201111803 • 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種用以連接半導體裝置至測試裝置 之連接單元及測試機，特別係有關於一種用以連接半導體 裝置至測試裝置之連接單元以及具有此連接單元之測試 機。 【先前技術】 半導體裝置係一種電子裝置其上有半導體基板具有許 多彼此電性連接之積體電路晶片，舉例來說，半導體裝置 包括圮憶體裝置（memory device)w動態隨機存取記憶體 (DRAM)裝置及靜態隨機存取記憶體（SRAM)裝置。 半導體裝置通常是在薄的單晶石夕基板如晶圓—Μ) 之半導體基板上製造，其間經過一連串的單元製程（unH processes)如工廠製程（fab pr〇cess)、接合製程（b〇nding process)、封膠製程（m〇lding pr〇cess)及測試製程 (testmg process)。具有不同電子電路及導電結構之電子 晶片經由工廠製程於單晶矽晶圓上製作，每一晶片獨立各 自刀離再，，工由接合製程接合至基本基板（base substrate) 上，接著，接合後之晶片經由封膠製程而被環繞之外模體 (outer· mold body)所保護，最後，半導體裝置經過測試製 程之電性測試以檢驗其電子缺陷（electr〇nic faUures)。 一般來說’半導體裝置係透過測試機而連接至測試裳 置’在測試裝置中對半導體裝置進行電性測試。 [S] 5 201111803 測5式機包括測試腔體（tes1： chamber)，其間放置有測 试托盤（test tray )’測試盤上具有待測試裝置檢測之半導 體裝置’以及在測試腔體中用以將半導體裝置連接至測試 裝置之連接单元。 連接單元包括托盤轨道（t J· ay r a丨丨），測試托盤沿其而 在測試腔體中移動，複數個連接至配合板（match plate) 之推進器（pusher)在鄰接之測試粍盤的間隙空間（gap space)中朝測試托盤推動半導體裝置，以及驅動器（driver) 連接至配合板藉以驅動推進器推動半導體裝置。 …、:而，由於測試托盤於測試腔體中係垂直排列，故測 4製程係對著測試腔體中垂直排列之半導體裝置執行，當 人口板於測5式腔體中垂直向上及向下移動時，驅動器及配 合板因其自身重量而向下偏斜（deflected d〇wnward)，因 此’半導體裝置無法精確地由推進器在間隙空間中推動。 【發明内容】 依據-實施例，提供-種用以連接半導體裝置至測試 之連接單兀，其半導體裝置可由配合板之複數個推進 益準確地推動。 依據-實施例’提供-種測試機具有上述之連接單元。 ^據本發明之-實施例之概I本發明提供—種用以 半導體裝置至-職裝置之連接單元，連接單元包 :托盤執道設置於一測試腔體中’測試腔體與— 式裝置連接’包括複數個半導體裳置之至少一測試托盤沿 201111803 托盤轨道移動並面對著外部測試裝置. 著托盤軌道’測試托盤位於配；板及托=、：配合板面對 板包括複數個推進器，推進器分別將挪試托=間^合 裝置推向測試裝置，·至少一導 ^之半導體 壁鄰近於配合板及托盤軌道， 筋之内側 中移動之方闩μ仙 干/口配合板於測試腔體 中移動之方向延伸；以及至少一 導引桿。 ，、用以連接配合板及 一對準支架用以 具有半導體裝置 在一實施例中，連接單元更包括至少 連接托盤執道及導引桿’藉以將配合板與 之測試托盤對齊。 在一實施例中，設置有一對墓 置於對導料及-對對準支架設 置於托盤軌道之側部之兩角 ^ ^ ^ ^ 洛具中對準支架係以可移 右一一執道連接，即對準支架與托盤執道之間預留 門自由空間’使得托盤執道之熱膨脹和收縮可由自由空 間所吸收。 i中連接早兀更包括一驅動器用以驅動配 合板朝測試裝w s 置移動’驅動器包括一電源用以產生驅動 力’以及一電源傳送裝置用以將驅動力由電源傳遞至配合 電源傳送裝置具有—環狀部位於一末端鄰近於配合 板。舉例來說，艇叙哭s & , 兄驅動咨更包括一彈性元件，插設於電源傳 送裝置與配合拓 Μ 奴之間’藉由彈性元件使得配合板與測試托 盤平行。 在一實施例中 傳送裝置之外部， ’電源係設置於測試腔體之外側及電源 設置於測試腔體之外側的部份由一伸笮_ L 5 i 7 201111803 管所覆蓋。 K他例中，_ 一對配合板係分別面對一對測試技 盤，且連接單元更 ^枯至少—對第二導引桿，設置於測諸 腔體之内側壁並盘導_引_ τ 一等Μ杯平行，以及至少一對第二導引 架’分別連接配合柘 D板及第二導引桿。 依據本發明之_ ^ 貝知例之概念，本發明提供一種測叙 機包括上述之連技留一 任早疋。測試機包括一前製程腔，容納具 有複數個半導體# @ β 装置之一測試托盤’在半導體裝置進行電 性測試製程之前，半導 一 千等體裝置於前製程腔中加熱或冷卻至 或低酿，—測試腔體與前製程腔連接並與對半導體 置進行電！·生測式製程之一外部測試裝置連接，在進行電 性測4衣削，測試托盤由前製程腔移動至測試腔體；一 連接單兀s又置於測試腔體用以將測試托盤中之半導體裝置 j推向外邛測试裝置；以及一後製程腔與測試腔體連 接，在進行電性測試製程I，測試托Μ由測試腔體移動至 後IL私腔體’半導體裝置於後製程腔中由高溫或低溫回復 至至舰，其中，連接單元包括一托盤軌道設置於一測試腔 體中，測試腔體與外部測試裝置連接，&括複數個半導體 裝置之至少一測試托盤沿托盤軌道移動並面對著外部測試 裝置；至少一配合板面對著托盤軌道，測試托盤位於配合 板及柁盤軌道之間，配合板包括複數個推進器，推進器分 別將測試托盤中之半導體裝置推向測試裝置；至少一導引 桿設置於測試腔體之内側壁鄰近於配合板及托盤軌道，導 引桿沿配合板於測試腔體中移動之方向延伸；以及至少一 8 201111803 導引架用以連接配合板及導引桿。 根據本發明之實施例之連接單元及具有連接單元之則 :少-導引桿係設置於測試腔體之内側壁，且配合 中：半而沿導引桿線性地移動，，在測試把盤 f導體裝置可由配合板之推進器準確地推向測試裝 而配合板係由驅動器而線性移動。 ,.t 一步，配合板及驅動器可避免因其在測試腔體中 v::桿垂直排列而發生之偏斜、損壞，另外，配合板之 推進器與測試托盤之相對位置幾乎不會改變，目此，半導 體裝置則可以高速被準確地推進測試裝置中，藉以 導體裝置之電性測試之測試效率。 【實施方式】 以下將特舉數個具體之較佳實施例，並配合所附圖式 做詳細說明，圖上顯示數個實施例。然而，本發明可以許 多不同形式實施’不局限於以下所述之實施例，在此提供 之實施例可使得揭露得以更透徹及完整，以將本發明之範 圍完整地傳達予同領域熟悉此技藝者，在圖示中，層（Uyer) 和區域（region)之尺寸及相對尺寸可能會擴大，藉以清楚 明確地顯示。 可以理解的是，當一元件或層被說明為”在上 (〇11)”、”連接至（(：011116(：:1:1;0)”或耦接至（(：〇111)1以1；〇广 另一元件或層時’其可以是直接在上、連接至或耦接至另 —元件或層，或是間接（intervening)在上、連接至或耗斧 9 201111803 至另一元件或層，而當一元件或層被說明為，，直接在上 (directly on)、” 直接連接至（directly connect to)” 或”直接耦接至（directly coupled to)，， 另一元件或層 時，則中間就沒有其他的元件或層，通篇將以相同符號代 表相同元件，如同在文中所述，”及/或（and/〇r)”包括了 一個或多個所列相關物之任何及所有的組合。 可以理解的是，雖然在文中使用了，，第一”、”第 一、第二等等以表示不同的元件（element)、構件 (component)、區域（region)、層（layer)及 / 或段部 (section)，這些元件、構件 '區域、層及/或段部並不被 這詞彙所限定，這些詞彙僅係用以區別此元件 '構件 '區 域 '層及/或段部，因此，僅管在本發明中並未教示，然第 一 7L件 '構件、區域、層及/或段部亦可以是第二元件、構 件、區域、層及/或段部。 (Mow)，’ 、，，低於（1〇wer)” 、，，於上（ab〇ve)，，、，，古於 (;pper)”和類似詞囊等，在本文中係用以使描述時較：容 易，如用以說明圖示令顯示之元件或特徵相對於另 或特徵時。可以理解的H間相對詞㈣包含 用或操作中的不同方位，不僅γ " 使 說，假-將H 扣如圖所示之方位。舉例來 u將圖不上下顛倒時，元件原被描述為， 下’於另一元件或特徵將會變為”於上 5 或特徵，因此，範例中的詞彙，，纟下，，可 / 一元件 個方位，裝置可以轉向不同的太彳彳 匕3上和下兩 的方位（旋轉9〇度或其他方 10 201111803 向）’而對應於在此描述之相對空間說明。 在本文中使用之專業術語（tenijjol 〇gy )係僅用以特 別說明本發明之實施例之用，但並不限於此。例如，在本 文中，單數的形式，，一（a)” 、，，一（an)”和”此（the)，， 係可包含複數的形式，除非文中清楚的指示以外。可以更 了解的疋，兒明書中使用，’包含（C〇mpriSes)，，及/或” 包含（comprising)’，時，係用以說明特徵狀態（stated feature)、整體（integer)、步驟（step)、操作 (operation)、元件及/或構件之存在’但不排除存在有或 增加一或更多其他之特徵、整體、步驟、操作、元件、構 件及/或群組（group)。 (cross-sectional 在文中配合以剖面圖 illustration)配合說明之實施例，其係用以理解實施例 (及其中間結構）之示意圖示，就其本身而言，範例從外型 之變化之結果，舉例來說，製造技術及或/公差 (tolerance)’其係可預期的。因此，示範之實施例並不能 以其文中說明範圍之特殊外型而解釋為限制條件，而應該 是包括外型誤差之結果’舉例來說，由製造時所產生之誤 差。舉例來說，一個埋置（i 1 Vimplant)的區域在圖上係以方型 (rectangl e)為代表，具右掙扯々山，山 、頁墩狀或曲狀特徵及/或在其埋置 集中之邊緣具有斜度， 法改變斜度，同樣的， 而不是從埋置處至未埋置處以二分 由埋置而產生之埋藏區域（buried region)會造成一些埋置會介於 "於埋臧區域和埋置發生之穿 過表面之間，因此，在圖示Φut 甲‘，"員不的區域係自然之示意圖， 11 201111803 而其外型並沒有要顯 要限制本發明之範圍 示裳置之部份區之真實外型 也沒有 除非另外有顧^予 ,^ ^ 予疋義，在本文中提及之所有的名詞（包 括技術上及科學> μ、μμ μ ^ 勺名詞）&與同領域中熟悉此技藝者一 般認知具有相同的立Μ w η “義’可以更理解的是，這些如在一般 予典中所疋義之名詞可 J J Μ被解釋成在其適當之領域中具有 二其在文中相符之意義，而不是解釋為過於理想化 (· Ze)或過度嚴格（overly formai)判斷，除非在文中 係如此定義。 以下，具體之實施例將配合圖示詳細說明如下。 第1圖係顯不本發明一實施例中用以將半導體裝置連 接至測s式裝置之連接單元之示意圖，第2圖係顯示本發明 之連接單元其第一及第二配合板連接至第一導引桿之平面 圖。 請參考第1和2圖，用以將半導體裝置連接至測試裝 置（test apparatus)l 之連接單元（connecti〇n unit)l〇〇 可包括托盤軌道（tray rail)ll〇、至少一配合板（match Plate)120、複數個第一導引桿（f irst guide bar)130 ' 複 數個導引架（guide holder)140 及驅動器（driver)160。 托盤軌道110係設置於測試腔體（test chamber)200 中’可容納複數個半導體裝置（semiconductor device)SD 之至少一個測試托盤（test tray)TT係可沿著托盤執道110 移動◊半導體裝置SD可包括電子裝置，其中至少一半導體 晶片接合於如基本基板（base substrate)之基板上，且可 12 201111803 藉由插置器Cinserter)(圖上未顯示）裝設於測試托盤ΤΤ 上牛例來5兒’半導體裝置包括§己憶體裳置（mem〇ry device) 如動態隨機存取記憶體（DRAM )裝置及靜態隨機存取記憶體 (SRAM)裴置。 在—實施例中，測試托盤ΤΤΓ係可於測試腔體2〇〇中沿 第一方向垂直排列，並在測試腔體2〇〇中沿大體垂直於第 一方向之第二方向水平移動，托盤執道1 1 〇係可沿第一方 向垂直排列於測試托盤TT之右手側（right_hand portion) ° 用以對半導體裝置SD進行電性測試之測試裝置1係可 連接至測試腔體2 0 0，在本實施例_，測試襞置】相對於 沿第一方向而垂直排列之托盤軌道丨丨〇係可連接至測試腔 體200之右手側，因此，在測試腔體2〇〇之右手側侧壁上 可提供連接部（connecti〇n port )21〇，而測試裝置1可透 過連接部21 0連接至測試腔體2 〇 〇。 托盤軌道11 0可具有一開口（opening)112，藉此，測 試托盤TT中之半導體裝置SD可朝測試裝置i顯露出。 在本實施例中’測試裝置丨可包括複數個插座 (socket)2、中間板（intermediate board)3 例如 Hi-Fix 測試板（Hi-Fix board)及測試模組（test m〇dule)4。插座 2可刀別與半導體襄置SD連接，插座2可容納於中間板3 中並與中間板3電性連接。舉例來說，中間板3可對應於 測試托盤TT之結構而更換。 測試模組4可與中間板3電性連接，因此測試模組4 L S. 1 13 201111803 可透過中間板3及插座2而與半導體裝置SD電性連接，許 多不同的測试訊號經由測试核組4施加於半導體旁置SD 上’藉此執行半導體裝置SD上的電性測試。 配合板120於測試腔體200中可面對著托盤軌道丨丨〇， 因此，測試托盤ττ係可設置於配合板120與托盤軌道11〇 之間，在本實施例中，配合板120係沿第一方向垂直排列 且位於托盤軌道110的左手側（left_hand side)。 複數個用以推動半導體裝置SD之推進器（pusher)122 係設置於配合板120之一第一表面並面對著測試托盤ττ， 在本實施例中，當配合板120沿第二方向朝右移動時，測 試托盤ΤΤ中的半導體裝置SD被推進器122朝右推動，因 此，半導體裝置SD可與測試裝置丄之插座2連接。 在本實施例中，測試托盤π可包括一第一托盤（first tray)TT1及一第二托盤（secon(j hay)TT2，其係沿第二方 向連續地排列著，而配合板120可包括一第一板12〇a及一 第一板120b，其係分別對應於第一托盤τη及第二托盤 TT2’即，第一板120a及一第二板12〇b係分別面對著第一 托盤TTi及第二托盤TT2,而托盤軌道11〇的開口 ιι2則 藉由分隔元件（separatorMu區分為上部與下部。 連接單元100可更包衽水姓— . 匕枯爽持兀件（grip member)150插 設於第一板120a和第二板12此夕„ a.儿姐 双以u D之間，當沿者托盤軌道1 1 〇 移動時，第一托盤TT1及第-杠般ττο π —丄Α 乐一托盤ΤΤ2可藉由夾持元件ΐ5〇 而吸引控制。 夾持元件丨50可包括一移動執道（transfer rau)i52 14 201111803 連接至測試腔n 2Q() @左手側壁以及_夾持件 (_ei〇15m㈣執道152移動並央持第一托盤 及第二托盤TT2。 在一實施例中’複數個第-導引桿130可分別設置於 第-板12〇a之上及第二板120b之下，因此，第一導引桿 130係於配合板12Ga和麗移動時與其朝相同的方向: 平地延伸。 在本實施例中，一對筮一^ Η ) j-θ ! ο Λ 對笫導引桿130係分別設置於第 -板12〇a之上及第二板麗之下，意即，四個第一導引 桿1 30係設置於托盤軌道丨丨〇的四個角落部。 第-導引桿130可於測試腔體2〇〇中沿第一方向延伸 而不會被托盤軌道110及配合板咖和l2〇b所干擾，因 此，第一導引桿130之兩末端可連接於測試 手側壁及左手側壁上。 右 第-配合板12Ga和第二配合板lm可分別藉由第一 導引架140而連接至第一導引桿ι3〇。 —舉例來說’每一導引架14〇係以可移動地方式裝設至 每第導引杯130上’藉此，第—配合板12〇3和第二配 合板120b可被導引於第一方向上水平移動。 在一修改例中，連接單元1〇〇可更包括至少一對第二 導引桿（second guide bar)135及至少一對第二導引架 (second guideholder)145’ 由於第一配合板 i2〇a 和第二 配合板120b係彼此分離的，因此第一導引桿13〇和第一導 引架140對於第一配合板12〇a和第二配合板^此在沿竿' 15 201111803 -方向上移動的平穩度而言似嫌不足，因此，第二導引桿 135和第二導引架145可改進第一配合板120a和第二配合 板120b移動穩定度。 第二導引桿135和第二導引架145可裝設在測試腔體 200的侧壁上介於第—配合板12〇a和第二配合板以⑽之 間且裝設在鄰近於第一配合板12〇a和第二配合板12仉之 處。舉例來說’第二導引桿135和第二導引架145可分別 具有大致上與第一導引桿13〇和第一導引架14〇相同的結 構。 在本實施例中，第二導引桿135和第二導引架145可 裝設在第一配合板1 2〇a和第二配合板丨2〇b之右手側壁或 左手側壁上，但因為夾持元件i 5 〇的存在而較難以襞設在 第一配合板120a和第二配合板i2〇b之間。 更進一步，由於托盤軌道11〇的干涉，第二導引桿135 較難在第一方向上延伸，因此，第二導引桿135可連接至 測試腔體200的左手側壁上朝在第一方向上沿著托盤軌道 110移動之第一托盤TT1和第二托盤TT2的方向延伸。 驅動器160可包括用以產生驅動力（driving p〇wer) 之電源（power source)162及用以將驅動力由電源162傳 遞至第一配合板120a和第二配合板120b之電源傳送裝置 (power transfer)165 。 舉例來說，電源162可裝設在測試腔體200的外側， 在本實施例中，電源1 62可位於測試腔體2〇〇之左手側， 因此驅動力朝右向測試腔體2 〇 〇而傳遞’藉此水平地將第 16 „201111803 一配合板120a和第二配合板12 Ob在第一方向上推動。 舉例來說，電源162可包括伺服電動機（servo motor)163用以產生旋轉力（r〇tational power)及準確地 控制第一配合板120a和第二配合板120b，以及包括滾珠 螺桿（ball screw)164與伺服電動機163連接並將旋轉力 轉換為線性驅動力（1 i near dr i vi ng power)。或者，電源 162可包括汽缸機構（cyiinder mechanism)用以直接產生 線性驅動力。 電源傳送裝置165可包括線性螺帽（Hnear screw)166、第一連接元件（firsi： c〇nnect〇r)167 及第二 連接元件（Secondc〇nnector)168，線性螺帽166可與電源 162之滾珠螺桿164連接並可部份於第二方向上延伸，線 ί1生螺fs 1 66可對應於滚珠螺桿i 64之旋轉而沿第—方向線 性地移動。 — 庄一…一 ％丨日i⑽夂上方並朝 :性螺帽166向下延伸，第-連接元件167可與第—配入 〇a連接且從測試腔體2〇〇穿出，因此，第— 應㈣性螺帽166之線性移動而在第—方向^ 第二連接元件168可裝置在線性螺帽 =螺帽〜延伸，第二連接元件168下方= 板_連接且從測試腔體咖穿出，因此，^一^ 二可對應於線性螺帽166之線性移動而在第—方 平地移動。 #术万向上水201111803 • VI. Description of the Invention: [Technical Field] The present invention relates to a connection unit and a test machine for connecting a semiconductor device to a test device, and more particularly to a connection for connecting a semiconductor device to a test device Unit and test machine with this connection unit. [Prior Art] A semiconductor device is an electronic device having a semiconductor substrate having a plurality of integrated circuit chips electrically connected to each other. For example, the semiconductor device includes a memory device w dynamic random access memory ( DRAM) devices and static random access memory (SRAM) devices. Semiconductor devices are typically fabricated on thin semiconductor substrates such as wafers, such as wafers, through a series of unH processes such as factory processes (fab pr〇cess), bonding processes (b〇nding). Process), encapsulation process (m〇lding pr〇cess) and test process (testmg process). Electronic wafers having different electronic circuits and conductive structures are fabricated on a single crystal germanium wafer by a factory process, and each wafer is independently separated from each other by a bonding process, and bonded to a base substrate by a bonding process, and then, after bonding The wafer is protected by an outer mold body via a sealant process. Finally, the semiconductor device is subjected to an electrical test of the test process to verify its electronic defects (electr〇nic faUures). Generally, the 'semiconductor device is connected to the test skirt through a tester'. The semiconductor device is electrically tested in the test device. [S] 5 201111803 The test 5 machine includes a test chamber (tes1: chamber) with a test tray placed on the test disc with the semiconductor device to be tested on the test panel and used in the test chamber. A semiconductor device is connected to the connection unit of the test device. The connecting unit includes a tray track (t J· ay ra丨丨) along which the test tray moves in the test cavity, and a plurality of pushers connected to the match plate are adjacent to the test disk In the gap space, the semiconductor device is pushed toward the test tray, and a driver is connected to the mating plate to drive the pusher to push the semiconductor device. ...,:,, because the test trays are vertically aligned in the test chamber, the test 4 process is performed perpendicular to the semiconductor devices arranged vertically in the test chamber, and when the population plate is vertically up and down in the test chamber 5 When moving, the driver and the mating plate are deflected downward due to their own weight, so the semiconductor device cannot be accurately pushed by the pusher in the interstitial space. SUMMARY OF THE INVENTION According to an embodiment, there is provided a connection unit for connecting a semiconductor device to a test, the semiconductor device of which can be accurately driven by a plurality of advancements of the mating plate. According to the embodiment, a test machine is provided having the above-described connecting unit. According to the present invention, the present invention provides a connection unit for a semiconductor device to a device, and a connection unit package: a tray is disposed in a test chamber, a test chamber and a device. The connection 'at least one test tray including a plurality of semiconductor skirts moves along the 201111803 pallet track and faces the external test device. The tray track' test tray is located in the distribution; the board and the support =, the mating plate faces the board including a plurality of advancements The pusher pushes the test support unit to the test device, and at least one of the semiconductor walls is adjacent to the mating plate and the tray track, and the inner side of the rib moves the latch. Extending in a direction of movement in the test cavity; and at least one guiding rod. For connecting the mating board and an alignment bracket for having a semiconductor device. In one embodiment, the connecting unit further includes at least a connection tray guide and a guiding rod </ RTI> to align the mating panel with the test tray. In one embodiment, a pair of tombs are disposed in the two corners of the pair of guides and the pair of alignment brackets disposed on the side of the tray rails, and the alignment brackets are connected to the left and right sides. That is, the door free space is reserved between the alignment bracket and the tray, so that the thermal expansion and contraction of the pallet can be absorbed by the free space. The connection between the first and the second includes a driver for driving the mating plate to move toward the test device w', the driver includes a power source for generating a driving force, and a power transmitting device for transmitting the driving force from the power source to the cooperating power source device - The annular portion is located at one end adjacent to the mating plate. For example, the boat whispering s & the driver's drive further includes an elastic element interposed between the power transmitting device and the mating slave. The elastic member makes the mating plate parallel to the test tray. In one embodiment, the power supply is disposed outside the test chamber and the portion of the power supply disposed outside the test chamber is covered by a tube _ L 5 i 7 201111803. K In his case, _ a pair of matching plates respectively face a pair of test discs, and the connecting unit is more at least - for the second guiding rod, is disposed on the inner side wall of the measuring cavity and is guided _ τ First-class cups are parallel, and at least one pair of second guide frames 'connecting the 柘D plate and the second guiding rod, respectively. According to the concept of the present invention, the present invention provides a predictor comprising the above-described technology. The test machine includes a front process chamber for accommodating a test tray having a plurality of semiconductor #@β devices. The semiconductor device is heated or cooled to a low level in the front process chamber before the semiconductor device is electrically tested. Brewing—the test chamber is connected to the front process chamber and is electrically connected to the semiconductor! · One of the biometric processes is connected to the external test device. During the electrical test, the test tray is moved from the front process chamber to the test chamber. A connection unit is placed in the test chamber for the test tray. The semiconductor device j pushes the external test device; and a post process chamber is connected to the test cavity, and during the electrical test process I, the test carrier moves from the test cavity to the rear IL private cavity 'semiconductor device The process chamber is restored from high temperature or low temperature to the ship, wherein the connection unit comprises a tray track disposed in a test cavity, the test cavity is connected to the external test device, and at least one test tray edge of the plurality of semiconductor devices is included The tray track moves and faces the external test device; at least one mating plate faces the tray track, and the test tray is located between the mating plate and the plate track, the mating plate includes a plurality of pushers, and the pusher respectively tests the semiconductor in the tray The device is pushed toward the testing device; at least one guiding rod is disposed on the inner side wall of the testing cavity adjacent to the mating plate and the tray rail, and the guiding rod moves along the mating plate in the testing cavity The direction of movement is extended; and at least one of the 201111803 guide frames is used to connect the mating plate and the guiding rod. According to the embodiment of the present invention, the connecting unit and the connecting unit have a small-guide rod system disposed on the inner side wall of the test cavity, and in the middle of the fit: half and linearly move along the guiding rod, in the test tray The f-conductor device can be accurately pushed toward the test fixture by the pusher of the mating plate and the mating plate is linearly moved by the driver. , .t step, the board and the driver can avoid the deflection and damage caused by the vertical alignment of the v:: rod in the test cavity. In addition, the relative position of the pusher of the mating plate and the test tray hardly change. Therefore, the semiconductor device can be accurately pushed into the test device at a high speed, whereby the test efficiency of the electrical test of the conductor device is made. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Several specific embodiments will be described in detail below with reference to the accompanying drawings, in which FIG. However, the present invention may be embodied in many different forms, and is not limited to the embodiments described below. The embodiments provided herein may be made to provide a more complete and complete disclosure of the scope of the invention. In the illustration, the size and relative size of the layers (Uyer) and regions (regions) may be enlarged to show clearly and clearly. It can be understood that when a component or layer is described as "on (〇11)", "connected to ((:011116(::1:1;0)" or coupled to ((:〇111)1) When another element or layer is used, it may be directly on, connected to or coupled to another element or layer, or indirectly, connected to or axe 9 201111803 to another An element or layer, and when a component or layer is described as being "directly on", "directly connected to" or "directly coupled to", another component or In the case of a layer, there are no other elements or layers in the middle, and the same symbols will be used to represent the same elements throughout. As described herein, "and/or (and /〇r)" includes one or more of the listed items. Any and all combinations thereof. It will be understood that, although used herein, the first, the first, the second, etc. are used to denote different elements, components, regions, Layers and/or sections, these components, components 'areas, layers and/or sections are not This term is defined by the terms used to distinguish the 'component' region and/or segment of the component. Therefore, as far as not being taught in the present invention, the first 7L component 'component, region, layer and The segment may also be a second component, component, region, layer, and/or segment. (Mow), ',,,, (1〇wer), ,,,, (ab〇ve), , , , (pper) and similar words, etc., are used herein to make the description easier: as used to illustrate the illustration of the elements or features displayed relative to another or feature. The relative word (H) of the H contains the different orientations in the operation or operation, not only γ " YES, false - H is buckled as shown in the figure. For example, when the figure is not upside down, the component is originally described as The following 'on another component or feature will become' in the upper 5 or feature, therefore, the vocabulary in the example, the squat, the / can be a component orientation, the device can be turned to different 彳彳匕 3 The next two directions (rotation 9 degrees or other side 10 201111803 direction) 'and correspond to the relative space described here The terminology used herein is used to specifically describe the embodiments of the present invention, but is not limited thereto. For example, in this document, the singular form, an (a)", , (a) and "the", "," may be in the form of a plural, unless the context clearly dictates otherwise. It can be better understood, used in the book, 'includes (C〇mpriSes), And/or "comprising" is used to describe the existence of a statistic feature, an integer, a step, an operation, an element, and/or a component, but does not exclude the existence of One or more other features, integers, steps, operations, components, components, and/or groups are added. (cross-sectional in the text with a sectional view illustration) in conjunction with the illustrated embodiment, which is used to understand the schematic representation of the embodiment (and its intermediate structure), for its part, the result of the variation of the example from the appearance For example, manufacturing techniques and/or tolerances are contemplated. Therefore, the exemplary embodiments are not to be construed as limiting the scope of the particular scope of the scope of the description, but should be the result of the inclusion of the tolerances, for example, an error resulting from the manufacture. For example, an area (i 1 Vimplant) is represented by a rectangl e on the map, with a right-handed mountain, a mountain, a pier, or a curved feature and/or buried in it. The edge of the set has a slope, and the method changes the slope. Similarly, instead of being buried from the buried to the unburied, the buried region generated by the two-part embedding will cause some embedding to be between " Between the buried area and the traversing surface where the embedding occurs, therefore, the area shown in the figure Φut A, " is not a natural schematic, 11 201111803 and its appearance does not necessarily limit the scope of the present invention. The true appearance of the part of the show area is not unless there is another me, ^ ^ to Yu Yi, all the nouns mentioned in this article (including technical and scientific > μ, μμ μ ^ spoon noun ) & is the same as the general cognition of those skilled in the same field. w η "Yi" can be more understood that these terms, as derogatory in the general syllabus, can be interpreted as appropriate in their There are two meanings in the field that match in the text, not It is interpreted as being too idealized (· Ze) or overly formai, unless it is so defined in the text. Hereinafter, specific embodiments will be described in detail below with reference to the drawings. FIG. 1 shows an embodiment of the present invention. A schematic view of a connection unit for connecting a semiconductor device to a s-type device, and FIG. 2 is a plan view showing the first and second mating plates of the connection unit of the present invention connected to the first guide bar. And FIG. 2, a connection unit for connecting the semiconductor device to the test apparatus 1 may include a tray rail, at least one match plate 120. a plurality of first finder guides 130', a plurality of guide holders 140 and a driver 160. The tray rails 110 are disposed in the test chamber 200. At least one test tray TT accommodating a plurality of semiconductor devices SD can be moved along the tray track 110. The semiconductor device SD can include electronic devices, at least one of which is semiconductor The wafer is bonded to a substrate such as a base substrate, and 12 201111803 is mounted on the test tray by means of an interposer (not shown). The semiconductor device includes § ** Mem〇ry devices such as dynamic random access memory (DRAM) devices and static random access memory (SRAM) devices. In an embodiment, the test tray tethers are vertically aligned in the first direction in the test cavity 2〇〇 and horizontally moved in a second direction substantially perpendicular to the first direction in the test cavity 2〇〇, the tray The circuit 1 can be vertically arranged in the first direction on the right-hand portion of the test tray TT. The test device 1 for electrically testing the semiconductor device SD can be connected to the test chamber 200. In this embodiment, the test device is connected to the right hand side of the test cavity 200 with respect to the tray track vertically aligned in the first direction, and therefore, on the right hand side of the test cavity 2〇〇 A connection portion (connecti〇n port) 21〇 can be provided on the wall, and the test device 1 can be connected to the test chamber 2 through the connection portion 210. The tray track 110 may have an opening 112 whereby the semiconductor device SD in the test tray TT may be exposed toward the test device i. In the present embodiment, the 'testing device' may include a plurality of sockets 2, an intermediate board 3 such as a Hi-Fix board and a test module 4. The socket 2 can be connected to the semiconductor device SD, and the socket 2 can be accommodated in the intermediate plate 3 and electrically connected to the intermediate plate 3. For example, the intermediate plate 3 can be replaced corresponding to the structure of the test tray TT. The test module 4 can be electrically connected to the intermediate board 3, so that the test module 4 L S. 1 13 201111803 can be electrically connected to the semiconductor device SD through the intermediate board 3 and the socket 2, and many different test signals are tested. The core group 4 is applied to the semiconductor side SD 'by performing an electrical test on the semiconductor device SD. The mating plate 120 can face the tray track 于 in the test cavity 200. Therefore, the test tray ττ can be disposed between the mating plate 120 and the tray track 11〇. In this embodiment, the mating plate 120 is along the edge. The first direction is vertically aligned and is located on the left-hand side of the tray track 110. A plurality of pushers 122 for pushing the semiconductor device SD are disposed on a first surface of the mating plate 120 and facing the test tray ττ. In this embodiment, when the mating plate 120 faces the second direction in the second direction When moving, the semiconductor device SD in the test tray 推动 is pushed to the right by the pusher 122, and therefore, the semiconductor device SD can be connected to the socket 2 of the test device. In this embodiment, the test tray π may include a first tray TT1 and a second tray (secon(j hay) TT2, which are continuously arranged in the second direction, and the mating panel 120 may include a first board 12〇a and a first board 120b respectively corresponding to the first tray τη and the second tray TT2′, that is, the first board 120a and the second board 12〇b respectively face the first board The tray TTi and the second tray TT2, and the opening ι2 of the tray rail 11〇 are divided into upper and lower portions by a separator element. The connecting unit 100 can further include a water surname — a dry grip member (grip member) The first plate 120a and the second plate 12 are inserted between the first plate 120a and the second plate 12, and the first tray TT1 and the first-bar-like ττο π are used when moving along the tray track 1 1 〇.乐 Le a tray ΤΤ 2 can be controlled by the clamping element ΐ 5 。. The clamping element 丨 50 can include a transfer rau i52 14 201111803 connected to the test chamber n 2Q () @ left hand side wall and _ clip Holder (_ei〇15m(4)) 152 moves and holds the first tray and the second tray TT2. In an embodiment The plurality of first guiding rods 130 can be respectively disposed above the first plate 12A and below the second plate 120b. Therefore, the first guiding rod 130 is in the same direction as the engaging plate 12Ga and the Li moving. : In the present embodiment, a pair of 筮 ^ Η j j j 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫 笫That is, the four first guiding rods 1 30 are disposed at four corners of the tray rail 。. The first guiding rod 130 can extend in the first direction in the test cavity 2〇〇 without being trayd. The track 110 and the matching board and the l2〇b interfere with each other. Therefore, the two ends of the first guiding rod 130 can be connected to the test hand side wall and the left hand side wall. The right first-mating board 12Ga and the second mating board lm can respectively borrow Connected to the first guide bar ι3 由 by the first guide frame 140. - For example, 'each guide frame 14 is movably mounted to each of the first guide cups 130', thereby The first mating panel 12〇3 and the second mating panel 120b can be guided to move horizontally in the first direction. In a modified example, the connecting unit 1〇〇 can further include at least one a second guide bar 135 and at least one pair of second guide holders 145'. Since the first mating panel i2a and the second mating panel 120b are separated from each other, the first guide The rod 13 〇 and the first guide frame 140 are insufficient for the smoothness of the first mating plate 12 〇 a and the second mating plate in the direction of 竿 ' 15 201111803 -, therefore, the second guide The rod 135 and the second guide frame 145 can improve the movement stability of the first mating plate 120a and the second mating plate 120b. The second guiding rod 135 and the second guiding frame 145 can be disposed on the sidewall of the testing cavity 200 between the first mating panel 12a and the second mating panel (10) and disposed adjacent to the first A mating panel 12〇a and a second mating panel 12仉. For example, the second guide bar 135 and the second guide frame 145 may have substantially the same structure as the first guide bar 13A and the first guide frame 14A, respectively. In this embodiment, the second guiding rod 135 and the second guiding frame 145 can be installed on the right hand side wall or the left hand side wall of the first mating board 1 2〇a and the second mating board 2丨b, but because The presence of the clamping element i 5 较 is more difficult to lay between the first mating plate 120a and the second mating plate i2〇b. Further, due to the interference of the tray track 11〇, the second guiding rod 135 is more difficult to extend in the first direction, and therefore, the second guiding rod 135 can be connected to the left hand side wall of the test cavity 200 toward the first side The direction of the first tray TT1 and the second tray TT2 moving up along the tray track 110 extends upward. The driver 160 may include a power source 162 for generating a driving force and a power transmission device for transmitting the driving force from the power source 162 to the first mating board 120a and the second mating board 120b. Transfer) 165. For example, the power source 162 can be disposed outside the test cavity 200. In this embodiment, the power source 1 62 can be located on the left-hand side of the test cavity 2〇〇, so the driving force is directed to the right to the test cavity 2 〇〇 And transmitting 'by this horizontally pushing the 16th „201111803 mate plate 120a and the second mating plate 12 Ob in the first direction. For example, the power source 162 may include a servo motor 163 for generating a rotational force. (r〇tational power) and accurately controlling the first mating plate 120a and the second mating plate 120b, and including a ball screw 164 connected to the servo motor 163 and converting the rotational force into a linear driving force (1 i near dr Alternatively, the power source 162 may include a cyiinder mechanism for directly generating a linear driving force. The power transmission device 165 may include a linear nut 166, a first connecting element (firsi: c〇). The nnect〇r) 167 and the second connecting component 168, the linear nut 166 can be connected to the ball screw 164 of the power source 162 and can partially extend in the second direction, and the line ί1 screw s 1 66 can correspond to to The rotation of the ball screw i 64 linearly moves in the first direction. - Zhuang Yi...1%丨i i(10)夂 above and extends downward toward the sex nut 166, the first connecting member 167 can be coupled with the first Connected and passed through the test cavity 2, therefore, the linear movement of the first (four) nut 166 and the second direction of the second connecting element 168 can be arranged in the linear nut = nut ~ extension, second Below the connecting element 168 = the plate _ is connected and is passed out from the test cavity, so that the two can move in the first - flat direction corresponding to the linear movement of the linear nut 166.
[SI 17 201111803 第一軸襯元件（first bushing member)220 和第二轴 概元件（second bushing member)230可分別插設於第一連 接元件167、第二連接元件168及測試腔體2〇〇的側壁之 間’藉以促進第一連接元件167和第二連接元件Kg之移 動。 於是’第一導引桿130和第二導引桿135可裝設在測 試腔體200的内側壁上並朝第一配合板12〇a和第二配合板 120b和動之相同的方向延伸，因此，當第一配合板 和第二配合板120b因電源162驅動而在第一方向上水平地 矛夕動時第一配合板12 0 a和第二配合板1 2 0 b在測試腔體 _中係可被第一導引架140和第二導引帛145引導而沿 第一導引桿13〇和第二導引桿135移動。 因此，儘管第一托盤ττι、第二托盤TT2、第一配合板 12〇a和第二配合板12〇b在測試腔體2〇〇中係垂直地排列， 亦可以避免其偏斜（deflect)的發生。 力外，由於避免了 斜’配合120之推進器122即可準確地推動相對應4 試托盤ττ中的半導體裝置SD，因此，半導體裝置sd; 精確地推進相對應之測試裝置1的插座2中。 更進一步’推進器122的位置可藉由導引桿13〇和 及導引架140和145準確且穩定的控制，因此，推進写 =試腔體200中可高速地運作而不會發生位置的_ 稭此改進半導體裝置SD之電性測試製程之效率。 連接元件m和168與配合板咖和im之間έ 18 201111803 接結構將在以下配合第3圖詳細說明。 第3圖係顯示依攄本發 诼尽赞明之弟1圖中電源傳送裝置及 配合板之間的連接結構之部份放大圖。 第一連接元件167和第二連接元件168可以相同的結 構分別與第一配合板12〇a和第二配合板12〇b連接，故， 以下將以第-連接㈣167和第—配合板咖之間的連接 結構作為範例來說明。 請參見第3圖，第—連接元件167可包括-環狀部 (r—1 P〇rti〇n)鄰近於第-配合板咖，當第一配合板 ⑽在測試腔體⑽中藉由第_導引桿13()和第二導引桿 135引^時帛配合板12〇a报可能會發生扭曲 的情況’此弟—ffi? 4c 1 Ο π , 。板120a之扭曲可藉由第一連接元件 m之環狀部來吸收’也就是說，第—配合板⑽可藉由 第連接元件167之環狀部而避免因扭曲而發生之破損和 損壞（broken)。 更特別的是，螺栓（b〇lt)1〇可以其螺栓頭（b〇H tap)12***設於第一連接元件167和第一配合板ι2〇&之 間之階梯板（stepped plate) ! 7◦卡固的形式而螺合入第一 連接元件16 7之環狀部’舉例來說，階梯才反^ 可固設於 第一配合板120a上。 階梯板170具有螺栓孔（b〇H h〇le)n2，螺栓1〇係由 此穿過，螺栓孔172的尺寸大於螺栓1〇，因此，當第一配 合板120a發生扭曲時，螺栓1〇可鎖上（fastened)或脫離[SI 17 201111803 The first bushing member 220 and the second bushing member 230 may be respectively inserted into the first connecting member 167, the second connecting member 168, and the test cavity 2〇〇. Between the side walls 'to facilitate the movement of the first connecting element 167 and the second connecting element Kg. Thus, the first guiding rod 130 and the second guiding rod 135 can be mounted on the inner side wall of the test cavity 200 and extend in the same direction as the first mating panel 12a and the second mating panel 120b. Therefore, when the first mating panel and the second mating panel 120b are horizontally sprung in the first direction by the power source 162, the first mating panel 12 a and the second mating panel 1 2 0 b are in the test cavity _ The middle system can be guided by the first guide frame 140 and the second guide cymbal 145 to move along the first guide bar 13 〇 and the second guide bar 135. Therefore, although the first tray ττι, the second tray TT2, the first mating panel 12〇a, and the second mating panel 12〇b are vertically arranged in the test cavity 2〇〇, the deflection thereof can be avoided (deflect). happened. In addition, since the semiconductor device SD in the corresponding 4-test tray ττ can be accurately pushed by avoiding the tilting of the thruster 122 of the 120, the semiconductor device sd; accurately advances the socket 2 of the corresponding test device 1 . Further, the position of the pusher 122 can be accurately and stably controlled by the guide rod 13 and the guide frames 140 and 145, so that the push write = test chamber 200 can operate at high speed without position. _ This improves the efficiency of the electrical test process of the semiconductor device SD. Between the connecting members m and 168 and the mating board and im έ 18 201111803 The connecting structure will be described in detail below in conjunction with FIG. Fig. 3 is a partially enlarged view showing the connection structure between the power transmission device and the mating plate in the figure 1 of the present invention. The first connecting member 167 and the second connecting member 168 can be connected to the first mating panel 12a and the second mating panel 12B, respectively, in the same structure. Therefore, the first connection (four) 167 and the first mating board will be used. The connection structure between them is explained as an example. Referring to FIG. 3, the first connecting member 167 may include a ring portion (r-1 P〇rti〇n) adjacent to the first mating plate, when the first mating plate (10) is in the test cavity (10) by the first The guide rod 13 () and the second guide rod 135 lead to the case where the board 12 〇 a report may be distorted 'this brother - ffi? 4c 1 Ο π , . The distortion of the plate 120a can be absorbed by the annular portion of the first connecting member m. That is, the first mating plate (10) can be prevented from being damaged and damaged by the twist by the annular portion of the connecting member 167 ( Broken). More specifically, the bolt (b〇lt) 1 can be inserted into the stepped plate between the first connecting member 167 and the first mating plate ι2 〇 & The 7-inch snap-in form is screwed into the annular portion of the first connecting member 16 7. For example, the step can be fixed to the first mating plate 120a. The step plate 170 has a bolt hole (b〇H h〇le) n2 through which the bolt 1 is passed, and the bolt hole 172 is larger in size than the bolt 1〇, so when the first mating plate 120a is twisted, the bolt 1〇 Can be fastened or detached
CunfastenecO。另外，第一配合板12〇a可更包括溝 19 201111803 (groove )124，其尺寸大於螺栓頭12，因此，即使在第一 配合板120a發生扭曲時也可在第一配合板120a和螺检頭 12之間有充分的備用空間（sufficient spare space)。 支撐板（support board) 180可設置於階梯板170的表 面並對應於階梯板170而與第一配合板i2〇a對稱地支樓著 第一連接元件167之環狀部，支撐板180可避免第一連接 元件167之環狀部在第一方向和第二方向上之水平和垂直 的移動，但不包括第一配合板1 2〇a可能發生扭曲的方向。 彈性兀件（elastic member)190可設置於階梯板17〇 之螺栓孔1 72中，藉由彈性元件丨9〇之彈力而將第一配合 板120a和第一連接元件167彼此分離，彈性元件19〇可包 括壓縮彈簣（compression spring)。 在階梯板170鄰近於螺栓頭12之右手側可更包括突出 部（pr〇trusion)174,彈性元件19〇之右手側可卡固於此， 藉以吸收（reduce)彈性元件之彈力。 -饮几旰—.，祁„ π ,Γ王兀仟丄yu和階梯 板no之引導而在第二方向上水平地移動，因此第一配合 板120a則可與測試托盤ττ保持平行。 在第-連接元件167的外側，如第一連接元件167在 測试腔體2GG外側的一部份，可以被伸縮管（ben〇w)i69 斤已覆目此W第一連接元件167由電源162驅動而在 第二方向上水平移動時’第-連接元彳167的外部可以受 到保護。CunfastenecO. In addition, the first mating plate 12A may further include a groove 19 201111803 (groove) 124, which is larger in size than the bolt head 12, and thus can be in the first mating plate 120a and the thread check even when the first mating plate 120a is twisted. There is sufficient spare space between the heads 12. A support board 180 may be disposed on the surface of the stepped plate 170 and corresponding to the stepped plate 170 to symmetrically support the annular portion of the first connecting member 167 with the first mating plate i2〇a. The support plate 180 can avoid the first The horizontal and vertical movement of the annular portion of a connecting member 167 in the first direction and the second direction, but does not include the direction in which the first mating plate 1 2〇a may be distorted. The elastic member 190 may be disposed in the bolt hole 1 72 of the step plate 17 , and the first mating plate 120 a and the first connecting member 167 are separated from each other by the elastic force of the elastic member , 9 ,, the elastic member 19 The 〇 may include a compression spring. The step plate 170 may further include a protrusion 174 adjacent to the right hand side of the bolt head 12, and the right hand side of the elastic member 19 may be fastened thereto to reduce the elastic force of the elastic member. - Drinking several times -., 祁 π π , Γ 兀仟丄 和 yu and the step board no guide horizontally moving in the second direction, so the first mating plate 120a can be kept parallel with the test tray ττ. The outer side of the element 167, such as a portion of the first connecting element 167 outside the test cavity 2GG, may be covered by a telescopic tube (ben〇w) i69 kg. The first connecting element 167 is driven by the power source 162. The outside of the 'first-connected element 彳 167' can be protected when moving horizontally in the second direction.
半導體裝置SD 之電性測試可能需要在測試腔體2〇〇中 20 201111803 施以極高溫或極低溫，因此第一連接元件167的外部 部可能會產生較大的溫差，第一連接元 =和内 i υ I的内部是 第一連接元件1 67位於測試腔體2〇〇中的部份，由於〜曰 連接元件167的溫差使得在第—連接㈣167的外部^ 會有水滴（water-drop)的產生，則伸縮管169即可避免= -連接元件167外部產生水滴，藉以避免第一連接元件⑻ 發生腐钱（erosion)。 同樣地’第二連接元件168的外部也可藉由伸縮管以 避免腐蝕的發生，由習知技術可知。 & 托盤執道110和第一導引桿13〇的連接結構將在以下 配合第4至6圖詳細說明。 第4圖係顯示依據本發明之第丨圖中托盤軌道及第— 導引桿彼此連接於連接單元中之示意圖，帛5圖係顯示第 4圖中沿1-1’剖面線之剖面圖，第6圖係顯示第*圖中沿 11 -11 ’剖面線之剖面圖。 請參見第4至6圖，連接單元1〇〇可更包括複數個對 準支架（aligning h〇lder)l 95，用以將第一導引桿13〇和 托盤執道110互相對準及連接，在本實施例中，對準支架 195可設置於連接單元1〇〇的四個角落。 托盤軌道110的位置可藉由對準支架195而固定於連 接單元1 0 0中，因此，測試托盤ττ沿托盤軌道j丨〇移動時， 可準確地與配合板12〇a和i2〇b對齊。 由於在測試托盤TT中的半導體裝置SD可準確地與配 合板1 20之推進器122對齊，因此，每個半導體裝置SD g -Si 21 201111803 可被推進測試裝置1之插座2中。 另外’對準支架195與第一導引桿130之連接可以對 準支架195可稍微沿著第一導引桿130移動的方式連接， 因此’當半導體裝置SD被水平的移動時，對準支架I”可 提供類似緩衝器（buf f er)之功能。額外的緩衝元件（圖上未 顯示）亦可插設於第一導引架140與測試腔體之右手側壁 之間’藉以補強（compensate)對準支架1 95之緩衝效果。 既然半導體裝置SD之電性測試可能在極高溫 (ultimately high temperature)或極低溫（ultimately 1 ow temperature)的情況下進行，測試托盤ττ則可能頻繁 的重覆經歷熱膨脹（thermai expansi〇n)和收縮 (contraction) ° 基於此，一對對準支架195與托盤軌道11()之兩末】 的連接方式則可以為其中一個對準支架i 95係牢固地連; 至托盤軌道11G之—第—末端如第5圖所示，而另一個1 準支架1 95則以可移動的方式連接至托盤軌道丨丨〇之一〗 二末端如第6圖所示，因此，在對準支架195和托盤執立 11 〇之間即預留有-自由空間（free space)s，藉以吸收3 試托盤TT的熱膨脹和收縮。也就是說，#中—個對準支聋 195可以僅僅只是支樓著托盤軌冑11(^已，藉以維持丰 盤軌道110在第二方向上之垂直排列。 在一修改例中，其他的對準支架195可包括滚輕 (roller)(圖上未顯示)與托盤軌道u"目接觸並沿第一方 °尺平也私動肖此’對準支架j 95之滾輪可吸收測試托 22 201111803 盤ττ的熱膨脹和收縮。 儘管在本實施例中’在對半導體裝置仙測試時係以測 試托盤π於測試腔體咖中沿第二方向垂直排列來做說 明’測試托盤ΤΤ亦可在測試腔體200中水平的排列，只要 把連接單元100旋轉一角卢 ^ 月度如向右轉90度，如習知技術可 知。 第7圖係顯不依據本發明之一實施例，具有第丨圖中 之連接早元之測試機之示意圖在第7圖中，與第1至6 圖相同之元件係以相同的標號表示，因此，相同元件之詳 細描述將省略。 "月參見第7圖，測試機（test handler)1〇〇〇包括裝載 ，台（loading stack)300、裝載單元（1〇ading uni〇4〇〇、 月）製耘腔（pre-process chamber)500、測試腔體 200、連 接單元 100 後‘私腔（p〇st_pr〇cess chamber )6〇〇、卸載 單元（unloading unit)700 、分類緩衝區（s〇rting buffer)800 及卸载棧台（unl〇ading stack)9〇〇。 複數個第一客戶托盤（f irst cust〇mer tray)CT1係可 排列於裝載棧台300,且複數個半導體裝置SD係以第一間 距（first gap distance)排列於第一客戶托盤上。 測試托盤TT係水平地排列於裝載單元4〇〇，半導體裝 置SD係由第一客戶托盤CT1被轉移至測試托盤ττ，並排 歹J為彼此間隔第一間距（second gap distance)，舉例來 說，在測試機1 000中可更裝設有裝載夹取器（1〇adingThe electrical test of the semiconductor device SD may require extremely high or very low temperatures in the test chamber 2, 201111803, so the outer portion of the first connecting element 167 may generate a large temperature difference, the first connecting element = and The inside of the inner υ I is the portion of the first connecting member 1 67 located in the test chamber 2, and the temperature difference of the 曰 connecting member 167 causes water-drop at the outside of the first-connected (four) 167. The generation of the telescopic tube 169 can avoid the occurrence of water droplets on the outside of the connecting element 167, in order to avoid the erosion of the first connecting element (8). Similarly, the exterior of the second connecting member 168 can also be formed by a telescopic tube to avoid corrosion, as is known in the art. The connection structure of the tray lane 110 and the first guide rod 13A will be described in detail below in conjunction with Figs. 4 to 6. Figure 4 is a schematic view showing the tray track and the first guide bar connected to each other in the connecting unit according to the first drawing of the present invention, and Figure 5 is a cross-sectional view taken along line 1-1' in Figure 4, Figure 6 is a cross-sectional view taken along line 11-11' in section *. Referring to FIGS. 4-6, the connecting unit 1 may further include a plurality of alignment brackets l 95 for aligning and connecting the first guiding rod 13 〇 and the tray trajectory 110 to each other. In the present embodiment, the alignment bracket 195 can be disposed at four corners of the connecting unit 1〇〇. The position of the tray track 110 can be fixed in the connecting unit 100 by the alignment bracket 195. Therefore, when the test tray ττ moves along the tray track j丨〇, it can be accurately aligned with the mating plates 12〇a and i2〇b. . Since the semiconductor device SD in the test tray TT can be accurately aligned with the pusher 122 of the mating plate 120, each semiconductor device SDg-Si 21 201111803 can be pushed into the socket 2 of the test device 1. In addition, the connection of the alignment bracket 195 to the first guiding rod 130 can be connected in such a manner that the bracket 195 can be slightly moved along the first guiding rod 130, so that when the semiconductor device SD is horizontally moved, the positioning bracket is aligned. I" can provide a buffer-like function. Additional buffer components (not shown) can also be inserted between the first guide frame 140 and the right hand side wall of the test cavity. Aligning the buffering effect of the bracket 1 95. Since the electrical test of the semiconductor device SD may be performed at an extremely high temperature or an extremely low temperature, the test tray ττ may be frequently repeated. Experience thermal expansion (thermai expansi〇n) and contraction ° Based on this, the connection between the pair of alignment brackets 195 and the tray rail 11 () can be firmly connected to one of the alignment brackets i 95 ; to the tray rail 11G - the first end is shown in Figure 5, and the other 1 quasi-bracket 1 95 is movably connected to one of the tray rails. The two ends are shown in Figure 6, because Between the alignment bracket 195 and the tray holding 11 〇, there is reserved - free space s, thereby absorbing the thermal expansion and contraction of the 3 test tray TT. That is, #中一 aligned support The 195 may simply be a tray rail 11 (which has been used to maintain the vertical alignment of the shelf rails 110 in the second direction. In a modification, the other alignment brackets 195 may include rollers ( The figure is not shown in the figure and is in contact with the tray rail u" and along the first square. The roller of the bracket j 95 can absorb the thermal expansion and contraction of the test tray 22 201111803 disk ττ. In the example, when the semiconductor device is tested, the test tray π is vertically arranged in the second direction in the test cavity. The test tray can also be horizontally arranged in the test cavity 200, as long as the connection unit is connected. 100 Rotate a corner Lu ^ If the moon turns 90 degrees to the right, as is known from the prior art. Figure 7 shows a schematic diagram of a test machine having a connection early in the figure according to an embodiment of the present invention. In the figure, the same components as in Figures 1 to 6 The same reference numerals will be used, and therefore, the detailed description of the same components will be omitted. "Monitor Referring to Figure 7, the test handler 1 includes loading, loading stack 300, loading unit (1〇) Ading uni〇4〇〇, month) pre-process chamber 500, test chamber 200, connection unit 100 'p〇st_pr〇cess chamber' 6〇〇, unloading unit 700, classification buffer (s〇rting buffer) 800 and unloading stack (unl〇ading stack) 9〇〇. A plurality of first customer trays CT1 can be arranged on the loading stack 300, and a plurality of semiconductor devices SD are arranged on the first customer tray with a first gap distance. The test trays TT are horizontally arranged on the loading unit 4, and the semiconductor device SD is transferred from the first customer tray CT1 to the test tray ττ, and the drains J are spaced apart from each other by a second gap distance, for example, Loader gripper can be installed in the test machine 1 000 (1〇ading)
Picker) 350介於裝載棧台300和裝載單元4〇〇之間，因 L S3 23 201111803 此’原本分離第一間距之半導體裝置SD在測試托盤ττ將 會被重新排列成間隔為第二間距。 裝載單元40 0係可與前製程腔500連接，在裝載單元 400中水平排列之測試托盤ΤΤ將以直立模式（standing mode)被裝載入前製程腔5〇〇中，也就是說，在裝載單元 400中係水平地平躺（1 y i ng d〇Wn )的測試托盤TT將會在前 製程腔500中垂直地豎立（stand Up)。加熱或冷卻製程將 會在前製程腔500中進行’因此，測試托盤ττ中的半導體 裝置SD將處於高溫或低溫之狀態。 前製程腔500係可與測試腔體200連接，則包含有複 數個半導體裝置SD之測試托盤TT將由前製程腔5〇〇轉移 至測試腔體200，在測試腔體200中將對半導體裝置SD進 行電性測試，用以執行電性測試之測試裝置1係可裝設於 測試腔體200之側壁。 連接單元1 00將可提供於測試腔體200中，並可將測 試托盤ττ中的半導體裝置SD推進測試裝置i的插座2中。 在一例中，如前所述，由連接單元1〇〇所執行之半導體裝 置SD的推動係可以以一相對高的速度進行，藉以改進半導 體裝置SD之電性測試的效率。 測試腔體200係可與後製程腔6〇〇連接，當所有測試 托盤TT中的半導體裝置如之電性測試執行完成時，測試 把盤Π冑由測試㈣200轉移至後製程腔_中，舉例來 說’被加熱或冷卻之半導體裝置SD將在後製程腔6〇〇中回 復至一般溫度（n〇rmal或室溫^咖 201111803 temperature) ° 後製程腔600係可與卸載單元7〇〇連接，包含有室溫 之半‘體裝置SD之測試托盤ττ將由後製程腔600轉移至 卸載單元700，在一例中，在後製程腔6〇〇中垂直排列之 測試托盤ττ將以平躺模式（lie_down m〇de)被卸載入卸載 單70 700中，也就是說，在後製程腔6〇〇中係垂直地豎立 的測試托盤TT將改變成在卸載單元700中係水平地平躺。 之後’半導體裝置SD將自測試托盤ττ中取出。 複數個第二客戶托盤（sec〇nd cust〇mer tray)CT2係 排列於卸載棧台9〇〇，且每個第二客戶托盤CT2依據測試 等級而彼此有所區別，因此，在分類緩衝區8〇〇中依測試 等級而刀類後之半導體裝置S])被轉移至卸載棧台中， 其係以在分類桌（sorting table)85〇上相同等級之半導體 裝置SD係被轉移至相同等級之卸載棧台9〇〇中的第二客戶 托盤CT2之方式。在分類桌85〇上以第二間距排列之半導 體裝置SD在第二客戶托盤CT2中將會被重新排列成間隔為 第一間距。 因此’在測試機1 000中可更裝設有卸載失取器 (unloading picker) 95〇介於分類緩衝區8〇〇和卸載棧台 900之間，因此，原本分離第二間距之半導體裝置將會 在第二客戶托盤CT2中被重新排列成間隔為第一間距。 依據本發明的一個實施例，複數個導引桿係可裝設於 測δ式腔體之内側壁上，而包括複數個推進器之配合板係沿 導引桿之引導而線性移動，因此，配合板之推進器可準確 [s] 25 201111803 地將測試托盤中之半導體裝置推人測試裝置之相對應之插 座中，藉以改進半導體裝置電性測試之準確率與效率。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明’惟以上之敘述僅為本發明之較佳實施例說明，凡 精於此項技蟄者當可依據上述之說明而作其它種種之改 良，惟這些改變仍屬於本發明之發明精神中，同時，這些 改變仍屬以下所界定之專利範圍巾。在專利範圍中，功能 手&用语（means-plus-functi〇n)子句係用以說明包含如 同文中之結構描述如同描述功能之表現，而不僅僅是結構 的等效而已’更包含了等效之結構。因此，可以理解的是， 上文係描述說明數個實施例，但並非受限於此些特定實施 例之揭路所揭露之實施例的修改，和其他的實施例—樣， 亦可被解釋成包含於本發明所界定之專利範圍中。 【圖式簡單說明】 本發明具體之實施例揭示之形態内容將配合圖示加以 詳’、’尤月第1至8圖在此係用以說明本發明之實施例， 但不應視為限制。 第1圖係顯示依據本發明一實施例中用以將半導體襞 置連接至測試裝置之連接單元之示意圖； 第2圖係顯示依據本發明之連接單元之第一及第二配 合板連接至第一導引桿之平面圖； 第圖係顯不依據本發明之第1圖中電源傳送裝置及 配合板之間的連接結構之部份放大圖； 26 201111803 第4圖係顯示依據本發明之第1圖中托盤軌道及第一 導引桿彼此連接於連接單元中之示意圖.； 第5圖係顯示第4圖中沿I - Γ 剖面線之剖面圖； 第6圖係顯示第4圖中沿Π -11 ’剖面線之剖面圖； 第7圖係顯示依據本發明之一實施例，具有第1圖中 之連接單元之測試機之示意圖。 【主要元件符號說明】 1 測試裝置The Picker) 350 is interposed between the loading stroller 300 and the loading unit 4A, because the semiconductor device SD which originally separated the first pitch will be rearranged to a second pitch at the test tray ττ. The loading unit 40 0 can be connected to the front process chamber 500, and the test trays 水平 horizontally arranged in the loading unit 400 will be loaded into the front process chamber 5〇〇 in a standing mode, that is, at the loading The test tray TT of the unit 400 lying horizontally (1 yi ng d〇Wn) will stand up vertically in the front process chamber 500. The heating or cooling process will be performed in the front process chamber 500. Thus, the semiconductor device SD in the test tray ττ will be in a high temperature or low temperature state. The pre-process chamber 500 can be connected to the test chamber 200, and the test tray TT including the plurality of semiconductor devices SD will be transferred from the front process chamber 5〇〇 to the test chamber 200, and the semiconductor device SD will be in the test chamber 200. The test device 1 for performing the electrical test for performing the electrical test can be installed on the side wall of the test cavity 200. The connection unit 100 will be provided in the test chamber 200 and the semiconductor device SD in the test tray ττ can be pushed into the socket 2 of the test device i. In one example, as described above, the pushing of the semiconductor device SD performed by the connecting unit 1 can be performed at a relatively high speed, thereby improving the efficiency of the electrical test of the semiconductor device SD. The test chamber 200 can be connected to the post-process chamber 6〇〇. When all the semiconductor devices in the test tray TT are completed, the test transfers the cassette from the test (4) 200 to the post-process chamber, for example. In other words, the semiconductor device SD that is heated or cooled will return to the normal temperature (n〇rmal or room temperature 201111803 temperature) in the post-processing chamber 6〇〇. The process chamber 600 can be connected to the unloading unit 7〇〇. The test tray ττ including the room temperature half body device SD will be transferred from the post process chamber 600 to the unloading unit 700. In one example, the test trays τ τ vertically arranged in the rear process chamber 6 将 will be in the flat mode ( The lie_down m〇de) is unloaded into the unloading list 70 700, that is to say, the test tray TT which is vertically erected in the rear process chamber 6 将 will be changed to be horizontally lying in the unloading unit 700. Thereafter, the semiconductor device SD is taken out from the test tray ττ. A plurality of second customer trays (sec〇nd cust〇mer tray) CT2 are arranged on the unloading stack 9〇〇, and each of the second customer trays CT2 is different from each other according to the test level, and therefore, in the sorting buffer 8 The semiconductor device S]) after the tool is transferred to the unloading stage, which is transferred to the same level of unloading at the same level of the semiconductor device SD system on the sorting table 85〇. The way of the second customer tray CT2 in the stack 9〇〇. The semiconductor devices SD arranged at the second pitch on the sorting table 85 are to be rearranged in the second customer tray CT2 to be spaced apart by a first pitch. Therefore, 'unloading picker 95' can be further installed in the test machine 1 000 between the sorting buffer 8 〇〇 and the unloading stack 900, therefore, the semiconductor device originally separating the second pitch will Will be rearranged in the second customer tray CT2 to be spaced apart by a first pitch. According to an embodiment of the present invention, a plurality of guiding rods can be mounted on the inner side wall of the delta-type cavity, and the mating plate including the plurality of propellers linearly moves along the guiding of the guiding rod. The pusher of the mating plate can accurately push the semiconductor device in the test tray to the corresponding socket of the test device to improve the accuracy and efficiency of the electrical test of the semiconductor device. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. The foregoing description is only illustrative of the preferred embodiments of the present invention, and those skilled in the art can Other various modifications, but these changes are still within the spirit of the invention, and at the same time, these changes are still within the scope of the patent scope defined below. In the scope of patents, the term “means-plus-functi〇n” clause is used to describe the inclusion of a structural description as described in the text as a description of the function, not just the equivalent of the structure. Equivalent structure. Therefore, it is to be understood that the foregoing description of the embodiments of the embodiments of the invention The invention is included in the scope of the patent as defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The exemplified embodiments of the present invention will be described in detail with reference to the drawings, and the drawings are used to illustrate the embodiments of the present invention, but should not be construed as limiting. . 1 is a schematic view showing a connecting unit for connecting a semiconductor device to a test device according to an embodiment of the present invention; and FIG. 2 is a view showing the first and second mating plates of the connecting unit according to the present invention connected to the first A plan view of a guide bar; the figure shows a partial enlarged view of the connection structure between the power transmission device and the mating plate according to the first embodiment of the present invention; 26 201111803 FIG. 4 shows the first aspect according to the present invention. In the figure, the tray track and the first guiding rod are connected to each other in the connecting unit. FIG. 5 is a cross-sectional view taken along line I - Γ in FIG. 4; FIG. 6 is a cross-sectional view in FIG. -11' sectional view of a section line; Fig. 7 is a schematic view showing a testing machine having the connecting unit of Fig. 1 according to an embodiment of the present invention. [Main component symbol description] 1 Test device
10 螺栓 12 螺栓頭 100 連接單元 110 托盤軌道 112 開口 114 分隔元件 120 配合板 120a 第一板 120b 第二板 122 推進器 124 溝槽 130 第一導引桿 135 第二導引桿 140 第一導引架 145 第二導引架 27 201111803 150 夾持元件 152 移動軌道 154 爽持件 160 驅動器 162 電源 163 伺服電動機 164 滾珠螺桿 165 電源傳送裝置 166 線性螺帽 167 第一連接元件 168 第二連接元件 169 伸縮管 170 階梯板 172 螺栓孔 174 突出部 180 支樓板 190 彈性元件 195 對準支架 1000 測試機 2 插座 200 測試腔體 210 連接部） 220 第一軸襯元件 230 第二轴襯元件 28 201111803 3 中間板 300 裝載梭台 350 裝載夾取器 4 測試模組 400 裝載單元 500 前製程腔 600 後製程腔 700 卸載單元 800 分類緩衝區 850 分類桌 900 卸載梭台 950 卸載夾取器 CT1 第一客戶托盤 CT2 第二客戶托盤 SD 半導體裝置 TT 測試托盤 TT1 第一托盤 TT210 Bolt 12 Bolt Head 100 Connection Unit 110 Tray Track 112 Opening 114 Separating Element 120 Mating Plate 120a First Plate 120b Second Plate 122 Propeller 124 Groove 130 First Guide Rod 135 Second Guide Rod 140 First Guide Rack 145 Second guide frame 27 201111803 150 Clamping element 152 Moving track 154 Sink 160 Drive 162 Power supply 163 Servo motor 164 Ball screw 165 Power transmission 166 Linear nut 167 First connection element 168 Second connection element 169 Telescopic Tube 170 step plate 172 bolt hole 174 protrusion 180 branch plate 190 elastic element 195 alignment bracket 1000 test machine 2 socket 200 test cavity 210 connection portion 220 first bushing element 230 second bushing element 28 201111803 3 intermediate plate 300 Loading Shuttle 350 Loading Gripper 4 Testing Module 400 Loading Unit 500 Front Process Chamber 600 Rear Process Chamber 700 Unloading Unit 800 Classification Buffer 850 Classification Table 900 Unloading Shuttle 950 Unloading Gripper CT1 First Customer Pallet CT2 Two customer tray SD semiconductor device TT test tray TT1 first tray TT2