TW201130605A - Method and apparatus for polishing plate-like material - Google Patents
Method and apparatus for polishing plate-like material Download PDFInfo
- Publication number
- TW201130605A TW201130605A TW099144600A TW99144600A TW201130605A TW 201130605 A TW201130605 A TW 201130605A TW 099144600 A TW099144600 A TW 099144600A TW 99144600 A TW99144600 A TW 99144600A TW 201130605 A TW201130605 A TW 201130605A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- grinding
- zones
- plate
- polished
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/244—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass continuous
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Surface Treatment Of Glass (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
201130605 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種板狀物之研磨方法及研磨裝置。 【先前技術】 近年來，廣泛利用液晶顯示裝置（LCD，Hquid crystal display)、電漿顯示器裝置（pDp，pia_ Dispiay panei)、 有機孔顯示裝置（OLED，organic light emitting di〇de )。具 體而言，作為大型電視 '筆記型電腦、汽車導航裝置、公 眾顯示裝置、或者行動電話等移動機器之顯示構件而使用。 於該等顯示裝置中搭載有包含至少一塊玻璃板之顯示元 件。最近之傾向為，伴隨顯示尺寸之大型化、顯示性能之 高品質化或者移動機器之流行，產生顯示元件之輕量化、 薄里化之新要求，因此，對於顯示元件用之玻璃板而提出 更兩之規格。 關於平板顯示器（FPD，Flat Panel Displays)中所使用之玻 璃板，自所要求之物理、化學性能之觀點考慮，目前係利 用熔合法（溢流下拉法）或浮式法來製造。熔合法係於玻璃板 之成形時玻璃之兩側表面成為自由表面，不經過成形後之 研磨步驟便可提供FPD用之玻璃板。 士與此相對，於利用浮式法製造FPD用之玻璃板之情形 日可’谷易產生在與浮法槽中之熔融金屬接觸之玻璃板之表 面（底面）所出現之錫缺陷等。又，由於會產生主要因成形步 驟所引起之玻璃表面之起伏、或異物之附著，故而於其下 游側°又置對玻璃板之表面進行研磨之研磨步驟。201130605 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of polishing a plate and a polishing apparatus. [Prior Art] In recent years, liquid crystal display devices (LCD), plasma display devices (pDp, pia_ Dispiay panei), and organic light emitting devices (OLED) have been widely used. Specifically, it is used as a display member of a mobile TV such as a notebook computer, a car navigation device, a public display device, or a mobile phone. Display elements including at least one glass plate are mounted on the display devices. The recent trend is to increase the size of the display size, improve the quality of display performance, or popularize mobile devices, and to create new requirements for weight reduction and thinning of display elements. Therefore, it is proposed to use a glass plate for display elements. Two specifications. The glass plate used in the flat panel display (FPD) is currently manufactured by a fusion method (overflow pull-down method) or a floating method from the viewpoint of physical and chemical properties required. The melting method is a free surface on both sides of the glass when the glass sheet is formed, and the glass sheet for the FPD can be provided without the grinding step after the forming. On the other hand, in the case of producing a glass plate for FPD by the floating method, it is possible to produce tin defects or the like which appear on the surface (bottom surface) of the glass plate which is in contact with the molten metal in the float bath. Further, since the undulation of the glass surface or the adhesion of the foreign matter mainly due to the forming step occurs, the polishing step of polishing the surface of the glass plate is further provided on the downstream side.
S 153067.doc 201130605 利用浮式法之玻璃板之製造為 咬两u下所不。如圖18所示. 設置有流量調節閥40、流槽42、炫：q a s μ a z私嘁金屬52、熔融金屬浴（浮S 153067.doc 201130605 The manufacture of glass plates using the floating method is not to be bitten. As shown in Figure 18. Flow regulating valve 40, flow channel 42, dazzle: q a s μ a z private metal 52, molten metal bath (floating
法槽）53、頂輥56、緩冷爐62、用於迦寂A 用於域察溶融玻璃之狀態之 攝像裝置50、51及切斷裝置7〇等。 〜 於流槽42之上游之溶融爐中炼融之炫融玻璃被供給至浮 法槽53。浮法槽53中儲存有炫融锡，熔融玻璃54於炫㈣ 上流動，被拉長而成為特定厚度之玻璃帶GR並且得以平坦 化0 於浮法槽53之下游側設置有將玻璃帶⑽自浮法槽㈣ 出並搬入至緩冷爐62之提昇㈣。藉由驅動該提昇該， 淨法槽53之㈣錫上线融玻璃顺朝向緩冷爐之方向拉 伸之同時向汙法槽53之下游側成為固定寬度之帶狀而前 進。 上述玻璃帶GR之流動方向Fd成為自浮法槽之上游側朝向 下游側之方向。並且，形成為帶狀之玻璃（玻璃帶gr)自浮 法槽53被搬送至緩冷爐62，藉由緩冷爐内之層輥搬送之 同時緩冷至室溫為止。 藉由上述緩冷，能夠使於浮法槽中形成為帶狀時所產生 之殘留應力減小、平均化。而且，已通過緩冷爐62之玻璃 帶GR藉由切斷裝置7〇而切斷為特定尺寸之玻璃板〇。 切斷後之玻璃板經過檢查步驟之後，被送至研磨步驟。 又進行玻璃板之端面加工（去角；chamfering)。於研磨步 驟中，藉由研磨裝置研磨玻璃板之表面，而將該表面之微 小損傷或起伏去除。 153067.doc 201130605 圖8表不先前之研磨裝置之一例。於圖8之研磨裝置1中， 在接者於工作台2之吸附薄片3上吸附保持有玻璃板G之非 研磨對象面，沿箭頭Χ之方向藉由移動機構（未圖示）連續地 , 冑％而且’藉由设置於搬送路之上方之複數個研磨頭之 圓形研磨具4、4·.•，將玻璃板G之研磨對象面（被研磨面）研 磨成所期望之平坦度。於上述研磨裝置丨中，圓形研磨具朝 向X方向而分為左右進行配置，依次與玻璃板接觸並進行研 磨。 圓形研磨具4、4···如圖9所示，以玻璃板G之移動中心線L 為基準而成對排列’並且沿移動方向配置成鑛齒狀㈤㈣ 狀）。於該狀態下，圓形研磨具4、4..·進行自轉之同時進行 A轉，自一方之單側越過移動中心線L而移動至另一方之單 側，從而對玻璃板G進行研磨。 根據以此方式包括複數個研磨頭之研磨裝置丨，無需使用 1台大型研磨具，而藉由直徑!：)小於玻璃板G之寬度w之小型 之圓形研磨具4、4·..’便可大量、連續地進行玻璃板G之研 磨（例如參照專利文獻1)。 又，亦眾所周知有董十大型之玻璃板之整個表面進行一次 • 研磨之研磨裝置（例如參照專利文獻2)。上述裝置為所謂單 • 頭（one head)方式之研磨裴置。 [先行技術文獻] [專利文獻] [專利文獻1]日本國日本專利特開2〇〇7_19〇657號公報 [專利文獻2]曰本國曰本專利特開2〇〇4_122351號公報 153067.doc . 201130605 【發明内容】 [發明所欲解決之問題] 然而’與浮式法中成形時之玻璃帶之移動方向平行地， 以-定傾向而分佈著玻璃表面缺陷。上述表面缺陷係指因 附著於輥之玻璃片或原料之授拌不均等各種理由所產生的 微小損傷或起伏等。上述損傷或起伏大體上形成為具有一 方向之規則性之條紋狀’於本說明書中，將形成於玻璃板 之上边條紋之方向稱作條紋方向⑽eakdi⑽iGn)。因此， 若將玻璃板之上述條紋方向以成為與研磨時之搬送方向相 :之方向的方式配置並研磨玻璃板，則存在如下情形：由 -部分研磨具研磨之被研磨面上所存在之表面缺陷較少， 而由其他研磨具研磨之被研磨面上所存在之表面缺陷較 多0 於利用先4方法對此種玻璃板進行研磨之情形時，有時 要預先反映所進行之玻璃板表面之檢查結果並對表面缺 陷較大之部位決定最大研磨量’而於使用該方法之情形 時，缺陷較少之部位與較多之部位會同樣地受到研磨。即， 於對玻璃板之整個面以相同方式研磨之先前方法之情形 存在難以縮短對一個基板進行研磨之所需公時（時間） 之問題。 本發明係鑒於上述狀況而完成者，使玻璃板等板狀物之 研磨步驟中之作業效率飛躍性地提高。進而，於進行如上 iC般之研磨時’藉由被研磨部位之偏離，有時會於板狀體 之被研磨面之特定之部位發生研磨不均（研磨條紋 > 本發明 I53067.doc 201130605 另一目的在於減少上述研磨不均。 [解決問題之技術手段] 本發明之癌樣1 k供一種板狀物之研磨方法，其特徵在 於.其係利用3個以上之研磨頭，研磨在特定之搬送方向上 搬送之板狀物之被研磨表面者，以將上述被研磨表面在與 上述搬送方向正交之方向上分隔之方式，設定複數個研磨 區帶，將與上述複數個研磨區帶中的各研磨區帶分別對應 之研磨頭之個數加權及配置，根據與上述複數個研磨區帶 中的各研磨區〒分別對應之被研磨表面之狀態來設定研磨 畺即，本發明之悲樣1提供一種板狀物之研磨方法，其特 徵在於：其係於平面内放置作為研磨對象之板狀物，將研 磨板狀物之被研磨表面之研磨頭設為河個（河^3)，以將被 研磨物相對於研磨頭而在平面内之χ軸方向上移動之方 式’自伴隨X軸方向上之被研磨物與研磨頭之相對移動之、 對-個被研磨物之藉由最初之研磨頭進行研磨開始直至藉 由最後之研磨頭進行上述被研磨物之研磨結束為止，藉由曰 通過之Μ個研磨頭之研磨’而對—個被研磨物之被研磨表 面之整體進行研磨，將被研磨表面在平面内之γ轴方向上分 隔而設定複數個研磨區帶，將對應於各研磨區帶之研磨頭 之個數加權及配置，從而達成針對各研磨區帶之所期望之 研磨量（研磨材料）。 其中上述複數個研磨區帶 態樣2提供態樣1之研磨方法 中，最小研磨量為0〜3 μηι。 態樣3提供態樣1之研磨方法 其中上述複數個研磨區帶 I53067.doc 201130605 中’最大研磨量為1〜1〇μηι。 態樣4提供態樣丨之研磨方法，其中上述複數個研磨區帶 中’最大研磨量與最小研磨量之差為〇〜1〇 μιη。 態樣5提供態樣1、2、3或4中任一態樣之研磨方法，其中 上述複數個研磨區帶之數目為2〜5。 態樣6提供態樣1至5中任一態樣之研磨方法，其中對廡於 各上述複數個研磨區帶而配置之上述研磨頭之個數，於最 小數目之研磨區帶時為〇〜16 ’於最大數目之研磨區帶時為 10〜32 。 態樣7提供態樣1至6中任一態樣之研磨方法，其中上述研 磨頭之總數為11〜35。 態樣8提供態樣1至7中任一態樣之研磨方法，其中將上述 研磨頭之各自之尺寸設定為大致相等。 態樣9提供態樣1至8中任一態樣之研磨方法，其中上述板 狀物為玻璃板，以該玻璃板之成形步驟中之搬送方向與研 磨時之搬送方向成為相同之方式配置玻璃板。 態樣10提供態樣1至9中任一態樣之研磨方法，其中若將 上述板狀物之寬度設為W、上述研磨頭之有效長度設為 dl，則滿足0.8W2 Dl^ 0.3W。 嘘樣11提供態樣1至1 〇中任一態樣之研磨方法其中同一 研磨區帶上之最下游區塊之研磨頭之自轉中心及/或公轉 中心、與自該最下游區塊算起位於U區塊上游側之至少一 個研磨頭之自轉中心及/或公轉中心，係不位於上述研磨時 之搬送方向之同一平行線上。 153067.doc 201130605 態樣12提供態樣1至10中任一態樣之研磨方法，其中自同 研磨區帶上之最下游區塊算起位於1〜3區塊上游側之研 磨頭中之至少一個，係於與上述研磨時之搬送方向橫切之 方向上往復運動。 態樣13提供態樣1至10中任一態樣之研磨方法，其中與自 同一研磨區帶上之最下游區塊算起位於丨〜3區塊上游側之 研磨頭中的至少一個相對向之板狀體搬送機構，係於上述 與搬送方向橫切之方向上往復運動。 態樣14提供態樣丨至13中任一態樣之研磨方法，其中於研 磨則，對上述被研磨表面中之表面缺陷之分佈狀態進行檢 查0 悲樣15提供態樣1至14中任一態樣之研磨方法，其中上述 板狀物為利用浮式法製造之玻璃板。 態樣1 6提供態樣1至1 5中任一態樣之研磨方法，其中於研 磨後，對上述被研磨表面中之表面缺陷之分佈狀態進行進 一步檢查。 態樣17提供態樣丨至16中任一態樣之研磨方法，其中上述 板狀物為平板顯示器用之玻璃基板。 態樣18提供態樣丨至^中任一態樣之研磨方法，其中上述 板狀物之短邊之長度為丨9〇〇 mm以上，長邊之長度為2200 mm以上。 上述被研磨物之厚度較佳為0.1〜1.8 mm。 態樣19提供態樣丨至^中任一態樣之研磨方法，其中上述複 數個研磨區帶中之一個研磨區帶之寬度為8〇〇 mm〜16〇〇 mm。 s 153067.doc 201130605 態樣2〇提供態樣中任一態樣之研磨方法，其中研磨 頭為圓形’各個研磨頭藉由各自之自轉軸而自轉，並且相 對於上述板狀物以特定之公轉半徑公轉。 態樣21提供態樣⑴心任一態樣之研磨方法，其十相對 於-個上述板狀物’自最初之研磨頭接觸且開始研磨後' 至最後之研磨頭之研磨結束為止之時間，係為i分鐘〜2〇分 鐘。 態樣22提供一種板狀物之研磨裝置，其特徵在於：其係 利用3個以上之研磨頭，研磨在特定之搬送方向上搬送之板 狀物之被研磨表面者，以將上述被研磨表面在與上述搬送 方向正交之方向上分隔之方式，設定複數個研磨區帶，將 與上述複數個研磨區帶中的各研磨區帶分別對應之研磨頭 之個數加權及配置，根據與上述複數個研磨區帶中的各研 磨區τ分別對應之被研磨表面之狀態來設定研磨量。 即’提供一種板狀物之研磨裝置，其特徵在於：其係於 平面内放置作為研磨對象之板狀物，設置Μ個（Mg 3)研磨 板狀物之被研磨表面之研磨頭， 使被研磨物相對於研磨頭而在平面内之X軸方向上移 動’伴隨著X軸方向上之被研磨物與研磨頭之相對移動，對 一個被研磨物自最初之研磨頭進行研磨開始直至最後之研 磨頭進行上述被研磨物之研磨結束為止，藉由通過之]^個 研磨頭之研磨，而對一個被研磨物之被研磨表面之整體進 行研磨， 將被研磨表面在平面内之Y轴方向上分隔而設定複數個 153067.doc •10· 201130605 研磨區帶’將與研磨區帶中的各研磨區帶分別對應之研磨 頭之個數加權及配置，從而達成針對各研磨區帶之所期望 之研磨量。 本發明中，較佳為被研磨物為FPD用之玻璃板。其原因 在於比起先前，FPD中大畫面且高精彩度之顯示裳置增 加要求平坦性優異之玻璃板。於玻璃板之製造時，自該 原料之熔解到成形、切斷等之玻璃板之步驟中，會產生玻 璃帶之寬度方向上之局部不均—性。目前，作為被用作量 f技術之製造技術，有浮式法、溢流下拉法、再拉成形法 寻，於各方法中’關於表面之平坦性或異物，可能會產生 玻璃帶之寬度方向上之傾向性缺陷，於搬送玻璃板之 中途’有時會不均一地產生玻璃板之端面之損傷、或玻璃 板之主表面之損傷。 本發明中，尤佳為藉由浮式法而製造之玻璃板。 通常，藉由浮式法並經過各步驟而形成為帶狀之玻璃 板，係藉由切斷裝置切斷為特定尺寸之玻璃板。此時，於 玻璃板G上’沿著成形時之移動方向^(條紋方向）而傾向性 地產生表面缺陷。 繼而，已加工為特定尺寸之玻璃板G於檢查步驟中，向與 ^紋方向（成形時之移動方向Fd)相同之方向移動，並進行檢 -。此處’檢測表面缺陷之位置、大小或深度、表面缺陷之 :等貝所檢測出之表面缺陷之資訊記錄於記錄機構。 =而’檢查後之玻璃板以條紋方向與前進方向成為相同 。之方式移動並it行研磨。於研磨步财，沿著玻璃板 153067.docThe groove 55, the top roller 56, the slow cooling furnace 62, the image pickup devices 50 and 51 for the state in which the glass is used for the molten glass, and the cutting device 7 and the like. The glazed glass which is smelted in the melting furnace upstream of the launder 42 is supplied to the float tank 53. The float bath 53 stores red tin, and the molten glass 54 flows on the dazzle (four), is elongated to become a glass ribbon GR of a specific thickness, and is flattened. On the downstream side of the float tank 53, a glass ribbon (10) is disposed. Lifting from the float tank (4) and moving into the slow cooling furnace 62 (4). By driving the lift, the (four) tin-on-line molten glass of the cleaning tank 53 is stretched toward the slow cooling furnace while advancing toward the downstream side of the fouling tank 53 to have a fixed width. The flow direction Fd of the glass ribbon GR is a direction from the upstream side to the downstream side of the float bath. Further, the strip-shaped glass (glass ribbon gr) is transferred from the float bath 53 to the slow cooling furnace 62, and is gradually cooled to room temperature while being conveyed by the layer roll in the slow cooling furnace. By the above-described slow cooling, the residual stress generated when the belt is formed in the float bath can be reduced and averaged. Further, the glass ribbon GR which has passed through the slow cooling furnace 62 is cut into glass sheets of a specific size by the cutting device 7〇. After the cut glass plate is subjected to the inspection step, it is sent to the grinding step. The end face processing of the glass plate (chamfering) is performed. In the grinding step, the surface of the glass plate is ground by a grinding device to remove minor damage or undulation of the surface. 153067.doc 201130605 Figure 8 shows an example of a prior grinding device. In the polishing apparatus 1 of FIG. 8, the non-polishing target surface of the glass sheet G is adsorbed and held on the adsorption sheet 3 attached to the table 2, and is continuously moved by a moving mechanism (not shown) in the direction of the arrow ,.胄% and 'The polishing target surface (the surface to be polished) of the glass sheet G is polished to a desired flatness by the circular polishing tools 4, 4, . . . which are provided in a plurality of polishing heads above the conveyance path. In the above polishing apparatus, the circular polishing tools are arranged in the left-right direction in the X direction, and are sequentially brought into contact with the glass plate to be ground. As shown in Fig. 9, the circular polishing tools 4, 4 are arranged in pairs in accordance with the movement center line L of the glass sheet G, and are arranged in a tooth-tooth shape (five) (four) in the moving direction. In this state, the circular polishing tools 4, 4, . . . perform the A-turn while rotating, and move the glass sheet G from one side of the one side over the movement center line L to the other side. According to the polishing apparatus 包括 including a plurality of polishing heads in this manner, it is not necessary to use one large-sized abrasive tool, but a small circular abrasive tool 4, 4·..' having a diameter of ::) smaller than the width w of the glass plate G Grinding of the glass sheet G can be performed in a large amount and continuously (for example, refer to Patent Document 1). Further, it is also known that a polishing apparatus for performing one-time polishing on the entire surface of a glass sheet of a large ten-size glass is known (for example, refer to Patent Document 2). The above device is a so-called one head type polishing device. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. 201130605 [Disclosure of the Invention] [Problems to be Solved by the Invention] However, in parallel with the moving direction of the glass ribbon during molding in the floating method, glass surface defects are distributed in a predetermined manner. The surface defect refers to minute damage or undulation caused by various reasons such as unevenness of the glass piece or the raw material adhered to the roll. The above-mentioned damage or undulation is formed substantially in a stripe shape having a regularity in one direction. In the present specification, the direction in which the stripe is formed on the glass sheet is referred to as a stripe direction (10) eakdi (10) iGn). Therefore, when the glass strip is placed and polished in such a manner that the stripe direction of the glass sheet is in the direction of the transport direction during polishing, there is a case where the surface on the surface to be polished which is polished by the -partial abrasive is present. There are fewer defects, and there are more surface defects on the surface to be polished by other abrasive tools. When the glass plate is polished by the first method, the surface of the glass plate is sometimes reflected in advance. The result of the inspection determines the maximum amount of polishing for the portion where the surface defect is large. When the method is used, the portion having fewer defects is polished in the same manner as the more portions. Namely, in the case of the prior method of grinding the entire surface of the glass sheet in the same manner, there is a problem that it is difficult to shorten the required puncturing (time) for polishing one substrate. The present invention has been made in view of the above circumstances, and the work efficiency in the polishing step of a plate member such as a glass plate is drastically improved. Further, when the polishing is performed as in the above iC, the polishing unevenness may occur in a specific portion of the surface to be polished of the plate-shaped body by the deviation of the portion to be polished (grinding stripe). The present invention I53067.doc 201130605 One object is to reduce the above-mentioned uneven grinding. [Technical means for solving the problem] The cancer sample of the present invention is a method for polishing a plate, which is characterized in that it is ground by using three or more polishing heads. And a plurality of polishing zones are set so as to separate the surface to be polished which is to be conveyed in the transport direction so as to be spaced apart from the transport direction, and to be in the plurality of polishing zones Each of the polishing zones has a weighting and arrangement corresponding to the number of the polishing heads, and the polishing flaw is set according to the state of the surface to be polished corresponding to each of the plurality of polishing zones, the sadness of the present invention. 1 is a method for polishing a plate, characterized in that it is placed in a plane as a plate for grinding, and a polishing head for grinding the surface of the plate River (river ^3), the relative movement of the object to be polished and the polishing head in the X-axis direction by moving the object to be polished in the direction of the axis in the plane with respect to the polishing head. The object to be polished is ground by the first polishing head until the polishing of the object is finished by the last polishing head, and the workpiece is polished by the grinding of the polishing head. The entire surface to be polished is polished, and the surface to be polished is divided in the γ-axis direction in the plane to set a plurality of polishing zones, and the number of polishing heads corresponding to each polishing zone is weighted and arranged, thereby achieving The desired amount of grinding (abrasive material) of each of the grinding zones. wherein the plurality of grinding zone zones 2 provide the grinding method of the aspect 1, the minimum amount of grinding is 0 to 3 μηι. The grinding method wherein the plurality of polishing zones I53067.doc 201130605 have a maximum grinding amount of 1 to 1 〇μηι. The aspect 4 provides a grinding method of the state 丨, wherein the plurality of grinding zones are the largest The difference between the amount of grinding and the minimum amount of grinding is 〇~1〇μιη. Aspect 5 provides a grinding method of any of the aspects 1, 2, 3 or 4, wherein the number of the plurality of grinding zones is 2 to 5 Aspect 6 provides the polishing method of any of the aspects 1 to 5, wherein the number of the polishing heads disposed for each of the plurality of polishing zones is 〇 for a minimum number of polishing zones 〜16' is 10 to 32 in the maximum number of polishing zones. Aspect 7 provides a grinding method in any of the aspects 1 to 6, wherein the total number of the polishing heads is 11 to 35. The polishing method of any of the aspects 1 to 7, wherein the respective sizes of the polishing heads are set to be substantially equal. The aspect 9 provides the polishing method of any of the aspects 1 to 8, wherein the plate is In the case of the glass plate, the glass plate is disposed in such a manner that the conveying direction in the forming step of the glass plate is the same as the conveying direction in the polishing. Aspect 10 provides a polishing method according to any one of Aspects 1 to 9, wherein if the width of the plate member is W and the effective length of the polishing head is dl, 0.8 W2 Dl ^ 0.3 W is satisfied. The sample 11 provides a grinding method according to any one of the aspects 1 to 1 , wherein the rotation center and/or the revolution center of the grinding head of the most downstream block on the same polishing zone are counted from the most downstream block The rotation center and/or the revolution center of at least one of the polishing heads located on the upstream side of the U block are not located on the same parallel line of the conveying direction during the above polishing. 153067.doc 201130605 Aspect 12 provides the grinding method of any of aspects 1 to 10, wherein at least the most downstream block on the same grinding zone is at least one of the grinding heads located on the upstream side of the 1 to 3 block One is reciprocating in a direction transverse to the conveying direction at the time of the above grinding. The aspect 13 provides the polishing method of any of the aspects 1 to 10, wherein at least one of the polishing heads located on the upstream side of the 丨3 block is calculated from the most downstream block on the same polishing zone The plate-shaped body conveying mechanism reciprocates in the direction transverse to the conveying direction. The aspect 14 provides a grinding method of any of the aspects 丨 to 13 in which, in the case of grinding, the distribution state of the surface defects in the surface to be polished is checked. 0 sadness 15 provides any of the modes 1 to 14 A grinding method according to the aspect, wherein the plate is a glass plate manufactured by a floating method. Aspect 16 provides a grinding method according to any one of Aspects 1 to 15, wherein after the grinding, the distribution state of the surface defects in the surface to be polished is further examined. Aspect 17 provides a polishing method for any of the aspects of the aspect, wherein the plate is a glass substrate for a flat panel display. The aspect 18 provides a grinding method of any of the aspects 丨 to ^, wherein the short side of the plate has a length of more than 〇〇9〇〇 mm and a length of the long side of 2200 mm or more. The thickness of the object to be polished is preferably 0.1 to 1.8 mm. The aspect 19 provides a polishing method for any of the aspects of the pattern, wherein one of the plurality of polishing zones has a width of 8 mm to 16 mm. s 153067.doc 201130605 Aspect 2〇 provides a grinding method in any of the aspects, wherein the grinding head is circular 'each grinding head rotates by its own rotation axis and is specific to the above plate The revolution radius is revolved. The aspect 21 provides a method of grinding (1) any aspect of the heart, which is ten times relative to the time when one of the above-mentioned plates 'contacts from the initial polishing head and starts to be grounded' to the end of the grinding of the final polishing head, The system is i minutes ~ 2 minutes. The aspect 22 provides a plate-like polishing apparatus characterized in that the surface to be polished which is conveyed in a specific conveying direction is polished by using three or more polishing heads to polish the surface to be polished. a plurality of polishing zones are set so as to be spaced apart in a direction orthogonal to the transport direction, and the number of the polishing heads corresponding to each of the plurality of polishing zones is weighted and arranged, according to the above The polishing amount is set for each of the plurality of polishing zones τ corresponding to the state of the surface to be polished. That is, a polishing apparatus for providing a plate is characterized in that it is placed in a plane as a plate to be polished, and a grinding head of a ground surface of a (Mg 3) abrasive plate is provided to make The polishing object moves in the X-axis direction in the plane with respect to the polishing head. With the relative movement of the object to be polished and the polishing head in the X-axis direction, the polishing object is ground from the original polishing head until the last. After the polishing head finishes the polishing of the object to be polished, the entire surface of the object to be polished is polished by the polishing of the polishing head, and the surface to be polished is in the plane in the Y-axis direction. Separate and set a plurality of 153067.doc •10· 201130605 The polishing zone 'weights and arranges the number of the polishing heads corresponding to the respective polishing zones in the polishing zone to achieve the desired requirements for each polishing zone. The amount of grinding. In the present invention, it is preferred that the object to be polished be a glass plate for FPD. The reason for this is that the display panel with a large screen and a high degree of fascination in the FPD has a glass sheet which is excellent in flatness. In the production of a glass sheet, local unevenness in the width direction of the glass ribbon occurs in the step of melting the raw material to a glass sheet such as forming or cutting. At present, as a manufacturing technique used as the amount f technology, there are a floating method, an overflow down-draw method, and a re-drawing method. In each method, the width direction of the glass ribbon may be generated regarding the flatness or foreign matter of the surface. In the middle of the conveyance of the glass sheet, the damage of the end surface of the glass sheet or the damage of the main surface of the glass sheet may occur unevenly. In the present invention, a glass plate produced by a floating method is particularly preferred. Usually, a glass plate formed into a strip shape by a floating method and subjected to each step is cut into a glass plate of a specific size by a cutting device. At this time, surface defects are preferentially generated on the glass sheet G in the moving direction ^ (streak direction) at the time of molding. Then, the glass sheet G which has been processed to a specific size is moved in the same direction as the rubbing direction (moving direction Fd at the time of forming) in the inspection step, and is checked. Here, the position, size or depth of the surface defect and the surface defect are detected: the information of the surface defect detected by the shell is recorded in the recording mechanism. = and the glass plate after inspection is the same as the direction of the stripe. The way to move and it grind. In the grinding step, along the glass plate 153067.doc
-η - S 201130605 之移動方向，兹 曰’十對每個研磨區帶配置之複數個研磨頭 之研磨具而進行研磨。 此夺才艮據上述檢查步驟中檢測出之表面缺陷之資訊， ；表面缺陷較少之位置而表面缺陷更多地存在之位 置，配置較吝3>·ΕΙ1ι*- 又少 <研磨頭。自記錄機構抽出研磨步驟中所需 之:磨資訊並由控制機構提供，以適當配置研磨頭。該研 磨貝Λ為與特定數量之生產相應之統計性資料。研磨頭之 配置可根據要生產之製品之品種或規格、各出貨目的地之 規格等而適當規定。於研磨步驟中，根據研磨資訊，以手 動、半自動或自動來使各研磨頭之位置移動。 藉此，藉由浮式法之各步驟之影響而傾向性地產生表面 缺陷之玻璃板’能夠提高表面缺陷程度較大之部位（研磨區 π)之研磨能力’另-方面能夠降低表面缺陷程度較小之部 位（研磨區帶）之研磨能力。其結果’比起先前方法（具有使 面内均一之研磨能力之研磨方法）能夠更有效地進行研磨。 稭由本發明，根據表面缺陷所存在之部位所需之研磨程 度，可使研磨時間最佳地對應，從而整體上實現無浪費之 研磨。藉此，能夠使板狀物之研磨裝置之運行率飛躍性地 提向。 進而，如態樣11〜13所示，藉由使最下游之區塊及與其鄰 接之上游之區塊之研磨頭之旋轉令心之位置錯開，而能夠 去除/減少因研磨所引起之研磨不均（研磨條紋）。 [發明之效果] 根據本發明，根據板狀物之被研磨面上之表面缺陷之產 153067.doc -12- 201130605 生分佈，來設定研磨區帶，並對應該研磨區帶之研磨能力 之分佈，藉此比起先前方法（均一研磨面内之研磨方法），於 研磨效率之方面能夠飛躍性地改善。又，能夠去除/減少因 研磨所引起之研磨不均（研磨條紋），故而能夠使研磨後之板 狀物之表面品質穩定化。 【實施方式】 以下依據圖式對本發明之研磨方法及研磨裝置之較佳實 施形態進行詳細說明。省略關於基板之端面之研磨或清洗 等步驟之說明。 圖1係朝向玻璃板G之移動方向觀察研磨裝置i 〇之研磨頭 5之研磨裝置10之㈣見圖，圖2係自相對於玻璃板〇之移動方 向為垂直之方向觀察研磨頭5之研磨裝置1〇之側視圖，圖3 係使研磨頭5自A側向_移動之研磨裝置1〇之側視圖圖* 係表示將研磨頭5設置於2研磨區帶之情況之模式性平面 圖，且表示沿著玻璃板之流動方向變更並聯配置之權重。 圖5係表示研磨頭5之固定狀態之研磨裝置1G之側視圖。 *藉由圖i之本發明之研磨裝置，能夠對由浮式法製造之玻 璃板G之表面之微小損傷或異物、起伏進行研磨而將其去 除：於藉由淨式法製造玻璃帶之步驟中，設置有熔融爐、 ’熔融金屬浴（浮法槽）、缓冷爐、及切斷裝置等（參照圖叫。 糟由浮式法並經各步驟而形成為帶狀之玻璃板，係 切斷裝置而切斷為特定尺寸之玻璃板G。此時，玻璃板〇 上，表面缺陷沿著成形時之移動方向傾向性地產生。 圖中將玻璃板之剖面方向上之起伏之狀態加強而模式 153067.doc •13· 201130605 性地加以表示。藉由浮式法製造之玻璃板具有基板面方向 上之短週期之起伏。玻璃板之厚度方向（Td)上之山谷之高度 為微米（μιη)級別，又，除上述起伏之外有時亦會具有損傷。 上述缺陷具有沿著成形時之玻璃帶移動方向、即條紋方向 而連續地產生之傾向。該短週期之起伏於將玻璃板用作顯示 裝置之構件之情形時’容易聯想到使用者可識別之級別之顯 示斑等。再者，上述玻璃板中亦存在更長週期間距之厚度之 差異（厚度偏差）’但該#就光學方面而言幾衫存在問題又。 本發明中將玻璃板之表面缺陷較多之部位與較少之部位 作為研磨區帶而加以區別，於各個研磨區帶中分散配置研 磨^達到所期望之研磨量。於本圖巾，將短週期之起伏 寺表面缺陷較多之研磨區帶之研磨量設為pR，將表 較少之研磨區帶之研磨詈讯盔 、 里叹為Pl。兩研磨區帶無需為完全 分離之區域，其端部亦可實際上疊合。- η - S The movement direction of 201130605 is honed and polished by a plurality of polishing heads arranged in each of the polishing zones. This information is based on the information of the surface defects detected in the above inspection steps; the position where the surface defects are less and the surface defects are more present, and the arrangement is smaller than 3>·ΕΙ1ι*- and less; The self-recording mechanism extracts the required grinding: the grinding information is provided by the control mechanism to properly configure the grinding head. The research is a statistical data corresponding to a specific quantity of production. The configuration of the polishing head can be appropriately determined depending on the type or specification of the product to be produced, the specifications of each shipping destination, and the like. In the grinding step, the positions of the respective polishing heads are moved manually, semi-automatically or automatically based on the polishing information. Thereby, the glass sheet which tends to generate surface defects by the influence of each step of the floating method can improve the polishing ability of the portion (the polishing region π) having a large degree of surface defects, and can further reduce the degree of surface defects. Grinding ability of the smaller part (grinding zone). As a result, the polishing can be performed more efficiently than the conventional method (the polishing method having the uniform polishing ability in the surface). According to the present invention, the grinding time can be optimally matched according to the degree of grinding required for the portion where the surface defect exists, thereby achieving waste-free grinding as a whole. Thereby, the operating rate of the plate-like polishing apparatus can be dramatically increased. Further, as shown in the aspects 11 to 13, it is possible to remove/reduce the grinding caused by the grinding by shifting the position of the center of the polishing head of the most downstream block and the block adjacent thereto. All (grinding stripes). [Effects of the Invention] According to the present invention, the polishing zone is set according to the surface distribution of the surface defects of the plate-like surface, 153067.doc -12-201130605, and the distribution of the grinding ability of the abrasive zone is determined. Therefore, compared with the prior method (the grinding method in the uniform polishing surface), the polishing efficiency can be drastically improved. Further, since uneven polishing (polishing streaks) due to polishing can be removed/reduced, the surface quality of the plate after polishing can be stabilized. [Embodiment] Hereinafter, preferred embodiments of the polishing method and polishing apparatus of the present invention will be described in detail with reference to the drawings. Description of steps such as grinding or cleaning of the end faces of the substrate is omitted. 1 is a view of the polishing apparatus 10 of the polishing head 5 of the polishing apparatus i facing the moving direction of the glass sheet G. FIG. 2 is a view showing the grinding of the polishing head 5 from a direction perpendicular to the moving direction of the glass sheet. A side view of the apparatus 1 is a side view of the polishing apparatus 1 of the polishing head 5 from the A side, and a schematic plan view showing the case where the polishing head 5 is placed in the 2 polishing zone, and Indicates that the weight of the parallel arrangement is changed along the flow direction of the glass sheet. Fig. 5 is a side view showing the polishing apparatus 1G in a fixed state of the polishing head 5. * By the polishing apparatus of the present invention shown in Fig. i, it is possible to remove minute damage or foreign matter and undulation of the surface of the glass sheet G produced by the floating method: the step of manufacturing the glass ribbon by the net method In the middle, a melting furnace, a 'melting metal bath (floating tank), a slow cooling furnace, a cutting device, etc. are provided (see the figure, the glass plate formed by the floating method and formed into a strip by each step) The glass plate G of a specific size is cut by the cutting device. At this time, the surface defects tend to occur along the moving direction during the forming of the glass plate. In the figure, the undulation in the cross-sectional direction of the glass plate is strengthened. The mode is 153067.doc •13·201130605. The glass plate manufactured by the floating method has a short period of undulation in the direction of the substrate surface. The height of the valley in the thickness direction (Td) of the glass plate is micrometer ( In addition to the above-mentioned undulations, the above-mentioned defects may have a tendency to be continuously generated along the moving direction of the glass ribbon at the time of molding, that is, the direction of the stripe. The short period of the undulation is on the glass sheet. When used as a member of a display device, it is easy to associate with a display spot of a level recognizable by a user, etc. Further, there is a difference in thickness (thickness deviation) of a longer period pitch in the above glass plate. In terms of optical aspects, there are problems in several shirts. In the present invention, a portion having a large surface defect of a glass plate and a small portion are distinguished as a polishing zone, and dispersion is arranged in each of the polishing zones to achieve desired The amount of grinding. In the figure, the grinding amount of the grinding zone with a large surface defect in the short cycle is set to pR, and the grinding zone of the grinding zone with less surface is less, and the sigh is Pl. The abrasive zone need not be a completely separated region, and its ends may actually overlap.
圖η表示上述先前例之研磨量之分佈H 磨區帶，各個研磨區帶中之研磨量設定為相等。研 圖12〜圖1 5模式性从本_ w丄 生地表不將本發明中之每 研磨量之加權設定為不同之狀態。圖：二之 了:物，係研磨區帶為3行，加二 研磨區帶為3行，加權為2:為？定 為内側之研磨區帶主一 且η又疋 帶，為了使研磨頭空行之研磨區 之階段性變化，而以f " 以進—步減小Y方向上 圖㈣4… 研磨之方式設定之事例。 圖16係一般性地表 本發明中之研磨區帶與研磨頭之配 153067.doc 201130605 置之方法之模式圖。X方向為研磨時之破璃板G之搬送方 向。於與上述X方向正交之γ方向上，以分隔 方=設定研磨區帶。研磨區帶係指研磨頭之中心（自轉^ . 及&轉中〜）所位於之區域，於研磨時相鄰之研磨區帶露出 $磨具之端部完全沒有問題。空間上研磨具專門於該研磨 區帶中進行自轉、公轉，藉此可對玻璃板之被研磨表面進 行研磨。 :圖中表示如下狀態：在γ方向上設置L丨〜“Μ個研磨 區帶，以於研磨區帶^配置一個研磨頭，於研磨區帶^配 置2個研磨頭’於研磨區帶^在又方向上成為最高密度之 方式，在所有位置配置研磨頭。而且，於該分散配置之設 定中，每個研磨區帶所獲得之研磨量為Pi' P2_Pm。研磨 區f之數目（Μ)較佳為2-5。若上述研磨區帶數（M)為2區帶 以上則可分為所需之研磨量較多之區域與較少之區域， 又’藉由為5區帶以下，能夠有效進行研磨頭位置之調整。 圖17中模式性地表示：本發明中設定複數個研磨區帶， 其中根據研磨條件即表面缺陷之分佈狀態等算定研磨量 (圖1 7(a)) ’對於研磨前之剖面方向上之表面狀態（圖丨7(b)) 進行研磨’其結果為，能夠獲得表面缺陷已被去除或緩和 - 之表面狀態（圖17(c))。 於以下之表1〜3中表示本發明中之研磨頭之配置之一 例。於本發明中，將X方向上分割之各N個區域稱作研磨區 塊。表1及表2中表示研磨區帶數為2(Li&l2)，研磨區塊數 為N(1~N)之例，表3中表示研磨區帶數為3(1^、L2及L3)，研 -15· 153067.doc i 201130605 磨區塊數為N(1〜N)之例。表1〜3中之〇符號表示研磨頭所位 於之位置。板狀物按照在X方向上配置之研磨頭（〗、2、…N) 之順序而被研磨。各研磨頭之直徑與將γ方向之板狀物之尺 寸除以區帶之分割數所得之大小大致相同。即，於2個研磨 頭之情形時可設為板狀物之γ方向之直徑之約1/2，於3個研 磨頭之情形時可設為約1 /3。成為研磨步驟之最後之第j •k、N段（最終段）之研磨頭較佳為於γ方向上分散。當將X 方向上之研磨區塊之位置設為X，γ方向上之研磨區帶之位 置设為y(其中X為1〜N之整數’ y為之整數，N為研磨區 塊數’ Μ為研磨區帶數）’各研磨頭之研磨量設為ρ(χ：，y) 時’各研磨區帶之研磨量PL(y)由下述之數式表示。 [數1] 及⑺=Σρμ 作1 [表1] 1 2 3 4 5 • » · Ν-5 Ν-4 Ν-3 Ν-2 Ν-1 Ν Li υ 〇 〇 〇 〇 〇 Ο Ο Ο Ο 〇 L2 〇 [表2] 1 2 3 4 5 « · · Ν-5 Ν-4 Ν-3 Ν-2 Ν-1 Ν Li υ 〇 〇 〇 〇 〇 Ο 〇 〇 〇 L2 〇 〇 [表3] _ 1 2 3 4 5 • » · Ν-5 Ν-4 Ν-3 Ν-2 Ν-1 Ν Li CJ 〇 〇 〇 〇 Ο Ο 〇 〇 〇 L2 υ 〇 〇 〇 L3 〇 〇 153067.doc -】6 - 201130605 車乂佳為於板狀物之面積較大之情形時應用本發明。具體 而言’較佳為第7代（1900x2200 mm)以上之玻璃板。 作為玻璃板之尺寸’更佳為可應用第8代（22〇〇 mmx2400 mm)、第 9 代（2400 mm><2800 mm)、或者第 1〇 代（2800 mmx3000 mm)。只要其面積實質上與上述尺寸相同或為該 尺寸以上’則可獲得相同之效果。 本發明中，重要的是於特定之時間内，如何將表面缺陷 全部或幾乎全部地加以去除。即，若進行長時間之研磨， 則雖容易去除表面缺陷’但重要的是於有限之步驟時間内 完成所期望之研磨。Figure η represents the distribution of the grinding amount of the above-mentioned prior art, and the amount of grinding in each of the polishing zones is set to be equal. Fig. 12 to Fig. 15 schematically do not set the weighting of each polishing amount in the present invention to a different state from the present invention. Figure: Two: The object, the grinding zone is 3 rows, plus 2 the grinding zone is 3 rows, the weight is 2: Is it? The grinding zone defined as the inner side is the main one and the η and the 疋 tape, in order to change the grinding zone of the grinding head blankly, and f " to reduce the Y direction in the upper direction (4) 4... An example of this. Fig. 16 is a schematic view showing the method of placing the polishing zone and the polishing head in the present invention. 153067.doc 201130605. The X direction is the conveying direction of the glass sheet G during polishing. In the γ direction orthogonal to the above X direction, the polishing zone is set by the division side =. The grinding zone refers to the area in which the center of the polishing head (self-rotating ^ and & transfer) is located, and the adjacent grinding zone is exposed at the time of grinding. There is no problem at the end of the grinding tool. The spatially abrasive tool is specifically rotated and revolved in the abrasive zone to thereby grind the ground surface of the glass sheet. : The figure shows the following state: in the γ direction, L丨~““one polishing zone is provided, so that one polishing head is arranged in the polishing zone, and two polishing heads are arranged in the polishing zone” in the polishing zone. In the direction of the highest density, the polishing head is disposed at all positions. Moreover, in the setting of the dispersion arrangement, the amount of grinding obtained per polishing zone is Pi' P2_Pm. The number of grinding zones f (Μ) is Preferably, the number of the polishing zone (M) is 2 zones or more, and it can be divided into a region with a larger amount of polishing and a smaller region, and can be 'by 5 zones or less. The adjustment of the position of the polishing head is effectively performed. Fig. 17 schematically shows that a plurality of polishing zones are set in the present invention, wherein the amount of polishing is calculated according to the grinding condition, that is, the distribution state of the surface defects (Fig. 17(a))' The surface state in the cross-sectional direction before the polishing (Fig. 7(b)) is polished. As a result, the surface state in which the surface defects have been removed or moderated can be obtained (Fig. 17(c)). Table 1 below ～3 shows an example of the arrangement of the polishing head in the present invention. In the description, each of the N regions divided in the X direction is referred to as a polishing block. Tables 1 and 2 show that the number of polishing zones is 2 (Li&l2), and the number of polishing blocks is N (1 to N). For example, Table 3 shows that the number of polishing zones is 3 (1^, L2, and L3), and the number of grinding blocks is N (1 to N). Tables 1 to 3 The 〇 symbol indicates the position at which the polishing head is located. The plate is ground in the order of the polishing heads (〗 〖, 2, ... N) arranged in the X direction. The diameter of each polishing head and the plate in the γ direction The size obtained by dividing the size by the number of divisions of the zone is substantially the same, that is, in the case of two polishing heads, it can be set to about 1/2 of the diameter of the γ direction of the plate, and in the case of three polishing heads. It is set to about 1 / 3. The grinding head of the jth, kth, and Nth stages (final stage) which is the last step of the grinding step is preferably dispersed in the γ direction. When the position of the polishing block in the X direction is set to X The position of the polishing zone in the γ direction is set to y (where X is an integer of 1 to N, y is an integer, N is the number of polishing blocks Μ is the number of polishing zones) 'The grinding amount of each polishing head is set Is ρ(χ:, y) 'The amount of grinding PL(y) of each polishing zone is expressed by the following formula: [1] and (7)=Σρμ 1 [Table 1] 1 2 3 4 5 • » · Ν-5 Ν-4 Ν- 3 Ν-2 Ν-1 Ν Li υ 〇〇〇〇〇Ο Ο Ο Ο 〇 L2 〇 [Table 2] 1 2 3 4 5 « · · Ν-5 Ν-4 Ν-3 Ν-2 Ν-1 Ν Li υ 〇〇〇〇〇Ο 〇〇〇 L2 〇〇 [Table 3] _ 1 2 3 4 5 • » · Ν-5 Ν-4 Ν-3 Ν-2 Ν-1 Ν Li CJ 〇〇〇〇Ο Ο 〇〇〇 L2 υ 〇〇〇 L3 〇〇 153067.doc -] 6 - 201130605 The rut is applied to the case where the area of the plate is large. Specifically, it is preferably a glass plate of the seventh generation (1900 x 2200 mm) or more. As the size of the glass plate, it is more preferable to apply the 8th generation (22〇〇 mmx2400 mm), the 9th generation (2400 mm><2800 mm), or the 1st generation (2800 mmx3000 mm). The same effect can be obtained as long as the area is substantially the same as or larger than the above size. In the present invention, it is important to remove all or almost all of the surface defects at a specific time. That is, if the polishing is performed for a long period of time, it is easy to remove the surface defects', but it is important to complete the desired polishing in a limited step time.
尤其對於表面品質高之高精細FPD用之玻璃板，存在所 研磨量增加之傾向’儘管如此，本發明意義在於：於特 疋之步驟時間之内完成-定品質之研磨作業。基本上，每 個區帶之玻璃之搬送方向(χ方向)上之研磨頭之個數(或者 研磨墊之直控尺寸X個數（χ方向上設置之個數））成為實際 之研磨能力之指數。 例如，列舉「0.5 分鐘」之數值作為整體步驟之研磨 能力指數。若增加χ方向之研磨頭之數目則研磨能力當然會 與其成比㈣上升。本發明中’基本上使每個研磨頭之研 磨能力為最大，且久;^ 且各研磨頭之研磨壓力或旋轉數於可能之 ，圍内歧為最大。於調整¥方向、即每個研磨區帶之研磨 里之比率時，並不需要降低研磨區帶之研磨能力，而設定 為整體步驟上顯示出齡古+ m ^ 車乂问之研磨旎力。其原因在於：於並 非以此方式設定之彳杳犯卩士 . Μ肜％，整體步驟之處理量會降低。例 J53067.doc 17- £ 201130605 如，藉由本發明能夠進行100塊/小時之研磨。其中，較佳 為因應品種或所要求之研磨特性，使各段之研磨墊之特性 發生變化。 本發明藉由以上述方式分散配置研磨頭，而能夠在短時 間内问效且大量地對作為被研磨對象物之大型玻璃板進行 研磨。 由浮式法衣造且被切斷為特定尺寸之玻璃板G，係將非研 磨對象面吸附保持於接著在工作台2之吸附薄片3上，且藉 由移動機構（未圖示）而連續地搬送至研磨裝置1〇。研磨裝置 1 〇中，如圖2所不，藉由針對每個研磨區帶加權及配置之複 數個研磨頭5之圓形研磨具4來研磨玻璃板G。上述玻璃板g 以條紋方向與X方向大致平行之方式配置於吸附薄片3上。 研磨頭5如®1所示，包括使圓形研磨具4旋轉之主轴卜 主—軸6之上端安裝於藉由氣紅7而上下移動之固定台8。氣虹 7女衣於由導執、滾珠螺桿、馬達等構成之移動機構9，且 設置成可朝向圖1所示之箭頭Y方向移動。 错由該構成，於本發明之研磨裝置1〇中，如圖3所示，可 使圓形研磨具4自玻璃糾上之A側向_移動或自B側向A 側移動。 再者’於本實施形態中，移動機構9由導軌、滾珠螺桿 馬達等構成’但本發明並不限於該構成，只要為可使研, 頭5向特定之位置移動之構播 切及機構即可，可利用鏈條、皮帶、； 社、齒輪等各種移動機構。 ‘ 於上述固定台8,將凸型銷 土硐u朝向下方設置於4點，夾4 I53067.doc 201130605 固定台8而於凸型銷η之相反側安t有固定用氣紅i2。凸型 銷11如圖5所示，藉纟氣缸7之活塞7入使固定台8下降至加工 2置為止，從而與設置於定位用軌道13上之凹型銷“嵌 合。若凸型銷U嵌合於凹型銷14，則固定用氣缸12之活塞 A上升攸而活塞12A之上端抵接於移動機構9。藉由其反 作用力，凸型銷！！被按壓至凹型銷14，因而氣虹7相對於移 動機構9之移動受到限制。藉此，主軸6被固定於藉由凹型 銷14而決定之所期望之位置。 再者，於本實施形態中，藉由凸型銷u、固定用氣缸& 凹型销14將主軸6固定於所期望之位置，但本發明並不限於 6亥構成，亦可藉由線性馬達、齒條與小齒輪機構等移動機 構使主軸移勤，並且固定於任意之位置。藉此，能夠於複 數個研磨區帶配置任意數目之研磨具4，且研磨具4亦可配 置成越過研磨區帶而進行自轉及/或公轉。 友於本發明之研磨裝置中，另外設置有對主軸仏旋轉、 孔或口疋用乳缸12之驅動、藉由移動機構9完成之氣缸7 之移動等進行控制之控制機糾。藉由該等機構研磨頭 之位置之設定變更根據數目或配置之組合而定，但於約5 分鐘以内便能夠完成。 ~ a t g ^磨步驟之具體作業之流程製成流程圖（圖 )則使用表不圓形研磨具4、4…之移動狀況之俯視圖(圖 7)對本發明之研磨方法進行說明。 於本發明之研磨方法 名力决中’首先能夠藉由檢查步驟S1或成 幵"驟（刖步驟）之官理資料，預先知曉成形時所產生之玻璃 153067.doc 201130605 板^表面缺pg之分佈f料。然後，能夠根據該表面缺陷之統 。十貝料找出研磨條件。於上述檢查步驟S1中，在與玻璃板 之條紋方向（成形時之移動方向）相同之方向1，使玻璃板移 動而進仃表面缺陷之檢查。作為檢查步驟si中之檢測機 構可使用利用有雷射光或指向性光束之光學式檢查裝置。 :藉由移動機構使玻璃板G通過檢測機構之下方時，獲得 關於玻璃板G上之表面缺陷之位置、大小、深度、種類（損 傷、起伏）等表面缺陷之資訊。所獲得之資訊被送至記錄機 構中且加以記錄（步驟S2)。 就玻璃板G之檢查而言，只要為光學式之檢查裝置，藉由 對拍攝玻璃板G所得之圖像進行圖像處理而 查裝置，或接觸式檢查裝置等獲得關於表面缺陷之 檢查裝置，則可使用各種檢查裴置。χ，亦可為藉由操作 員之目視進行之檢查，於該情形時，以手動將關於表面缺 陷之資訊輸入至記錄機構。 繼而，使配置有複數個之圓形研磨具4(研磨頭5)根據表 面缺陷之資訊而移動（步驟S3)。 於玻璃板G上存在表面缺陷之情形時，其資訊於檢查步驟In particular, in the case of a glass plate for a high-precision FPD having a high surface quality, there is a tendency that the amount of polishing increases. Despite this, the present invention is intended to complete the polishing operation of a predetermined quality within the step time of the special process. Basically, the number of polishing heads in the direction of transport (the direction of the glass) of each zone (or the number of direct control dimensions of the polishing pad X (the number set in the direction of the ))) becomes the actual grinding ability. index. For example, the value of "0.5 minutes" is listed as the index of the grinding capacity of the overall step. If the number of grinding heads in the χ direction is increased, the grinding ability will of course rise in proportion to (4). In the present invention, 'the grinding ability of each of the polishing heads is substantially maximized and long; and the grinding pressure or the number of rotations of each of the polishing heads is possible, and the internal friction is maximum. When adjusting the direction of the ¥, that is, the ratio of the grinding in each of the grinding zones, it is not necessary to reduce the grinding ability of the grinding zone, and it is set as the overall step to show the grinding force of the age + m ^ 乂. The reason is that if you don't set a swearing gentleman in this way, Μ肜%, the overall amount of processing will be reduced. Example J53067.doc 17- £ 201130605 For example, 100 pieces/hour of grinding can be performed by the present invention. Among them, it is preferred that the characteristics of the polishing pads of the respective stages are changed in accordance with the variety or the required polishing characteristics. According to the present invention, by disposing the polishing head in the above-described manner, it is possible to polish a large-sized glass sheet as an object to be polished in a short time. The glass plate G which is made of a floating method and cut into a specific size is obtained by adsorbing and holding the non-polishing surface on the adsorption sheet 3 next to the table 2, and continuously by a moving mechanism (not shown). Transfer to the polishing apparatus 1〇. In the polishing apparatus 1 , as shown in Fig. 2, the glass sheet G is ground by a circular grinding tool 4 of a plurality of polishing heads 5 weighted and arranged for each polishing zone. The glass plate g is disposed on the adsorption sheet 3 such that the stripe direction is substantially parallel to the X direction. The polishing head 5, as shown in Fig. 1, includes a spindle which rotates the circular abrasive tool 4, and the upper end of the shaft 6 is attached to a fixed table 8 which is moved up and down by the gas red 7. The gas rainbow 7 is a moving mechanism 9 composed of a guide, a ball screw, a motor, or the like, and is provided to be movable in the direction of the arrow Y shown in Fig. 1 . According to this configuration, in the polishing apparatus 1 of the present invention, as shown in Fig. 3, the circular polishing tool 4 can be moved from the A side of the glass to the A side or from the B side to the A side. Further, in the present embodiment, the moving mechanism 9 is constituted by a guide rail, a ball screw motor or the like. However, the present invention is not limited to this configuration, and is a configuration and mechanism for moving the head 5 to a specific position. Yes, various moving mechanisms such as chains, belts, and clubs can be used. ‘In the above-mentioned fixed table 8, the convex pin 硐u is placed downward at 4 o'clock, and the fixed table 8 is clamped on the opposite side of the male pin η, and the fixed gas red i2 is fixed. As shown in Fig. 5, the male pin 11 is engaged with the piston 7 of the cylinder 7 to lower the fixing table 8 until the machining 2 is placed, so as to be "fitted with the female pin provided on the positioning rail 13. If the male pin U is engaged. When the concave pin 14 is fitted, the piston A of the fixing cylinder 12 rises and the upper end of the piston 12A abuts against the moving mechanism 9. By the reaction force, the convex pin!! is pressed to the concave pin 14, and thus the gas rainbow 7 The movement of the moving mechanism 9 is restricted. Thereby, the main shaft 6 is fixed to a desired position determined by the concave pin 14. Further, in the present embodiment, the convex pin u and the fixing are used. The cylinder & concave pin 14 fixes the main shaft 6 at a desired position, but the present invention is not limited to the configuration of 6 hai, and the main shaft can be moved by a moving mechanism such as a linear motor, a rack and a pinion mechanism, and fixed to Any number of polishing tools 4 can be disposed in a plurality of polishing zones, and the polishing tool 4 can also be configured to rotate and/or revolve across the polishing zone. , additionally set to rotate the spindle, hole or The control machine is controlled by the driving of the milk cylinder 12, the movement of the cylinder 7 by the moving mechanism 9, etc. The setting of the position of the polishing head by the mechanism is changed according to the number or the combination of the configurations, but It can be completed in about 5 minutes. ~ Atg ^ The flow of the specific operation of the grinding step is made into a flow chart (Fig.). The polishing of the present invention is carried out using a top view of the movement of the non-circular grinding tools 4, 4... (Fig. 7). The method of the present invention is described above. In the first step of the inspection method, the glass of the 153067.doc 201130605 board can be known in advance by examining the official data of the step S1 or the 幵 幵 刖 step. ^The surface lacks the distribution of pg. Then, it is possible to find the polishing conditions according to the surface defects. In the above-mentioned inspection step S1, it is the same as the stripe direction of the glass sheet (the moving direction during molding). In the direction 1, the glass plate is moved to check the defects of the surface. As the detecting mechanism in the inspection step si, an optical inspection device using a laser beam or a directional beam can be used: by moving When the mechanism passes the glass sheet G through the lower side of the detecting mechanism, information on the surface defects such as the position, size, depth, type (damage, undulation) of the surface defects on the glass sheet G is obtained. The obtained information is sent to the recording mechanism. And the recording is performed (step S2). As for the inspection of the glass plate G, as long as it is an optical inspection device, the image obtained by photographing the glass plate G is subjected to image processing to check the device, or the contact inspection device, etc. For inspection devices for surface defects, various inspection devices can be used. Alternatively, inspections can be performed by visual inspection by an operator, in which case information on surface defects is manually input to the recording mechanism. The circular abrasive tool 4 (the polishing head 5) configured with a plurality of pieces is moved in accordance with the information of the surface defects (step S3). When there is a surface defect on the glass plate G, the information is in the inspection step.
Si之段階取得。控制機構15根據表面缺陷之資訊，以將圓 形研磨具4於比起表面缺陷較少之位置而表面缺陷更多地 存在之研磨區帶相對多地配置之方式’藉由移動機構9使圓 形研磨具4於Y方向上移動。 通常，研磨頭5成為凸型銷η與凹型銷14嵌合，且固定 氣缸12之活塞12A上升之狀態（圖5)。於使研磨頭$移動2 J53067.doc -20- 201130605 形時，使活塞12A下降以解除按麼狀態，纟且使氣缸7之活 塞7A上升以解除凸型銷u與凹型銷14之嵌合狀態（圖工）。 其次，使氣紅7沿著移動機構9水平移動，使研磨頭5自玻 璃板G上之研磨區帶La側向研磨區帶^側移動，或自研磨 區帶LB側向研磨區帶La側移動（圖3)。而且，再次驅動氣缸 7 口疋用孔缸12而將凸型銷j j與凹型銷14設為嵌合狀態 (圖 5)。 繼而，使關7之（7_2)及（7_3)對圓形研磨具4(研磨頭5) 之移動之-例進行說明。如（7_2)所示，當於玻璃板G上之 研磨區仏側產生多個表面缺陷17時，使位於研磨區帶b 側之2個圓形研磨具4(研磨頭5)向研磨區帶“側移動，藉由 5個圓形研磨具4來對研磨區帶“側之破璃板g進行研磨。 例如’於研磨區帶LB側所產生之玻璃板G之起伏為研磨區 ，側所產生之起伏之3倍之情形時，於玻璃板^研磨區 A側之區域需要更大之研磨力。因此，以研磨區帶Lb側 ::磨力為研磨區帶之3倍之方式，藉由控制機構15 Γ 頭5所需之數目’進行研磨頭5之Y方向之移動與固 定。 其次’依據以成為適合於研磨對象之玻璃板〇之研磨條件 =式料加權之以，_邊利用搬送裝置將玻璃板 ° L 邊利用複數個圓形研磨具4(研磨頭）連續地 進行研磨（步驟S4)。 =上述例之情形時’藉由於研磨區帶Lb側更多地配置之 0形研磨具4 ' 4.，研麻F册 "研磨側之研磨能力提高，能夠 153067.docThe stage of Si is obtained. The control mechanism 15 aligns the circular abrasive device 4 with a relatively large number of polishing zones in which the surface defects are more present than the surface defects are less than the information of the surface defects. The shaped abrasive tool 4 moves in the Y direction. Normally, the polishing head 5 is in a state in which the male pin η is fitted into the female pin 14 and the piston 12A of the fixed cylinder 12 is raised (Fig. 5). When the grinding head $ is moved by 2 J53067.doc -20-201130605, the piston 12A is lowered to release the pressing state, and the piston 7A of the cylinder 7 is raised to release the fitting state of the male pin u and the female pin 14. (Photographer). Next, the gas red 7 is horizontally moved along the moving mechanism 9, so that the polishing head 5 moves from the side of the polishing zone La on the glass plate G to the side of the polishing zone, or from the side of the polishing zone LB to the side of the polishing zone. Move (Figure 3). Further, the cylinder port hole cylinder 12 is driven again to form the male pin j j and the female pin 14 in a fitted state (Fig. 5). Next, an example in which the movement of the circular polishing tool 4 (the polishing head 5) is performed by (7_2) and (7_3) of the closing 7 will be described. As shown in (7_2), when a plurality of surface defects 17 are generated on the side of the polishing zone on the glass sheet G, the two circular abrasives 4 (the polishing heads 5) on the side of the polishing zone b are brought to the polishing zone. "Side movement, grinding the side of the glass strip g of the grinding zone by five circular grinding tools 4. For example, when the undulation of the glass sheet G generated on the side of the polishing zone LB is the polishing zone and the undulation of the side is three times, a larger grinding force is required in the region on the side of the glass plate. Therefore, the movement and fixation of the polishing head 5 in the Y direction are performed by the number "the required amount of the head 5 of the control mechanism 15" so that the grinding zone Lb side :: grinding force is three times that of the polishing zone. Next, 'the grinding condition of the glass plate which is suitable for the object to be polished=the weight of the formula is used, and the glass plate L is continuously ground by a plurality of circular polishing tools 4 (polishing heads) by the conveying device. (Step S4). = In the case of the above example, the 0-shaped abrasive tool 4' is more arranged by the Lb side of the polishing zone, and the grinding ability of the grinding side is improved, which can be 153067.doc
-21 - S 201130605 更快速地將玻璃板G之表面缺陷17去除。 於進行研磨（步驟S4)後，再次進行與檢查步㈣相同之 玻璃板G之檢查（步驟S5)。對表面缺陷之研磨不存在問題之 玻璃板G結束研磨步驟，對研磨不充分之玻璃板g再次於步 驟S4中進行研磨。 — 如以上。兒明觳，根據本發明之研磨方法及研磨裝置，根 據於玻璃板G上產生之表面缺陷17之資訊，最佳配置研磨裝 置之複數個研磨頭5’藉此比起將研磨能力設為均一之先前 之研磨方法，能夠更有效地進行研磨。 再者，本實施形態中研磨頭5係配置為玻璃板G上之研磨 區帶LA側與研磨區帶Lb側之2行，但本發明並不限於此，亦 可根據玻璃板G之表面缺陷而將研磨區帶排列為3行以上。 又田將X方向（板狀物之搬送方向）上之研磨區塊分割數 設為N時，較佳為使最下游區塊之研磨頭之自轉中心及/或 公轉中心、與位於自最下游區塊算起丨〜3區塊上游側之研磨 頭中之至J 一個之自轉中心及/或公轉中心，不位於板狀體 搬送方向（X方向）之同一平行線上。 於本發明之研磨裝置中，最下游之研磨區塊或最下游之2 個研磨區塊中之研磨係為了將板狀體之被研磨面之損傷去 除而進行。將該研磨稱作「去除損傷研磨」，並將進行去除 才貝傷研磨之區塊稱作「去除損傷研磨區塊（defect removing zone)」。並且’將鄰接於最下游區塊之上游側之1〜3之研磨 區塊稱作「去除條紋研磨區塊（streak rem〇ving z〇ne)」，進 行用以去除上述研磨不均之研磨。 153067.doc -22- 201130605 因此’當將板狀體搬送方向（x方向）之研磨區塊數設為 N，最上游之區塊設為Z,，自最上游算起第2個區塊設為Z2, 敢下游设為ZN時，單個區塊ZN或區塊zN及zN.]之2區塊成為 去除損傷研磨區塊。而且’於鄰接於最下游區塊之上游側 之1〜3之研磨區塊，即該去除損傷研磨區塊僅為區塊Zn之情 形時’ ZN·3〜ZNqiS區塊成為去除條紋研磨區塊，於該去除 損傷研磨區塊為區塊ZN及Ζν^之2區塊之情形時，Zn 4〜Zn 之2區塊成為去除條紋研磨區塊。而且，較佳為位於該去除 條紋研磨區塊之研磨頭中之至少一個之自轉中心及/或公 轉中心與其下游側之去除損傷研磨區塊之研磨頭之自轉令 心及/或公轉中心不位於板狀體搬送方向（χ方向）之平行線 上。 圖19表示以上述方式構成之研磨裝置之例。於該例中， 將區帶之分割數設為2而設置有第！區帶La與第2區帶Lb，表 示出最下游之研磨區塊zN與一個上游側之研磨區塊Zn」。而 且，ZN為去除損傷研磨區塊，Znis定為去除條紋研磨區 塊。如該圖所示，去除條紋研磨區塊之圓形研磨具4(研 磨頭5)之旋轉中心（自轉中心及/或公轉中心）與去除損傷研 磨區塊zN之圓形研磨具4(研磨頭5)之旋轉中心（自轉中心及/ 或公轉中心）並不重合，且不位於X方向之同一平行線上。 藉此，去除條紋研磨區塊中之被研磨區域被分散，可去除/ 減小板狀體之被研磨面之特定之部位所產生之研磨不均 (研磨條紋）。 為了去除/減小研磨不均（研磨條紋），除了將去除條紋研 153067.doc -23- 201130605 磨區塊中之圓形研磨具（研磨頭）之位置錯開之上述方法以 外，亦可使圓形研磨具(研磨頭)於¥方向(與板狀體搬送方 向橫切之方向）上往復運動，又，亦可使與去除條紋研磨區 塊令之圓形研磨具（研磨頭）相對向之位置之板狀體搬送機 構（工作台2)於γ方向（與板狀體搬送方向橫切之方向）上往 復運動。 已參照詳細且特定之實施態#對本巾請案進行了說明， 但業者應當明白不脫離本發明之精神與範圍可添加各種變 更或修正。 本申請案基於2009年12月18曰申請之曰本專利申請案 (日本專利特願2〇〇9_288〇〇5)，其内容以參照方式併入本文 中。 【圖式簡單說明】 圖1係朝向玻璃板之移動方向觀察本發明之連續式研磨 裝置之研磨頭之側視圖； 圖2係自相對於玻璃板之移動方向為垂直之方向觀察研 磨頭之側視圖； 圖3係使研磨頭自a側向]b側移動之側視圖； 圖4係於2研磨區帶設置研磨頭之情形時之模式性平面 圖5係表示研磨頭之固定狀態之側視圖； 圖6係本發明之研磨方法之流程圖； 圖7((7-1)〜(7-3))係表示本發明中之研磨頭之設定狀況之 俯視圖； 153067.doc •24· 201130605 圖8係表示先前之研磨褒置之立體圖； 圖9係表示先前夕^ 研磨裝置之研磨狀態之俯視圖； 圖10係表示針對★政 發明中之玻璃板之研磨材料之設定 法（2行研顧”之模相； 圖11係表不先前例之相等之研磨材料之 性剖面圖； 〜保八 明之研磨材料（2研磨區帶）之設定之模 明之研磨材料（3研磨區帶）之設定之模 圖12係表示本發 式性剖面圖； 圖13係表示本發 式性剖面圖； 明之研磨材料（3研磨區帶）之設定 圖14係表示本發 之模 式性剖面圖； 圖5係表不本發明中 呵厲材科之重豐分佈之狀態之模 式性剖面圖； 力 例之模式 圖16係表示本發明巾 % Θ甲之研磨頭之分散配置之一 性俯視圖； 之 土圖i 7⑷〜⑷係表示本發明中之研磨材料之分佈與研磨 月’J後之狀態之模式性剖面圖； 驟及緩冷步驟之概要之模式 圖1 8係表示浮式法之成形步 性俯視圖；及 圖19係表示本發明之研磨裝 名衣置之一例之模式圖 【主要元件符號說明】 研磨裝置 研磨頭 1、10-21 - S 201130605 Remove the surface defect 17 of the glass plate G more quickly. After the polishing (step S4), the inspection of the glass sheet G identical to the inspection step (4) is performed again (step S5). The glass plate G which has no problem in the polishing of the surface defects ends the polishing step, and the glass plate g which is insufficiently polished is polished again in the step S4. — as above. According to the polishing method and the polishing apparatus of the present invention, according to the information of the surface defects 17 generated on the glass sheet G, the plurality of polishing heads 5' of the polishing apparatus are optimally arranged, thereby setting the grinding ability to be uniform. The previous grinding method enables grinding to be performed more efficiently. Further, in the present embodiment, the polishing head 5 is disposed in two rows of the polishing zone LA side and the polishing zone Lb side on the glass plate G. However, the present invention is not limited thereto, and may be based on the surface defect of the glass plate G. The polishing zones are arranged in three rows or more. When the number of divisions of the polishing block in the X direction (the direction in which the plate is conveyed) is N, it is preferable to make the rotation center and/or the revolution center of the polishing head of the most downstream block and the downstream The block counts from the grinding head on the upstream side of the 丨3 block to the rotation center and/or the revolution center of J, and is not located on the same parallel line of the plate-like conveying direction (X direction). In the polishing apparatus of the present invention, the polishing in the most downstream polishing block or the two most downstream polishing blocks is performed in order to remove the damage of the polished surface of the plate-like body. This polishing is referred to as "de-damage grinding", and the block in which the ball-removal is removed is referred to as "defect removing zone". Further, the polishing block of 1 to 3 adjacent to the upstream side of the most downstream block is referred to as "streak rem〇ving block", and polishing for removing the uneven polishing is performed. 153067.doc -22- 201130605 Therefore, 'when the number of polishing blocks in the direction of transport of the plate-shaped body (x direction) is N, the block in the most upstream is set to Z, and the second block is set from the most upstream. For Z2, when the downstream is set to ZN, the 2 blocks of the single block ZN or the blocks zN and zN.] become the damaged damage grinding block. Moreover, the 'ZN·3~ZNqiS block becomes a stripe-grinding block when the grinding block adjacent to the upstream side of the most downstream block is 1 to 3, that is, the case where the damage-removed block is only the block Zn. In the case where the damage-removed polishing block is the block of the block ZN and the Ζν^, the 2 blocks of Zn 4 to Zn become the stripe-polishing block. Moreover, it is preferable that the rotation center and/or the revolution center of the polishing head of the at least one of the polishing heads of the stripe-removing block and the revolving center and the downstream side of the grinding head are not located. Parallel lines of the plate-like conveying direction (χ direction). Fig. 19 shows an example of a polishing apparatus constructed as described above. In this example, the number of divisions of the zone is set to 2 and the number is set! The zone La and the second zone zone Lb indicate the most downstream grinding zone zN and one upstream side grinding zone Zn". Moreover, ZN is to remove the damaged grinding block, and Znis is determined to remove the striped grinding block. As shown in the figure, the circular center of the circular abrasive device 4 (the polishing head 5) of the stripe polishing block (the rotation center and/or the revolution center) and the circular abrasive tool 4 for removing the damage polishing block zN (the polishing head) 5) The rotation centers (rotation centers and/or revolution centers) do not coincide and are not located on the same parallel line in the X direction. Thereby, the portion to be polished in the stripe-polished block is removed, and the unevenness (grinding stripe) generated by the specific portion of the surface to be polished of the plate-like body can be removed/reduced. In order to remove/reduce uneven grinding (grinding streaks), in addition to the above method of removing the position of the circular grinding tool (grinding head) in the grinding block 153067.doc -23- 201130605 grinding block, the circle may be made The shaped abrasive (grinding head) reciprocates in the direction of the ¥ (the direction transverse to the direction in which the plate is conveyed), and may also be opposite to the circular abrasive (grinding head) which removes the striped polishing block The position plate conveyance mechanism (stage 2) reciprocates in the γ direction (the direction transverse to the plate-like conveyance direction). The present invention has been described with reference to the detailed and specific embodiments. However, it should be understood that various changes or modifications may be added without departing from the spirit and scope of the invention. The present application is based on a patent application filed on Dec. 18, 2009, the disclosure of which is hereby incorporated by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view of the polishing head of the continuous grinding apparatus of the present invention as seen in the direction of movement of the glass sheet; Fig. 2 is a side view of the polishing head viewed from a direction perpendicular to the direction of movement of the glass sheet Fig. 3 is a side view showing the movement of the polishing head from the side a to the side b; Fig. 4 is a side view showing the state in which the polishing head is fixed in the case where the polishing head is provided in the 2 polishing zone; Figure 6 is a flow chart of the polishing method of the present invention; Figure 7 ((7-1) to (7-3)) is a plan view showing the setting state of the polishing head in the present invention; 153067.doc •24· 201130605 Figure 8 Fig. 9 is a plan view showing the state of grinding of the arbitrarily polished device; Fig. 10 is a view showing the setting method of the abrasive material for the glass plate in the invention of the invention (2 rows of research) Fig. 11 is a cross-sectional view showing the same as the abrasive material of the previous example; the pattern of the set abrasive material (3 grinding zone) set by the abrasive material (2 polishing zone) of Bao Baoming 12 series indicates the hair profile Figure 13 is a cross-sectional view of the present invention; the setting of the abrasive material (3 polishing zone) is shown in Figure 14 as a schematic cross-sectional view of the present invention; Figure 5 is a representation of the heavy material of the present invention. Schematic cross-sectional view of the state of distribution; mode of the force diagram Fig. 16 is a top plan view showing the dispersed configuration of the polishing head of the present invention; the soil map i 7(4) to (4) shows the abrasive material of the present invention. Schematic cross-sectional view of the state after distribution and grinding month J; schematic diagram of the outline of the step and the slow cooling step FIG. 1 is a plan view showing the forming step of the floating method; and FIG. 19 is a view showing the name of the grinding machine of the present invention. Schematic diagram of one example [Description of main component symbols] Grinding heads 1, 10
2 ' ...N J53067.doc .25. £ 201130605 2 工作台 3 吸附薄片 4 圓形研磨具 5 研磨頭 6 主軸 7 氣缸 7A、12A 活塞 8 固定台 9 移動機構 11 凸型銷 12 固定用氣缸 13 定位用軌道 14 凹型銷 15 控制機構 17 表面缺陷 40 流量調節閥 42 流槽 50 ' 51 攝像裝置 52 熔融金屬 53 浮法槽 54 熔融玻璃 56 頂輥 60 提昇輥 62 緩冷爐 -26- 153067.doc 201130605 64 層輥 70 切斷裝置 D 直徑 Fd 成形時之移動方向 G 玻璃板 GR 玻璃帶 L 移動中心線 La、Lb 研磨區帶 N、N-l、N_2 段 P!、P2、P3、PM 每個研磨區帶所獲 Pr 表面缺陷較多之研 Pl 表面缺陷較少之研 Td 玻璃板之厚度方向 W 寬度 X、Y 方向 ZN 去除損傷研磨區塊 ZN-1 去除條紋研磨區塊2 ' ...N J53067.doc .25. £ 201130605 2 Table 3 Adsorption sheet 4 Round grinding tool 5 Grinding head 6 Spindle 7 Cylinder 7A, 12A Piston 8 Fixing table 9 Moving mechanism 11 Convex pin 12 Fixing cylinder 13 Positioning rail 14 Concave pin 15 Control mechanism 17 Surface defect 40 Flow regulating valve 42 Flow cell 50 ' 51 Imaging device 52 Molten metal 53 Float groove 54 Molten glass 56 Top roller 60 Lifting roller 62 Slow cooling furnace -26- 153067. Doc 201130605 64 Roller 70 Cutting device D Diameter Fd Direction of movement during forming G Glass plate GR Glass tape L Moving center line La, Lb Grinding zone N, Nl, N_2 Segment P!, P2, P3, PM Each grinding The surface defects of the Pr surface obtained by the zone are less. The surface defects of the Td glass plate are less. W Width X, Y direction ZN Removal damage Grinding block ZN-1 Stripe grinding block
I 153067.doc -27-I 153067.doc -27-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009288005 | 2009-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201130605A true TW201130605A (en) | 2011-09-16 |
Family
ID=44167367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099144600A TW201130605A (en) | 2009-12-18 | 2010-12-17 | Method and apparatus for polishing plate-like material |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5637147B2 (en) |
| KR (1) | KR20120115272A (en) |
| CN (1) | CN102666010A (en) |
| TW (1) | TW201130605A (en) |
| WO (1) | WO2011074615A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101381673B1 (en) * | 2011-07-27 | 2014-04-14 | 주식회사 엘지화학 | Polishing Apparatus of Novel Structure |
| CN103433830A (en) * | 2013-08-12 | 2013-12-11 | 西安轨道交通装备有限责任公司 | Polishing and rust removing machine for iron roof of passenger vehicle |
| CN104308685A (en) * | 2014-10-17 | 2015-01-28 | 王秀云 | Grinder for mechanical parts |
| JP6441056B2 (en) * | 2014-12-10 | 2018-12-19 | 株式会社ディスコ | Grinding equipment |
| CN107068544A (en) * | 2016-12-28 | 2017-08-18 | 重庆晶宇光电科技有限公司 | The Ginding process of chip |
| CN108838853A (en) * | 2018-05-23 | 2018-11-20 | 维达力实业(深圳)有限公司 | Burnishing device and method |
| CN109227256A (en) * | 2018-11-13 | 2019-01-18 | 安徽同步自动化科技有限公司 | A kind of aluminosilicate fiberboard automatic grinding machine |
| CN114683113B (en) * | 2022-05-31 | 2022-09-27 | 江苏振宁半导体研究院有限公司 | Vehicle-mounted display screen polishing device stable in operation |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2690253B2 (en) * | 1992-12-11 | 1997-12-10 | 日立造船株式会社 | Polishing device for image display surface in display device |
| JPH06292904A (en) * | 1993-04-12 | 1994-10-21 | Sumitomo Metal Ind Ltd | Method for cold rolling hot rolled steel strip and surface grinding line |
| JPH09103943A (en) * | 1995-08-02 | 1997-04-22 | Sumitomo Metal Ind Ltd | Grinding device and method for inspecting steel plate surface |
| JP4862404B2 (en) * | 2006-01-20 | 2012-01-25 | 旭硝子株式会社 | Method and apparatus for polishing glass substrate for FPD |
| CN1830621A (en) * | 2006-04-14 | 2006-09-13 | 河南安彩高科股份有限公司 | Grinding equipment of plate material and grinding method |
| CN101357447A (en) * | 2008-09-02 | 2009-02-04 | 河南安飞电子玻璃有限公司 | Plate glass surface grinding device and method |
-
2010
- 2010-12-15 KR KR1020127015688A patent/KR20120115272A/en not_active Application Discontinuation
- 2010-12-15 JP JP2011546154A patent/JP5637147B2/en not_active Expired - Fee Related
- 2010-12-15 WO PCT/JP2010/072587 patent/WO2011074615A1/en active Application Filing
- 2010-12-15 CN CN2010800576887A patent/CN102666010A/en active Pending
- 2010-12-17 TW TW099144600A patent/TW201130605A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011074615A1 (en) | 2013-04-25 |
| CN102666010A (en) | 2012-09-12 |
| JP5637147B2 (en) | 2014-12-10 |
| KR20120115272A (en) | 2012-10-17 |
| WO2011074615A1 (en) | 2011-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201130605A (en) | Method and apparatus for polishing plate-like material | |
| TWI435852B (en) | Crossing Method and Segmentation Method of Fragile Material Substrate | |
| TWI480127B (en) | Glass substrate and its production method | |
| JP5162640B2 (en) | Sheet glass conveying device and chamfering device equipped with the same | |
| CN103659572B (en) | Edge grinding apparatus and method for grinding a glass substrate | |
| JP6190108B2 (en) | Polishing apparatus and polishing method for polishing peripheral edge of workpiece such as plate glass with polishing tape | |
| JP2015091610A (en) | Glass plate end surface treatment method | |
| US11389919B2 (en) | Methods for strengthening edges of laminated glass articles and laminated glass articles formed therefrom | |
| KR100895830B1 (en) | Method for cutting the edge of the flat display glass substrate | |
| CN1447152A (en) | Mfg. appts. and method of liquid crystal display panel | |
| TWI648232B (en) | Glass plate manufacturing method and glass plate manufacturing device | |
| JP6011627B2 (en) | Glass substrate polishing method | |
| CN1826208A (en) | Methods and apparatus for edge finishing glass sheets | |
| CN105290912A (en) | Glass plate manufacturing method and glass plate manufacturing apparatus | |
| TW201912605A (en) | Method for manufacturing plate glass | |
| JP2011140409A (en) | Glass substrate and method for manufacturing the same | |
| KR100964328B1 (en) | Scribing apparatus and method | |
| KR101226953B1 (en) | Apparatusfor polishing substrates | |
| TW201328818A (en) | Glass plate-polishing device |