CN103185857A - Test handler - Google Patents
Test handler Download PDFInfo
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- CN103185857A CN103185857A CN2012105588059A CN201210558805A CN103185857A CN 103185857 A CN103185857 A CN 103185857A CN 2012105588059 A CN2012105588059 A CN 2012105588059A CN 201210558805 A CN201210558805 A CN 201210558805A CN 103185857 A CN103185857 A CN 103185857A
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- test
- matching disc
- pusher
- plate
- pushing units
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
This invention relates to a test hander. According to the present invention, a plurality of semiconductor elements are electrically connected to a testor through semiconductor elements supported placed on a test tray by using multiple matching plates. Therefore, exchanging or moving matching board can be more easily handled.
Description
Technical field
The present invention relates to the Test handler that a kind of test of the semiconductor element that the semiconductor element of producing was carried out provides support before dispatching from the factory.
Background technology
Test handler is a kind ofly to support the semiconductor element made through pre-customized fabrication technique so that it can tested device test, and semiconductor element is loaded into the equipment of client's pallet according to test result by grade separation.
Fig. 1 is the concept map of overlooking general Test handler 100.
As shown in Figure 1, Test handler 100 comprises test pallet 110, loading attachment 120, equal hot cell 130 (soak chamber), test cabinet 140, thrust unit 150, moves back equal hot cell 160 (desoak chamber), discharge mechanism 170 etc.
As shown in Figure 2, test pallet 110 be arranged to allow to settle semiconductor element D a plurality of inserts 111 what can be movable, and according to a plurality of transfer devices (not shown) along fixed closed path C circulation.
The not semiconductor element of test that loading attachment 120 will be loaded into client's pallet is transplanted on the test pallet that is positioned at " loaded " position LP.
The purpose that equal hot cell 130 is set is, before testing, carries out preheating or precooling according to test environment conditions to transferring semiconductor element that come, that be placed on the test pallet 110 from " loaded " position LP.
The purpose that test cabinet 140 is set is, to all be preheated in the hot cell 130/be shifted into semiconductor element test position TP, that be placed in test pallet 110 after the precooling to test.At this, test cabinet 140 can be accommodated a test pallet 110, and is also can be as is well known the same, accommodates the test pallet 110 more than two in order to improve the processing capacity.
The purpose that thrust unit 150 is set is that the tester towards butt joint (combination) in test cabinet 140 sides promotes to be placed in the semiconductor element of the test pallet 110 that is positioned at test cabinet 140, so that semiconductor element is electrically connected to tester.The present invention relates to this thrust unit 150, will further describe in the back.
The purpose that equal hot cell 160 is moved back in setting is, makes from the test cabinet 140 handovers semiconductor element through heating or cooling that come, that be placed in test pallet 110 and returns to normal temperature.
As above explanation, semiconductor element with the state that is placed in test pallet 110 along from " loaded " position LP through equal hot cell 120, test cabinet 130, move back equal hot cell 140 and unloading position UP and the closed path C that is connected to " loaded " position LP again circulates.
Then, thrust unit related to the present invention 150 is described in more details.
From the side view of the summary of Fig. 3 as can be known, the general thrust unit 150 that Test handler 100 in the past possesses comprises two matching discs (match plate) 50 and pipeline 60 and drive source 70 etc.
Shown in the planimetric map of Fig. 4, two matching discs 50 comprise a plurality of pushing units 51 respectively and plate 52 etc. are set.As shown in Figure 3, a plurality of pushing units 51 of possessing of matching disc 50 possess with the quantity that a plurality of semiconductor elements that are loaded into a test pallet 110 can be electrically connected to the tester side.Therefore, the quantity of test pallet 110 that is contained in test cabinet 140 is identical with the quantity of matching disc 50, and, as shown in Figure 5, be provided with the test board 211,212 suitable with the quantity of the test pallet 110 that is contained in test cabinet 140 in tester 200, test board 211,212 is responsible for the semiconductor elements that test is loaded into a test pallet 110 accordingly.That is it is identical, to be contained in test board 211,212 the quantity of the quantity of quantity, matching disc 50 of the test pallet 110 of test cabinet 140 and tester 200.
In addition, shown in Fig. 6 a, pushing unit 51 utilization is formed at and plate 52 hole 52a being set is set and arranges, and by pusher 51a, parts 51b two bolt 51c-1,51c-2 are set and two spring 51d-1,51d-2 constitute.
Pusher 51a arranges for the support semiconductor element.
And, spring 51d-1,51d-2 with pusher 51a resiliency supported to plate 52 is set.Therefore, shown in Fig. 6 b, when the front end of pusher 51a supported the semiconductor element that is electrically connected on tester, the reacting force of reply tester side can retreat to a certain degree pusher 51a.
Certainly, the bolt of a corresponding pusher and the quantity of spring can constitute different according to how constituting pushing unit.
As by technique known such as Korean Patent communique 10-0934033 number and 10-0709114 number, pipeline 60 arranges with air in order to reconcile to the semiconductor element supply temperature.And, in this pipeline 60, can be according to the work of drive source 70 and mobile towards the direction advance and retreat of tester side simultaneously in order to make two matching discs 50, in the middle of two matching discs 50 across supporting track 61 and combination.Therefore, pipeline 60 also plays the effect as the support component that supports matching disc 50, and in this pipeline 60, matching disc 50 is along the direction of arrow loading and unloading of Fig. 3.
But, be increased in the quantity of the semiconductor element that at every turn can test gradually in order to improve the processing capacity, thereby the quantity that can be loaded into the semiconductor element of a test pallet also increases gradually, and correspondingly, it is big that the size of test pallet and matching disc also becomes gradually.Accordingly, the weight of matching disc also increases gradually, thereby the supvr brings bigger burden to the supvr when exchange matching disc etc. needs the thicker matching disc of moving metal material.
Summary of the invention
The technology that the object of the present invention is to provide a kind of weight that can make every matching disc to lighten.
Aforesaid Test handler provided by the present invention comprises: test pallet also is being connected to the predetermined circulating path cocycle of " loaded " position again through " loaded " position, test position and unloading position, and can settling a plurality of semiconductor elements; Loading attachment when described test pallet is positioned at " loaded " position, is loaded into test pallet with a plurality of semiconductor bulk elements; All the hot cell is arranged to carry out preheating or precooling to finish a plurality of semiconductor elements that load and come with the state handover that is placed in described test pallet by described loading attachment; Test cabinet is arranged to accommodate from described equal hot cell and is transferred M the test pallet of coming, and a plurality of semiconductor elements that will be placed in a described M test pallet are electrically connected to tester; Thrust unit, a plurality of semiconductor elements of being arranged to will to be placed in by a described M test pallet is clung to the tester side a described M test pallet are electrically connected to the tester side; Move back equal hot cell, be arranged to make a plurality of semiconductors that are placed in described test pallet of coming from described equal hot cell handover to return to normal temperature; Discharge mechanism, from moving back the described test pallet that equal hot cell is transplanted on unloading position and unload a plurality of semiconductor elements by described, described thrust unit comprises: N matching disc, being arranged to can be mobile along the direction advance and retreat of tester side, the a plurality of semiconductor elements that are placed in M the test pallet that is contained in described test cabinet are supported and a plurality of semiconductor elements are electrically connected with tester, wherein, N=a * M, a are the natural number greater than 1; Support component is arranged to support simultaneously a described N matching disc so that a described N matching disc can be simultaneously along the direction advance and retreat of tester side, and can be with the direction advance and retreat movement of a described N matching disc along the tester side; And drive source, be provided for making described support component along the mobile driving force of direction advance and retreat of tester side.
Preferably, at least one matching disc in the described N matching disc comprises: a plurality of pushing units of support semiconductor element; Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form, described a plurality of pushing units comprise respectively: the pusher of support semiconductor element; Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to; The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set; Elastomeric element, with described pusher resiliency supported to plate is set, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, the rear end that parts are set of a plurality of pushing units that is close to the row of adjacent matching disc is compared with the rear end that parts are set of a plurality of push mechanism of remaining row, and is narrow along the width of a side direction.
In be arranged at described described a plurality of pushing units that plate is set with the matrix form, it is different to be close to the direction that a plurality of bonded blocks of a plurality of push mechanism of direction that a plurality of bonded blocks of a plurality of pushing units of the row of adjacent matching disc arrange and remaining row arrange.
In described a plurality of pushing units, being close to direction that a plurality of bonded blocks of a plurality of pushing units of the row of adjacent matching disc arrange can be vertical mutually with the direction that a plurality of bonded blocks of a plurality of push mechanism of remaining row are arranged.
Preferably, at least one matching disc in the described N matching disc comprises: a plurality of pushing units of support semiconductor element; Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form, described a plurality of pushing units comprise respectively: the pusher of support semiconductor element; Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to; The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set; Elastomeric element, with described pusher resiliency supported to plate is set, when overlooking, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, the part that is close to the pusher that a plurality of pushing units of the row of adjacent matching disc possess breaks away from and describedly plate is set and side-prominent towards adjacent matching disc.
Preferably, at least one matching disc in the described N matching disc comprises: a plurality of pushing units of support semiconductor element; Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form, described a plurality of pushing units comprise respectively: the pusher of support semiconductor element; Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to; The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set; Elastomeric element, with described pusher resiliency supported to plate is set, when overlooking, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, a plurality of areas that the hole is set that are close to the row of adjacent matching disc are compared remaining row, and a plurality of areas that the hole is set are narrow.
According to aforesaid the present invention, make a plurality of matching disc correspondences at a test pallet, therefore finally can reduce the weight of matching disc, thereby have the advantage that when exchange or mobile matching disc, can handle more like a cork.
Description of drawings
Fig. 1 is the conceptual planimetric map about general Test handler.
Fig. 2 is about the skeleton diagram of general Test handler with test pallet.
Fig. 3 is the skeleton diagram of the thrust unit that possesses about existing Test handler.
Fig. 4 is the planimetric map about the matching disc of the thrust unit that is applied to Fig. 3.
Fig. 5 is the skeleton diagram about general tester.
Fig. 6 a and Fig. 6 b are the sectional view about the pushing unit that is applied to existing thrust unit.
Fig. 7 is the skeleton diagram about thrust unit provided by the present invention.
Fig. 8 is the planimetric map about the matching disc that is applied to Fig. 7.
Fig. 9 a to Fig. 9 d is the reference figure that is used for the matching disc of key diagram 7.
The sectional view of the pushing unit that Figure 10 provides for further application of the invention.
Symbol description:
100: Test handler 110: test pallet
120: loading attachment 130: equal hot cell
140: test cabinet 160: move back equal hot cell
170: discharge mechanism 700: thrust unit
710: matching disc 711,712: pushing unit
711a, 712a: pusher 711b, 712b: parts are set
711c-1,711c-2,712c-1,712c-2: bolt
711d-1,711d-2,712d-1,712d-2: spring
713: plate 713a is set: the hole is set
F: grid bar 720: pipeline
730: drive source
Embodiment
Below, with reference to the aforesaid preferred embodiment provided by the present invention of description of drawings, in this terseness in order to illustrate, omit or reduce the explanation of repetition as far as possible.
The explanation of the Test handler that present embodiment provides as carrying out in background technology comprises test pallet, loading attachment, equal hot cell, test cabinet, thrust unit, moves back equal hot cell, discharge mechanism etc.
In the superincumbent formation, test pallet, loading attachment, all hot cell, test cabinet, move back equal hot cell and discharge mechanism identical with each formations of the general Test handler that in background technology, illustrates, so omission is to its explanation.
As shown in Figure 7, the thrust unit 700 of Test handler provided by the present invention possesses: quantity is matching disc 710A, the 710B of the twice (two) of the quantity (one) that is housed in the test pallet 110 of test cabinet; Pipeline 720 makes two matching disc 710A, 710B whiles towards the function of the mobile support component of the direction advance and retreat of tester side when playing as support two matching disc 710A, 710B; Drive source 730 is provided for making pipeline 720 towards the mobile driving force of direction advance and retreat of tester side.That is, in order to make the semiconductor element that is loaded into a test pallet 110 be electrically connected on tester and possess two matching disc 710A, 710B.If being contained in the quantity of the test pallet of test cabinet is two, then matching disc also possesses four of the quantity that doubles test pallet.Certainly, the difference according to implementing is electrically connected to tester in order to make the semiconductor element that is loaded into a test pallet, and matching disc can possess the quantity more than three or four or four.For this reason, matching disc 710A, the 710B that is applied to Test handler provided by the present invention has particular structure as hereinafter described.As a reference, below with symbol " 710 " indicia matched plate.
As shown in Figure 8, matching disc 710 is by a plurality of pushing units 711,712 and plate 713 is set constitutes.As a reference, when comparing with the situation of two test pallets of use top and bottom among Fig. 3 and matching disc, for convenience of explanation, Fig. 8 has only used this example to test pallet and the matching disc of upper end, then omits for the lower end.
A plurality of pushing units 711,712 pairs of a plurality of semiconductor elements that are electrically connected on tester support, and plate 713 is set has for a plurality of pushing units 711, a plurality of hole 713,713b of arranging of 712 are set with the matrix form.
Fig. 9 a is for separating pushing unit 711,712 and the planimetric map of plate 713 is set in the matching disc 710 of Fig. 8, Fig. 9 b is for observing the sectional view of the 7th a plurality of pushing units 711 that are listed as and the 8th a plurality of pushing units 712 that are listed as from the side in Fig. 9 a, Fig. 9 c is a plurality of pushing units 711 of vertical view 9b, 712 conceptual planimetric map.
Shown in Fig. 9 a to Fig. 9 c, the 7th row and the 8th a plurality of pushing units 711,712 that are listed as respectively by pusher 711a, 712a, parts 711b, 712b, two bolt 711c-1,711c-2,712c-1,712c-2 and two spring 711d-1,711d-2,712d-1,712d-2 are set.
Two bolt 711c-1,711c-2,712c-1,712c-2 are as in conjunction with the bonded block of parts 711b, 712b and pusher 711a, 712a being set and arranging.
Two spring 711d-1,711d-2,712d-1,712d-2 conducts arrange pusher 711a, 712a resiliency supported to the elastomeric element that plate 713 is set.
Obviously, in this example too, can have different formations according to how constituting pushing unit corresponding to the bolt of a pusher and the quantity of spring.
And, arrange plate 713 with the matrix form be formed with for arrange with the matrix form pushing unit 711,712 hole 713a, 713b be set.
Then, further describe feature structure of the present invention.
As illustrating shown in Fig. 9 d of a plurality of rear end parts that parts 711b, 712b be set from the back side in a plurality of pushing units 711,712 of Fig. 9 c, it is narrow that the width along Y direction of the rear end that parts 712b is set that is close to the 8th row of adjacent matching disc M is compared the width along Y direction of the rear end that parts 711b is set of the 7th row.Therefore, two bolt 711c-1,711c-2 of the pushing unit 711 of the 7th row are arranged side by side along X-direction, and two bolt 712c-1,712c-2 of the pushing unit 712 of the 8th row are arranged side by side along the Y direction perpendicular to X-direction.The reason of Bu Zhiing is like this, under the situation that the structure of the test board of tester does not have to change, when wanting that two matching discs 710 are applied to a test pallet 110, to make the rear end that parts 711b, 712b are set snap fit onto the structure that hole 713a, 713b are set in order constituting, need to guarantee to arrange the area of the grid bar F of plate 713.And, corresponding to this structure, a plurality of of plate 713 being set arranging among hole 713a, the 713b, the 8th row a plurality of arrange a plurality of hole 713a that arrange that hole 712b compares remaining row (the 1st row to the 7th row), and the area when overlooking forms narrowly.
In addition, even being arranged at the width along Y direction of the rear end that parts 712b is set of the 8th row is configured narrower, also need to guarantee in the same manner the area of the front end support semiconductor element of pusher 712a, therefore be preferably the pusher 712a that the pushing unit 712 of the 8th row possesses and have the identical structure of pusher 711a that possesses with the pushing unit 711 of the 7th row.Therefore, possessing will be side-prominent towards adjacent matching disc M in the part (lower portion on the figure at Fig. 8) of the 8th pusher 712a that is listed as.
As a reference, the 1st row to the pushing unit of the 6th row has the structure identical with the pushing unit 711 of the 7th row.
Above-mentioned explanation is to cutting apart center section and situation dichotomous along the matching disc in the past of pushing units that X-direction possesses 16 row.Namely, when comparing with in the past a matching disc, the invention belongs to divide into and have the 1st row to the matching disc of the pushing unit of the 8th row from the upper end and have the 9th row to the situation of the matching disc of the pushing unit of the 16th row, therefore for being the situation that benchmark is cut apart matching disc with other positions in the middle of not being, the present invention is suitable for certainly too.
In addition, as Fig. 7 a of Korean Patent mandate communique 10-0709114 number disclosed, for the morphotic situation that the pushing unit with two row is combined as a whole, the present invention also can use aptly with form as shown in figure 10.
As mentioned above, though be that embodiment according to the reference accompanying drawing carries out about of the present invention specifying, but, the above embodiments are only enumerated the preferred embodiments of the present invention and are illustrated, therefore should understand interest field of the present invention with its equivalents with the scope that claims are put down in writing, and can not the understanding cost invention only be confined to the above embodiments.
Claims (6)
1. a Test handler is characterized in that, comprising:
Test pallet is being connected to the predetermined circulating path cocycle of " loaded " position again, and can settling a plurality of semiconductor elements through " loaded " position, test position and unloading position;
Loading attachment when described test pallet is positioned at " loaded " position, is loaded into test pallet with a plurality of semiconductor bulk elements;
All the hot cell is arranged to carry out preheating or precooling to finish a plurality of semiconductor elements that load and come with the state handover that is placed in described test pallet by described loading attachment;
Test cabinet is arranged to accommodate from described equal hot cell and is transferred M the test pallet of coming, and a plurality of semiconductor elements that will be placed in a described M test pallet are electrically connected to tester;
Thrust unit, a plurality of semiconductor elements of being arranged to will to be placed in by a described M test pallet is clung to the tester side a described M test pallet are electrically connected to the tester side;
Move back equal hot cell, be arranged to make a plurality of semiconductors that are placed in described test pallet of coming from described equal hot cell handover to return to normal temperature;
Discharge mechanism, from moving back the described test pallet that equal hot cell is transplanted on unloading position and unload a plurality of semiconductor elements by described,
Described thrust unit comprises:
N matching disc, being arranged to can be mobile along the direction advance and retreat of tester side, a plurality of semiconductor elements that are placed in M the test pallet that is contained in described test cabinet are supported and a plurality of semiconductor elements are electrically connected with tester, wherein, N=a * M, a are the natural number greater than 1;
Support component is arranged to support simultaneously a described N matching disc so that a described N matching disc can be simultaneously along the direction advance and retreat of tester side, and can be with the direction advance and retreat movement of a described N matching disc along the tester side; And
Drive source is provided for making described support component along the mobile driving force of direction advance and retreat of tester side.
2. Test handler as claimed in claim 1 is characterized in that, at least one matching disc in the described N matching disc comprises:
A plurality of pushing units of support semiconductor element;
Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form,
Described a plurality of pushing unit comprises respectively:
The pusher of support semiconductor element;
Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to;
The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set;
Elastomeric element, with described pusher resiliency supported to plate is set,
In be arranged at described described a plurality of pushing units that plate is set with the matrix form, the rear end that parts are set of a plurality of pushing units that is close to the row of adjacent matching disc is compared with the rear end that parts are set of a plurality of push mechanism of remaining row, and is narrow along the width of a side direction.
3. Test handler as claimed in claim 2, it is characterized in that, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, it is different to be close to the direction that a plurality of bonded blocks of a plurality of push mechanism of direction that a plurality of bonded blocks of a plurality of pushing units of the row of adjacent matching disc arrange and remaining row arrange.
4. Test handler as claimed in claim 3, it is characterized in that, in described a plurality of pushing units, it is vertical mutually to be close to the direction that direction that a plurality of bonded blocks of a plurality of pushing units of the row of adjacent matching disc arrange and a plurality of bonded blocks of a plurality of push mechanism of remaining row arrange.
5. Test handler as claimed in claim 1 is characterized in that, at least one matching disc in the described N matching disc comprises:
A plurality of pushing units of support semiconductor element;
Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form,
Described a plurality of pushing unit comprises respectively:
The pusher of support semiconductor element;
Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to;
The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set;
Elastomeric element, with described pusher resiliency supported to plate is set,
When overlooking, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, the part that is close to the pusher that a plurality of pushing units of the row of adjacent matching disc possess breaks away from and describedly plate is set and side-prominent towards adjacent matching disc.
6. Test handler as claimed in claim 1 is characterized in that, at least one matching disc in the described N matching disc comprises:
A plurality of pushing units of support semiconductor element;
Plate is set, has for a plurality of holes that arrange that described a plurality of pushing units are set with the matrix form,
Described a plurality of pushing unit comprises respectively:
The pusher of support semiconductor element;
Parts are set: front end is connected to described pusher mutually, and the rear end is connected in the described hole that arranges that plate is set, wherein, with the direction of tester side be defined as the place ahead to, with the side of tester side be defined as in the opposite direction the rear to;
The a plurality of bonded blocks that are arranged side by side mutually are in conjunction with described pusher with parts are set;
Elastomeric element, with described pusher resiliency supported to plate is set,
When overlooking, in be arranged at described described a plurality of pushing units that plate is set with the matrix form, a plurality of areas that the hole is set that are close to the row of adjacent matching disc are compared remaining row, and a plurality of areas that the hole is set are narrow.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0000338 | 2012-01-03 | ||
| KR1020120000338A KR101658078B1 (en) | 2012-01-03 | 2012-01-03 | Test handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103185857A true CN103185857A (en) | 2013-07-03 |
| CN103185857B CN103185857B (en) | 2015-08-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210558805.9A Active CN103185857B (en) | 2012-01-03 | 2012-12-20 | Test handler |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101658078B1 (en) |
| CN (1) | CN103185857B (en) |
| TW (1) | TWI490509B (en) |
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| CN104889068A (en) * | 2014-03-03 | 2015-09-09 | 泰克元有限公司 | Test Handler and Circulation Method of Test Trays in Test Handler |
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| CN104338682B (en) * | 2013-07-26 | 2017-04-12 | 泰克元有限公司 | A push component assembly for a matching plate of a testing and sorting machine |
| CN107003350A (en) * | 2014-11-28 | 2017-08-01 | 泰克元有限公司 | Testing, sorting machine |
| CN111505349A (en) * | 2015-01-12 | 2020-08-07 | 泰克元有限公司 | Pressure device for test sorting machine |
| TWI779650B (en) * | 2021-06-08 | 2022-10-01 | 南亞科技股份有限公司 | Test handler and operation method thereof |
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| WO2016080670A1 (en) * | 2014-11-20 | 2016-05-26 | (주)테크윙 | Test tray for test handler and interface board for tester |
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| CN104338682B (en) * | 2013-07-26 | 2017-04-12 | 泰克元有限公司 | A push component assembly for a matching plate of a testing and sorting machine |
| CN104889068A (en) * | 2014-03-03 | 2015-09-09 | 泰克元有限公司 | Test Handler and Circulation Method of Test Trays in Test Handler |
| CN104889068B (en) * | 2014-03-03 | 2017-09-08 | 泰克元有限公司 | The round-robin method of test pallet in testing, sorting machine and testing, sorting machine |
| CN107003350A (en) * | 2014-11-28 | 2017-08-01 | 泰克元有限公司 | Testing, sorting machine |
| CN111505349A (en) * | 2015-01-12 | 2020-08-07 | 泰克元有限公司 | Pressure device for test sorting machine |
| CN106111552A (en) * | 2015-05-04 | 2016-11-16 | 泰克元有限公司 | Testing, sorting machine plug connector |
| TWI779650B (en) * | 2021-06-08 | 2022-10-01 | 南亞科技股份有限公司 | Test handler and operation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201331606A (en) | 2013-08-01 |
| KR20130079701A (en) | 2013-07-11 |
| TWI490509B (en) | 2015-07-01 |
| KR101658078B1 (en) | 2016-09-21 |
| CN103185857B (en) | 2015-08-19 |
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