201036098 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種半導體裝置之分類設備，尤其係關於一種 能夠依據分類準則自動地對半導體晶片等裝置進行分類之分類設 備及分類方法。 [先前技術] 經過封裝製程之半導體裝置（以下將被稱爲裝置）係將經過 各種不同的測試，例如電測試及抗熱或抗壓之可靠性測試。 作爲上述這些裝置測試中的一種，老化測試係用以透過將複 數個裝置***到老化板中，並將老化板收容於老化測試設備中， 然後在測試時間內對老化板加熱或加壓藉以測試裝置是否具有缺 陷。 用於老化測試之分類設備係指依據基於各裝置之測試結果應 用於包含有合格及不合格產品之各個裝置之分類準則，將待進行 老化測試之新的裝置裝載（***）到裝置所位於的老化板之空餘 空間（插槽）中，並將裝置從其上裝載有經老化測試後的裝置之 老化板中卸載（分類）到各個托盤中之設備。 分類設備之性能係基於每小時分類的單元之數量（UPH :每 小時單元數）而評價得出。並且，此每小時單元數（UPH)係由 在分類設備之各組件之間開始傳送裝置及老化板之時間來確定。 爲了提高每小時單元數，分類設備之各個組件的構造及排佈 4 201036098 需要加以改良。 【發明內容】 因此，本發明之一目的在於提供一種半導體裝置之分類設 .備，係透過在被提供有待測試之裝置（〃第一裝置〃）的裝載單元 與老化板之間，以及在老化板與裝載有測試後之裝置（〃第二裝 置的卸載單元之間配設複數個之上暫時裝載有裝置之移動緩衝 器藉以能夠透過連續地執行裝載與卸載製程進而有效地提高處理 ^速度。 本發明之另一目的在於提供一種半導體裝置之分類設備，係 透過在被提供有第一裝置的裝載單元與老化板之間，以及在老化 板與裝載有第二裝置的卸載單元之間配設複數個之上暫時裝載有 裝置之移動緩衝器，並透過在移動緩衝器與其上最大數量的裝置 被交換的老化板之間交換大量的裝置，藉以能夠透過一最佳之結 ❸構進而有效地提高處理速度並有效地降低製造成本。 爲了獲得本發明的這些及其它優點且依照本發明之目的，現 對本發明作具體化和槪括性地描述，本發明所提供之一種半導體 裝置之分類設備，係包含：裝載單元，係用以裝載其上裝載有第 -一裝置之托盤；複數個第一移動緩衝器，係用以從裝載單元之托 ' 盤中接收第一裝置；第一傳送工具，係用以將裝載於第一移動緩 衝器之上的第一裝置***到老化板之空餘空間中；第二傳送工 具，係用以從老化板中取回第二裝置；複數個第二移動緩衝器， 5 201036098 係用以在其之上裝載由第二傳送工具取回之第二裝置；以及卸載 單元，係用以從第二移動緩衝器中接收第二裝置，並將第二裝置 裝載於托盤之上。 第一及第二傳送工具可包含複數個排列成複數行並配置成可 單獨地拾取第一及第二裝置之拾取器。 第一及第二移動緩衝器可包含：第一裝置收容單元，係配置 成透過安裝於設備之上部的支撐元件之上端所安裝之第一導向元 件而被支撐並可被水平地移動；第二裝置收容單元，係配置成透 過安裝於支撐元件之中端的第二導向元件而被支撐並可被水平地 移動；以及第三裝置收容單元，係配置成透過安裝於支撐元件之 下端或設備之上部的第三導向元件而被支撐並可被水平地移動。 上述設備可進一步包含用以測試介於裝載單元與第一移動緩 衝器之間的第一裝置之電特性的測試單元。 上述裝置還可包含：第一固定緩衝器，係用以在其之上暫時 地裝載裝載於第一移動緩衝器之上的第一裝置；以及第二固定緩 衝器，係用以在其之上暫時地裝載裝載於第二移動緩衝器之上的 第二裝置。 爲了獲得本發明的這些及其它優點且依照本發明之目的’現 對本發明作具體化和槪括性地描述，本發明還提供了一種半導體 裝置之分類方法，係包含：用以裝載其上裝載有第一裝置之托盤 的裝載步驟；用以將複數個第一移動緩衝器水平地移動至第一裝 6 201036098 置裝載位置，並將托盤之第一裝置依序地傳送至第一移動緩衝器 之第一傳送步驟；用以將第一移動緩衝器水平地移動至第一裝置 ***位置，並將第一移動緩衝器之第一裝置依序地***到老化板 之空餘空間中的***步驟；用以將複數個第二移動緩衝器水平地 移動至第二裝置取回位置，並將第二裝置從老化板中依序地取回 藉以傳送至第二移動緩衝器之第二傳送步驟；以及用以將第二移 動緩衝器之第二裝置卸載到托盤之卸載步驟。 上述方法可進一步包含用以測試介於裝載步驟與第一傳送步 驟之間的第一裝置之電特1生的測試步驟。 第一傳送步驟還可包含：用以將測試步驟中確定爲不合格產 品的第一裝置從第一移動緩衝器中加以分類的分類步驟；以及緩 衝步驟’係用以在必要時將分類步驟中未經分類的留存於第一移 動緩衝器上的第一裝置傳送至緩衝器，並從緩衝器傳送合格的第 一裝置並將合格的第一裝置塡充到第一移動緩衝器之空餘空間 中’此空餘空間係位於已將分類步驟中確定爲不合格產品之第一 不合格裝置移除之位置。 上述半導體裝置之分類設備可具有如下優點： 首先’透過在被提供有第一裝置的裝載單元與老化板之間， 以及在老化板與裝載有第二裝置的卸載單元之間配設複數個之上 暫時裝載有裝置之移動緩衝器藉以能夠透過連續地執行裝載與卸 載製程進而可以有效地提高處理速度。 7 201036098 此外，透過藉由在老化板與其上大量裝置被交換之移動緩衝 器之間傳送大量的裝置所獲得的最佳之結構，可提高設備之穩定 性並可極大地降低製造成本。 本發明之前述及其他的目的、特徵、形態及優點將結合圖示 部分在如下的本發明之詳細說明中更清楚地加以闡述。 【實施方式】 現在，將結合圖示部分對本發明進行詳細說明。 爲了根據圖示簡要說明，相同或相當之部件將以相同的參考 標號表示，並且將不會對相同或相當之部件進行重複說明。 下面，將結合附圖進一步詳細說明本發明之半導體裝置之分 類設備。 「第1圖」爲本發明之半導體裝置之分類設備的總體設計圖； 「第2圖」爲「第1圖」之半導體裝置之分類設備的結構平面圖； 以及「第3圖」爲「第1圖」之半導體裝置之分類設備的第一及 第二移動緩衝器之結構剖視圖。 如「第1圖」及「第2圖」中所示，本發明之半導體裝置之 分類設備係包含：裝載單元210、卸載單元220、分類單元320、 複數個第一移動緩衝器600、複數個第二移動緩衝器700及複數個 用於傳送裝置20之第一至第五傳送工具510、520、530、540、550 及分類工具560。 老化板10係指其上裝載有第一裝置20之板體藉以於老化測 201036098 試設備（附圖中未示出）中經歷老化測試。並且，老化板ίο係配 設有用於將裝置***到其之中的插槽以使得裝置之電特性及訊號 特性能夠在高溫下得以測試。 • 老化板10係安裝至分類設備之板狀工作台110 〇已經完成老 化測試之第二裝置20係被卸載到老化板10，且第一裝置20係被 裝載到老化板10之上。 板狀工作台110可包含：板交換單元（附圖中未示出），係用 以接收將要進行裝置20之交換製程的老化板10，或用以取回已完 成交換製程之老化板10 ;以及板移動單元（附圖中未示出），係用 以移動老化板10 ,以使得裝置能夠透過稍後將要說明的傳送工具 而被方便地裝載到老化板10之上或從老化板10中取回。 板移動單元可具有用於移動老化板10之各種不同的結構，例 如，可沿X及Y方向移動老化板10或使老化板10旋轉（例如沿 0方向旋轉），以使得裝置20能夠透過傳送工具被方便地裝載到BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sorting apparatus for a semiconductor device, and more particularly to a sorting apparatus and a sorting method capable of automatically classifying devices such as semiconductor wafers according to classification criteria. [Prior Art] A semiconductor device (hereinafter referred to as a device) subjected to a packaging process will undergo various tests such as electrical testing and reliability tests against heat or pressure. As one of the above-mentioned devices, the aging test is used to insert a plurality of devices into the aging plate, and the aging plate is housed in the aging test equipment, and then the aging plate is heated or pressurized during the test time to test Whether the device has a defect. The classification device used for the aging test refers to loading (inserting) a new device to be subjected to the aging test to the device according to the classification criteria applied to each device including the qualified and non-conforming products based on the test results of the respective devices. The empty space (slot) of the aging board is loaded and sorted into the equipment in each tray from the aging board on which the aging-tested device is loaded. The performance of the sorting equipment is evaluated based on the number of units sorted per hour (UPH: number of units per hour). Also, the number of units per hour (UPH) is determined by the time between the start of the transfer of the device and the aging board between the components of the sorting device. In order to increase the number of units per hour, the construction and arrangement of the various components of the sorting device 4 201036098 needs to be improved. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor device classification apparatus that is disposed between a loading unit and an aging panel provided with a device to be tested (〃 first device 〃), and in aging The board is loaded with the device after the test (the unloading unit of the second device is provided with a plurality of mobile buffers temporarily loaded with the device to enable the processing speed to be effectively increased by continuously performing the loading and unloading process. Another object of the present invention is to provide a sorting device for a semiconductor device by arranging between a loading unit provided with a first device and an aging plate, and between an aging plate and an unloading unit loaded with a second device. a plurality of mobile buffers temporarily loaded with devices, and a large number of devices are exchanged between the moving buffers and the aging boards on which the largest number of devices are exchanged, so that an optimal junction structure can be effectively utilized Increasing the processing speed and effectively reducing the manufacturing cost. In order to obtain these and other advantages of the present invention and in accordance with the present invention The present invention is embodied and described in detail. The present invention provides a sorting device for a semiconductor device, comprising: a loading unit for loading a tray on which a first device is loaded; a first movement buffer for receiving a first device from the tray of the loading unit; a first transfer tool for inserting the first device loaded on the first movement buffer into the aging plate In the free space; the second transfer tool is for retrieving the second device from the burn-in board; the plurality of second move buffers, 5 201036098 is used to load the second device retrieved by the second transfer tool And an unloading unit for receiving the second device from the second movement buffer and loading the second device on the tray. The first and second transfer tools may include a plurality of rows arranged in a plurality of rows and configured to The pickers of the first and second devices may be separately picked up. The first and second movement buffers may include: a first device housing unit configured to pass over a support member mounted on an upper portion of the device The first guiding element mounted is supported and can be moved horizontally; the second device housing unit is configured to be supported by the second guiding element mounted at the middle end of the supporting element and can be horizontally moved; The three device housing unit is configured to be supported and movable horizontally through a third guiding member mounted to the lower end of the support member or to the upper portion of the device. The apparatus may further include testing the loading unit and the first movement a test unit for electrical characteristics of the first device between the buffers. The apparatus may further include: a first fixed buffer for temporarily loading the first device loaded on the first movement buffer thereon And a second fixed buffer for temporarily loading a second device mounted thereon over the second mobile buffer. To achieve these and other advantages of the present invention and in accordance with the purpose of the present invention The invention is embodied and described in detail, and the present invention also provides a method for classifying a semiconductor device, comprising: loading thereon a loading step of a tray of a device; horizontally moving the plurality of first moving buffers to a loading position of the first device 6 201036098, and sequentially transmitting the first device of the tray to the first moving buffer a transmitting step; an inserting step of horizontally moving the first moving buffer to the first device insertion position, and sequentially inserting the first device of the first moving buffer into the free space of the aging board; Moving a plurality of second movement buffers horizontally to a second device retrieval position, and sequentially retrieving the second device from the aging panel for transmission to the second movement buffer; and The unloading step of unloading the second device of the second moving buffer to the tray. The above method may further comprise a test step for testing the electrical characteristics of the first device between the loading step and the first transferring step. The first transmitting step may further include: a sorting step of classifying the first device determined to be a defective product in the testing step from the first moving buffer; and a buffering step 'to use the sorting step when necessary The unclassified first device remaining on the first mobile buffer is transferred to the buffer, and the qualified first device is transferred from the buffer and the qualified first device is buffered into the free space of the first mobile buffer 'This free space is located at the location where the first unqualified device identified as a non-conforming product in the sorting step has been removed. The sorting device of the above semiconductor device may have the following advantages: firstly, by arranging a plurality of between the loading unit provided with the first device and the aging plate, and between the aging plate and the unloading unit loaded with the second device The mobile buffer temporarily loaded with the device is capable of effectively increasing the processing speed by continuously performing the loading and unloading processes. 7 201036098 In addition, by optimizing the structure obtained by transferring a large number of devices between the aging board and the mobile buffer exchanged with a large number of devices thereon, the stability of the device can be improved and the manufacturing cost can be greatly reduced. The above and other objects, features, aspects and advantages of the present invention will become more apparent from [Embodiment] Now, the present invention will be described in detail in conjunction with the drawings. The same or equivalent components will be denoted by the same reference numerals, and the same or equivalent components will not be repeatedly described. Hereinafter, the sorting apparatus of the semiconductor device of the present invention will be described in further detail with reference to the accompanying drawings. 1 is a general plan view of a sorting device for a semiconductor device of the present invention; FIG. 2 is a plan view showing a structure of a semiconductor device of "1"; and "3" is "1" Figure 1 is a cross-sectional view showing the structure of the first and second movement buffers of the sorting device of the semiconductor device. As shown in "1" and "2", the classification device of the semiconductor device of the present invention includes a loading unit 210, an unloading unit 220, a classifying unit 320, a plurality of first moving buffers 600, and a plurality of The second movement buffer 700 and a plurality of first to fifth transfer tools 510, 520, 530, 540, 550 and sorting tool 560 for the transfer device 20. The aging panel 10 refers to a panel on which the first device 20 is loaded to undergo an aging test in an aging test 201036098 test device (not shown in the drawings). Also, the aging board ίο is provided with a slot for inserting the device therein so that the electrical characteristics and signal characteristics of the device can be tested at high temperatures. • The aging panel 10 is mounted to the panel table 110 of the sorting device. The second device 20 that has completed the aging test is unloaded to the aging panel 10, and the first device 20 is loaded onto the aging panel 10. The plate-shaped workbench 110 may include: a plate exchange unit (not shown in the drawing) for receiving the aging plate 10 to be subjected to the exchange process of the device 20, or for aging the aging plate 10 that has completed the exchange process; And a plate moving unit (not shown in the drawings) for moving the burn-in board 10 so that the apparatus can be conveniently loaded onto or from the burn-in board 10 through a transfer tool to be described later. retrieve. The board moving unit can have various different configurations for moving the aging panel 10, for example, the aging panel 10 can be moved in the X and Y directions or rotated (eg, rotated in the 0 direction) to enable the device 20 to transmit The tool is conveniently loaded into
%J 老化板10之上或從老化板10中取回。 板狀工作台110係安裝於分類設備之主體100上。並且，主體 100可包含具有開口 101之上部102，通過開口 101，裝置20可藉 由傳送工具而從老化板10中取回或被裝載到老化板10之上。 裝載單元210係用以將其上將裝載複數個第一裝置20之托盤 30 (以下將被稱爲"裝載托盤。裝載到老化板1〇之上。此裝載 單元210可具有各種不同的構造。 9 201036098 卸載單元220係用以將第二裝置20中的合格的裝置（〃合格 產品〃）卸載到托盤30。此卸載單元220可具有各種不同的構造。 如「第2圖」中所示，裝載單元210及卸載單元220包含一對 用於引導托盤30移動的導軌211、221，以及用於移動托盤30之 驅動單元（附圖中未示出）。 裝載單元210及卸載單元220可根據設計條件被排佈成各種不 同的方式。如「第1圖」及「第2圖」中所示，裝載單元210及 卸載單元220 —般可平行設置，以使得測試單元310、卸載單元 220、分類單元320、第一移動緩衝器600、第二移動緩衝器700能 夠被安裝在其之間。然而，本發明並非以上述結構爲限。 當裝置20從裝載單元210之托盤30中被取回之後，空的托盤 30可透過托盤傳送單元（附圖中未示出）被傳送至卸載單元220 以使得第二裝置20能夠被裝載到其之上。 這裡，托盤30之上可留存有裝置20。爲了於托盤30被從裝 載單元210傳送至卸載單元220之前移除空托盤30上所有留存的 裝置20，可進一步安裝有托盤旋轉單元330，係用以透過旋轉托 盤30而將托盤30上留存的所有裝置20移除。 如「第1圖」及「第2圖」中所示，托盤旋轉單元330係安 裝於介於裝載單元210與卸載單元220之間的托盤30之傳送路徑 上。並且，托盤旋轉單元330係配置成透過托盤傳送單元接收來 自裝載單元210之托盤30，並於隨後將托盤30傳送至卸載單元 10 201036098 220。 此分類設備可進一步包含測試單元310，係用以在將裝置20 裝載到老化板10上之前測試從裝載單元210供應之裝置20的電特 性，例如直流特性，以使得只有合格的裝置能夠被裝載到老化板 10之上。 、測試單元310可具有各種不同的構造。例如，測試單元310 可包含複數個安裝在裝載單元210與第一移動緩衝器600之間的插 0 槽，並配置成與各第一裝置20電連接。較佳地而言，測試單元310 可包含有與水平排列之托盤30的數量相同的水平排列之插槽。 由測試單元310測試出的各個第一裝置20之測試結果係用作 藉由分類單元320進行分類製程之資料，這將於隨後加以說明。 本發明之分類設備可包含有分類單元320，係用以將由測試單 元310之測試結果確定爲不合格產品之第一不合格裝置20與需要 在第二裝置20中加以分類的第二不合格裝置20進行分類，並將 〇 第一及第二不合格裝置20裝載到其之上。 分類單元320可根據排佈及分類標準具有各種不同之構造。 並且，分類單元320可根據分類標準（合格、第一不合格（接觸 .不合格）、第二不合格（直流失效）等）包含有適當數量的之上裝 載有裝置20之托盤30 (分類托盤）。分類單元320可具有與前述 裝載單元210相似之結構，或可在固定至主體1〇〇之狀態設置於裝 載單元210與卸載單元220之間。 11 201036098 在主體100 ±’不僅可安裝有分類單元320也可安裝有空托盤 單元340。空托盤單元340用以提供空的托盤30至卸載單元22〇 等處，或可將從裝載單元210接收的空的托盤3〇暫時地裝載到其 之上。 傳送工具係用以在老化板10、裝載單元210、測試單元310、 卸載單元220、分類單元320、第一移動緩衝器600及第二移動緩 衝器700之間傳送裝置20。並且，傳送工具可根據各組件之排佈 具有各種不同之構造。 例如，傳送工具可包含用於在第一移動緩衝器600與老化板 10之間傳送裝置20之第一傳送工具530，及用於在老化板10與第 二移動緩衝器7〇〇之間傳送裝置20之第二傳送工具540。 傳送工具還可包含用於在裝載單元210與測試單元310之間傳 送裝置20之第三傳送工具510 ;用於在測試單元310與第一移動 緩衝器600之間傳送裝置20之第四傳送工具520 ;用以在第二移 動緩衝器700與卸載單元220之間傳送裝置20之第五傳送工具 550 ;以及用以在第一移動緩衝器600、第二移動緩衝器700及分 類單元320之間傳送裝置20之分類工具560。 裝載於老化板之上的裝置20之排佈不同於裝載於托盤30 之上的裝置20之排佈，並且排佈在老化板1〇之上的裝置之數量 較大。 因此，用於傳送裝置20至老化板10或將裝置20從老化板10 12 201036098 中取回的第一傳送工具530及第二傳送工具540相較於其它傳送工 具係較佳地配置成能夠傳送較大數量的裝置20 〇例如，第一傳送 工具530及第二傳送工具540中的每一傳送工具具有12x2之結 構，而其它的傳送工具則具有8x1、8x2之結構。 基於上述結構，用於傳送小數量的裝置20之傳送工具可被用 於需要傳送小數量的裝置20之位置。因此，分類設備之製造成本 及尺寸大小可被縮減，並且分類設備之可靠性可被提高。 考慮到老化板10上的裝置20之裝載製程及取回製程係交替 地進行，因而第一傳送工具530與第二傳送工具540可配置成能夠 彼此整體地移動。 由於第三傳送工具510及第四傳送工具520係在測試單元310 設置於其之間的狀態下傳送裝置20，因此第三傳送工具510及第 四傳送工具520也可配置成能夠彼此整體地移動。 爲了裝置20之傳送效率，第一傳送工具530及第二傳送工具 540之水平排列的拾取器之數量可被設置成與第一及第二移動緩 衝器600、700上的用以將裝置20裝載於其之上的水平排列之裝置 收容槽（附圖中未示出）的數量相等。 分類工具560之數量可形成爲一個或複數個。並且，分類工 具560可與用於在第一移動緩衝器600與分類單元320之間傳送裝 置20以及用於在第二移動緩衝器700與分類單元320之間傳送裝 置之第二分類工具560 —起使用。 13 201036098 每一傳送工具可包含一個或多個拾取器以及用以沿Χ-Ζ、γ-ζ 或Χ-Υ-Ζ方向移動拾取器之拾取器移動單元，上述拾取器之端部 設置有用以透過真空壓力吸取裝置20之吸頭。 傳送工具之拾取器可排列成一行，或排列成複數行，如排列 成12x2行。 第一及第二移動緩衝器600、700係可移動地安裝於主體1〇〇 上，並用以在老化板10與裝置交換之裝置交換位置③，裝載單元 210或卸載單元220與裝置交換之裝饞交換位置①，以及分類單元《》 320與裝置交換之裝置交換位置②之間移動時平穩及連續地將裝 置20彼此加以交換。如此可使得分類製程之執行速度得到極大地 提高。 第一移動緩衝器600係配置成可移動至用以透過第四傳送工 具520裝載從測試單元310接收之第一裝置20之裝載位置（裝置 交換位置）①，用以透過分類工具560傳送第一不合格裝置20至 I | 分類單元320之分類托盤30之分類位置②，以及用以透過第一傳 s 送工具530裝載已從中移除第一不合格裝置20之剩餘的第一裝置 20至板狀工作台11〇之老化板1〇之上的裝載位置(裝置交換位置） ③。 如「第3圖」中所示，每一第一移動緩衝器600包含：用於 在其上裝載裝置20之裝置收容單元610 ,用於在主體100上可移 動地支撐裝置收容單元610之導向元件620，以及用於透過導向元 14 201036098 件620移動裝置收容單元610之移動單元（附圖中未示出）。 爲了在裝載位置③上裝載或取回大量的裝置20，位於水平方 向上的裝置收容單元610之裝置收容槽的數量係較佳地設置成大 . 於水平方向上的其上用以裝載裝置之托盤30之裝置收容槽的數 量。 其上用以裝載裝置20之裝置收容單元610可配置成將裝置20 直接裝載於其之上。並且，裝置收容單元610由於其尺寸大小可 ^ 依據待進行分類之裝置20的類型發生變化，因此可包含具有裝置 收容槽的額外的收容元件610a。 如「第1圖」及「第2圖」中所示，第一移動緩衝器600之 數量係較佳地配置成三個，藉以於各個位置（①、②、③）同時 進行多個製程。這裡，一個導向元件620係配置成當其移動時不 會與另一個導向元件620相互干擾。 ^ 如「第3圖」中所示，第一移動緩衝器600可包含：第一裝 〇 置收容單元611，係配置成可透過第一導向元件621之支撐而水平 地移動；第二裝置收容單元612，係配置成可透過第二導向元件 622之支撐而水平地移動；以及第三裝置收容單元613，係配置成 可透過第三導向元件623之支撐而水平地移動。 用於引導第一至第三裝置收容單元611、612、613之水平運動 的第一至第三導向元件621、622、623可具有各種不同的構造。如 「第3圖」中所示，第一導向元件621可安裝於主體100之支撐元 15 201036098 件640之上端，第二導向元件622可安裝於支撐元件640之中端， 而第三導向元件623可安裝於支撐元件640之下端或主體100之上 部102 〇此處，第一至第三導向元件621、622、623可成對配置藉 以能夠穩定地支擦裝置收容單元610 (第一至第三裝置收容單元 61卜612、613)。 用於水平地移動裝置收容單元610 (第一至第三裝置收容單元 611、612、613)之移動單元630可根據驅動方法而具有各種不同 的構造，並且可包含分別用於水平地移動裝置收容單元610 (第一 至第三裝置收容單元611、612、613)之第一至第三移動單元631、 632、633。這裡，第一至第三移動單元63卜632、633可透過將產 生旋轉力之馬達、連接至第一至第三導向元件621、622、623之皮 帶，特別是同步皮帶及皮帶輪加以結合而形成。 以下將更爲詳細地說明第一移動緩衝器600之操作。 當第一移動緩衝器600位於裝載位置①時，第一裝置20將從 測試單元310被裝載到裝置收容單元610。此處，裝載至裝置收容 單元610之第一裝置20可不合乎需要地具有由測試單元310確定 爲不合格產品之第一不合格裝置20。因此，此裝置20需要經過分 類製程。 爲了從已經被完全裝載於裝載位置上的第一裝置20中劃分出 第一不合格裝置20，第一移動緩衝器600將移動至分類位置②。 一旦第一移動緩衝器600位於分類位置②，將執行第一分類 16 201036098 製程’即，第一不合格裝置20將透過傳送工具而從裝置收容單元 610被傳送至分類單元320。這裡，每一第一不合格裝置20係將根 據其不合格的等級被裝載到分類單元320之托盤30之上。 在分類位置②’由測試單元310之測試結果確定爲合格產品 (〃第一正常裝置〃）的合格的裝置20將從其上已經預先裝載有 合格的裝置20之第一固定緩衝器413中塡充到裝置收容單元610 之空餘空間中，此空餘空間係位於第一不合格裝置20已被移除之 η 位置。上述製程係被稱爲緩衝製程。 第一固定緩衝器413係安裝於主體100上，並且由測試結果劃 分的第一正常裝置20係預先裝載於其之上。當第一固定緩衝器413 從一開始或於操作時被清空，第一正常裝置20便可被裝載到位於 分類位置②上的第一移動緩衝器600之裝置收容單元610之上。 當分類位置②上的第一分類製程已經完成時，第一移動緩衝 q 器600將從分類位置②被移動至裝載位置③。並且，裝載於第一 移動緩衝器600之上的第一正常裝置20將透過傳送工具而被裝載 到老化板10之上。 虽弟一移動緩衝器600之裝置收容單元610已經被完全清空 時，第一移動緩衝器600將從裝載位置③移回裝載位置①，以使 得第一裝置20能夠於裝載製程中被裝載到其之上。 第二移動緩衝器700與第一移動緩衝器6〇〇具有相似的結構。 並且，第二移動緩衝器700係配置成能夠反覆移動至用以透過第 17 201036098 四傳送工具520從老化板10接收第二裝置20並將接收到的第二裝 置20裝載到其之上的裝載位置（裝置交換位置）③，用以透過傳 送工具傳送第二不合格裝置20至分類單元320之托盤30 (分類托 盤）的分類位置②，以及用以透過第五傳送工具550傳送已從中 移除第二不合格裝置20之剩餘的第二裝置20至托盤30 (卸載托 盤）之卸載位置（裝置交換位置）①。 如「第3圖」中所示，與第一移動緩衝器600 —樣，第二移 動緩衝器700包含：用於在其上裝載裝置20之裝置收容單元 〇 710，用於在主體100上可移動地支撐裝置收容單元710之導向元 件720，以及用於透過導向元件720 7jc平地移動裝置收容單元710 之移動單元730。 爲了在裝載位置③上裝載大量的裝置20，位於水平方向上的 裝置收容單元710之裝置收容槽的數量係較佳地設置成大於水平 方向上的其上用以裝載裝置20之托盤30之裝置收容槽的數量。 () 其上用以裝載裝置20之裝置收容單元710可配置成將裝置20 直接裝載於其之上。並且，裝置收容單元710由於其尺寸大小可 依據待進行分類之裝置20的類型發生變化，因此可包含具有裝置 收容槽的額外的收容元件。 如「第1圖」及「第2圖」中所示，第二移動緩衝器700之 數量係較佳地配置成三個，藉以於各個位置（①、②、③）同時 進行多個製程。這裡，一個導向元件720係配置成當其移動時不 18 201036098 會與另一個導向元件720相互干擾。 更具體而言，如「第3圖」中所示，第二移動緩衝器700可 包含：第一裝置收容單元7U，係配置成可透過第一導向元件721 之支撐而水平地移動；第二裝置收容單元712，係配置成可透過第 二導向元件722之支撐而水平地移動；以及第三裝置收容單元 713，係配置成可透過第三導向元件723之支撐而水平地移動。 用於引導第一至第三裝置收容單元711、712、713之水平運動 〇 的第一至第二導向兀件721、722、723可具有各種不同的構造。如 「第3圖」中所示，第一導向元件721可安裝於主體100之支撐元 件740之上端，第二導向元件722可安裝於支撐元件740之中端， 而第三導向元件723可安裝於支撐元件740之下端或主體100之上 部102。此處，第一至第三導向元件721、722、723可成對配置藉 以能夠穩定地支撐裝置收容單元710 〇 用於水平地移動裝置收容單元Ή0 (第一至第三裝置收容單元 〇 711、Ή2、713)之移動單元730可根據驅動方法而具有各種不同 的構造，並且可包含分別用於水平地移動裝置收容單元710 (第一 至第三裝置收容單元711、712、713)之第一至第三移動單元731、 .732、733。這裡，第一至第三移動單元731、732、733可透過將產 生旋轉力之馬達、連接至第一至第三導向元件721'722、723之皮 帶，特別是同步皮帶及皮帶輪加以結合而形成。 第二移動緩衝器700係以與第一移動緩衝器600相似之方式加 19 201036098 以操作。並且，第二移動緩衝器700用以執行用於在裝載位置③ 將第二裝置20從老化板10中裝載到裝置收容單元710之上的裝載 製程，用於在分類位置②將第二不合格裝置20傳送至分類單元320 之第二分類製程，以及用於在卸載位置①將剩餘的第二裝置20傳 送至卸載單元220之托盤30的卸載製程。 在裝載製程中，與裝載於第一移動緩衝器600上的裝置20之 數量相同的裝置，例如排列成12x2行之形式的裝置將被同時傳送。 在第二分類製程中，第二不合格裝置20係從裝置收容單元710 ° 被傳送至分類單元320。這裡，每一第二不合格裝置20係根據其 不合格的等級而被裝載到分類單元320之托盤30之上。 在分類位置②，第二正常裝置20將從其上已經預先裝載有第 二正常裝置20之第二固定緩衝器423中塡充到裝置收容單元710 之空餘空間中，此空餘空間係位於第二不合格裝置20已被移除之 位置。上述製程係被稱爲緩衝製程。 || 第二固定緩衝器423係安裝於主體100上，並且第二正常裝置 20係預先裝載於其之上。當第二固定緩衝器423從一開始或於操 作時被清空，第二正常裝置20便可被裝載到位於分類位置②上的 第二移動緩衝器700之裝置收容單元710之上。 本發明之半導體裝置之分類方法係包含：用以裝載其上裝載 · 有第一裝置20之托盤30的裝載步驟；用以將複數個第一移動緩 衝器600水平地移動至第一裝置裝載位置①，並將托盤30之第一 20 201036098 裝置20依序地傳迭至弟一*移動緩衝器600之弟一傳送步驟；用以 將第一移動緩衝器水平地移動至第一裝置***位置③，並將第一 移動緩衝器600之第一裝置20依序地***到老化板10之空餘空間 中的***步驟；用以將複數個第二移動緩衝器7〇〇水平地移動至 第二裝置取回位置③，並將第二裝置20從老化板10中依序地取 回藉以傳送至第二移動緩衝器700之第二傳送步驟；以及用以將 第二移動緩衝器700之第二裝置20卸載到托盤30之卸載步驟。 上述方法可進一步包含用以測試介於裝載步驟與第一傳送步 驟之間的第一裝置20之電特性的測試步驟。 上述第一傳送步驟還可包含：用以將測試步驟中確定爲不合 格產品的第一裝置20從第一移動緩衝器600中加以分類的分類步 驟；以及緩衝步驟，係用以在必要時將分類步驟中未經分類的留 存於第一移動緩衝器600上的第一裝置20傳送至第一固定緩衝器 413，並從第一固定緩衝器413傳送合格的第一裝置20並將合格的 第一裝置塡充到第一移動緩衝器600之空餘空間中，此空餘空間 係位於已將分類步驟中確定爲不合格產品之第一不合格裝置20移 除之位置。 前述本發明之實施例及優點僅僅是具有代表性的並且並不構 成對本發明之限制。其中所提供之教示可實際應用於其它類型的 設備。此說明書僅是爲了解釋說明，而並非用以限制本發明之申 請專利範圍。任何熟習相像技藝者，在不脫離本發明之精神和範 21 201036098 圍內，當可對上述本發明作些許之替換、更動與潤飾，並可對上 述本發明之典型實施例的特徵、結構、方法及其它特性以各種不 同的方式加以組合，進而獲得其它的和/或有變化的典型實施例。 因此，雖然本發明以前述之實施例揭露如上，然其並非用以 限定本發明。本領域之技術人員應當意識到在不脫離本發明所附 之申請專利範圍所揭示之本發明之精神和範圍的情況下’所作之 更動與潤飾，均屬本發明之專利保護範圍之內。關於本發明所界 定之保護範圍請參照所附之申請專利範圍° 【圖式簡單說明】 第1圖爲本發明之半導體裝置之分類設備的總體設計圖； 第2圖爲第1圖之半導體裝置之分類設備的結構平面圖；以 及 第3圖爲第1圖之半導體裝置之分類設備的第一及第一移動 緩衝器之結構剖視圖。 【主要元件符號說明】 10 老化板 20 裝置 30 托盤 100 主體 101 開口 102 上部 22 201036098The %J aging panel 10 is taken over or retrieved from the aging panel 10. The plate-shaped table 110 is mounted on the main body 100 of the sorting device. Also, the body 100 can include an upper portion 102 having an opening 101 through which the device 20 can be retrieved from the aging panel 10 or loaded onto the aging panel 10 by means of a transfer tool. The loading unit 210 is for loading a tray 30 on which a plurality of first devices 20 are to be loaded (hereinafter referred to as a "loading tray.) onto the aging panel 1 。. This loading unit 210 can have various configurations 9 201036098 The unloading unit 220 is used to unload the qualified device (〃 qualified product 〃) in the second device 20 to the tray 30. The unloading unit 220 can have various different configurations, as shown in "Fig. 2" The loading unit 210 and the unloading unit 220 include a pair of guide rails 211, 221 for guiding the movement of the tray 30, and a driving unit (not shown in the drawings) for moving the tray 30. The loading unit 210 and the unloading unit 220 may be The design conditions are arranged in various different ways. As shown in "1" and "2", the loading unit 210 and the unloading unit 220 can be generally arranged in parallel such that the test unit 310, the unloading unit 220, The classification unit 320, the first movement buffer 600, and the second movement buffer 700 can be installed therebetween. However, the present invention is not limited to the above structure. When the device 20 is from the tray 30 of the loading unit 210 After the return, the empty tray 30 can be transported to the unloading unit 220 through the tray transfer unit (not shown in the drawings) to enable the second device 20 to be loaded thereon. Here, the device can be retained above the tray 30. 20. In order to remove all the remaining devices 20 on the empty tray 30 before the tray 30 is transferred from the loading unit 210 to the unloading unit 220, a tray rotating unit 330 may be further mounted for rotating the tray 30 through the tray 30. All the remaining devices 20 are removed. As shown in "1" and "2", the tray rotating unit 330 is attached to the transport path of the tray 30 between the loading unit 210 and the unloading unit 220. And, the tray rotation unit 330 is configured to receive the tray 30 from the loading unit 210 through the tray transfer unit, and then transfer the tray 30 to the unloading unit 10 201036098 220. The sorting device may further include a test unit 310 for The electrical characteristics of the device 20 supplied from the loading unit 210, such as DC characteristics, are tested prior to loading the device 20 onto the burn-in board 10 so that only qualified devices can be The test unit 310 can have a variety of different configurations. For example, the test unit 310 can include a plurality of slots 0 mounted between the loading unit 210 and the first movement buffer 600, and configured to The first unit 20 is electrically connected to each of the first devices 20. Preferably, the test unit 310 can include horizontally aligned slots of the same number of horizontally aligned trays 30. Each of the first devices 20 tested by the test unit 310 The test results are used as information for the classification process by the classification unit 320, which will be described later. The classification device of the present invention may include a classification unit 320 for determining the test result of the test unit 310 as a non-conforming product. The first defective device 20 is sorted with the second defective device 20 that needs to be classified in the second device 20, and the first and second defective devices 20 are loaded thereon. Classification unit 320 can have a variety of different configurations depending on the arrangement and classification criteria. And, the classification unit 320 can include an appropriate number of trays 30 loaded with the device 20 according to the classification criteria (pass, first failure (contact. failure), second failure (DC failure), etc.) ). The sorting unit 320 may have a structure similar to that of the aforementioned loading unit 210, or may be disposed between the loading unit 210 and the unloading unit 220 in a state of being fixed to the main body 1. 11 201036098 Not only the classification unit 320 but also the empty tray unit 340 can be installed in the main body 100 ±'. The empty tray unit 340 is used to provide an empty tray 30 to the unloading unit 22, or the like, or the empty tray 3〇 received from the loading unit 210 can be temporarily loaded thereon. The transfer tool is used to transfer the device 20 between the burn-in board 10, the loading unit 210, the test unit 310, the unloading unit 220, the sorting unit 320, the first moving buffer 600, and the second moving buffer 700. Also, the transfer tool can have various configurations depending on the arrangement of the components. For example, the transfer tool can include a first transfer tool 530 for transferring the device 20 between the first move buffer 600 and the burn-in board 10, and for transferring between the burn-in board 10 and the second move buffer 7 A second transfer tool 540 of device 20. The transfer tool can also include a third transfer tool 510 for transferring the device 20 between the load unit 210 and the test unit 310; a fourth transfer tool for transferring the device 20 between the test unit 310 and the first move buffer 600 a fifth transfer tool 550 for transferring the device 20 between the second movement buffer 700 and the unloading unit 220; and for use between the first movement buffer 600, the second movement buffer 700, and the classification unit 320 A sorting tool 560 of the transport device 20. The arrangement of the devices 20 mounted on the aging panels is different from the arrangement of the devices 20 mounted on the trays 30, and the number of devices arranged above the aging panels 1 is large. Accordingly, the first transfer tool 530 and the second transfer tool 540 for transferring the device 20 to the burn-in board 10 or retrieving the device 20 from the burn-in board 10 12 201036098 are preferably configured to be capable of being transported compared to other transfer tools. A larger number of devices 20, for example, each of the first transfer tool 530 and the second transfer tool 540 has a 12x2 configuration, while other transfer tools have a 8x1, 8x2 configuration. Based on the above structure, a transfer tool for transferring a small number of devices 20 can be used for a position where a small number of devices 20 need to be transferred. Therefore, the manufacturing cost and size of the sorting device can be reduced, and the reliability of the sorting device can be improved. In view of the fact that the loading process and the retrieval process of the apparatus 20 on the aging panel 10 are alternately performed, the first transfer tool 530 and the second transfer tool 540 can be configured to be movable integrally with each other. Since the third transfer tool 510 and the fourth transfer tool 520 are the transfer device 20 in a state in which the test unit 310 is disposed therebetween, the third transfer tool 510 and the fourth transfer tool 520 can also be configured to be movable integrally with each other. . For the transfer efficiency of the device 20, the number of horizontally arranged pickers of the first transfer tool 530 and the second transfer tool 540 can be set to be loaded with the first and second move buffers 600, 700 to load the device 20. The number of horizontally arranged device receiving grooves (not shown in the drawings) above them is equal. The number of classification tools 560 can be formed into one or a plurality. Also, the sorting tool 560 can be associated with a second sorting tool 560 for transferring the apparatus 20 between the first movement buffer 600 and the sorting unit 320 and for transferring the apparatus between the second moving buffer 700 and the sorting unit 320. Use it. 13 201036098 Each transfer tool may include one or more pickers and a picker moving unit for moving the picker in a Χ-Ζ, γ-ζ or Χ-Υ-Ζ direction, the end of the picker being configured to The tip of the device 20 is sucked through the vacuum pressure. The pickers of the transfer tool can be arranged in a row or arranged in a plurality of rows, such as in 12x2 rows. The first and second movement buffers 600, 700 are movably mounted on the main body 1 and are used to exchange the position 3 between the aging panel 10 and the device exchanged device, and the loading unit 210 or the unloading unit 220 is exchanged with the device. The device 20 is exchanged smoothly and continuously with each other when the exchange position 1 and the classification unit "" 320 are moved between the device exchange position 2 of the device exchange. This allows the execution speed of the classification process to be greatly improved. The first movement buffer 600 is configured to be movable to a loading position (device exchange position) 1 for loading the first device 20 received from the test unit 310 through the fourth transfer tool 520 for transmitting the first through the sorting tool 560. The defective device 20 to I | the sorting position 2 of the sorting tray 30 of the sorting unit 320, and the first device 20 to the board from which the remaining first defective device 20 has been removed by the first transfer tool 530 The loading position (device exchange position) above the aging plate 1〇 of the table 11〇. As shown in "Fig. 3", each of the first movement buffers 600 includes: a device housing unit 610 for loading the device 20 thereon for movably supporting the device housing unit 610 on the main body 100. Element 620, and a mobile unit (not shown in the drawings) for moving the device housing unit 610 through the guide element 14 201036098. In order to load or retrieve a large number of devices 20 at the loading position 3, the number of device receiving slots of the device housing unit 610 in the horizontal direction is preferably set to be large. The number of device receiving slots of the tray 30. The device housing unit 610 on which the loading device 20 is mounted can be configured to load the device 20 directly thereon. Further, the device housing unit 610 may vary depending on the type of the device 20 to be classified, and may include an additional housing member 610a having a device housing groove. As shown in "Fig. 1" and "Fig. 2", the number of first movement buffers 600 is preferably three, whereby a plurality of processes are simultaneously performed at respective positions (1, 2, 3). Here, one of the guiding members 620 is configured such that it does not interfere with the other guiding member 620 when it moves. As shown in FIG. 3, the first movement buffer 600 may include: a first mounting storage unit 611 configured to be horizontally movable through the support of the first guiding member 621; The unit 612 is configured to be horizontally movable through the support of the second guiding member 622; and the third device housing unit 613 is configured to be horizontally movable through the support of the third guiding member 623. The first to third guiding members 621, 622, 623 for guiding the horizontal movement of the first to third device housing units 611, 612, 613 may have various different configurations. As shown in FIG. 3, the first guiding member 621 can be mounted on the upper end of the support member 15 201036098 of the main body 100, and the second guiding member 622 can be mounted on the middle end of the supporting member 640, and the third guiding member. The 623 can be mounted on the lower end of the support member 640 or the upper portion 102 of the main body 100. Here, the first to third guiding members 621, 622, 623 can be arranged in pairs to stably support the device housing unit 610 (first to third The device housing unit 61 is 612, 613). The moving unit 630 for horizontally moving the device housing unit 610 (the first to third device housing units 611, 612, 613) may have various configurations according to the driving method, and may include a housing for horizontally moving the device, respectively. First to third moving units 631, 632, 633 of the unit 610 (first to third device housing units 611, 612, 613). Here, the first to third moving units 63 632, 633 can be formed by combining a motor that generates a rotational force, a belt connected to the first to third guiding members 621, 622, 623, in particular, a timing belt and a pulley. . The operation of the first mobile buffer 600 will be explained in more detail below. When the first movement buffer 600 is at the loading position 1, the first device 20 is loaded from the test unit 310 to the device housing unit 610. Here, the first device 20 loaded to the device housing unit 610 may undesirably have a first defective device 20 that is determined to be a defective product by the testing unit 310. Therefore, the device 20 needs to be subjected to a sorting process. In order to divide the first defective device 20 from the first device 20 that has been completely loaded in the loading position, the first moving buffer 600 will move to the sorting position 2. Once the first movement buffer 600 is at the sorting position 2, the first classification 16 201036098 process will be executed. That is, the first defective device 20 will be transmitted from the device housing unit 610 to the classification unit 320 via the transfer tool. Here, each of the first defective devices 20 will be loaded onto the tray 30 of the sorting unit 320 according to its unqualified level. The qualified device 20 determined as the qualified product (〃 first normal device 由) by the test result of the test unit 310 at the sorting position 2' will be preloaded with the first fixed buffer 413 of the qualified device 20 塡The vacant space is filled in the vacant space of the device housing unit 610, and the vacant space is located at the η position where the first defective device 20 has been removed. The above process is called a buffer process. The first fixed buffer 413 is mounted on the main body 100, and the first normal device 20, which is divided by the test result, is preloaded thereon. When the first fixed buffer 413 is emptied from the beginning or during operation, the first normal device 20 can be loaded onto the device housing unit 610 of the first movement buffer 600 located at the sorting position 2. When the first sorting process on the sorting position 2 has been completed, the first moving buffer q is moved from the sorting position 2 to the loading position 3. Also, the first normal device 20 loaded on the first movement buffer 600 will be loaded onto the burn-in board 10 through the transfer tool. While the device housing unit 610 of the mobile buffer 600 has been completely emptied, the first movement buffer 600 will be moved from the loading position 3 back to the loading position 1 to enable the first device 20 to be loaded into the loading process. Above. The second movement buffer 700 has a similar structure to the first movement buffer 6A. And, the second movement buffer 700 is configured to be able to repeatedly move to a load for receiving the second device 20 from the burn-in board 10 through the 17th 201036098 four transfer tool 520 and loading the received second device 20 thereon. a position (device exchange position) 3 for transmitting the second defective device 20 to the sorting position 2 of the tray 30 (classification tray) of the sorting unit 320 through the transfer tool, and for transmitting the same from the fifth transfer tool 550 The remaining second device 20 of the second defective device 20 is to the unloading position (device exchange position) 1 of the tray 30 (unloading tray). As shown in FIG. 3, like the first movement buffer 600, the second movement buffer 700 includes: a device housing unit 710 for loading the device 20 thereon for use on the main body 100. The guiding member 720 of the mobile supporting device housing unit 710 and the moving unit 730 for moving the device housing unit 710 through the guiding member 720 7jc are moved. In order to load a large number of devices 20 in the loading position 3, the number of device receiving slots of the device housing unit 710 in the horizontal direction is preferably set larger than the device on the tray 30 for loading the device 20 in the horizontal direction. The number of storage slots. () The device housing unit 710 on which the device 20 is loaded may be configured to load the device 20 directly thereon. Also, the device housing unit 710 may vary depending on the type of the device 20 to be classified, and thus may include additional housing members having device receiving slots. As shown in "Fig. 1" and "Fig. 2", the number of second movement buffers 700 is preferably three, whereby a plurality of processes are simultaneously performed at respective positions (1, 2, 3). Here, one guiding element 720 is configured such that when it moves, 18 201036098 will interfere with another guiding element 720. More specifically, as shown in FIG. 3, the second movement buffer 700 may include: a first device housing unit 7U configured to be horizontally movable through the support of the first guiding member 721; The device housing unit 712 is configured to be horizontally movable through the support of the second guiding member 722; and the third device housing unit 713 is configured to be horizontally movable through the support of the third guiding member 723. The first to second guide members 721, 722, 723 for guiding the horizontal movement 〇 of the first to third device housing units 711, 712, 713 may have various different configurations. As shown in "Fig. 3", the first guiding member 721 can be mounted on the upper end of the supporting member 740 of the main body 100, the second guiding member 722 can be mounted on the inner end of the supporting member 740, and the third guiding member 723 can be mounted. At the lower end of the support member 740 or the upper portion 102 of the body 100. Here, the first to third guiding members 721, 722, and 723 may be disposed in a pair to stably support the device housing unit 710 for horizontally moving the device housing unit Ή0 (the first to third device housing units 〇 711, The moving unit 730 of Ή2, 713) may have various different configurations according to the driving method, and may include the first for respectively moving the device housing unit 710 (the first to third device housing units 711, 712, 713) horizontally To the third mobile unit 731, .732, 733. Here, the first to third moving units 731, 732, 733 can be formed by combining a motor that generates a rotational force, a belt connected to the first to third guiding members 721'722, 723, in particular, a timing belt and a pulley. . The second mobile buffer 700 is operated by adding 19 201036098 in a manner similar to the first mobile buffer 600. Moreover, the second movement buffer 700 is configured to execute a loading process for loading the second device 20 from the aging panel 10 onto the device housing unit 710 at the loading position 3 for the second failure at the sorting position 2. The apparatus 20 transmits a second sorting process to the sorting unit 320, and an unloading process for transferring the remaining second apparatus 20 to the tray 30 of the unloading unit 220 at the unloading position 1. In the loading process, the same number of devices as those loaded on the first mobile buffer 600, such as devices arranged in the form of 12x2 rows, will be simultaneously transmitted. In the second sorting process, the second defective device 20 is transferred from the device housing unit 710° to the sorting unit 320. Here, each of the second defective devices 20 is loaded onto the tray 30 of the sorting unit 320 in accordance with the level of its failure. In the sorting position 2, the second normal device 20 is buffered from the second fixed buffer 423 on which the second normal device 20 has been preloaded into the free space of the device housing unit 710, and the free space is located in the second space. The location where the failed device 20 has been removed. The above process is called a buffer process. The second fixed buffer 423 is mounted on the main body 100, and the second normal device 20 is preloaded thereon. When the second fixed buffer 423 is emptied from the beginning or during operation, the second normal device 20 can be loaded onto the device housing unit 710 of the second movement buffer 700 located at the sorting position 2. The method of classifying a semiconductor device of the present invention comprises: a loading step for loading a tray 30 on which the first device 20 is loaded; and horizontally moving the plurality of first moving buffers 600 to the first device loading position 1, and the first 20 201036098 device 20 of the tray 30 is sequentially transferred to the brother-one mobile buffer 600-one transmission step; to move the first movement buffer horizontally to the first device insertion position 3 And inserting the first device 20 of the first movement buffer 600 into the free space of the aging panel 10 in sequence; for horizontally moving the plurality of second movement buffers 7 to the second device Retrieving position 3, and sequentially removing the second device 20 from the aging panel 10 to the second transfer step of the second movement buffer 700; and the second device for using the second movement buffer 700 The unloading step of unloading to the tray 30. The above method may further comprise a test step for testing the electrical characteristics of the first device 20 between the loading step and the first transferring step. The first transmitting step may further include: a sorting step of classifying the first device 20 determined to be a defective product in the testing step from the first moving buffer 600; and a buffering step for using the The unclassified first device 20 remaining on the first movement buffer 600 in the sorting step transmits to the first fixed buffer 413, and transmits the qualified first device 20 from the first fixed buffer 413 and passes the qualified first A device is charged into the free space of the first movement buffer 600, which is located at a position where the first defective device 20 determined to be a defective product in the sorting step has been removed. The foregoing embodiments and advantages of the invention are intended to be illustrative and not limiting. The teachings provided therein can be practically applied to other types of equipment. This description is for illustrative purposes only and is not intended to limit the scope of the invention. Any of the skilled in the art, without departing from the spirit of the invention and in the scope of the present invention, may be substituted, modified, and retouched, and may have the features, structures, and methods of the exemplary embodiments of the present invention described above. And other features are combined in various different ways to obtain other and/or varied exemplary embodiments. Accordingly, the present invention has been described above in the foregoing embodiments, which are not intended to limit the invention. It will be appreciated by those skilled in the art that modifications and modifications may be made without departing from the spirit and scope of the invention as disclosed in the appended claims. For the scope of protection defined by the present invention, please refer to the attached patent application. [Simplified description of the drawings] FIG. 1 is a general design diagram of a classification device of a semiconductor device of the present invention; FIG. 2 is a semiconductor device of FIG. A structural plan view of the sorting device; and FIG. 3 is a cross-sectional view showing the structure of the first and first moving buffers of the sorting device of the semiconductor device of FIG. 1. [Main component symbol description] 10 aging board 20 device 30 tray 100 main body 101 opening 102 upper part 22 201036098
110 板狀工作台 210 裝載單元 211 導軌 220 卸載單元 221 導軌 310 測試單元 320 分類單元 330 托盤旋轉單元 340 空托盤單元 413 第一固定緩衝器 423 第二固定緩衝器 510 第二傳送工具 520 第四傳送工具 530 第一傳送工具 540 第二傳送工具 550 第五傳送工具 560 分類工具 600 第一移動緩衝器 610 裝置收容單元 610a 收容元件 611 第一裝置收容單元 23 201036098 612 613 620 621 622 623 630 631 632 633 第二裝置收容單元 第三裝置收容單元 導向元件 第一導向元件 第二導向元件 第三導向元件 移動單元 第一移動單元 第二移動單元 第三移動單元 640 支撐元件 700 第二移動緩衝器 710 裝置收容單元 711 第一裝置收容單元 712 第二裝置收容單元 713 720 721 722 723 第三裝置收容單元 導向元件 第一導向元件 第二導向元件 第三導向元件 730 移動單元 24 201036098 731 第一移動單元 732 第二移動單元 733 第三移動單元 740 支撐元件110 plate-shaped table 210 loading unit 211 rail 220 unloading unit 221 rail 310 test unit 320 sorting unit 330 tray rotating unit 340 empty tray unit 413 first fixed buffer 423 second fixed buffer 510 second transfer tool 520 fourth transfer Tool 530 First Transfer Tool 540 Second Transfer Tool 550 Fifth Transfer Tool 560 Classification Tool 600 First Movement Buffer 610 Device Storage Unit 610a Housing Element 611 First Device Storage Unit 23 201036098 612 613 620 621 622 623 630 631 632 633 Second device housing unit third device housing unit guiding member first guiding member second guiding member third guiding member moving unit first moving unit second moving unit third moving unit 640 supporting member 700 second moving buffer 710 device housing Unit 711 first device housing unit 712 second device housing unit 713 720 721 722 723 third device housing unit guiding member first guiding member second guiding member third guiding member 730 moving unit 24 201036098 731 first moving unit 732 second Moving the movable unit 733 of the third supporting member 740 units
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