TW201011305A - Fixture for circuit board inspection - Google Patents

Fixture for circuit board inspection Download PDF

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Publication number
TW201011305A
TW201011305A TW098129962A TW98129962A TW201011305A TW 201011305 A TW201011305 A TW 201011305A TW 098129962 A TW098129962 A TW 098129962A TW 98129962 A TW98129962 A TW 98129962A TW 201011305 A TW201011305 A TW 201011305A
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TW
Taiwan
Prior art keywords
inspection
substrate
probe
end portion
opening
Prior art date
Application number
TW098129962A
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Chinese (zh)
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TWI427297B (en
Inventor
Makoto Fujino
Tadakazu Miyatake
Minoru Kato
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Nidec Read Corp
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Publication of TWI427297B publication Critical patent/TWI427297B/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The object of the present invention is to provide an inspection jig for inspecting substrates, which guides the front ends of the inspection probes to a predetermined part of an inspection substrate while preventing deformations such as bending thereof, and automatically removes dirt from the front end. The inspection jig for inspecting substrates is employed to hold a plurality of inspection probes. The probe comprises: a front end, contacting a predetermined part of a wiring pattern of an inspection substrate to inspect the wiring pattern of the inspection substrate; and a rear end connected to a detection device. The inspection jig for inspecting substrates also includes: a base plate for holding the rear ends of a plurality of inspection probes; and a head portion having holes for the front ends of the plurality of inspection probes to penetrate through, being used to guide the front ends to the predetermined part of the wiring pattern, the head portion being able to partially or wholly move in the axial direction of the holes of the head portion.

Description

201011305 六、發明說明: 【發明所屬之技術領域】 查的基板檢查用探針 又,ί查基板’係例如可捷性基板、 板檢查用之檢查治具’固持用於進行基板檢 多 極板、及半 _ 中,將該等各種配線的電氣配線’本說明書 ❿ 【先前技術】 確地ΐΐί該以圖案,將電信號正 零件,因此糊電嘴電•電子 ===成r線圖案的電路配=或== ί=ί.ί=:斷案找定之接觸部分間的電阻值啸^ 用端夂之判_使電流供給用端子及/或電壓測定 部分,從電流供給用端子供給測定用電流至 ===供給電流與所測得電壓計算出既定之』 置句i有正確地進行此種檢查而使用基板檢查裝置,該裝 ίϋ之ΐί ^持複數之基板檢查用探針,用以抵接至檢 、▲呈銘之崎圖案上的既定接觸部分而進行既定之檢查; 該檢查治具移__之檢查位置;及輸送機 冓用將檢查對象之基板輸送到實施檢查的檢查部。 之賴專tii獻n日本專利第3690801號專利文獻1揭示如下 接:定機構互相蚊而一體化形 基板檢查裝置中,於檢查時係進行如下之控制:移動治具移 201011305 動機構以使基板檢查用治具之檢查用探針(接觸接腳)抵接至檢查 ^基板之接觸部分,藉此進行既定之檢查;當檢查結束時,移動 治具移動機構以使檢查治具遠離檢查用基板。 【發明内容】 發明所欲解決之課題 近年來’由於檢查對象之基板不斷複雜化及細微化,設定於 土板之檢查點變得更細或更小,故變成小於檢查用探針的直徑。 志移動治具移動機構以使基板檢查用治具的檢查用探針抵接 查用基板的檢查點時,該檢查用探針之前端有時錯開、搖動 5 、動而該前端難以正確地抵接於既定之檢查點。因此,本發明 2為」提供基板檢查用之檢查治具,藉由將檢查用探針之前 地導引至檢查對象之基板的既定檢查點(既定部分),可使具 、’、田祕直從之檢查用探針的前端正確地抵接至該既定位置。 本發明之目的為.提供基板檢查用之檢查治且,於 端抵接至檢查用基板之—部分時“檢查用探 針之則端發生彎折等變形。 产杳本發明之目的為:提供基板檢查用之檢錢具,於使 前端抵接至檢查用基板之一部分而進行檢查後,將 用m用探針之前端的污物等去除,或者使其容易從檢查 解決課題之手段 _ί檢查用之檢查治具係_ _複數之 2針的: ί特!支為·包含:底板,用以固持複數之檢查用 部的開孔通有複數檢查用探針之前端 邻八々入加用將卩導引線醜的既定部分;且頭部之 口p刀或全部可沿頭部之開孔的軸線方向移動。刀且貝丨之 該基板檢查用之檢查治具中,頭部之部分或全部較佳係可沿 .201011305 , 線方向,在離開底板的待機位置與接近底板的檢查位置 端部位於待機位置時’複數之檢查用探針的前 之頭突Ϊ查用探針的前端部可從與檢查基板接觸 或2 上f板片構成’少於構成頭部之複數板片的1 =上之板片可沿頭部之開孔的轴線方向移動。 偏塵^梯係於頭部内或固持頭部之機構配置偏壓裝置’而 φ 部分或全部朝離開底㈣方向偏愿。 底板的方Hi。3彈菁機構’藉此可使頭部之部分或全部朝離開 移動至檢置的頭部之部分或全部可细檢查對象之基板而 係形有複數檢查用探針的頭部之前面的開孔的周圍較佳 可進檢查位置時,檢查用探針之前端部所接觸的部分 又’依本發明之基板檢查裝置中, ❷查用之檢查治具及檢查用信號控制處理=為,==檢 板之配線圖案的既定部;,用:檢;j檢=部’接觸於檢查基 後端部,連接於測定裝置;底板,=;力配2案;及 ,部;與頭部,具有供該4:=;=== 該碩部之部分或全部可沿該頭部之開孔,且 用信號控制、處理裝置,連接於兮檢、、、:私動,該檢查 以控制及處理檢查基板用之信號Γ檢查祕針的後端部,用 發明之效果 本發月A進订;^查,移動治具移動機構使基板檢查用治 201011305 具之仏查用採針抵接至檢查 —.士 — 探猎由導_用 部分時,可端抵接至檢錢基板之一 -部=進IS :=用探针之前端抵接至檢查用基板之 氧化膜碎Π焊除附^於該檢4贿針之前端的 礼朕外月从錫屑等〉讀,或使其容易從檢查用探針剝落。 【實施方式】 實施發明之最佳形態 [檢查治具之概要] 具1«之部分剖面 去拉^治具」0包含:頭部11、導引板12、底板14、基座15及 ^寺棒16。碩部n、導引板12、底板14 等之絕緣材韻成職_件。支娜16 14,而將其等固持於頭部u與基座15之間員^引板12及底板 11由ΓΓ31 針17之前端導往檢查點(既定部位)。該頭部 1 中6 移動’板片11B及11C固定於支持棒16。 之移動機構的、ίΐίίί板片仙之脫離距離變更,該板片iia 料形成有複數之貫通孔llh,該等貫通孔位於檢查 板(未圖示)之配線圖案上之待檢查點,並導ί 接觸於該k查點的位置。於導引板12、底板14及 於板片11A之貫通孔llh的位置,也各形成有 、了 15h,且探針17貫通該等貫通孔。 各貫通孔llh、12h、14h***穿通有1支探針17,如圖}所 不,板片11A移動至離開板ρ1Β的位置時,其前端部17&從板 201011305 片11A之表面縮入。 揀針17的直徑約為4〇至6〇μιη , 不鏽鋼構成之帶有彈性的鋼琴線或鶴(w)等如可使用由 後端部而將周面絕緣被覆。 铋佺係去除前端部及 導引板12固持著***穿通於貫通孔 ^橫方向滑動,秘檢鱗,使紐之= 請二^於圖i 此,防止探針於貫通孔I2h、14h内滑動、挽曲。藉 17由帶有可撓性之導電性探針形成=移=振動。探針 複數之探針17,因此_於如上述滑糾 於固定保持 0 17為具有如彈菩之袖給A 更#衣針曲。又,探針 時,利用導引板針(不彎曲變形之探針) 與貫通孔14h的中間導引。 為用以使振針貫通過貫通孔llh 气座I5之貫通孔lsh嵌入有電極15b ?的後端部17b導通接觸。該電極15b it接著2針 等檢查。 19進碰1紐之蚊健的電特性 择描器19將檢查用信號依序選擇性地發送至样制定| ❿ i否ί通,〜收仏號,计异出檢查點間的電阻值,或者判斷 與檢==例中導 中空狀配置有各^板^^與底板14具有既機,而呈 L 1 铸’實際情況下,·料之探針與貫通孔 絲ϋ 的部分壁面接觸,但圖2A及圖3A t ’為求圖式 >月楚易讀,探針17描繪成直線狀。 口式 w ΐ圖士2A所不’板片1U受固持於距離板片11]^L1之距離 、立(待機位置)。L1雖未特定,但形成例如2〇〇〜4〇〇μιη。此狀 201011305 怨維持到使檢查基板接觸於板片11A的表面以檢查基板。另一方 面’板片11B、11C固定於支持棒16。 又,如圖2A所示,板片11A、11B、11C形成有小直徑之固 持孔21及大直徑之預備孔22。固持孔21的直徑約為40〜ΙΟΟμηι。 形成大直徑之預備孔22係為使小直徑之固持孔21可輕易形成, 而使板片有厚度以確保一定強度。 於扳片11Α之固持孔21形成開口的前面,形成有凹部2〇。 該凹部20之深度D1為50〜150μιη ’且如後述,檢查基板的凸塊 可進入該凹部20。又’從該凹部20之底面至探針丨7之前端部17a 的尖端面的距離D2為100〜200μιη。 _圖2^係圖1中以一點鏈線2Β圍繞之位置的放大圖。如圖2β 所示,板片11Α與圖2Α同樣地,受固持於距離板片jig恰以之 距離的位置。此狀態維持到使檢查基板接觸於板片ηΑ的表面以 檢查基板。另一方面,板片11B、llc固定於支持棒16。 土板片11A***穿通有支持棒16之前端部16§,而板片UA沪 罪該,部可於圖2B沿上下方向(支持棒之長邊方向)來回移動;3 -ηγΛ是’支持板片UA的支持棒即使並非棒狀物,只要能沿著 碩狀***穿通有探針的開孔的軸線方向移動,也可為該種構件。 置有二ΐΐΓϋιΐβ各形成有開孔_、腿,且該處配 板片11B之方向偏壓的碰裝置3〇。 偏壓裝置30包含:固定部31,固定 使固定部於圖2B向上方偏壓。 M HA’及彈貫32’ 之内列構成:大直徑部也,形成接近開孔11Ah ί ’小直徑部31b,形成小於開孔職之内徑的 外形,及卡止部31s,連接於下端部。 々門㈣ _大直徑部31&例如從板片11A之外側以错知u =環:彈板簧二^ 以丨艮疋板片11A可脫離板片11B 偏壓裝置30中’通常係彈笙32 # 士古、離 201011305 二同往上方移動。此時,卡止部31s與板片11B之開孔11Bh内的 突起部34卡止,以使大直徑部31a停止於該位置。藉此,可將板 片11A固持於距離板片11B恰距離以的位置。 圖3A顯示板片11A位於接觸於板片UB之檢查位置的狀態。 ,即,係板片11A與板片11B之間的距離L3為零的狀態。此狀 ’知下探針17之別端部17a從板片11A之前面突出。該突出之距 離L2為50^100#!!!。又,因著板片11A向板片11B恰移動圖2八 及f 2B所示之距離L1,由於探針17之前端部17a變成從板片11A 之前面突出,因此探針17之前端部17a於圖3A中,恰移動從二 鲁點鏈線所示位置到實線所示位置的距離’即相當於L2、m與〇2 之總和距離的200〜450//m。 但是,如後述,板片11A移動係因板片11A之前面的一部分 抵接至基板的部分面’而板片11A被推向板片11B ;此時,由於 探針17之别端部17a的尖端碰撞到檢查基板之檢查點的例如凸 塊,因此進行基板檢查時,探針17之前端部17a並不如圖3A所 示地從板片11A之前面突出。 人圖3B中,與圖3A同樣地,板片11A位於接觸於板片11B之 k查位置。亦即,距離L3為零。於此位置,偏壓裝置的彈簧 32收縮。其原因為:板片11A向底板14沿靠支持棒饧之前端部 • 移動時,由於大直徑部31a與該板片11A—同向板片UB移 動’故彈簧32由大直徑部31a向突起部34所抵緊。此時,卡止 部31s碰撞到板片11C而停止。 圖4係顯示為對檢查基板40作檢查,使探針17之前端部17& 抵接至該檢查基板40上之配線圖案的凸塊42的狀態。此狀熊下, 檢查基板40之表面與板片11A之前面(圖4中之上方面)的_^部分 接觸,並且凸塊42進入板片11A的凹部20内。因此,探針17 ^ 小直么之固持孔21内被推入。從而,雖未圖示,探針I?藉由^ 圖1在導引板12與底板14之間的空間内彎曲,以吸收相^於該 被推入而無法突出之距離的長度變化。 田、^ 如上述’檢查基板40雖接觸於板片HA之前面,但由於凸塊 201011305 42收納於凹部20内,又探針可突 吸收,因此可不受凸塊之高度變;^又··能_探針之彎曲 至檢查基板40。 的衫響,而使頭部11適切抵接 圖4所示之狀態中,從圖j 檢查用信號經由複數之探針17發=1^器19依序選擇性地將 凸塊幻接收檢查用信號,故可塊42,由於從該等 線電===導通二判斷^線的=鬼"間的配 平行Ί3述 成對貫通孔-呈大致 觸於貫通孔仙的内壁)而配置置因ft f孔llh往一邊傾斜(接201011305 VI. Description of the Invention: [Technical Fields of the Invention] The substrate inspection probes are also inspected, and the substrate is exemplified, for example, a substrate for inspection and a test fixture for inspection of a board. In the middle and the middle of the wiring, the wiring of the various wirings is as follows: [Previously] The pattern is used to electrically signal the positive parts, so the paste electric and electronic === ○========================================================================================================== The current is supplied to the === supply current and the measured voltage is calculated. The substrate inspection device is used to perform such inspection correctly, and the substrate inspection probe is used for the substrate inspection. Abutting to the inspection, ▲ the predetermined contact portion on the pattern of the sakizaki, and performing the predetermined inspection; the inspection position of the inspection fixture is moved __; and the conveyor is transporting the substrate to be inspected to the inspection department for performing the inspection . Patent Document 1 of Japanese Patent No. 3690801 discloses the following: In the integrated substrate inspection apparatus of the fixed-system mosquito, the following control is performed during the inspection: the moving fixture moves the 201011305 moving mechanism to make the substrate The inspection probe (contact pin) of the jig is abutted to the contact portion of the inspection substrate, thereby performing a predetermined inspection; when the inspection is finished, moving the jig moving mechanism to keep the inspection jig away from the inspection substrate . SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION In recent years, the number of inspection points set on the soil plate has become smaller or smaller because the substrate to be inspected has become more complicated and finer, and thus has become smaller than the diameter of the inspection probe. When the inspection probe of the substrate inspection jig is brought into contact with the inspection point of the inspection substrate, the front end of the inspection probe may be shifted, shaken, and moved, and the front end is difficult to accurately abut. Connect to the established checkpoint. Therefore, the present invention 2 provides an inspection jig for substrate inspection, which can be guided to a predetermined inspection point (predetermined portion) of the substrate to be inspected before the inspection probe, thereby enabling The front end of the inspection probe is correctly abutted to the predetermined position. An object of the present invention is to provide a test for inspection of a substrate and to deform the end of the test probe when the end abuts against the portion of the test substrate. The purpose of the present invention is to provide In the inspection tool for the substrate inspection, after the front end is brought into contact with one of the inspection substrates, the dirt at the front end of the probe is removed by m or the like, or it is easy to check the problem from the inspection. It is used to check the jig _ _ 2 of the plural: ί 特 ! 支 · · Contains: the bottom plate, which is used to hold the opening of the plurality of inspection parts, and the front end of the inspection probe The 部分 卩 既 既 ; ; ; ; ; 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩 卩Or all of them may be along the direction of .201011305, in the line direction, when the standby position away from the bottom plate and the end of the inspection position near the bottom plate are in the standby position, the front end of the plurality of inspection probes is used to detect the front end of the probe. Can be contacted from the inspection substrate or 2 The sheet constitutes 'less than the number of sheets constituting the head 1 = the upper sheet can be moved along the axis of the opening of the head. The dust is placed in the head or the mechanism for holding the head is biased. The device 'and some or all of φ are biased away from the bottom (four) direction. The square Hi 3 elastic mechanism of the bottom plate can thereby move part or all of the head toward the left to the part of the head to be examined. When the substrate of the inspection object is formed and the periphery of the opening of the head of the plurality of inspection probes is preferably in the inspection position, the portion of the inspection probe that is in contact with the front end is inspected by the substrate according to the present invention. In the device, the inspection jig for inspection and the signal control processing for inspection = yes, == the predetermined part of the wiring pattern of the inspection board; use: inspection; j inspection = part 'contact with the rear end of the inspection base, connected to Measuring device; bottom plate, =; force matching 2 case; and, part; and head, having the 4:=; === part or all of the part can be along the opening of the head, and is controlled by signals And the processing device is connected to the inspection, the:, the private movement, and the inspection is used to control and process the signal for checking the substrate. The rear end of the secret needle, with the effect of the invention, is issued in the month of the month; ^ check, the mobile jig moving mechanism makes the substrate inspection treatment 201011305 with the inspection needle to abut to the inspection -. When the part of the guide _ is used, it can be abutted to one of the money-checking substrates - the part = the front of the IS: = the front end of the probe is abutted to the inspection substrate, and the oxide film is smashed before the inspection The outer moon of the end is read from tin scraps or the like, or it is easily peeled off from the test probe. [Embodiment] The best form of the invention is carried out [summary of the inspection jig] The "0" includes a head 11, a guide plate 12, a bottom plate 14, a pedestal 15, and a temple bar 16. Insulation material such as the master part n, the guide plate 12, the bottom plate 14 and the like. Zhina 1614, and is held between the head u and the pedestal 15 and the bottom plate 11 and the bottom plate 11 are guided to the inspection point (established part) by the front end of the ΓΓ31 needle 17. The 6 moving 'plates 11B and 11C in the head 1 are fixed to the support rod 16. The detachment distance of the moving mechanism is changed, and the plate iia material is formed with a plurality of through holes 11h which are located at the points to be inspected on the wiring pattern of the inspection board (not shown), and are guided ί Contact the location of the k checkpoint. The guide plate 12, the bottom plate 14, and the through hole 11h of the plate piece 11A are also formed for 15 hours, and the probe 17 penetrates through the through holes. Each of the through holes 11h, 12h, and 14h is inserted through a probe 17, and when the plate 11A is moved to a position away from the plate ρ1, the front end portion 17& is retracted from the surface of the plate 201011305. The picking needle 17 has a diameter of about 4 〇 to 6 〇 μηη, and an elastic piano line or crane (w) made of stainless steel can be used to insulate the circumferential surface by the rear end portion. The 去除 removal front end portion and the guide plate 12 are fixedly inserted and traversed through the through hole ^ in the horizontal direction, and the secret inspection scale is made, so that the yoke is prevented from sliding through the through holes I2h and 14h. , to play. Borrowing 17 is formed by a conductive probe with flexibility = shift = vibration. The probe has a plurality of probes 17, so that it is fixed as shown in the above-mentioned slip to maintain a value of 17 to have a needle, such as a sleeve. Further, in the case of the probe, the guide plate needle (probe which is not bent and deformed) is guided in the middle of the through hole 14h. The rear end portion 17b of the electrode 15b? is inserted into contact with the through hole lsh through which the vibrating needle passes through the through hole llh. The electrode 15b it is then inspected by two needles or the like. 19 Touching 1 New Zealand mosquito electric characteristic selector 19 will selectively send the inspection signal to the sample according to the order | ❿ i No ί通, ~ 仏 ,, calculate the resistance value between the checkpoints, Or judge and check == In the example, the hollow plate is arranged with each plate and the bottom plate 14 has an existing machine, and in the case of L 1 casting, the probe of the material is in contact with a part of the wall surface of the through-hole wire. However, in Fig. 2A and Fig. 3A', it is easy to read, and the probe 17 is drawn in a straight line. The mouth type w ΐ 2 2 2 is not the plate 1U is held at a distance from the plate 11] ^ L1, standing (standby position). Although L1 is not specific, it forms, for example, 2 〇〇 to 4 〇〇 μιη. This state 201011305 is maintained until the inspection substrate is brought into contact with the surface of the sheet 11A to inspect the substrate. The other side plates 11B, 11C are fixed to the support rod 16. Further, as shown in Fig. 2A, the sheets 11A, 11B, and 11C are formed with a small-diameter holding hole 21 and a large-diameter preliminary hole 22. The diameter of the holding hole 21 is about 40 to ΙΟΟμηι. The large-diameter preliminary hole 22 is formed so that the small-diameter holding hole 21 can be easily formed, and the plate has a thickness to ensure a certain strength. The recess 21 is formed in the front surface of the opening formed by the retaining hole 21 of the yoke 11 ,. The depth D1 of the recess 20 is 50 to 150 μm and the bump of the inspection substrate can enter the recess 20 as will be described later. Further, the distance D2 from the bottom surface of the concave portion 20 to the tip end surface of the distal end portion 17a of the probe bundle 7 is 100 to 200 μm. _ Figure 2^ is an enlarged view of the position surrounded by a point chain 2Β in Fig. 1. As shown in Fig. 2β, the sheet 11Α is held at a distance from the sheet jig as in the case of Fig. 2Α. This state is maintained until the inspection substrate is brought into contact with the surface of the sheet nΑ to inspect the substrate. On the other hand, the sheets 11B and 11c are fixed to the support rod 16. The soil sheet 11A is inserted into the front end 16 § of the support rod 16 , and the sheet UA is sinned, and the portion can be moved back and forth in the up and down direction (the long side direction of the support rod) in FIG. 2B; 3 -ηγΛ is the 'support board The support rod of the sheet UA may be such a member even if it is not a rod, as long as it can be moved in the axial direction of the opening through which the probe is inserted. Each of the two ΐΐΓϋ ΐ ΐ β is formed with an opening _, a leg, and a contact device 3 偏压 biased in the direction of the plate 11B. The biasing device 30 includes a fixing portion 31 that is fixed so that the fixing portion is biased upward in Fig. 2B. The inner row of the M HA' and the spring 32' is formed: the large diameter portion is also formed to be close to the opening 11Ah ί 'the small diameter portion 31b, forming an outer shape smaller than the inner diameter of the opening, and the locking portion 31s is connected to the lower end unit. Tip (4) _ Large diameter portion 31 & For example, from the outside of the plate 11A, the u = ring: the spring plate spring 2 can be separated from the plate 11B 32 #士古, move from 201011305 to the top. At this time, the locking portion 31s is locked with the projection portion 34 in the opening 11Bh of the plate piece 11B so that the large diameter portion 31a is stopped at this position. Thereby, the sheet 11A can be held at a position close to the sheet 11B. Fig. 3A shows a state in which the sheet 11A is in contact with the inspection position of the sheet UB. That is, a state in which the distance L3 between the land 11A and the plate 11B is zero. In this case, the other end portion 17a of the probe 17 is protruded from the front surface of the sheet 11A. The protruding distance L2 is 50^100#!!!. Further, since the plate 11A moves the distance L1 shown in Figs. 2 and f 2B toward the plate 11B, since the front end portion 17a of the probe 17 becomes protruded from the front surface of the plate 11A, the front end portion 17a of the probe 17 is formed. In Fig. 3A, the distance 'moving from the position indicated by the chain line of the second Lu point to the position indicated by the solid line corresponds to 200 to 450//m of the sum of the distances of L2, m and 〇2. However, as will be described later, the movement of the sheet 11A is caused by a portion of the front surface of the sheet 11A abutting against the partial surface ' of the substrate, and the sheet 11A is pushed toward the sheet 11B; at this time, due to the other end portion 17a of the probe 17. The tip collides with, for example, a bump of the inspection point of the inspection substrate, and therefore, when the substrate inspection is performed, the front end portion 17a of the probe 17 does not protrude from the front surface of the sheet 11A as shown in FIG. 3A. In Fig. 3B, as in Fig. 3A, the sheet 11A is located at a position in contact with the sheet 11B. That is, the distance L3 is zero. In this position, the spring 32 of the biasing device contracts. The reason for this is that when the plate piece 11A moves toward the bottom plate 14 toward the front end portion of the support bar •, the spring 32 is protruded from the large diameter portion 31a because the large diameter portion 31a and the plate piece 11A are moved toward the same plate UB. Department 34 is in a position to resist. At this time, the locking portion 31s collides with the sheet piece 11C and stops. 4 is a view showing a state in which the inspection substrate 40 is inspected so that the front end portion 17& of the probe 17 abuts on the bump 42 of the wiring pattern on the inspection substrate 40. Under this condition, the surface of the inspection substrate 40 is in contact with the portion of the front surface of the sheet 11A (the upper side in Fig. 4), and the projection 42 enters the recess 20 of the sheet 11A. Therefore, the inside of the holding hole 21 of the probe 17 is pushed straight. Therefore, although not shown, the probe I is bent in the space between the guide plate 12 and the bottom plate 14 by the Fig. 1 to absorb the length change of the distance which is pushed in and cannot be protruded. Field, ^ As described above, the inspection substrate 40 is in contact with the front surface of the sheet HA. However, since the projections 201011305 42 are accommodated in the concave portion 20, the probe can be absorbed, so that the height of the projections is not changed. The bend of the probe can be detected to the inspection substrate 40. The shirt is ringing, and the head 11 is adapted to abut the state shown in FIG. 4, and the inspection signal is sequentially selected from the j probe through the plurality of probes 17 Since the signal is transmitted, the block 42 is arranged such that the parallel line 3 between the "devil" and the "through hole" is arranged to be substantially in contact with the inner wall of the through hole. Tilt to the side due to ft f hole llh

端17=1變得,除探針17之前端^=物與探針17謂 [檢查治具之安裝及拆卸概要] 百先,如圖2A所示,將頭部n板^ 機位置。此係如上述,藉由 ^ 大直控部3la朝離開板片11β的方向偏壓而達成。之彈晉32使 11A ’以探針17之前端部17a㈤尖端面縮入從板片 =之别面所形成的凹部20之底面起m的距離,例如15〇_ 方式’ ^罙針17配置於小直徑之固持孔21内。藉此,可防止探 針17之^端部17a因基板檢查前接觸於其他物體而彎曲。The end 17 = 1 becomes, except for the front end of the probe 17 and the probe 17 (the outline of the mounting and dismounting of the jig). As shown in Fig. 2A, the head n is placed. This is achieved by biasing the large direct control portion 3la in the direction away from the sheet 11β as described above. The protrusion 32 is placed at a distance of m from the bottom surface of the concave portion 20 formed by the other end of the sheet 17 from the tip end portion 17a (f) of the probe 17, for example, 15 〇 _ ' ' The small diameter retaining hole 21 is inside. Thereby, it is possible to prevent the end portion 17a of the probe 17 from being bent due to contact with other objects before the substrate inspection.

接著,使頭部11之前面接觸於檢查對象之基板。亦即,於維 持頭部在圖2A之狀態下,移動檢查治具1〇整體,以使頭部n之 板片11A的前面抵接至基板的對向面。此時,由於板片iia盥基 板的面有高低差,因此各個較高部分抵接。又,板片UA之^ 抵接至基板之對向面時,基板的凸塊42進入板片11A的凹部如 内。 该抵接/後,當使檢查治具1〇整體進一步向基板移動時,由於 板片UA受基板推壓,故偏壓裝置3〇之大直徑部31a抵抗彈簧 32的偏壓力而擠進板片11B内。因此,板片11A以靠近板片11B 之方式向底板14移動。 如圖3B所示’當板片11A抵接至板片11B時,停止該移動。 10 201011305 述二!^片11A抵接至板片115前,隨著板片iia接近 =出Λ ϊίίΓ仏從小直徑之11持孔21内向凹部 2〇 一犬出。柄’由於凸塊42如上述地進入凹部2〇内,故 所=,探針17之前端部17a變成與該凸塊42抵接。如上述,由 之固持孔21突出時能馬上與檢查對象之凸 塊接,,因此可正確地進行供作探_ 17接觸之位置的控制。Next, the front surface of the head 11 is brought into contact with the substrate to be inspected. That is, in the state in which the head is held in Fig. 2A, the inspection jig 1 is moved so that the front surface of the sheet 11A of the head n abuts against the opposite surface of the substrate. At this time, since the surface of the plate iia 盥 base plate has a height difference, the respective upper portions abut. Further, when the plate UA is abutted against the opposite surface of the substrate, the projection 42 of the substrate enters the concave portion of the plate 11A as it is. After the abutment/post, when the inspection jig 1 is further moved toward the substrate as a whole, since the plate UA is pressed by the substrate, the large diameter portion 31a of the biasing device 3 is pushed into the plate against the biasing force of the spring 32. Inside the piece 11B. Therefore, the sheet 11A moves toward the bottom plate 14 in a manner close to the sheet 11B. As shown in Fig. 3B, when the sheet 11A abuts against the sheet 11B, the movement is stopped. 10 201011305 述二! ^片11A abuts to the plate 115, as the plate iia approaches = out Λ ϊίίΓ仏 from the small diameter 11 holding hole 21 to the recess 2 〇 a dog out. Since the projection 42 enters the concave portion 2 as described above, the front end portion 17a of the probe 17 abuts against the projection 42. As described above, when the holding hole 21 is protruded, it can be immediately connected to the projection of the inspection object, so that the position for the contact of the probe 17 can be accurately controlled.

Jtjfu17之前端部17a於凹部20内與凸塊42抵接後的時 t由於板片11A尚未抵接至板片11B,因此探針17之前端部i7a 雖進入凹部20内,但其前端部的移動馬上被凸塊42擔住。 參 該被擔住之移動的長度相當於:不存在凸塊4 針π之前端部m可突出的位置(圖3A戶斤示狀態中= 接至凸塊严而被擋住的位置(圖4所示狀態中之位置〉的差。… 門的ΐΐΓίΐί突f之差異量’探針17於導引板12與底板14之 間的工間内¥曲。由於探针17帶有彈性,故探針17之立 因該^曲部分恢復直線的作用力而可適切地接觸於凸塊。 定之配線接至板片11B的位置為檢查位置,其後,進行既 t,===與上述安裝順序相反流程的順序進行作 由於t,使檢查治具1G整體崎開基板之对移動時, 觀置30之彈簧32的偏壓力抵緊至基板, 直徑之_=之 落,因此發揮^洗效Γ 20進入小直控之固持孔21内時剝 能說明依本發明之基板檢查用之檢查治具的一實施形 態,但本發日林隨該實施職,縣本技藝之士可輕 11 201011305 追加、刪除、修改等亦包含於本發明; 依附加之申請專利範圍的記載而限定。,本發明之技術性範圍 [其他實施形態] 上述實施形態中,已揭示頭部u中 構。另外,也可以使板片11A及11B t Hi移動的結 者使頭部11整體能對支持棒16任意移任思移動,或 整體移動時,例如亦可在板片11(: 。使頭部11 叫,並於支持棒16内配置偏壓裝置的大直徑部 簧32者,以利用彈簧32之偏壓環裝有彈 而使頭部11可以遠離底板14之方式移^^ u離開支持棒16, ❿ ΠΒ二上等穿通有探針的開孔_ 11A、 其他部分沿垂直方向“。此種、部2部_對 孔以對於該等板片之面方向,不呈 以對基板往傾斜方向接近的方式移動。1之轴線方向,變成 【圖式簡單說明】 側視^1 _示依本發明之—實_的基板檢查用之檢查治具的 圖2Α係圖1中以基板檢查用之檢查治 a 部分的放大側視® ‘點鏈線2A所不 圖2B係圖1中以基板檢查用之檢查 — 部分的放大侧視圖 /又‘點鍵線2B所不 ,3Α係以圖丨之基板檢查用之檢查治具的一點鏈a 邛分中,用以說明移動部分結構後之狀態的放大側視圖 n’、 圖3B係以圖!之基板檢查用之檢查治具的一點鍵線 邛分中,用以說明移動部分結構後之狀態的放大側視圖 放大本發明之一實施例的基板檢查用之檢查治具的部分 12 201011305 【主要元件符號說明】 ίο〜基板檢查用之檢查治具 11〜頭部 11A、11B、11C〜板片 llAh、llBh〜開孔 12〜導引板 14〜底板 15〜基座 15b〜電極When the front end portion 17a of the Jtjfu 17 abuts against the bump 42 in the concave portion 20, since the plate piece 11A has not yet abutted against the plate piece 11B, the front end portion i7a of the probe 17 enters the concave portion 20, but the front end portion thereof The movement is immediately carried by the bump 42. The length of the movement to be carried is equivalent to: there is no position where the end portion m can be protruded before the projection 4 pin π (Fig. 3A shows the state where the pin is tightly blocked and blocked) (Fig. 4 The difference between the position of the state is shown.... The difference between the door ΐΐΓίΐ 突f' the probe 17 is in the space between the guide plate 12 and the bottom plate 14. Since the probe 17 is elastic, the probe The stand of 17 can be properly contacted with the bump due to the restoring force of the curved portion. The position where the wire is connected to the plate 11B is the inspection position, and thereafter, t is performed, and === is opposite to the above-mentioned installation order. The sequence of the flow is performed, and when the inspection jig 1G is moved by the pair of the substrate, the biasing force of the spring 32 of the viewing 30 is pressed against the substrate, and the diameter of the substrate is lowered, so that the effect is Γ 20 When it is inserted into the holding hole 21 of the small direct control, an embodiment of the inspection jig for the substrate inspection according to the present invention is described. However, the Japanese Ninglin can be added to the workmanship of the county. Deletion, modification, etc. are also included in the present invention; limited by the scope of the attached patent application Technical Field of the Invention [Other Embodiments] In the above embodiment, the configuration of the head portion u has been disclosed. Alternatively, the heads 11A and 11B t Hi can be moved to support the head portion 11 as a whole. When the rod 16 is moved freely, or when moving as a whole, for example, the plate 11 can be called, and the head 11 is called, and the large-diameter portion spring 32 of the biasing device is disposed in the support rod 16 to utilize the spring. The biasing ring of 32 is spring-loaded so that the head 11 can be moved away from the bottom plate 14 away from the support rod 16, and the upper portion of the yoke is threaded through the opening _11A of the probe, and the other portions are in the vertical direction. In this way, the two parts of the pair of holes are moved so as not to approach the oblique direction of the substrate in the direction of the surface of the plates. The direction of the axis of 1 becomes [simple description of the drawing] side view ^1 _ Fig. 2 showing the inspection jig for substrate inspection according to the present invention - Fig. 1 is an enlarged side view of the portion for inspection of the substrate inspection in Fig. 1 'The point chain 2A is not shown in Fig. 1 Check for the inspection of the substrate - the enlarged side view of the part / the 'point key line 2B' is not, 3Α is the picture In the point chain a of the inspection jig for inspection of the substrate, an enlarged side view n' for explaining the state of the moving portion structure, and FIG. 3B is a point key line for the inspection jig for the substrate inspection. In an enlarged side view for explaining the state of the moving portion structure, a portion 12 of the inspection jig for substrate inspection according to an embodiment of the present invention is enlarged. 201011305 [Explanation of main component symbols] ίο~ Inspection jig for substrate inspection 11 to the head 11A, 11B, 11C to the plate llAh, llBh to the opening 12 to the guiding plate 14 to the bottom plate 15 to the base 15b to the electrode

llh、12h、14h、15h〜貫通孔 16〜支持棒 16g〜支持棒之前端部 17〜探針 17a〜探針之前端部(前端) 17b〜探針之後端部 18〜生產線 19〜掃描器 19a〜電極部 20〜凹部 21〜小直徑之固持孔 22〜大直徑之預備孔 30〜偏壓裝置 31〜虱定部 31a〜大直徑部 3 lb〜小直徑部 31s〜卡止部 32〜彈簧 33〜鏍釘 34〜突起部 40〜檢查基板 13 201011305 42〜凸塊 D1〜凹部之深度 D2〜凹部之底面至探針之前端部的尖端面的距離 L1〜板片11A受固持於待機位置時距離板片11B的距離 L2〜探針之前端部從板片11A之前面突出的距離 L3〜^板片11A與板片11B之間的距離11h, 12h, 14h, 15h to through hole 16 to support rod 16g to support rod front end portion 17 to probe 17a to probe front end portion (front end) 17b to probe rear end portion 18 to production line 19 to scanner 19a The electrode portion 20 to the recessed portion 21 to the small-diameter holding hole 22 to the large-diameter preliminary hole 30 to the biasing device 31 to the predetermined portion 31a to the large-diameter portion 3 lb to the small-diameter portion 31s to the latching portion 32 to the spring 33镙 34 〜 〜 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 The distance L2 from the sheet 11B to the distance L3 of the front end of the probe from the front surface of the sheet 11A is the distance between the sheet 11A and the sheet 11B.

Claims (1)

.201011305 七 申請專利範圍: 包含 1· 一種基板檢查用之檢查治具,用以固持複數之檢查 針具有·河端部,接觸於檢查基板之配線圖案的既該探 檢查ϊί查基板之配線圖案,·及後端部,連接於測“ί ’用以 底板,用以固持該複數之檢查用探針的後端部丨食 頭部,具有供該複數之檢查用探針之前端部***穿 孔,用以將該前端部導引至該配線圖案的既定部分 k用的開 該頭部之部分或全部可沿該頭部之開孔的轴線方向移動。 2.如申請專利範圍第!項之基板檢查用之檢查治具, 之部分或全部可沿該開孔的軸線方向,在 #、 w頭部 與接近該底板的檢查位置之間移動。雜開核板的待機位置 3·如申明專利範圍第2項之基板檢查用之檢查治呈,1 ❿ 4由如/Λ專概圍第1項之基板檢查狀檢查治具,_,該頭邻 利範圍第1項之基板檢查用之檢查治具,其中,更科 ======置’她鐵該頭ΐ 梦利範圍第5項之基板檢知之檢查治υ巾,兮偏麼 裝置包含彈簧機構’藉此彈簧機構使铜部之部分ΐ二:1 15 201011305 該底板的方向偏壓 2項之基板檢查用之檢查治具,其中,位於該 杳位置。、°之部分或全部藉由檢查對象之基板移動至該檢 項之基板檢查用之檢查治具,其中,***穿 凹部^ —探針的該頭部之前面的該開孔的周圍形成有 【如申請專利翻帛8項之基板檢查用之檢查治具,增 位置時,該檢查用探針之前端;所接觸的部分‘入 ^控inti置,包含:基紐查狀檢查料及檢查用信 該基板檢查用之檢查治具包括: 案的檢ii檢=’接缺檢查基板之配線圖 接於測定裝置;查查基板之配線圖#;及後端部,連 用以固持該複數之檢查用探針的後端部;與 孔,用i將之檢查用探針之前端部***穿通用的開 用以將該剛端部導引至該配線圖案的既定部分;且 ϊίϊΐ部分或全部可沿該頭部之開孔的轴線方向移動; 八 © 、圖式 16.201011305 VII Patent Application Area: Included 1. A test fixture for substrate inspection, which is used to hold a plurality of inspection needles with a river end portion, and is in contact with the wiring pattern of the inspection substrate, and the wiring pattern of the substrate is checked. And a rear end portion connected to the bottom end of the inspection probe for holding the plurality of foraging heads, and having a perforation inserted into the front end of the plurality of inspection probes Part or all of the opening portion for guiding the front end portion to the predetermined portion k of the wiring pattern may be moved along the axial direction of the opening of the head portion. Part or all of the inspection jig for substrate inspection can be moved between the #, w head and the inspection position close to the bottom plate along the axis direction of the opening. The standby position of the miscellaneous nuclear plate is as follows: Inspection and treatment of the substrate inspection in the second item of the scope, 1 ❿ 4 Inspection inspection tool for the substrate inspection according to item 1 of Λ Λ, _, inspection of the substrate inspection for the first item of the neighborhood Fixture, of which, more division === ===Set 'She iron the head ΐ 梦 范围 范围 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板The inspection jig for the substrate inspection in which the direction is biased by two items, wherein the inspection tool for the substrate inspection is moved to the substrate of the inspection item by the substrate of the inspection object. Inserting a recessed portion of the probe, the periphery of the opening of the probe is formed with an inspection tool for substrate inspection according to the application of the present invention, and the front end of the inspection probe is added when the position is increased; The part to be contacted is controlled by the inti, including: the base check inspection material and the inspection letter. The inspection tool for the substrate inspection includes: the inspection of the case ii inspection = the wiring diagram of the inspection substrate is connected to the measurement device The rear end portion of the inspection probe for holding the plurality of inspection probes; and the hole, the front end portion of the inspection probe is inserted into the universal opening for use with i Leading the rigid end portion to the wiring pattern Moiety; and ϊίϊΐ part or all along the axial direction of the opening movement of the head; eight ©, 16 figures
TW098129962A 2008-09-05 2009-09-04 Fixture for circuit board inspection TWI427297B (en)

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KR20100029035A (en) 2010-03-15
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JP2010085398A (en) 2010-04-15

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