671 (實施例47〜52、比較例14〜16) 作為實施例33〜46以及比較例u〜13中的（B)成分， 使用了與上述相同之滑石（DM : 5 μιη )來代替勃姆石粒子。 除此之外’與實施例3 3〜46以及比較例丨丨〜丨3相同。關 於所獲得之貼有銅箔的複合積層板，進行與上述相同之評 彳貝。其結果不於下述表6。 [表6] 實施 例 、比較例編號 實施 例47 實施 例48 實施 例49 實施 例50 實施 例51 實施 例诏 比較 例14 比較 例15 比較 例Ifi 不織 布廣 用熱 硬化 性樹 脂組 成物 的調 配量 (體 積 份） 機 充 填 材 CA)二水銘石型氫氣化 鋁粒子（DM:5.4 ίζηΟ 31.5 49 0 0 0 0 25 50 0 (Α)三水鋁石型氫氧化 銘粒子（Ds〇:12.6 “m) 31.5 49 60 70 80 100 25 100 100 (β)滑石（D5q:5 13.5 21 60 90 80 100 10 100 100 氧化鋁粒子（d50 : 0.5 仁m) 13.5 21 60 70 110 200 10 200 250 無機充填材的合計量 90 140 180 230 270 400 70 450 450 熱硬化性樹脂（樹脂成分與 硬化劑成分的合計量） 100 100 100 100 100 100 100 100 100 評 價 結 果 ^傳導率（W/m-K) 0.9 1.2 1.6 1.8 2.1 3 0.6 3.1 3.2 烘箱耐熱性（1小時）（°c) 220 220 220 220 220 220 220 210 200 鑽孔加工性（磨耗率）（〇/〇) 76 82 85 90 92 94 72 100 100 鑽孔加工性（評價） _ 〇 〇 〇 Δ Δ △ 〇 X X 阻燃性（UL-94) 〇 〇 〇 〇 〇 〇 〇 〇 〇 (實施例5 3〜5 8、比較例17〜19 ) 作為實施例3 3〜4 6以及比較例1 1〜1 3中的（B )成分， 使用了與上述相同之二氧化矽（Dw : 5 μπι)來代替勃姆石 粒子。除此之外，與實施例3 3〜4 6以及比較例1 1〜13相 同。關於所獲得之貼有銅箔的複合積層板，進行與上述相 34 201134671 同之評價。其結果示於下述表7。 [表7] 實施例 、比較例編號 貧施 例53 實施 例54 實施 例55 實施 例56 實施 例57 實施 例58 比較 例17 比較 例18 比較 例19 不織 布層 無 機 (A)三水鋁石型氫氧化 紹粒子（D5〇:5. 4 /zm) 31.5 49 0 0 0 0 25 50 0 用熱 硬化 充 填 (A)三水鋁石型氫氧化 铭粒子 〇&gt;5。：12. 6 Atm) 31.5 49 60 70 80 100 25 100 100 性樹 脂組 成物 的調 配量 (體 材 (B)二氧化矽（Dm:5 nm) 13.5 21 60 90 80 100 10 100 100 (d)氧化銘粒子 (Ds〇：0. 5 //m) 13.5 21 60 70 110 200 10 200 250 無機充填材的合計量 90 140 180 230 270 400 70 450 450 積 份） 热硬化性樹脂（樹脂成分與 硬化劑成分的合計量）、 100 100 100 100 100 100 100 100 100 評 簿導率（W/in.K) 0.9 1.1 1.5 1.7 1.9 2.8 0.6 3.4 3.2 價 烘箱耐熱性（1小時）（〇C)] *孔加1性（評價^ MliTULl?)--- 220 220 220 220 220 220 220 210 200 結 果 81 83 86 88 89 93 76 100 100 〇 〇 〇 〇 〇 Δ 〇 X X 〇 〇 〇 〇 〇 〇 〇 〇 〇 (貫施例59〜64、比較例20 ) 作為實施例41中的（C )成分，使用了平均粒徑不同 之複數種氧化紹粒子。除此之外，與實施例4丨相同。關於 所獲得之貼有銅箔的複合積層板，進行與上述相同之評 價。其結果示於下述表8。(Examples 33 to 46, Comparative Examples 11 to 13) In the same manner as in Examples 1 to 14 and Comparative Examples 1 to 3, in the thermosetting resin varnish ^ φ » ' with respect to 100 parts by volume of the thermosetting resin, 5 shows that the inorganic filler is blended and dispersed uniformly. The thermosetting resin varnish of the inorganic filler was blended into the glass nonwoven fabric in the same manner as described above, and the prepreg for the nonwoven fabric layer was obtained. On the other hand, the above-mentioned thermosetting resin varnish is impregnated to a filling material (per square meter) of a glass cloth (woven fabric) having a basis weight of 200 g/m 2 and a thickness of 18 μm. (7628) manufactured by Nitto Boseki Co., Ltd., a prepreg for a woven fabric layer was known. Further, two non-woven fabric layers were superposed on each other on the outer surface of the nonwoven fabric layer, and a prepreg for the woven fabric layer and a copper foil having a thickness of 8 mm were sequentially placed on the outer surfaces of the two nonwoven fabric layers to obtain a laminate. The laminated body is sandwiched between two metal plates, and is heat-molded at a temperature of 18 (TC, pressure of 3.3 kPa (3 〇 kgf/m 2 ) to obtain a paste having a thickness of j 〇 mm. A composite laminated board having a steel foil. The same evaluation as above was carried out regarding the obtained laminated copper foil-clad laminate. The results are shown in Table 5 below. 32 201134671 Comparative Example 13 CD CD 〇〇τ^Η 100.0 250.0 〇LO CD ◦ r~H LO CO C3 Ο 03 ο CZ5 τ-Ή X 〇Comparative Example 12 50.0 100.0 100.0 200.0 〇LO Ο ο LO CO 〇&gt;cz&gt; (Nl CO cr&gt;&lt; 〇Comparative example 11 CD ΙΟ CsJ CD ΙΟ οα C5 cS &lt;zi ο &lt;=&gt;卜&lt;=i CD CNI Csl Οί inch 〇〇 Example 46 CZ3 &lt;=&gt; 100.0 100.0 CD cr&gt; o 03 〇ο ο t · &lt; LO 〇6 &lt;N1 CO oo 〇〇CT) d 103.7 103.7 142.6 s CO ο ο CO CD oa CO 寸 oo 〇〇 Example 44 c=&gt;cr&gt; CT) ΟΟ ΟΟ 〇 6 oo 122.2 &lt;=&gt; ο &lt;=&gt; ι—Ι Buοά &lt;=&gt; 03 (Nl CO oo 〇〇 Example 43 cr&gt; ci 80.0 O CD OO 110.0 CSI ο ο LO C^* CD OO CNI oa oo 〇 〇 Embodiment 42 o cr&gt; τ-Η CO OO ,, &lt; CO CD LO oa CD ο »&quot; Η CO C&lt;J cr&gt; oa &lt;NI S 〇〇«yP — CD CD ο ο &lt;=&gt;Cz&gt; 70.0 n C&lt;i &lt;=&gt; ο ι«Η t-H oi OJ LO 〇〇Example 40 &lt;=&gt; CD ο- cd CO 66.7 66.7 &lt;z&gt; ο C5 CN3 o CsJ (Nl CO 〇〇 Example 39 &lt;=&gt; C3 60.0 60.0 60.0 o oo τ-Η &lt;=&gt; ο 1 - Η 1 &lt; o oa 03 〇〇 Example 38 o Q CO CO LO 53.3 53.3 § 1 &lt C3 CD Bu 1-i CD &lt;NI C&lt;I LO CO 〇〇Example 37 52.5 ΙΛ c&gt;i LO 22.5 to csi 03 CD LO i 4 ο ο 1—Η CO CD 03 C&lt;J CO CO 〇〇 CO V? CO 49.0 CD ai inch 21.0 rrH ο ◦ ι-Η inch 1-H CD &lt;NJ Csi OO LO 〇〇Example 35 42.0 cz&gt; oi inch od 18.0 &lt;z&gt;C&lt;icz&gt; ο oa 〇C&lt;I oa 〇〇Example 34 31.5 LO t 1 CO 13.5 in CO t—H § ο ο j—i 1 to c&gt;a cvj CO LO 〇〇Example 33 28.0 28.0 CD &lt;&gt; —H CD oi CD &lt;r? τ-Η CD CZ) 〇&gt; CN! oa s 〇〇Example, comparison example number S#co K 〇0 · 'Ί ^ ^ q2 J One (four) one (B) Boehmite particles (Ds〇: 3. 0 ^m) (c) Alumina particles (Ds〇:0. 5 inorganic filler Total Aim bite · ΰΐ per Φ • ul 21 ^ $ 铼哿 Φ 犮癍哒 umbrella thermal conductivity (W / irK) oven heat resistance (1 hour) (°c) drilling processability (wear rate) (%) Hole processing property (evaluation) Flame retardancy (UL-94) 锾 戚 荜璁荽睬 荜璁荽睬 韬 韬 评价 评价 评价 评价 评价 评价 评价 评价 CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO In the 46 (B) and the components (B) in Comparative Examples u to 13, the same talc (DM: 5 μιη) as described above was used instead of the boehmite particles. Other than the above, it is the same as Examples 3 to 46 and Comparative Examples 丨 to 丨3. Regarding the obtained composite laminate with copper foil obtained, the same evaluation mussels as above were carried out. The results are not shown in Table 6 below. [Table 6] Examples, Comparative Examples No. Example 47 Example 48 Example 49 Example 50 Example 51 Example 诏 Comparative Example 14 Comparative Example 15 Comparative Example Ifi The amount of the thermosetting resin composition widely used for nonwoven fabrics ( Volume) Machine Filling Material CA) Dihydrate Mingshi Type Hydrogenated Aluminum Particles (DM: 5.4 ζ Ο Ο 31.5 49 0 0 0 0 25 50 0 (Α) gibbsite type hydroxide particles (Ds〇: 12.6 “m 31.5 49 60 70 80 100 25 100 100 (β) talc (D5q: 5 13.5 21 60 90 80 100 10 100 100 Alumina particles (d50: 0.5 ren m) 13.5 21 60 70 110 200 10 200 250 Inorganic filling materials Total quantity 90 140 180 230 270 400 70 450 450 Thermosetting resin (total amount of resin component and hardener component) 100 100 100 100 100 100 100 100 100 Evaluation results ^ Conductivity (W/mK) 0.9 1.2 1.6 1.8 2.1 3 0.6 3.1 3.2 Oven heat resistance (1 hour) (°c) 220 220 220 220 220 220 220 210 200 Drilling processability (wear rate) (〇/〇) 76 82 85 90 92 94 72 100 100 Drilling processability (Evaluation) _ 〇〇〇Δ Δ △ 〇 XX Flame retardancy UL-94) 〇〇〇〇〇〇〇〇〇 (Examples 5 3 to 5 8 , Comparative Examples 17 to 19) As Examples (3) in Examples 3 3 to 4 6 and Comparative Examples 1 to 1 3 The same cerium oxide (Dw: 5 μπι) as described above was used instead of the boehmite particles, and the same procedures as in Examples 3 3 to 4 6 and Comparative Examples 1 to 13 were used. The composite laminate having a copper foil was evaluated in the same manner as the above-mentioned phase 34 201134671. The results are shown in the following Table 7. [Table 7] Examples, Comparative Examples No. Example 53 Example 54 Example 55 Example 56 Example 57 Example 58 Comparative Example 17 Comparative Example 18 Comparative Example 19 Non-woven layer inorganic (A) gibbsite-type hydroxide particles (D5 〇: 5. 4 /zm) 31.5 49 0 0 0 0 25 50 0 Hot hardening filling (A) gibbsite type hydroxide hydroxide particles 〇 &gt; 5. :12. 6 Atm) 31.5 49 60 70 80 100 25 100 100 Resin composition (body (B) cerium oxide (Dm: 5 nm) 13.5 21 60 90 80 100 10 100 100 (d) Oxidation Ming particles (Ds〇:0. 5 //m) 13.5 21 60 70 110 200 10 200 250 Total amount of inorganic fillers 90 140 180 230 270 400 70 450 450 parts) Thermosetting resin (resin component and hardener) Total amount of ingredients), 100 100 100 100 100 100 100 100 100 Bookkeeping rate (W/in.K) 0.9 1.1 1.5 1.7 1.9 2.8 0.6 3.4 3.2 Price oven heat resistance (1 hour) (〇C)] * Hole Add 1 (evaluation ^ MliTULl?)--- 220 220 220 220 220 220 220 210 200 Result 81 83 86 88 89 93 76 100 100 〇〇〇〇〇Δ 〇XX 〇〇〇〇〇〇〇〇〇 Examples 59 to 64, Comparative Example 20) As the component (C) in Example 41, a plurality of kinds of oxidized particles having different average particle diameters were used. Except for this, it is the same as that of Embodiment 4. Regarding the obtained composite laminate with copper foil obtained, the same evaluation as above was carried out. The results are shown in Table 8 below.

S 35 201134671 [表8] 實施1 对、比較例編號 實施 例59 實施 例60 實施 例61 實施 例62 實施 例63 實施 例64 比較 例20 不織 布層 用熱 硬化 性樹 脂組 成物 的調 配量 (體 積 份） 無 機 充 填 材 &lt;A；二水鋁石型氫氧化鋁 粒子（Dm:5. 4 “πΟ 0 0 0 0 0 0 0 CΑ)三水鋁石型氫氧化鋁 粒子 d 12. 6 em) 70 70 70 70 70 70 70 勡姆石粒子（Dm:3.〇 //m) 90 90 90 90 90 90 90 cc)氧化鋁粒子（Dm:0 2 Mm) 70 0 0 0 0 0 0 cc)氧化鋁粒子（1)5。:0 4 ^m) 0 70 0 0 0 0 0 CC)氧化鋁粒子（])5。:〇 6 /zm) 0 0 70 0 0 0 0 CC)氧化鋁粒子（dm:〇 8 Um) 0 0 0 70 0 0 0 CC)氧化鋁粒子（d5。:i 2 /zm) 0 0 0 0 70 0 0 CC)氧化鋁粒子（Dm:1 5 //m) 0 0 0 0 0 70 0 CC)氧化鋁粒子（d5():2,〇 βπι) 0 0 0 0 0 0 70 無機充填材的合計量 230 230 230 230 230 230 230 热戌化性樹脂（樹脂成分與硬 _ 化劑成分的合計量） 100 100 100 100 100 100 100 評 價 結 果 熱傳導率（W/m.K) 1.8 2 2.1 2.1 2.2 2.2 2.4 ，箱耐熱性（1小時） 220 220 220 220 220 220 220 鑕孔加工性（磨耗率） 68 70 75 77 86 90 100 鑽孔加工性（評價） 〇 〇 〇 〇 〇 〇 X 阻燃性_(UL-94) 〇 〇 〇 〇 〇 〇 〇 (實施例65〜68、比較例2 1、22 ) 藉由將含有氫氧化鋁（住友化學（股）製造，D5〇: 4.3 μιη) 之熱硬化性樹脂清漆浸潰至玻璃布中，而使用含有氫氧化 紹之織布層用預浸材料，來代替實施例41中的不含充填材S 35 201134671 [Table 8] Embodiment 1 Pair, Comparative Example No. Example 59 Example 60 Example 61 Example 62 Example 63 Example 64 Comparative Example 20 Formulation amount (volume part) of thermosetting resin composition for nonwoven fabric layer Inorganic filler material &lt;A; gibbsite-type aluminum hydroxide particles (Dm: 5.4 "πΟ 0 0 0 0 0 0 0 CΑ) gibbsite-type aluminum hydroxide particles d 12. 6 em) 70 70 70 70 70 70 70 勡石石颗粒(Dm:3.〇//m) 90 90 90 90 90 90 90 cc) Alumina particles (Dm: 0 2 Mm) 70 0 0 0 0 0 0 cc) Alumina Particles (1) 5::0 4 ^m) 0 70 0 0 0 0 0 CC) Alumina particles (]) 5: 〇6 /zm) 0 0 70 0 0 0 0 CC) Alumina particles (dm: 〇8 Um) 0 0 0 70 0 0 0 CC) Alumina particles (d5.: i 2 /zm) 0 0 0 0 70 0 0 CC) Alumina particles (Dm: 1 5 //m) 0 0 0 0 0 70 0 CC) Alumina particles (d5(): 2, 〇βπι) 0 0 0 0 0 0 70 Total amount of inorganic fillers 230 230 230 230 230 230 230 Thermally degradable resin (resin composition and hardening Total amount of ingredients) 100 100 100 100 100 100 100 Evaluation results Thermal conductivity (W /mK) 1.8 2 2.1 2.1 2.2 2.2 2.4, heat resistance of the box (1 hour) 220 220 220 220 220 220 220 Boring processability (wear rate) 68 70 75 77 86 90 100 Drilling processability (evaluation) 〇〇〇 〇〇〇X flame retardancy_(UL-94) 〇〇〇〇〇〇〇 (Examples 65 to 68, Comparative Example 2 1, 22) by containing aluminum hydroxide (Sumitomo Chemical Co., Ltd., D5) 〇: 4.3 μιη) of the thermosetting resin varnish was impregnated into the glass cloth, and the prepreg containing the woven fabric layer containing the hydroxide was used instead of the filler-free material in Example 41.

S 36 201134671 之織布層用預浸材料。除此之外，與實施例41相同。關於 所獲得之貼有銅箔的複合積層板，進行與上述相同之評 價、耐追蹤性評價以及表面突起評價。其結果示於下述表 9 〇 〈耐追蹤性〉 耐追蹤性試驗係遵照標準IEC60112第 4版（JIS C2134 )而進行。並且，藉由根據對比電弧徑跡指數 (Comparative Tracking Index，CTI )而得出之評價來求出 最大電壓。 〈表面突起〉 觀察所獲得之貼有銅羯的複合積層板的表面。並且， 將具有基本上不會在成形上以及實際應用上造成問題之表 面突起之複合積層板標注為〇，將具有在成形上或者實際 應用上會輕微產生問題之複合積層板標注為X。 [表9] 實施例 、比較例編號 實施 例65 實施 例66 實施 例67 實施 例68 比較 例21 比較 例22 不織布 層用熱 無 機 (A)三水鋁石型氫氧化鋁粒子 (Ds〇:5. 4 /zm) 0 0 0 0 0 0 硬化性 樹脂組 充 填 (A)三水鋁石型氫氧化鋁粒子 (1&gt;5。:12.6 &quot;m) 70 70 70 70 70 70 成物的 調配量 (體積 材 (B)勃姆石粒子（1)50:3· 0 /zm) 90 90 90 90 90 90 (C)氧化銘粒子（D5〇:0. 5 /im) 70 70 70 70 70 70 份） 無機充填材的合計量 230 230 230 230 230 230 熱硬化性樹脂（樹脂成分與硬化劑 成分的合計量） 100 100 100 100 100 100 相對於織布層熱硬化性樹脂100體積份 之氫氧化鋁的調配量（體積份） 25 50 100 150 0 180Pre-impregnated material for woven layers of S 36 201134671. Other than that, it is the same as that of the embodiment 41. Regarding the obtained composite laminated plate with a copper foil obtained, the same evaluation, tracking resistance evaluation, and surface protrusion evaluation as described above were carried out. The results are shown in the following Table 9 〈 <Traceability Resistance> The tracking resistance test was carried out in accordance with the standard IEC 60112, 4th edition (JIS C2134). Further, the maximum voltage was obtained by evaluation based on a comparative tracking index (CTI). <Surface Protrusion> The surface of the obtained composite laminate with the copper beryllium was observed. Further, a composite laminate having surface protrusions which are substantially not problematic in forming and practical application is denoted by 〇, and a composite laminate having slight problems in forming or practical use is denoted as X. [Table 9] Examples, Comparative Examples No. Example 65 Example 66 Example 67 Example 68 Comparative Example 21 Comparative Example 22 Thermal inorganic (A) gibbsite-type aluminum hydroxide particles for a nonwoven fabric layer (Ds〇: 5 . 4 /zm) 0 0 0 0 0 0 The curable resin group is filled with (A) gibbsite-type aluminum hydroxide particles (1&gt;5.:12.6 &quot;m) 70 70 70 70 70 70 (Volume material (B) Boehmite particles (1) 50:3·0 /zm) 90 90 90 90 90 90 (C) Oxidized particles (D5〇:0. 5 /im) 70 70 70 70 70 70 parts ) Total amount of inorganic fillers 230 230 230 230 230 230 Thermosetting resin (total amount of resin component and hardener component) 100 100 100 100 100 100 100 parts by volume of aluminum hydroxide with respect to woven layer thermosetting resin Formulation amount (volume parts) 25 50 100 150 0 180

S 37 201134671 評 價 結 果 熱傳導率（W/nrK) 2.2 2.1 2.3 2.0 2.2 烘箱耐熱性（1小時）（°c) 220 220 220 220 220 220 鑽孔加工性（磨耗率）（％) 66 71 70 68 64 73 鑽孔加工性（評價） 〇 〇 〇 〇 〇 o'· 阻燃性（UI-94) 〇 〇 〇 〇 〇 耐追蹤性 590 620 610 620 560 610 表面突起 〇 〇 〇 〇 〇 X (比較例23〜30 ) 比較例23〜26，除了使（A)成分、（B )成分及（c ) 成分之調配比如表10所示般以外，係與實施例1相同地獲 得貼有銅箔的積層板。比較例27〜30，除了使（A )成分、 (B)成分及（C)成分之調配比如表10所示般以外，係 與實施例3 3相同地獲得貼有銅箔的複合積層板。關於所獲 得之貼有鋼箔的積層板以及貼有銅箔的複合積層板，進行 與上述相同之評價。其結果示於下述表10。各實施例以及 比較例的（A )成分、（B )成分及（C )成分之調配比如 下所示。 比較例23及27: (A)成分：（B)成分：（c)成分 =1 ： 4.3 ： 2.3 比較例24及28: (A)成分：（B)成分：（c)成分 =1 : 0 ： 0.44 比較例25以及29 : ( A)成分：（b )成分：（c )成 分=1 : 3 : 4.3 比較例26及30: (A)成分：（B)成分：（c)成分 =1 : 0.56 : 〇S 37 201134671 Evaluation results Thermal conductivity (W/nrK) 2.2 2.1 2.3 2.0 2.2 Oven heat resistance (1 hour) (°c) 220 220 220 220 220 220 Drilling processability (wear rate) (%) 66 71 70 68 64 73 Drilling Processability (Evaluation) 〇〇〇〇〇o'· Flame Retardancy (UI-94) 〇〇〇〇〇 Traceability 590 620 610 620 560 610 Surface protrusion 〇〇〇〇〇X (Comparative Example 23 ～30) In Comparative Examples 23 to 26, a laminate in which a copper foil was attached was obtained in the same manner as in Example 1 except that the components (A), (B), and (c) were blended as shown in Table 10. . In Comparative Examples 27 to 30, a composite laminated plate with a copper foil attached thereto was obtained in the same manner as in Example 3 except that the components (A), (B) and (C) were blended as shown in Table 10. The laminates with the steel foil obtained and the composite laminate with the copper foil obtained were evaluated in the same manner as above. The results are shown in Table 10 below. The blending of the component (A), the component (B) and the component (C) in each of the examples and the comparative examples is as follows. Comparative Examples 23 and 27: (A) Component: (B) Component: (c) Component = 1: 4.3 : 2.3 Comparative Examples 24 and 28: (A) Component: (B) Component: (c) Component = 1 : 0 : 0.44 Comparative Examples 25 and 29: (A) Component: (b) Component: (c) Component = 1: 3 : 4.3 Comparative Examples 26 and 30: (A) Component: (B) Component: (c) Component = 1 : 0.56 : 〇

S 38 201134671 丄u」 實施例、比較例編號 比較 例23 比較 例24 比較 例25 比較 例26 比較 例27 比較 例28 比較 例29 比較 例30 不織 布層 無 機 (A)三水鋁石型氫氧化 铭粒子（1)50:5. 4 μπι) 0 0 0 0 0 0 U U 用熱 硬化 充 填 (Α)三水鋁石型氫氧化 銘粒子（Dse:12.6 /zm) 30 160 30 160 30 160 30 160 性樹 脂組 材 (B)勃姆石粒子 (D5〇：3. 0 jum) 130 0 90 90 130 0 90 90 成物 的調 配量 (體 (C)氧化鋁粒子 (D5〇:0. 5 ^m) 70 70 130 0 70 70 130 0 無機充填材的合計量 230 230 230 230 230 230 230 230 積 份） 熱硬化性樹脂（樹脂成分與 硬化劑成分的合計量） 100 100 100 100 100 100 100 100 熱傳導率（W/m.K) 」 2.1 2.1 2.9 1.5 1.9 1.9 2.6 1.4 〇T 價 烘箱耐熱性（1小時）（) 220 200 220 180 220 200 220 180 結 鑽孔加工性（磨耗率）（％) 100 69 100 67 100 74 100 76 来 鑽孔加工性（評價） X 〇 X 〇 X 〇 X 〇 阻燃性（UL-94) 〇 〇 〇 〇 〇 〇 〇 〇 比較例26及30合 微來 t分（ C) 的調 配量 減少 ，因 此’僅為平均粒徑較大之無機充填材，最終難以進行高充 填’存在成形性降低之傾向。因此，比較例26及30與其 他實施例或比較例相比，成形性會惡化。 (實施例69〜78、比較例3 1〜33 ) 除了將酚化合物（苯酚酚醛清漆樹脂）用作硬化劑成 分’並且’使無機充填材的調配比如表丨丨所示般以外，係 與實施例1相同地形成貼有銅箔的積層板。關於所獲得之 貼有鋼箱的積層板，進行與上述相同之評價。其結果示於 下述表11。再者，係使用與上述相同之滑石和二氧化矽， 並刀別使用啟和爐材（股）（Keiwa Rozai Co.，Ltd.)製造 的〇5〇為5 μιη的高嶺土、以及和光純藥工業（股）（wakoS 38 201134671 实施u" Example, Comparative Example No. Comparative Example 23 Comparative Example 24 Comparative Example 25 Comparative Example 26 Comparative Example 27 Comparative Example 28 Comparative Example 29 Comparative Example 30 Non-woven layer inorganic (A) gibbsite-type hydroxide Particles (1) 50: 5. 4 μπι) 0 0 0 0 0 0 UU Filling (Α) gibbsite type hydroxide particles with heat hardening (Dse: 12.6 /zm) 30 160 30 160 30 160 30 160 Resin component (B) Boehmite particles (D5〇: 3. 0 jum) 130 0 90 90 130 0 90 90 Formulation amount of the product (body (C) alumina particles (D5〇: 0. 5 ^m) 70 70 130 0 70 70 130 0 Total amount of inorganic fillers 230 230 230 230 230 230 230 230 parts) Thermosetting resin (total amount of resin component and hardener component) 100 100 100 100 100 100 100 100 Thermal conductivity (W/mK) ” 2.1 2.1 2.9 1.5 1.9 1.9 2.6 1.4 〇T price oven heat resistance (1 hour) () 220 200 220 180 220 200 220 180 knot drilling processability (wear rate) (%) 100 69 100 67 100 74 100 76 Drilling processability (evaluation) X 〇X 〇X 〇X 〇Flame retardance (UL-94) 〇〇〇〇 〇 〇 〇 〇 In Comparative Examples 26 and 30, the amount of the component (C) is reduced. Therefore, it is only an inorganic filler having a large average particle diameter, and it is difficult to achieve high filling in the end. Therefore, in Comparative Examples 26 and 30, the formability was deteriorated compared with the other examples or comparative examples. (Examples 69 to 78, Comparative Examples 3 to 33) In addition to the use of a phenol compound (phenol novolak resin) as a hardener component 'and 'the formulation of the inorganic filler is as shown in the table, In Example 1, a laminate having a copper foil attached thereto was formed in the same manner. Regarding the obtained laminated board to which the steel box was attached, the same evaluation as above was carried out. The results are shown in Table 11 below. Further, the same talc and cerium oxide as described above were used, and 〇5〇, 5 μιη of kaolin, and Wako Pure Chemical manufactured by Keiwa Rozai Co., Ltd. were used. Industry (stock) (wako

Pure Chemical Industries，Ltd.)製造的 D5〇 為 5 μιη 的氧化 鈦（銳銀礦型）。 39 201134671 Γ-~1 比較 例33 〇 CZ&gt; Ο τ*Ή cz&gt; ο 1—&lt; c=» cr&gt; C3 CD 〇 LO cq hyou CD cr&gt; t—4 寸 寸· 〇 寸 CNI CD CT) X 〇 比較 例32 S ο ο 1 ( CD CD cz&gt; CD C3 〇 o s m 寸 &lt;=&gt; &lt;z&gt; r-H LO 寸· &lt;=&gt; 寸 CNJ 宕 &lt; 〇 比較 例31 LO οα m οα C5 〇 cr&gt; 〇 &lt;=&gt; S r—H c£ CD CO &lt;NI CO 寸 〇 〇 實施 例78 cz&gt; ο cz&gt; CD CD § o o CO Osl c=&gt; c=&gt; r—) &lt;=&gt; oi 03 LO OO 〇 〇 實施 例77 &lt;=&gt; ο 〇&gt; &lt;z&gt; 〇 o c=&gt; CO &lt;&gt;a &lt;3&gt; cr&gt; r—&lt; &lt;=&gt; c&lt;5 导 C&lt;I CO 〇〇 〇 〇 實施 例76 ο ο CD &lt;=&gt; s C5 cz&gt; o o CO (NI C3&gt; CD r &lt; CD CN1’ CD 寸 (NJ LTD OO 〇 〇 實施 例75 ο ο CD § cz? CD &lt;z&gt; o 另 og CD c=&gt; r-H CTi 1 &lt;=&gt; oa CO OO 〇 〇 實施 例74 CD ο &lt;=&gt; CD &lt;=&gt; ◦ C3 cr&gt; &lt;z&gt; c=&gt; &lt;=&gt; CSI cr&gt; 寸 c=&gt; cz&gt; r—♦ 寸 03 LO oo 〇 〇 實施 例73 c=&gt; § § c=&gt; &lt;z&gt; CD o t—H T—^ C&lt;! c=&gt; o y i 卜 oi &lt;r&gt; CV3 〇 〇 實施 例72 〇&gt; § CD 〇 cz&gt; 〇 CO oa &lt;z&gt; c=? r-H L〇 csi CD 寸 CS3 Γ ) 〇 〇 實施 例71 ο § § C5 o CD s &lt;=&gt; oo CD &lt;r? r-H (Nl od 导 CO CO 〇 〇 實施 例70 0¾ 寸 CD 寸 CD &lt;r&gt; o 〇 1—H &lt;33 CD 卜 r-H o 寸 oa 〇 〇 實施 例69 L〇 LCf r-H CO 13.5 CZ5 ◦ C3 CZ5 L〇 CO 1—&lt; c=&gt; &lt;=&gt; t—1 LO o CO csi uo LO 〇 〇 ^、比較例編號 (A)三水鋁石型氫氧化鋁粒子 (Ds〇:5. 4 /zm) (A)三水鋁石型氫氧化鋁粒子 (D5〇:12. 6 um) (B)勃姆石粒子（D5〇:3.0 //in) (B)滑石（1&gt;5。：5 μm) (B)二氧化石夕（Dai:5 ym) (B)高嶺土（E&gt;5d:5 yra) (B)氧化鈦（Ds〇:5 /zm) (C)氧化紹粒子（Ι)5β:0·5 /zm) 無機充填材的合計量 \〇J 鍊 噠 Λ) 01 t=： 萆 萆兹 Jj &lt;7* -or ^ φ 熱傳導率(W/nrK) 烘箱耐熱性（1小時）（°c) 鑽孔加工性（磨耗率）（％) 鑽孔加工性（評價） 阻燃性（UL-94) 摄_癍与 寒崩荽驟_韜伞D5® manufactured by Pure Chemical Industries, Ltd. is 5 μηη of titanium oxide (sharp silver ore). 39 201134671 Γ-~1 Comparative Example 33 〇CZ&gt; Ο τ*Ή cz&gt; ο 1—&lt; c=» cr&gt; C3 CD 〇LO cq hyou CD cr&gt; t—4 inch inch 〇 inch CNI CD CT) X 〇 Comparative Example 32 S ο ο 1 (CD CD cz&gt; CD C3 〇osm inch &lt;=&gt;&lt;z&gt; rH LO inch · &lt;=&gt; inch CNJ 宕 &lt; 〇Comparative Example 31 LO οα m οα C5 〇 Cr&gt; 〇 &lt;=&gt; S r - H c £ CD CO &lt; NI CO 〇〇 〇〇 Example 78 cz&gt; ο cz&gt; CD CD § oo CO Osl c=&gt;c=&gt; r-) &lt;=&gt; oi 03 LO OO 〇〇Example 77 &lt;=&gt; ο 〇&gt;&lt;z&gt;〇oc=&gt; CO &lt;&gt;a &lt;3&gt;cr&gt;r-&lt;&lt;=&gtc&lt;5&quot;5&quot;I CO 〇〇〇〇Example 76 ο ο CD &lt;=&gt; s C5 cz&gt; oo CO (NI C3&gt; CD r &lt; CD CN1' CD inch (NJ LTD OO 〇〇 implementation Example 75 ο ο CD § cz? CD &lt;z&gt; o Another og CD c=&gt; rH CTi 1 &lt;=&gt; oa CO OO 〇〇Example 74 CD ο &lt;=&gt; CD &lt;=&gt; ◦ C3 cr&gt;&lt;z&gt;c=&gt;&lt;=&gt; CSI cr&gt; inch c=&gt;cz&gt; r-♦ inch 03 LO oo 〇〇 embodiment 73 c=&gt; § § c=&gt;&lt;z&gt; CD ot-HT-^ C&lt;! c=&gt; oyi 卜 &lt;r&gt; CV3 〇〇Example 72 〇&gt; § CD 〇cz&gt; 〇CO oa &lt;z&gt; =? rH L〇csi CD inch CS3 Γ ) 〇〇 Example 71 ο § § C5 o CD s &lt;=&gt; oo CD &lt;r? rH (Nl od Guide CO CO 〇〇 Example 70 03⁄4 inch CD inch CD &lt;r&gt; o 〇1—H &lt;33 CD 卜rH o inch oa 〇〇Example 69 L〇LCf rH CO 13.5 CZ5 ◦ C3 CZ5 L〇CO 1—&lt;c=&gt;&lt;=&gt; T-1 LO o CO csi uo LO 〇〇^, Comparative Example No. (A) gibbsite-type aluminum hydroxide particles (Ds〇: 5. 4 /zm) (A) gibbsite-type aluminum hydroxide particles (D5〇: 12. 6 um) (B) Boehmite particles (D5〇: 3.0 // in) (B) Talc (1) 5. :5 μm) (B) Dioxin (Dai: 5 ym) (B) Kaolin (E &gt; 5d: 5 yra) (B) Titanium oxide (Ds〇: 5 /zm) (C) Oxidized particles (Ι) ) 5β:0·5 /zm) Total amount of inorganic fillers \〇J chain 哒Λ) 01 t=: 萆萆兹Jj &lt;7* -or ^ φ Thermal conductivity (W/nrK) Oven heat resistance (1 Hour)(°c) Drilling processability (wear rate) (%) Drilling processability (evaluation) Flame retardancy (UL-94) Photographs _癍 and cold collapse 韬 韬 umbrella

耠蛱垅®K 201134671 (實施例79〜88、比較例34〜3 6 ) 除了將紛化合物（苯紛紛酿清漆樹脂）用作硬化劑成 分，並且，使無機充填材的調配比如表12所示般以外，係 與實施例3 3相同地形成貼有銅箔的複合積層板。關於所獲 1之貼有鋼洎的複合積層板，進行與上述相同之 。盆 結果示於 卜述表12。 201134671 比較 例36 CD 〇&gt; CT&gt; 1 ( &lt;3&gt; CD 1—Η O C5 〇 CD 〇&gt; LO 〇 L〇 寸 &lt;=&gt; c=&gt; i Η CO CO &lt;=&gt; 寸 OJ ο ο τ—Η X 〇 比較 例35 Ο LTD Ο Ο r—^ &lt;=5 CD r—Η o c=&gt; 〇&gt; C=&gt; CZ&gt; CD CO o in 寸 CD &lt;=&gt; 1 &lt; 卜 CO &lt;NI ΟΟ &lt; 〇 比較 例34 in (N1 ΙΟ οα Ο 〇&gt; CD c=&gt; c=&gt; cr&gt; CD 1 &lt; 〇〇 c=&gt; οα 〇 〇 實施 例88 o ο &lt;〇 &lt;=&gt; &lt;Z5 § CD CO (N1 &lt;=&gt; &lt;=&gt; i—H 00 1 1 &lt; 写 (&gt;3 § 〇 〇 實施 例87 o ο c=&gt; CD O § CD o cr&gt; CO C&lt;J CD CD oo t &lt; 〇 CNI 〇 〇 實施 例86 o ο &lt;=&gt; o g o C3 c=&gt; CO C&lt;I o o r—^ oo ”丨_H 写 03 § 〇 〇 實施 例85 o ο § CD O CD o CO C&lt;J &lt;=&gt; CZ&gt; i—H 00 1 &lt; σ&gt; οο 〇 〇 實施 例84 (3) &lt;=&gt; ο γ—Η CD CD ι—Ι o &lt;=) CD 〇 o CD 导 o o r-H CO oo &lt;=5 (ΝΪ ΟΟ οο 〇 〇 實施 例83 〇 § § cr&gt; cr&gt; 〇 cz&gt; &lt;=&gt; r— » Ή &lt;ΝΪ C5 &lt;=&gt; i—H c&lt;i 〇 Cs3 呀 οο 〇 〇 實施 例82 〇 Ο o c=&gt; o o &lt;=5 CO oa c=&gt; cr&gt; r—H OJ 03 导 CNI CO 〇 〇 如— ΟΟ %: ^ o § S o o o o § o 〇〇 1—H cr&gt; cr&gt; T—^ oo 1—H &lt;=) οα CO CO 〇 〇 實施 例80 CD 寸 α&gt; 寸 o CD C3 o 导 r-M cz&gt; &lt;=&gt; i 1 1 1 &lt; 〇 寸 &lt;Μ § 〇 〇 實施 例79 LO CO LO 1 1 &lt; CO LO CO »—1 cr&gt; c=&gt; c=) o LTD CO § o 0 1 '&lt; C=&gt; CO oo m LO 〇 〇 ~1U|* X) ΛΧ / ¥ (A)三水鋁石型氫氧化鋁粒子 (Ds〇:5. 4 ^m) (Α)三水鋁石型氫氧化鋁粒子 (1)50:12. 6 厚） (8)勃姆石粒子（〇5〇:3.0//111) (B)滑石（Dse:5 #m) (B)二氧化石夕（D5〇:5 ym) (B)高嶺土（D5e:5 /zm) (B)氧化欽（D5a:5 em) (〇氧化銘粒子（〇5。：0.5以111) 無機充填材的合計量 «ITt J φ 噠 i}m os? 率 萆犮 Si ^ aJ ·ς&gt; 十 -to 熱傳導率（W/nrK) 烘箱耐熱性（1小時）（°c) 鑽孔加工性（磨耗率）（％) 鑽孔加工性（評價） 阻燃性（UL-94) 碟奪Θ够本： 癍^率溴荽蓀ΦΊ韜 ^ 201134671 (實施例89〜98、比較例37〜39) 藉由第2圖所不之製造方法’連續形成貼有銅箔的複 合積層板。作為熱硬化性樹脂組成物，係使用了含有環氧 乙烯基酯樹脂、自由基聚合性不飽和單體及聚合引發劑之 熱硬化性樹脂組成物。亦即，在四口燒瓶中裝入：環氧當 量為400克/當量之四溴雙酚A型環氧樹脂（「商品名 EPICLON 153」（大日本油墨化學工業（股）（叫咖〇11恤 and Chemicals InC〇rporated，DIC)製造））4〇〇質量份；分 子量為3500,鍵結丙烯腈為27%，在羧基為【9個/分子之 丁二烯與丙烯腈的共聚物的分子兩末端具有羧基之 HYCAR CTBN 1300X13〔古立德公司（B F⑼隨⑽ CH麵CAL)製造〕92質量份；曱基丙婦酸（環氧基數量： 總叛基數量: D 82質量份；對苯二紛〇 29質量份；及 三苯基碟α.58質量份；並在UQt下進行反應。繼而，確 認酸價變為1Gmg—K〇H/g以下，添加笨乙稀309質量份。 之後’添加乙醯丙_ h32f量份，獲得環氧乙烯基醋樹月旨 成物繼而’在該環氧乙烯基自旨樹脂組成物⑽體積份 中’添加表13所示之調配比之無機充填材和過氧化苯甲酸 二級丁酯（「商品名叔丁基過氧化苯甲醯(perbutyiz)」〔曰 本油脂公司(股)(Taset〇C〇.，Ltd )製造〕）ι〇體積份，並 利用均質混合機進行均勻現合，藉此製作熱硬化性樹脂组 成物。其他構成係與實施例33相同地形成貼有銅落的複合 積層板。關於所獲得之貼 ^ 貼有鋼·冶的複合積層板，進行與上 述相同之評價。其結果示於下述表… 、耠蛱垅® K 201134671 (Examples 79 to 88, Comparative Examples 34 to 3 6 ) In addition to the use of a compound (benzene varnish resin) as a hardener component, and the formulation of the inorganic filler is shown in Table 12. A composite laminated plate to which a copper foil was attached was formed in the same manner as in Example 3 except for the above. Regarding the obtained composite laminate having the steel reinforced sheet obtained, the same as described above was carried out. The results of the pots are shown in Table 12. 201134671 Comparative Example 36 CD 〇&gt;CT&gt; 1 (&lt;3&gt; CD 1 - Η O C5 〇 CD 〇 &gt; LO 〇 L〇 inch &lt;=&gt;c=&gt; i Η CO CO &lt;=&gt; Inch OJ ο ο τ—Η X 〇Comparative Example 35 Ο LTD Ο Ο r—^ &lt;=5 CD r—Η oc=&gt;〇&gt;C=&gt;CZ&gt; CD CO o in inch CD &lt;=&gt 1 &lt; 卜CO &lt;NI ΟΟ &lt; 〇Comparative Example 34 in (N1 ΙΟ οα Ο 〇&gt; CD c=&gt;c=&gt;cr&gt; CD 1 &lt;〇〇c=&gt; οα 〇〇Implementation Example 88 o ο &lt;〇&lt;=&gt;&lt;Z5 § CD CO (N1 &lt;=&gt;&lt;=&gt; i-H 00 1 1 &lt; Write (&gt; 3 § 〇〇 Example 87 o ο c=&gt; CD O § CD o cr&gt; CO C&lt;J CD CD oo t &lt; 〇CNI 〇〇Example 86 o ο &lt;=&gt; ogo C3 c=&gt; CO C&lt;I oor-^ oo丨_H Write 03 § 〇〇Example 85 o ο § CD O CD o CO C&lt;J &lt;=&gt;CZ&gt; i-H 00 1 &lt;σ&gt; οο 〇〇 Example 84 (3) &lt;=&gt; ο γ—Η CD CD ι—Ι o &lt;=) CD 〇o CD oo rH CO oo &lt;=5 (ΝΪ ΟΟ οο 〇〇 Example 83 〇§ § cr&gt;cr&gt;〇cz&gt;&lt;;=&gt; R— » Ή &lt;ΝΪ C5 &lt;=&gt; i—H c&lt;i 〇Cs3 呀οο 〇〇Example 82 〇Ο oc=&gt; oo &lt;=5 CO oa c=&gt;cr&gt; r-H OJ 03 Guide CNI CO For example - ΟΟ %: ^ o § S oooo § o 〇〇 1 - H cr &gt; cr &gt; T - ^ oo 1 - H &lt; =) οα CO CO 〇〇 Example 80 CD inch α &gt ; inch o CD C3 o guide rM cz&gt;&lt;=&gt; i 1 1 1 &lt;〇&lt;Μ § 〇〇 Example 79 LO CO LO 1 1 &lt; CO LO CO »-1 cr&gt;c=&gt; c=) o LTD CO § o 0 1 '&lt;C=&gt; CO oo m LO 〇〇~1U|* X) ΛΧ / ¥ (A) gibbsite-type aluminum hydroxide particles (Ds〇: 5 . 4 ^m) (Α) gibbsite-type aluminum hydroxide particles (1) 50:12. 6 thick) (8) boehmite particles (〇5〇:3.0//111) (B) talc (Dse :5 #m) (B) Dioxin eve (D5〇: 5 ym) (B) Kaolin (D5e: 5 /zm) (B) Oxidized chin (D5a: 5 em) (〇 铭 ing particles (〇5. :0.5 to 111) Total amount of inorganic filler «ITt J φ 哒i}m os? rate 萆犮Si ^ aJ ·ς&gt; Ten-to thermal conductivity (W/nrK) oven heat resistance (1 hour) (°c Drilling processability (wear rate) (%) Drilling processability (evaluation) Flame retardancy (UL-94) Dish is enough for this: 癍^ rate bromine 荽荪ΦΊ韬^ 201134671 (Examples 89 to 98, Comparative Examples 37 to 39) A composite laminated plate with a copper foil attached thereto was continuously formed by the manufacturing method of Fig. 2 . As the thermosetting resin composition, a thermosetting resin composition containing an epoxy vinyl ester resin, a radical polymerizable unsaturated monomer, and a polymerization initiator is used. That is, a four-necked flask was charged with a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 400 g/eq ("trade name EPICLON 153" (Daily Ink Chemical Industry Co., Ltd.) (manufactured by Chemicals InC〇rporated, DIC))) 4 parts by mass; molecular weight 3500, bonded acrylonitrile 27%, at the carboxyl group [9 molecules per molecule of copolymer of butadiene and acrylonitrile HYCAR CTBN 1300X13 having a carboxyl group at both ends [manufactured by Gulide (B F (9) with (10) CH surface CAL)] 92 parts by mass; mercapto-propyl benzoic acid (number of epoxy groups: total number of bases: D 82 parts by mass; 29 parts by mass of benzene was used; and α.58 parts by mass of triphenylbenzene; and the reaction was carried out under UQt. Then, it was confirmed that the acid value became 1 Gmg-K〇H/g or less, and 309 parts by mass of stupid ethylene was added. Then, 'addition of acetaminophen _ h32f parts to obtain an epoxy vinyl vinegar tree and then add the inorganic content of the composition shown in Table 13 to the epoxy resin composition (10) by volume. Filling material and secondary butyl peroxybenzoate ("trade name t-butyl peroxybenzoate (perbutyiz)" [Production of 〇 油脂 油脂 Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta Ta In the same manner as in Example 33, a composite laminate having a copper drop adhered thereto was formed. The composite laminate having the obtained steel and metallurgy was subjected to the same evaluation as described above. The results are shown in the following table:

S 43 201134671 比較 例39 cz&gt; cz&gt; 〇&gt; 1 Η CD 〇 F 1 &lt; ◦ CD § CD LO CJ &lt;=&gt; 寸 ΙΟ c=&gt; 〇 1 1 LO CO o CD cva CD 〇 Ρ·&lt; X 〇 比較 例38 CD ΙΟ &lt;r&gt; 〇&gt; 1 &lt; C2&gt; Ο Η 〇 〇 § CD CD CD &lt;NJ 导 LO 〇 〇 CO &lt;=&gt; i i C&lt;J CO CT) &lt;] 〇 比較 例37 LO &lt;NI LO οα Ο CD cz&gt; 〇 〇 CD c=&gt; τ—^ CO &lt;=i s Cs3 CSI 寸 〇 〇 實施 例98 CD ο ο &lt;=&gt; &lt;=&gt; cr&gt; § &lt;NI ο ο 1—&lt; 〇〇 1—Η 〇 (Nl (Nl S5 〇 〇 實施 例97 cr&gt; ο CD CD C3 § CD 〇 CO (NJ CD CD οο r—&lt; CD oa OJ LO OO 〇 〇 實施 例96 〇 ο CD o § o o CD CO &lt;NI CD Ο ΟΟ τ—Η CD C&lt;3 oa S5 〇 〇 拍LO cr&gt; ο CD § CD cr&gt; C3 O CO (NI Ο Ο 1—Η 卜 ι1 4 s (NI S5 〇 〇 實施 例94 o ο CD r i Ο Ο ι^Η O CD CD CD O CD CD CD CO CO S CNI 寸 OO 〇 〇 實施 例93 CD g § 〇 〇 &lt;r&gt; CD 〇 i—C Cv3 CD Ο r-H 寸 οα CD CNI (Nl s 〇 〇 實施 例92 CD Ο § CD CD o o a Ο CO οα CD 〇 oi CD CvJ C&lt;1 D-- 〇 〇 實施 例91 cz&gt; § S C3 CD CD CD s § Η CT) o cz&gt; C&lt;J 寸 CO 〇 〇 實施 例90 0¾ 寸 CD 寸 〇 〇 o CD 写 ι—Η CD 〇 i—H 1 CD c&lt;\ oa LO LO 〇 〇 實施 例89 i—H CO LO ι—Η CO LO CO 1—Η C3 C3 CT&gt; LO CO i—« § 〇 CD i—H i 1 CD (&gt;a oa 〇 〇 、比較例編號 (A)三水鋁石型氫氧化鋁粒子 (Ds〇:5. 4 β\Ά) (A)三水鋁石型氫氧化鋁粒子 (1)50:12. 6 卵） (Β)勃姆石粒子（Ds〇:3.0 /zm) (B)滑石（Dsd:5 /zin) (B)二氧化石夕（Dsd:5 ym) (B)高嶺土（D5d:5 ym) (B)氧化鈦（D5〇:5 /zm) (C)氧化紹粒子（D5d:0.5 /zm) 無機充填材的合計量 冢 tfn t Φ 噠 Aim BS； 萆 柴♦! Jj -to Q Sf #: 烘箱耐熱性（1小時）（°c) 鑽孔加工性（磨耗率）（％) 鑽孔加工性（評價） 阻燃性（UL-94) ¥ 媒奪θ鹅龙 k 敖蟀焚&lt;S 43 201134671 Comparative Example 39 cz&gt;cz&gt;〇&gt; 1 Η CD 〇F 1 &lt; ◦ CD § CD LO CJ &lt;=&gt; inch ΙΟ c=&gt; 〇1 1 LO CO o CD cva CD 〇Ρ· &lt; X 〇Comparative Example 38 CD ΙΟ &lt;r&gt;〇&gt; 1 &lt;C2&gt; Ο Η 〇〇§ CD CD CD &lt;NJ Guide LO 〇〇CO &lt;=&gt; ii C&lt;J CO CT) &lt;;] 〇Comparative Example 37 LO &lt;NI LO οα Ο CD cz&gt; 〇〇CD c=&gt; τ—^ CO &lt;=is Cs3 CSI 〇〇Example 98 CD ο ο &lt;=&gt;&lt;=&gt;cr&gt; § &lt;NI ο ο 1 -&lt; 〇〇 1 - Η 〇 (Nl (Nl S5 〇〇 Example 97 cr&gt; ο CD CD C3 § CD 〇 CO (NJ CD CD οο r-&lt; CD Oa OJ LO OO 〇〇Example 96 〇ο CD o § oo CD CO &lt;NI CD Ο ΟΟ τ—Η CD C&lt;3 oa S5 LO拍LO cr&gt; ο CD § CD cr&gt; C3 O CO (NI Ο Ο 1—Η ι1 4 s (NI S5 〇〇 Example 94 o ο CD ri Ο Ο ι^Η O CD CD CD O CD CD CD CO CO S CNI inch OO 〇〇 Example 93 CD g § 〇〇&lt ;r&gt; CD 〇i-C Cv3 CD Ο rH inch οα CD CNI (Nl s 〇〇Example 92 CD Ο § CD CD ooa Ο CO οα CD 〇 oi CD CvJ C&lt;1 D-- 〇〇 Example 91 cz&gt; § S C3 CD CD CD s § Η CT) o cz&gt;C&lt;J inch CO 〇〇Example 90 03⁄4 inch CD 〇〇o CD Write ι—Η CD 〇i—H 1 CD c&lt;\ oa LO LO 〇〇Example 89 i—H CO LO ι—Η CO LO CO 1—Η C3 C3 CT> LO CO i— « § 〇CD i-H i 1 CD (&gt;a oa 〇〇, comparative example number (A) gibbsite-type aluminum hydroxide particles (Ds〇: 5. 4 β\Ά) (A) aluminum trihydrate Stone-type aluminum hydroxide particles (1) 50: 12. 6 eggs) (Β) boehmite particles (Ds〇: 3.0 /zm) (B) talc (Dsd: 5 /zin) (B) dioxide dioxide ( Dsd: 5 ym) (B) Kaolin (D5d: 5 ym) (B) Titanium oxide (D5〇: 5 /zm) (C) Oxidized particles (D5d: 0.5 /zm) Total amount of inorganic filler 冢tfn t Φ 哒Aim BS; Weichai ♦! Jj -to Q Sf #: Oven heat resistance (1 hour) (°c) Drilling processability (wear rate) (%) Drilling processability (evaluation) Flame retardancy (UL -94) ¥ Media wins θ goose dragon k 敖蟀 burning &lt;

S 201134671 【圖式簡單說明】 第1 ( a)圖係表示本發明的積層板的實施形態的一例 之面圖’第1 ( b )圖係表示其他實施形態的一例之剖面 圖。 第2圖係表示本發明的積層板的製造方法的實施形態 的一例之概略圖。 第3圖係表示本發明的led背光模組的實施形態的一 例之概略圖。 第4圖係表示本發明的led背光模組的實施形態的其 他例’ （a) 、（ b )係概略圖β 【主要元件符號說明】 1 不織布層 2 織布層 3 ' 13 金屬箔 9 浸潰有熱硬化性樹脂之玻璃織布 10 玻璃不織布 11 熱硬化性樹脂組成物 12 浸潰有熱硬化性樹脂之玻璃不織布 14 層壓輥 15 壓接物 17 加熱硬化爐 18 引導輥 19 切割機BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a) is a plan view showing an example of an embodiment of a laminated plate of the present invention. Fig. 1(b) is a cross-sectional view showing an example of another embodiment. Fig. 2 is a schematic view showing an example of an embodiment of a method for producing a laminated plate of the present invention. Fig. 3 is a schematic view showing an example of an embodiment of the LED backlight module of the present invention. Fig. 4 is a view showing another example of the embodiment of the LED backlight module of the present invention' (a) and (b) is a schematic view β [Description of main component symbols] 1 non-woven layer 2 woven layer 3 ' 13 metal foil 9 dip Glass woven fabric with thermosetting resin 10 Glass non-woven fabric 11 Thermosetting resin composition 12 Glass non-woven fabric impregnated with thermosetting resin 14 Laminating roller 15 Crimp 17 Heat curing oven 18 Guide roller 19 Cutting machine

S 45 201134671 20 LED背光模組 21 電路基板 22 LED 23 LED組件23 24 導光板 171 搬送輥S 45 201134671 20 LED backlight module 21 Circuit board 22 LED 23 LED assembly 23 24 Light guide plate 171 Transfer roller

S 46S 46

Claims (1)

201134671 七、申請專利範圍： 之不織布 1. -種積層板’其具備含有熱硬化性樹脂組成物 層，該積層板的特徵在於： 在上述熱硬化性樹脂組成物中，相對於熱硬化 100體積份，含有無機充填材8〇〜4〇〇體積份， 曰 上述無機充填材，含有： 〇50)之三水鋁石型 (A)具有2〜15 μιη的平均粒徑 氫氧化鋁粒子； (Β)至少一種無機成分’其選自由具有h5〜15 μιη 的平均粒徑（d5。）之勃姆石粒子、及具有l 5〜i5叫的 平均粒徑（Dm )且含有游離開始溫度為4〇〇β(：以上的結晶 水或者不含結晶水之無機粒子所組成之群組；以及 曰 (C)微粒子成分’其由具有15 μηι以下的平均粒徑 (D50)之氧化鋁粒子所構成； 並且，上述三水鋁石型氫氧化鋁粒子（A)、上述無機 成分（B)及上述微粒子成分（c)之調配比（體積比）為 1 : 0.1 〜3 : 〇. 1 〜3 〇 2. 如申請專利範圍第1項所述之積層板，其係在上述不 織布層的表面形成織布層而構成。 3. 如申請專利範圍第1項或第2項所述之積層板，其中： 在上述熱硬化性樹脂中，含有環氧樹脂。 5 47 201134671 4.如申請專利範圍第3項所述之積層板，其中： 在上述熱硬化性樹脂中，含有酚化合物來作為上述環 氧樹脂的硬化劑成分。 5·如申請專利範圍第1項或第2項所述之積層板，其中： 在上述熱硬化性樹脂中，含有環氧乙烯基酯樹脂、自 由基聚合性不飽和單體及聚合引發劑。 6.如申請專利範圍第i項〜第5項中任一項所述之積層 板，其中： 上述不織布層的不織布基材的黏合劑係環氧化合物。 7·如申請專利範圍第2項至第6項中任一項所述之積層 板，其中： 在上述織布層中，含有氫氧化鋁。 項所述之 . 種貼有金屬箔的積層板，其特徵在於： 係在如申請專利範圍第i項至第7項中任 積層板的至少一個表面，設置金屬箔而構成。 • 種印刷配線板’其特徵在於： 係在如申請專利範圍第i項至第7項中任一 積層板的至少一個表面’設置導體圖案而構成。 48 201134671 i〇. —種電路基板，其特徵在於： 係在如申請專利範圍第1項篦 布1喟主第7項中任一項所述之 積層板的至少一個表面，設置電路而構成。 u. —種LED背光模組，其特徵在於： 係在如申請專利範圍第i項至第7項中任一項所述之 積層板的至少一個表面，構裝LED而構成。 12. —種LED照明裝置，其特徵在於： 係在如申請專利範圍第丨項至第7項中任一項所述之 積層板的至少一個表面，構裝LED而構成。 13. —種積層板的製造方法，其一邊連續地搬送不織布基 材 邊將熱硬化性樹脂組成物浸潰至上述不織布基材 中，並且一邊連續地搬送該不織布基材，一邊在其兩個表 面將織布積層，且利用輥來壓接該積層物並進行加熱，藉 使上述熱硬化性樹脂組成物硬化，從而形成不織布層和 織布層’該積層板的製造方法的特徵在於： 在上述熱硬化性樹脂組成物中，相對於熱硬化性樹脂 1〇〇體積份’含有無機充填材8〇〜4〇〇體積份， 上述無機充填材，含有： (A)具有2〜15 μΓη的平均粒徑（〇5。）之三水鋁石型 氫氧化铭粒子； (Β)至少一種無機成分，其選自由具有ι5〜ΐ5 49 201134671 的平均粒徑（Dm)之叙 平均粒徑（d5。)且含有：板子、及具有1,5〜15 _的 .^ 有游離開始溫度為40(TC以上的結晶 水或者不含結晶水之無機粒子所組成之群組；以及 (C)微粒子成分，其由具有1.5 μηι以下的平均粒徑 (〇50)之氧化鋁粒子所構成； 並且’上述三水鋁石型氫氧化鋁粒子（Α)、上述無機 成分（Β)及上述微粒子成分（c )之調配比（體積比）為 1 : . 1 〜3 : 〇. 1 〜3。 50201134671 VII. Patent application scope: Non-woven fabric 1. The laminated board is provided with a thermosetting resin composition layer, and the laminated board is characterized in that: in the above thermosetting resin composition, 100 volumes with respect to heat hardening a portion comprising 8 〇 4 parts by volume of the inorganic filler, 曰 the above inorganic filler, comprising: 〇50) gibbsite type (A) having an average particle diameter of 2 to 15 μm of aluminum hydroxide particles; Β) at least one inorganic component 'selected from a boehmite particle having an average particle diameter (d5.) of h5 to 15 μηη, and an average particle diameter (Dm) having a value of 5 to 5, and having a free onset temperature of 4 〇〇β (: a group consisting of the above crystal water or inorganic particles not containing crystal water; and 曰(C) fine particle component' consisting of alumina particles having an average particle diameter (D50) of 15 μη or less Further, the mixing ratio (volume ratio) of the gibbsite-type aluminum hydroxide particles (A), the inorganic component (B), and the fine particle component (c) is 1: 0.1 to 3: 〇. 1 to 3 〇 2. If the scope of patent application is item 1 The laminated board is formed by forming a woven fabric layer on the surface of the non-woven fabric layer. The laminated board according to claim 1 or 2, wherein: the thermosetting resin contains a ring 5. The laminated board according to the third aspect of the invention, wherein the thermosetting resin contains a phenol compound as a hardener component of the epoxy resin. The laminate according to the above aspect, wherein the thermosetting resin contains an epoxy vinyl ester resin, a radical polymerizable unsaturated monomer, and a polymerization initiator. The laminated board according to any one of the items of the present invention, wherein the non-woven fabric base material of the non-woven fabric layer is an epoxy compound. A laminated board according to any one of the preceding claims, wherein: in the woven fabric layer, aluminum hydroxide is contained. The metal foil-clad laminate is characterized by: Item 7 The at least one surface of the board is formed by providing a metal foil. The printed wiring board is characterized in that: a conductor pattern is formed by providing a conductor pattern on at least one surface of any of the laminates of items i to 7 of the patent application. The circuit board is characterized in that: at least one surface of the laminated board according to any one of the items of the first aspect of the invention is provided in the first aspect of the invention. An LED backlight module is characterized in that it is constructed by arranging LEDs on at least one surface of a laminated board according to any one of the above items. 12. An LED lighting device, comprising: LEDs constructed by mounting LEDs on at least one surface of a laminate according to any one of the above claims. 13. In the method of producing a laminated board, the nonwoven fabric substrate is continuously conveyed while the thermosetting resin composition is impregnated into the nonwoven fabric substrate, and the nonwoven substrate is continuously conveyed while The surface is woven with a woven fabric, and the laminate is pressure-bonded by a roll and heated, whereby the thermosetting resin composition is cured to form a nonwoven fabric layer and a woven fabric layer. The manufacturing method of the laminate is characterized in that: In the thermosetting resin composition, the inorganic filler is contained in an amount of 8 〇 to 4 parts by volume with respect to 1 part by volume of the thermosetting resin, and the inorganic filler contains: (A) having 2 to 15 μΓη a gibbsite type hydroxide particle having an average particle diameter (〇5.); (Β) at least one inorganic component selected from the average particle diameter (d5) of an average particle diameter (Dm) having ι 5 ΐ 5 49 201134671 (Dm) And containing: a plate, and a group having a free starting temperature of 40 (crystalline water of TC or higher or inorganic particles containing no crystal water); and (C) fine particle component , It is composed of alumina particles having an average particle diameter (〇50) of 1.5 μη or less; and 'the above-described gibbsite-type aluminum hydroxide particles (Α), the above inorganic component (Β), and the above-mentioned fine particle component (c) The mixing ratio (volume ratio) is 1: . 1 to 3 : 〇. 1 to 3. 50
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