TW201126184A - Inspection fixture for substrate inspection - Google Patents

Inspection fixture for substrate inspection Download PDF

Info

Publication number
TW201126184A
TW201126184A TW099139014A TW99139014A TW201126184A TW 201126184 A TW201126184 A TW 201126184A TW 099139014 A TW099139014 A TW 099139014A TW 99139014 A TW99139014 A TW 99139014A TW 201126184 A TW201126184 A TW 201126184A
Authority
TW
Taiwan
Prior art keywords
inspection
test head
plate
shape
probe
Prior art date
Application number
TW099139014A
Other languages
Chinese (zh)
Other versions
TWI412768B (en
Inventor
Norihiro Ohta
Tadakazu Miyatake
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW201126184A publication Critical patent/TW201126184A/en
Application granted granted Critical
Publication of TWI412768B publication Critical patent/TWI412768B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

This invention provides an inspection fixture for substrate inspection wherein the leading end of an inspection probe may be made to accurately touch a prescribed location of a minute inspection point by holding the leading end of the inspection probe at an accurate position. The inspection fixture 10 is used in a detecting device for detecting the electrical properties of an inspection object. The inspection fixture 10 includes a plurality of probes each having a leading end for contacting a prescribed target portion of the inspection object and a rear end electrically connected to the detecting device, a head plate having holes for allowing the leading ends of the plurality of probes to insert therethrough, a base plate having electrodes for electrically connecting the rear ends of the plurality of probes to the detecting device, and a supporting rod provided between the head plate and the base plate, the supporting rod having a location determining means that can move the head plate in axial direction from a first position to a second position and can maintain the head plate at a prescribed location at least when the head plate is at the first position.

Description

201126184 六、發明說明: 1 【發明所屬之技術領域】 本發明係關於將待檢查物之檢查對 點與檢查裝置二者電連接的檢查治具。 轉U々的檢查 【先前技術】 號,之 查物而言,例如有印刷電路基板、撓性基板、陶竞多 薄膜載體等各種基板,或者彻晶圓 且prepaci零’晶片尺寸封農)等半_裝置。 ^本月"中,將上述待檢查物總稱為「待檢查物」,並將待於 二物上所形成的檢查對象部稱為「對象部」。 、双 裳主檢查物為基板’而且具有搭載於基板之1c(積體電路) 且器等電氣·電子零件時,形成在基板上的對 此時,為了確保對象部之配線能準確地傳達 烟料部份’對於安裝電氣·電子零件前之印刷電路 s之尸顯示器面板上所形成配線上的既定檢查點 電F值荨電氣特性進行檢測,以判斷該配線良否。 具體而言’該配線良否的判定以下述方式進行:使電流供仏 用J子及/或電_定聰針的前端抵接到各檢魅,從該探“ =電流巧給用端子供給檢測用電流到檢查點,同時對於抵接到檢 二點之棟針前端間的配線所產生的電壓進行測定,然後從該等供 給電流與所測定到的電壓二者計算出既定檢查㈣之配線的電阻 值。 、又使用基板仏查裝置進行檢查用基板的檢查時,進行下述 控制:令治具移動機構移動以使基板檢查治具的檢查用探針(接觸 201126184 聽板的_部份,藉錢行狀之檢查,且 —動以使檢查治具遠離檢查用基板田, 寻刊文獻15己載有杈查治具,該檢查治具包含:以*知&m 檢查對象之電子零件側的支持板與檢錢備 ϊΐίΐ具之端部固定在檢查設備側的支持板’而檢杳探針的、、列 试頭貫穿於電子零件側的支持板。 啊錄針的測 探針將因彈性而屈曲成可復原的程度。Λ推人時檢查用 【專利文獻1】日本特開2008_197〇〇9號公報 【發明内容】 (發明所欲解決之課題) •it來’檢查縣之基板不斷複雜化或細微化,設定於美柄 形因此檢查用探針的餘二= 查點時’該檢查用探針之前端偏離移動,晃動 Hi日以㈣前端準確地 出,使電子,v# 2查崎的顧頭從電子零件側的支持板突201126184 VI. Description of the Invention: 1 Technical Field of the Invention The present invention relates to an inspection jig that electrically connects both the inspection point of the object to be inspected and the inspection device. For the inspection of the U-turn, for example, there are various substrates such as a printed circuit board, a flexible substrate, a Tao Jing multi-film carrier, or a wafer and a prepaci zero-wafer size. Half_device. In this month, the object to be inspected is collectively referred to as "object to be inspected", and the portion to be inspected formed on the object is referred to as "target portion". In the case where the main inspection object is a substrate and has an electrical/electronic component such as a 1c (integrated circuit) mounted on the substrate, the wiring is formed on the substrate, and the wiring of the target portion can be accurately conveyed. The material portion 'detects the electrical value of the predetermined checkpoint on the wiring formed on the gantry display panel of the printed circuit s before the installation of the electrical and electronic components, to determine whether the wiring is good or not. Specifically, the determination of whether the wiring is good or not is performed by bringing the front end of the current supply J and/or the electric pin to the respective enchantment, and detecting the supply of the current supply terminal. The current is applied to the checkpoint, and the voltage generated by the wiring between the front ends of the pins that are connected to the second point is measured, and then the wiring of the predetermined inspection (4) is calculated from the supplied current and the measured voltage. In the inspection of the substrate for inspection using the substrate inspection device, the following control is performed: the probe for moving the fixture to move the inspection probe for the substrate inspection jig (contact the _ part of the 201126184 listening plate, The inspection of the money is carried out, and the inspection fixture is kept away from the inspection substrate field. The search document 15 contains the inspection tool, which includes: the electronic component side of the object to be inspected by * know & m The support board and the check-out ϊΐ ΐ ΐ 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 ΐ ΐ ΐ ΐ 啊 啊 啊 啊Elastic and flexed to be recoverable 。 。 。 。 。 。 。 。 。 ( 专利 Λ Λ Λ 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查 检查In the case of the U.S. handle, the remaining two probes are inspected. When the checkpoint is used, the front end of the probe is moved away from the front end of the probe, and the front end of the probe is accurately shaken to make the electrons, v# 2 Support plate on the part side

Li 查點接觸聯探針的測試頭之前端面而強 探針因著彈性;頭推入電子零件側的支持板内,藉此使檢查 但是貫通孔而被固持, 突出*f生變化,因此檢查探針之前端部 石_妾觸到ΐί=二f余查探針的測試頭之前端面有時未準 古式頭之前#面^4勺^二點’或者在電子零件將檢查探針的測 it下按壓直到該電子零件抵接到電子零件侧的支^ 如上i動作時该1試頭之前端面會從檢查點偏離移動。又,因著 -而欢查楝針與測試頭平板之貫通孔的側壁之間進行 201126184 滑動因剝為其問題。 由使檢查用探針之前端部不偏查治具,其藉 ,探 r吏檢查用探針之前端準確地抵^ 又,本發明之目的為:提供基板 =探針之前端強力抵緊於檢查部時7以= 使:探 探針之前端折彎或彎曲等的變形。板R刀知,可防止該檢查用 (角早決課題之手段) 測定========_性的 =¾:檢 針的該前端部貫穿的孔部;底板,呈,,/、有供该複數之探 該測試頭平板可從第1位置沿著轴線方南板之間’以使 少於^==^試頭平板保持於;位置,且至 持在?。ί時’該測持:被保 201126184 ,π. —/α具所具有之5亥互補的形狀為:在該支持柊渺 大圓為下底而小圓為上底之圓錐 ;^叉持棒形成有以 ΪΖ?成有圓錐台形狀的孔部:該孔部台 t圓錐面的形狀’以大圓為下底而小圓為iLi checks the front end of the test head of the contact probe and the strong probe is elastic; the head is pushed into the support plate on the side of the electronic component, so that the inspection but the through hole is held, and the protrusion is changed, so the inspection is performed. Before the probe, the end of the stone _ 妾 touches ΐ ί = two f remaining check probe test head before the end face is sometimes not allowed the ancient head before #面 ^ 4 scoop ^ two points ' or in the electronic parts will check the probe test it Pressing down until the electronic component abuts on the side of the electronic component. When the i is actuated, the end face of the 1 test head will deviate from the checkpoint. In addition, because of the - the check between the needle and the side wall of the through hole of the test head plate 201126184 sliding due to peeling is a problem. By making the front end of the inspection probe unbiased, the front end of the probe is accurately resisted, and the object of the present invention is to provide a substrate = the front end of the probe is strongly pressed against the inspection. When the part is 7, the deformation of the front end of the probe is bent or bent. The plate R knife knows that it can prevent the inspection (the means of the problem of the early decision) =================================================================================== The test head plate can be moved from the first position along the axis to the south plate between the first position to keep the test plate less than ^==^ in the position; and to hold it. ί 时 'The test holding: insured 201126184, π. — / α has a complementary shape of 5 hai: in the support of the big circle as the bottom and the small circle as the upper bottom of the cone; ^ fork holding rod formation There is a hole in the shape of a truncated cone: the shape of the conical surface of the hole table t is a large circle as a bottom and a small circle is i

_ί ίΐ治具中,環繞該支持棒設置有彈簧部,且^彈笼W 化成為使相_貞平板娜_底板的方向偏壓。 J 部可的==形成有凹部’該探針之該前端 。亥基板檢查用之檢查治具中,在、 部’以使該大直徑部卡止於該測試頭平才^。 盆特之絲測㈣檢查物之電氣特性的測定裝置, 八特被係包括檢查治具與信號控制處戒罝 含:複數之探針,分別具有用來接ς至=檢台具包 的前端部,*電連接至㈣查物之既定對象部 供該複數之探針的該前:部板測 =置敕機構,·且該位置確絲構設在該測試 =,^_試頭平板可從第丨位置沿著軸_ ::以對於用來測定該待檢查物之電氣特性:;=^ 在此,所謂「從底面突出」,係指「從底面些微突 些微」的上限與下限,屬於以熟悉本技藝)」, 加以變更的設計事項。以下,在本說明書 u丰可依核境 (發明之效果) 201126184 上依本發明,藉由使檢查用探針之前端部保持在準確位置,可 使該檢查用探針之前端準確地抵接於微小檢查點的既定位置。 依本發明,能保持使檢查用探針之前端準確地抵接於檢查 基板之檢查點的狀態。 一 依本發明,在使檢查用探針之前端強力抵緊於檢查部時,可 防止該前端從檢查部偏離移動。 八士又,依本發明,在使檢查用探針之前端抵接於檢查用基板部 份時,可防止該檢查用探針之前端折彎或彎曲等的變形。 立、而且,依本發明,在使檢查用探針之前端抵接於檢查用基 ,份而進行檢查後,可輕易地去除該檢查用探針之前端所附g Ϊ化膜^碎片或銲錫屑等污物,或者可使該等污物容易從檢查用 才采劍脱,装。 ' 【實施方式】 (實施發明之最佳形態) [檢查治具的概要] 圖1係顯不依本發明之一實施形態的檢查治具1〇之部份 的側面概略圖。又,為了便於理解,全圖中之各構件的厚度、σ 5、形狀、構件間的間隔、間隙等,適當加以放大、縮小;二 ^略化等。又’賴圖式時之上τ、左右的表現,絲示ς 圖之狀態下的位置關係。 檢查治具10包含:測試頭平板η、底板14、基座15及 t L3:測試頭平板11、底板14及基座15係由樹脂:材料等絕緣衬 ,構成的板狀構件。支持棒13之後端部貫通底板14而固定於義 j 15。支持棒13之前端部如後所述,以測試頭平板:u可沿^ 知13移動的方式安褒於測試頭平板u。又# ’而將測試頭平板支持棒13之== 201126184 查點。· 板試頭平 卞板11如0 1所示,由3片的此μ,Ί 成,且該等板片lla、川 片的板片11a、lib、11c構 片形,該等板 接至未圖示之用來進粁雷# 基座15中而配線,且電連 板與基座二者i的掃描器。又,在此將底 而省略基座 構件來進行說明,但也可在底板設置電極 端部及後=的==:;物等,且較一 佳係i戍不,形成有絕緣被覆部的探針17之直徑, 歸貫通孔llalwlbh、lleh大。此係由 =針_卡止固定於 或使=之f徑增大,或者“份 处伸°出^突方固定在貫舰uh,因此從貫通孔 保持於—定。里^不㈢比卡止時的突出量多。因此可使推壓力 的;t Ϊ針17可在測試頭平板11與底板14二者間 ϋ弓曲’亚猎者其傾向於恢復成直線狀的偏壓力,可使探針 而部以適當的壓力抵靠於既定之檢查點(對象部),同時可 木、十17之後端部以適當的壓力抵靠於電極丨%。 圖2A係將圖1中用短劃、線2〇圍住之位置加以放大的前視圖 201126184 (包y3部份剖面圖)。圖2B A \ 用以說日__板υ.移動時的狀態。,支持棒13。圖20係 第支Ϊ棒13之_部份由下列部份構成: 為下底;第2#· 1卿纟碱,配置細賴為上底而小圓 底而大圓為下:置;i=b=f連, ⑽第2位置確定:。呈®柱狀,連結第1位置確定部 該孔二= 部, 的形狀則對應於之1部 二置確 置將確疋於一疋位置;又如圖2C所示,去拓 2位置確定部…嵌入板片山的孔部時,板 測試頭’平板^於一疋位置。藉由該等位置的確定,而使得固持在 上 ,17之前端部Μ各個情形下確實地保ί 定之位置。 可將探針17之前端部17a準確地配置在既 頭平板U的板片Ub形成有圓錐形狀的孔部,該孔 Ϊ 係對應於導引心屬之外周面的形狀,錢導引 而心1於5亥孔部内沿轴線方向移動。又,當導引部说之外周 孔部之面二者間的間隙大時,在板片Ub沿導引部3 =日守’會發生該板y晃動恰該間隙之距義情形。因著 ,付固持在測試頭平板η的探針17之前端部17a的位置依, 大小而大幅晃動,因此該間隙較佳為小間隙。 眾 利用支持棒13的第1位置確定部13a,和測試頭平板u ^與該位置確定部1¼對應的互補形狀的孔部二者,並利用拉、 才 =13的第2位置確定部13c ’和測試頭平板u之具.有與該石 尺部13c對應的互補形狀的孔部二者’分別構成位置確定機隹 如圖2A及圖2C所示,測試頭平板n的板片Ua之頂面固定 10 201126184 有載置檢查基板4〇之-部份的基被固持部Uu;且如圖 隨著檢查基板40向下按壓,職頭平板u被—同向下按辦。因 此,支持棒13的第2位置確定部13c嵌入板片山的土 板Hlc的巧確定於既定之位置。X,因著測試頭平板:U被向 下按壓,使彈黃部12被向下按壓而收缩,因此彈箬部12呈 .測試頭平板11推回的偏壓力。 ^ 〃’將 也就是說’測試頭平板Π可於圖2A的位置 2㈣之間往返移動。㈣,若是圖2A的f置,I 查基板40之既定檢查點未接觸到探針17之前端部% 僅接觸而未受推壓力的狀態。又,若是圖2C的位置,測試反 11最是被向下按壓,而使探針17之前端部17a處於適^ 壓力抵緊至檢查基板40之檢查點之適當位置的狀能。95勺推 如圖2A所示’作為在測試頭平板Γί安裝支持^泰13 可使用下述方法:將例如支持棒U的第工位置確定部仏以轉 引部13b另成一體之方式軸,並在例如第i位置確定部⑸^ 裝外螺紋,在導引部13b形成與其嵌合的内螺紋;於 ===二以導引㈣為前端將支持上入 測麵千板Η的貝通孔Uh,然後將第i位 =部職螺紋’以將第丨位置確定部仏固㊁ 圖3係將圖1之基板檢查用之檢查治具1〇中用短 =份加以放大的前視圖(包含部份剖面圖)。如圖示、^ 11 llah^llbh lith «孔部對齊,⑽等孔部貫穿有探針I7 .為例如約40〜丨任意大小。 了貝狐之直役可 備孔Ϊ3圖I所Ϊ亩板、仙、&分別形成有大直經的預 備孔22、23、24。大直㈣預備孔22、23、24 = f以確保ϋ度’另-方面用來使貫通孔 易形成,因此依板片之厚度’該等預備孔並非必要形 」合 測試頭平板11的板片Ua之頂面形成有凹部21。***板片山 201126184 之孔部的探針17之前端部17a,從形成凹部2;[的底面突出,但是 位於較板片11a之頂面下方處。凹部21之深度例如為]〇〇〜 200μηι,且如後所述,該凹部可供檢查基板4〇的檢查點之凸塊 ^(圖4)進入。又,從該凹部幻之底面到探針17的前端部na之 月端面為止的距離,例如為50〜i〇〇pim。 為說明測試頭平板η與探針17的_,圖4A及圖4B係從 圖3所示部份抽出一部份加以顯示的前視圖(包含部份剖面圖)。 μ ’檢查基板4〇接近測試頭平板11的板月lla,但尚 ^…接片蜀’而檢查治具:1〇處於待開始檢查的狀態。又,如該 =,板片m之頂面形成有凹部21,探針17之前端部I7a從凹 向$出些微的長度。此狀態下,測試頭平板11 在確定·置,因《針Π之前端部?7a處於準ίίί 持在既定位置的狀態。 处干隹聊示 料^圖4Α/雖未圖*,在探針17位於較板片❿之孔部下 方的部伤,形成比該孔部之直徑大的大直徑部。 圖4Β中,探針]7之前端部17a抵接於檢查基板4〇 線 40 Π I权經f合距離S。此時,如圄9P*純-...^ ⑶嵌合於如^圓==部支持棒13的位置較部 直丨與底板]4之_驗_s,但由於大 直仫。卩卡止在測试頭平板丨〗的板片llc之底 彎曲而吸收該距離S的變化. _ 口此彳木針17 抵接至凸塊42後,如^匕述里吉面;針】7之前端部】% 面侧,因此探針17之前端部17a從^^卡止在l lc之底 變化。於是,在前端部17a被凸塊按面突出的量不會 部Ha從該凸塊之表面的既定位置偏离^私日、’可防止該前端 針示的掃描器經由複數之探 該等凸塊42接刪顿軸號,同時從 -乳號,藉此可檢查出複數之凸塊犯間的 12 201126184 配線電阻值,或者判斷有無導通。 L另一實施形態] 圖5係顯示圖2A 5 m π α _ 所示,支持棒.叫由下列部份的另—實施形態。如該圖 位置確定部13e的構成。寺之支持棒U的圓錐台形狀之第2 ❿-】又測試頭平板11 孔部,該孔部的形狀對應於位貝置的板片形成有 的圓錐面的形狀;板片llb 上底與下底二者間 狀則對應於導引邱nh丨々成m 1也形成有孔部’該孔部的形 該孔部内移^ 外周面的形狀,而使導引部13b-i可於. 環繞I持棒圖不’係與圖2A之實施形態相同, 上方偏[Γ 5又置有12,而使測試頭平板通常朝 之實施形態相同,當導引部 小,使得固持在測試頭平板:1么,時,嫩 幅晃動,因此該間隙較佳為小間S針17之則端部17a的位置大 棒的觸應於圖2A中之支持 點例如凸塊,但4ϋ而σΠ74觸到檢查基板40的檢查 置,利用失円而精於尚未被向下按壓的狀態。於該位 推,因此支持 試頭平板叫的位置確定在部,藉此可將測 持才夫U面甚虛線所不支持棒13-1的位置對應於圖2c中之支 + 、&,係於檢查基板40之底面抵接到基板固持部 201126184 llu-],同%•採針π之前端部1乃抵接到檢查基板4〇上 ^的凸塊42的狀態下,凸塊42及檢查基板4〇分別對探針if 洳私邛17a及基板固持部]]u_丨施加推壓力,而將測試頭平板_工 向下按廢。其結果,導引部131>1沿板片]1Μ及11Μ的孔部移 動。 圖6Α係用以顯示依本發明另一實施例之支持棒13_2的前視 包it部=面圖)。支持棒13—2包含:柱塞61,固定於測試頭 平板11,止動部62,與該柱塞61卡合;及圓筒狀 圖6B係從圖6A抽出止動部幻加以顯示的放大圖。 止動部62由卡止部62a與本體部6沈構成,且該止動部犯 ,内,形成有用來使柱塞61.可任隸_貫通孔—。位於 f =之下端面的貫通孔62ώ具有傾斜面必。傾斜面必的傾 圖所示,可形成為位在對向位置的傾斜面62c之延 長線以約90度相交。 、 、,/ί力部62的卡止部62a卡止於圓筒狀之本體部63㊅上端部, 亚筒狀之本體部63的縮窄部63p與止動部62的縮窄部& 一 ^例如餘縫,因此圓筒狀之本體部63固定於止動部62。 構成二仙、傾斜部·、導引部610及突出部61d ϋ連/具有可於止動部62之貫通孔62ώ内移動的大小 平板1的且内:^ 61b ^ 62i, _ &勺角二。又,柱基61的導引部6:lc可於圓芮狀之太 體部63内部的貫通孔内移動。 认W苟狀之本 彈箐部的貫通孔配置有線圈狀形成的彈簧部63s,該 柱塞61之導引=卡止體部63的突出部’而上端部抵接於 推的偏壓力;彈簧部伽產生,引部6】C往上 與止動部62之·_ 69. ^破在上推,而使柱基61的傾斜部61b 6】.的位置得ί確;^ n_斜面必卡合。因著該卡合,柱塞 14 201126184 頭平卜柱基61之上端面係例如以螺絲固定於測試 基板檢查前’因著彈簧部63s的偏愿力,使柱夹 二_部61b與止動部62之貫通孔62m的傾斜二= 主塞 岸曰此,可使探針前端的位置保持於既定之位置。 部ίΪΪ/1與測試頭平板—同被向下按壓時,導引 離開傾爾力W,咖斜物 當檢查結束時,由於測試頭平板回到原來的位置,因此 6°L 的偏壓力推回,而使傾斜部仙卡合於傾斜面 62c藉此,可再度使探針前端的位置保持於既定之位置。 圖U依圖1之檢查治具1〇之另一實施形態的檢查治且 檢查治^不具^處更包含依另—實施賴持棒13·3,此係與 支持棒13-3包含:本體部13_3d ;彈性部13_3r 棒的軸線方向任意伸縮;及軸心部13_3c,用以防止該彈性^= 。彈性部⑽由例如橡膠構件構成,而當推壓 就能恢復到原來的狀態。又,支持棒13_3的上 相互固定之板片lla_2、llb_2、㈣所構成的測試頭“ 依圖7之實施形態,當放下檢查基板4〇時,檢查基板牝之 底面抵接至職頭平板11_2之板片iia_2的頂面,與此 針17之剛端部17a抵接至檢查基板40上之配線圖荦的 此時,由於支持棒D-3的上端部固定於由相互固定、 llb-2、llC-2所構成的測試頭平板n_2,因此探針17之 能準確地抵接到凸塊42的既定位置。 ° 於此狀態下,當放下檢查基板40,而將測試頭平 部13_31·會沿軸心部13_3e收縮。此時’測試頭^板 11-2與底板14之間的距離縮短㈣性部13·3γ的收缩4 針Π f曲而吸收該距離的縮短量。藉著該探針所具有的彎曲恢復 201126184 ί探之前端部⑺以適當壓力抵緊到凸部,同時也能 便私針17之後端部17b抵緊到電極部i5b。 13 面’ ^升南檢查基板4G時,測試頭平板]】,2因彈性部 U-3i的弹性力而恢復到原來的位置。 持拷實施形態,在探針之前端部接檢查_,由於支 ί 持f既仅位置,因此測試頭平板不會產生晃動,而 便才木針之刚鳊部可抵接於檢查點之準確的位置。 η ] UP便於該抵接後’也由於檢查點及探針同時沿著軸心部 -34動’^檢查點與探針之間不會產生橫向滑動。 槿点又上f實施形態中’已揭示凹部21供一個凸塊42收納的 大小。—凹。卩21的大小並不限於此,可具有能收納好幾個凸塊的 來能已針對依本發日狀基板檢查用的檢絲具之若干實施 2可ίΓ明’但本發明並不限於該等實施形態’係熟悉本技藝 t士了輕易元成的追加、刪除、修改等亦包含於本發明·又,本 兔明的技術性範圍係依附加之中請專利範圍的記載而決定。 【圖式簡單說明】 圖]係概略顯示依本發明之一實施例的基板檢聋用之治 具的側視圖(包含部份剖面圖)。 一 圖.2A係將圖1之基板檢查用之檢查治具中用 部份純放大的前視圖(包含部份剖面圖)。 -说%所,、 圖2B係取出圖2A所示部份之一部份的前視圖。 圖2C係用以說明圖2A所示部份之變動的前視圖(包含部份剖 圖3係將圖1之基板檢查用之檢查治具中用短劃線邓 份加以放大的前視圖(包含部份剖面圖)。 ’、 I^4A、4B係為說明圖3所示部份的使用狀態而從圖3抽出 一部份加以概略顯示的前視圖(包含部份剖面圖)。 圖5係關於依本發明之基板檢查用之檢查治真的另—實施形 201126184 態,為用以顯示圖2A所示部份之另一實施形態的前視圖(包含部 份剖面圖)。 圖6A、6B係關於依本發明之基板檢查用之檢查治具的支持 棒之另一實施形態的前視圖(包含部份剖面圖)。 圖7係概略顯示依本發明之基板檢查用之檢查治具的又另一 實施形態的前視圖(包含部份剖面圖)。 【主要元件符號說明】 10、 10-1〜基板檢查用之檢查治具 11、 11-1、11-2〜測試頭平板 ^ 11a、lib、11c〜板片 、llb-1、llc-1 〜板片 lla-2、llb-2、llc-2〜板片 llh、llah、llbh、llch〜貫通孔 llu、llu-1〜基板固持部 12〜彈簧部(彈簣構件) 13、13-卜13-2、13-3〜支持棒 13a、13c、13a-l〜位置確定部 13b、131>1〜導引部 13-3c〜軸心部 13-3d〜本體部 13-3r〜彈性部 14〜底板 14h〜貫通孔 15〜基座 15b〜電極 15h〜貫通孔 16〜電線 17〜探針 17a〜探針17之前端部 17 201126184 17b〜探針17之後端部 20、30〜短劃線 21〜凹部 22、23、24〜預備孔 40〜檢查基板 42〜凸塊 61〜柱塞 61a〜連結部 61b〜傾斜部 61c〜導引部 61d〜突出部 61 in〜内螺紋 62〜止動部 62a〜卡止部 62b〜本體部 62c〜傾斜面 62in〜貫通孔 62p〜縮窄部 63〜本體部 63p〜縮窄部 63s〜彈簧部 S〜測試頭平板11被向下按壓之距離In the fixture, a spring portion is provided around the support rod, and the ^cuffle is turned into a biasing direction of the phase plate. The J portion can be == formed with a recessed portion' the front end of the probe. In the inspection jig for the inspection of the substrate, the portion is locked so that the large diameter portion is locked to the test head. Measure of the electric characteristics of the inspection of the wire. (4) The measuring device for the electrical characteristics of the inspection object, the eight-item is included in the inspection fixture and the signal control section. The numerator includes: a plurality of probes, respectively, which are used to connect to the front end of the inspection table package. Department, *Electrically connected to (4) the predetermined target part of the object for the first part of the probe of the plurality of probes = the placement mechanism, and the position is confirmed by the wire in the test =, ^_ test head plate From the third position along the axis _ :: for the electrical characteristics used to determine the object to be inspected:; = ^ Here, the term "prominent from the bottom surface" means the upper and lower limits of "slightly slightly from the bottom surface". Design items that are subject to change by familiarity with this technique. Hereinafter, in the present invention, according to the present invention, the front end of the test probe can be accurately abutted by holding the front end portion of the test probe at an accurate position. At a given location for a small checkpoint. According to the present invention, it is possible to maintain a state in which the front end of the inspection probe is accurately brought into contact with the inspection point of the inspection substrate. According to the present invention, when the front end of the inspection probe is strongly pressed against the inspection portion, the front end can be prevented from being displaced from the inspection portion. According to the present invention, when the front end of the inspection probe is brought into contact with the inspection substrate portion, deformation of the front end of the inspection probe can be prevented from being bent or bent. According to the present invention, after the inspection probe is brought into contact with the inspection substrate at the front end, the inspection can be easily removed, and the front end of the inspection probe can be easily removed. Contaminants such as swarf, or the smudges can be easily removed from the inspection. [Embodiment] (Best Mode for Carrying Out the Invention) [Outline of Inspection Fixture] Fig. 1 is a schematic side view showing a portion of an inspection jig 1 according to an embodiment of the present invention. Further, in order to facilitate understanding, the thickness, σ 5, shape, spacing between members, gaps, and the like of the respective members in the entire drawing are appropriately enlarged and reduced, and the like. In addition, the expression of τ and left and right on the Lai pattern is the positional relationship in the state of the graph. The inspection jig 10 includes a test head plate η, a bottom plate 14, a susceptor 15, and a t L3: the test head plate 11, the bottom plate 14, and the susceptor 15 are plate-like members composed of an insulating lining of resin: material. The rear end of the support rod 13 passes through the bottom plate 14 and is fixed to the j 15 . The front end of the support rod 13 is mounted on the test head plate u in such a manner that the test head plate: u can be moved along the guide 13 as will be described later. Also # ‘ and the test head plate support bar 13 == 201126184 check points. The plate test head flat plate 11 is formed of three pieces of this μ as shown in FIG. 1, and the plates 11a, lib, and 11c of the plate piece 11a are formed into a sheet shape, and the boards are connected to A scanner (not shown) for wiring the susceptor 15 and wiring, and electrically connecting the board to the pedestal. Here, the base member is omitted from the bottom, but the electrode end portion and the rear ===:; or the like may be provided on the bottom plate, and the insulating coating portion may be formed. The diameter of the probe 17 is larger than the through holes llalwlbh and lleh. This is fixed by the = pin_lock or the diameter of the f is increased, or "the extension of the part is fixed to the warship uh, so it is kept from the through hole. The inside is not (three) than the card The amount of protrusion at the end of the time is large. Therefore, the pressing force can be used; the t-needle 17 can be bent between the test head plate 11 and the bottom plate 14, and the sub-hunter tends to return to a linear biasing force, which can The probe portion is pressed against the predetermined inspection point (object portion) with an appropriate pressure, and at the same time, the end portion of the wood and the post-17 is pressed against the electrode 丨% with an appropriate pressure. FIG. 2A is a short stroke in FIG. The front view of the line 2〇 is enlarged to enlarge the front view 201126184 (part y3 partial cross-sectional view). Figure 2B A \ is used to say the state of the __ plate. When moving. Support bar 13. Figure 20 is the first The part of the support rod 13 is composed of the following parts: for the bottom; the second #·1 纟 纟 base, the arrangement depends on the bottom and the small round bottom and the big circle is the lower: set; i=b=f (10) The second position is determined: the column is in the shape of a column, and the first position determining portion is connected to the hole 2 = portion, and the shape corresponds to the position of one portion and the second position is determined to be in a position; as shown in Fig. 2C. , go to extension 2 When the determining portion is inserted into the hole portion of the plate mountain, the plate test head 'plate' is placed at a position. By the determination of the positions, the position is fixed, and the position of the end portion before the 17 is surely secured in each case. The front end portion 17a of the probe 17 can be accurately disposed on the sheet Ub of the front flat plate U to form a conical hole portion corresponding to the shape of the outer peripheral surface of the guiding core, and the money guide The core 1 moves in the direction of the axis in the 5 hole portion. Further, when the guide portion says that the gap between the faces of the outer hole portion is large, the sheet Ub is along the guide portion 3 = The plate y is shaken by the gap of the gap. The position of the end portion 17a of the probe 17 held by the test head plate η is greatly shaken by the size, so that the gap is preferably a small gap. The first position determining portion 13a of the rod 13 and the hole portion of the complementary shape corresponding to the test head plate u^ and the position determining portion 11b, and the second position determining portion 13c' and the test head using the pull = 13 The flat plate u has a complementary shaped hole portion corresponding to the stone rule portion 13c. As shown in FIG. 2A and FIG. 2C, the top surface of the plate Ua of the test head plate n is fixed 10 201126184, and the base-mounted portion Uu of the portion on which the inspection substrate 4 is placed is mounted; The inspection substrate 40 is pressed downward, and the head plate u is pressed down. Therefore, the second position determining portion 13c of the support rod 13 is embedded in the soil plate Hlc of the plate mountain to be determined at a predetermined position. X, The test head plate: U is pressed down, so that the spring portion 12 is pressed down and contracted, so the magazine portion 12 is biased by the test head plate 11. ^ 〃 ' will be the test head The plate 往返 can be moved back and forth between position 2 (four) of Figure 2A. (4) If it is set to f in Fig. 2A, I check that the predetermined checkpoint of the substrate 40 is not in contact with the probe 17 before the end portion % is in contact only and is not subjected to the pressing force. Further, in the position of Fig. 2C, the test reverse 11 is most pressed downward, and the front end portion 17a of the probe 17 is placed in an appropriate position to be pressed to the appropriate position of the inspection point of the inspection substrate 40. The 95-spoon push is as shown in Fig. 2A. 'As the test head plate Γί mounting support ^Tai 13, the following method can be used: the work position determining portion 例如, for example, the support rod U, is integrally integrated with the turning portion 13b, And, for example, the ith position determining portion (5) is provided with an external thread, and the internal thread is fitted to the guiding portion 13b; and the front end of the guide (4) is guided by (4) to support the Beton connected to the measuring surface. Hole Uh, then the i-th position = part of the thread 'to tamper the second position determining portion. FIG. 3 is a front view in which the inspection tool for the substrate inspection of FIG. 1 is enlarged by short = part ( Contains a partial section). As shown in the figure, ^11 llah^llbh lith «hole alignment, (10) and other holes penetrate the probe I7. For example, about 40 ~ 丨 any size. In the direct service of Beihu, you can prepare the pre-filled holes 22, 23, and 24 with large straights, respectively. The large straight (four) preparatory holes 22, 23, 24 = f to ensure the degree of twist 'other aspects are used to make the through holes easy to form, so depending on the thickness of the plate 'the preliminary holes are not necessary to form" the plate of the test head plate 11 A concave portion 21 is formed on the top surface of the sheet Ua. The front end portion 17a of the probe 17 inserted into the hole portion of the plate mountain 201126184 protrudes from the bottom surface where the concave portion 2 is formed, but is located below the top surface of the plate piece 11a. The depth of the concave portion 21 is, for example, 〇〇 to 200 μm, and as will be described later, the concave portion can be used to inspect the bump of the inspection point of the substrate 4 (Fig. 4). Further, the distance from the bottom surface of the concave portion to the end surface of the distal end portion of the probe 17 is, for example, 50 to i 〇〇 pim. To illustrate the test head plate η and the probe 17 _, Figs. 4A and 4B are front views (including partial cross-sectional views) which are extracted from a portion shown in Fig. 3. The μ' inspection substrate 4 is close to the plate month 11a of the test head plate 11, but is still in the vicinity of the test piece: 1〇 is in a state to be inspected. Further, as this =, the top surface of the sheet m is formed with the concave portion 21, and the front end portion I7a of the probe 17 is slightly lengthwise from the concave direction. In this state, the test head plate 11 is determined to be set, because "the front end of the needle?" 7a is in a state where it is held in a given position. When the probe 17 is located below the hole portion of the sheet bundle, a large diameter portion larger than the diameter of the hole portion is formed. In Fig. 4A, the front end portion 17a of the probe 7 abuts on the inspection substrate 4, and the line 40 Π I is connected to the distance S. At this time, for example, 圄9P*pure-...^ (3) is fitted to the position of the support bar 13 such as the circle == part of the support bar 13 and the bottom plate _ _ _ s, but due to the large straight 仫. The 卩 card is bent at the bottom of the test piece 丨 的 llc llc llc llc 吸收 吸收 吸收 吸收 吸收 llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc llc The front end portion is % face side, so the front end portion 17a of the probe 17 is changed from the bottom of the latch to the bottom of l lc . Therefore, the amount by which the front end portion 17a is protruded by the convex portion does not deviate from the predetermined position of the surface of the convex portion, and the scanner that prevents the front end needle from detecting the bumps can be prevented from passing through the plurality of bumps. 42 to delete the axis number, and from the - milk number, by which you can check the value of the 12 201126184 wiring resistance between the complex bumps, or to determine whether there is conduction. Another embodiment of the present invention is shown in Fig. 2A as shown in Fig. 2A, 5 m π α _ , and a supporting rod. The configuration of the figure position determining unit 13e is as shown. The second shape of the truncated cone shape of the support rod U of the temple is further tested. The shape of the hole portion corresponds to the shape of the conical surface formed by the plate placed in the position; the upper surface of the plate llb is The shape of the lower bottom corresponds to the shape of the guiding portion of the hole portion, and the shape of the hole portion is formed by the inner peripheral surface of the hole portion, so that the guiding portion 13b-i can be formed. The surrounding I hold bar graph is not the same as the embodiment of Fig. 2A, and the upper side is biased [Γ 5 is set to 12, so that the test head plate is usually implemented in the same form, when the guide portion is small, so that the test head plate is held. :1, when, the tenderness is swaying, so the gap is preferably the position of the end portion 17a of the small S pin 17 and the large bar touches the support point in FIG. 2A such as a bump, but the Π Π 74 touches the inspection. The inspection of the substrate 40 is performed in a state in which it has not been pressed downward by using a failure. Pushing in this position, therefore, the position of the test head tablet is determined to be in the portion, whereby the position of the rod 13-1 that does not support the U-side and the dotted line of the tester can be corresponding to the branch +, & The bottom surface of the inspection substrate 40 is abutted against the substrate holding portion 201126184 llu-], and the front portion 1 of the inspection needle π is in contact with the bump 42 of the inspection substrate 4, the bump 42 and The inspection substrate 4 丨 applies a pressing force to the probe if 洳 private 邛 17a and the substrate holding portion ] u_ ,, respectively, and presses the test head slab downward. As a result, the guiding portion 131 > 1 moves along the hole portions of the sheets 1Μ and 11Μ. Fig. 6 is a view showing a front view of a support bar 13_2 according to another embodiment of the present invention. The support rod 13-2 includes: a plunger 61 fixed to the test head plate 11, a stopper 62, and engaged with the plunger 61; and a cylindrical shape FIG. 6B is an enlarged view of the stop portion from FIG. 6A Figure. The stopper portion 62 is formed by the locking portion 62a and the body portion 6, and the stopper portion is formed therein to form a plunger 61. The through hole 62ώ located at the lower end surface of f = has an inclined surface. As shown in the oblique view of the inclined surface, the extension line of the inclined surface 62c which is formed at the opposite position intersects at about 90 degrees. The locking portion 62a of the force portion 62 is locked to the upper end portion of the cylindrical main body portion 63, and the narrowed portion 63p of the sub-tubular main body portion 63 and the narrowed portion of the stopper portion 62 For example, the residual seam is such that the cylindrical body portion 63 is fixed to the stopper portion 62. The two slanting portions, the inclined portion, the guiding portion 610, and the protruding portion 61d are connected/incorporated with the large and small flat plate 1 movable in the through hole 62ώ of the stopping portion 62: ^ 61b ^ 62i, _ & two. Further, the guide portion 6: lc of the column base 61 is movable in the through hole inside the circular body portion 63. The through hole of the inner portion of the W-shaped portion is disposed with a coil-shaped spring portion 63s, the guide of the plunger 61 is a protruding portion of the locking body portion 63, and the upper end portion is abutted against the biasing force of the pushing; The spring portion is generated, and the lead portion 6C is upwardly and the stopper portion 62 is _ 69. ^ is broken up, and the position of the inclined portion 61b 6 of the column base 61 is determined; ^ n_ bevel Must be stuck. Due to the engagement, the upper end surface of the plunger 14 201126184 is fixed to the test substrate by screws, for example, before the test substrate is inspected. [Because of the biasing force of the spring portion 63s, the column clamp portion _ portion 61b and the stopper portion 62 are caused. The inclination of the through hole 62m is two, and the position of the front end of the probe can be maintained at a predetermined position. Department ΪΪ ΪΪ / 1 and the test head plate - when pressed down, the guide leaves the slanting force W, when the check is finished, the test head plate returns to the original position, so the 6 °L partial pressure push By returning the inclined portion to the inclined surface 62c, the position of the distal end of the probe can be again maintained at a predetermined position. Figure U is an inspection and treatment according to another embodiment of the inspection tool of Figure 1. The inspection and treatment are not included, and the support rod 13-3 is included. The portion 13_3d; the elastic portion 13_3r is arbitrarily stretchable in the axial direction of the rod; and the axial portion 13_3c is for preventing the elasticity ^=. The elastic portion (10) is composed of, for example, a rubber member, and can be restored to its original state when pressed. Further, the test heads composed of the upper and lower fixed plates 13a3, 11b_2, and (4) of the support rods 13_3 "in accordance with the embodiment of Fig. 7, when the inspection substrate 4 is lowered, the bottom surface of the inspection substrate is abutted to the front plate 11_2 The top surface of the plate iia_2 is in contact with the front end portion 17a of the needle 17 to the wiring pattern on the inspection substrate 40. Since the upper end portion of the support rod D-3 is fixed to each other, llb-2 The test head plate n_2 formed by llC-2, so that the probe 17 can accurately abut the predetermined position of the bump 42. ° In this state, when the inspection substrate 40 is lowered, the test head flat portion 13_31· It will contract along the axial center portion 13_3e. At this time, the distance between the test head plate 11-2 and the bottom plate 14 is shortened (four) the contraction of the fourth portion 13·3γ is 4 times, and the shortening amount of the distance is absorbed. The bending recovery of the probe is 201126184. The front end portion (7) is pressed against the convex portion with an appropriate pressure, and the end portion 17b of the private needle 17 is also pressed against the electrode portion i5b. 13 face ' ^ 升南 inspection substrate 4G When the test head plate]], 2 is restored to the original position due to the elastic force of the elastic portion U-3i. In the form of the probe, the end of the probe is connected to the inspection _. Since the support is only the position, the test head plate does not sway, and the rigid portion of the wooden needle can abut the exact position of the inspection point. η ] UP facilitates the contact after the 'also because the checkpoint and the probe move along the axis -34 simultaneously' ^ checkpoint and the probe does not produce lateral sliding. The size of the recessed portion 21 for storing one of the bumps 42 has been disclosed. The size of the recessed portion 21 is not limited thereto, and may have a wire detecting device capable of accommodating several bumps for inspection of the substrate according to the present invention. The present invention is not limited to the embodiments. It is also known that the addition, deletion, modification, etc. of the present invention are also included in the present invention. The range is determined by the description of the scope of the patent application. [Brief Description of the Drawings] Fig. 4 is a side view (including a partial cross-sectional view) of a jig for substrate inspection according to an embodiment of the present invention. Fig. 2A is the inspection and treatment of the substrate inspection of Fig. 1. A partially enlarged front view (including a partial cross-sectional view) is used. - Speaking of %, Figure 2B is a front view of a portion of the portion shown in Figure 2A. Figure 2C is used to illustrate Figure 2A. A front view showing a variation of the portion (including a partial cross-sectional view 3 is a front view (including a partial cross-sectional view) in which the dash portion of the inspection jig for the substrate inspection of Fig. 1 is enlarged. ', I ^4A, 4B are front views (including partial cross-sectional views) which are schematically shown in Fig. 3 for explaining the state of use of the portion shown in Fig. 3. Fig. 5 is for inspection of the substrate according to the present invention. The inspection is also in the form of a front view (including a partial cross-sectional view) showing another embodiment of the portion shown in Fig. 2A. Figs. 6A and 6B are front views (including partial cross-sectional views) showing another embodiment of a support rod for an inspection jig for inspection of a substrate according to the present invention. Fig. 7 is a front view (including a partial cross-sectional view) showing still another embodiment of the inspection jig for inspection of a substrate according to the present invention. [Description of main component symbols] 10, 10-1~ Inspection jig for substrate inspection 11, 11-1, 11-2~ test head plate ^ 11a, lib, 11c~ plate, llb-1, llc-1 Plates 11a-2, 11b-2, 11-2 to 11h, 11ah, 11bh, 11ch, through holes 11u, 11u-1, substrate holding portion 12, spring portion (elastic member) 13, 13 - 13 -2, 13-3 - support bars 13a, 13c, 13a-1 to position determining portions 13b, 131 > 1 to guiding portions 13-3c to eccentric portions 13-3d to main portions 13-3r to elastic portions 14 to Base plate 14h to through hole 15 to base 15b to electrode 15h to through hole 16 to wire 17 to probe 17a to probe 17 front end portion 17 201126184 17b to probe 17 rear end portion 20, 30 to dash 21 to Concave portion 22, 23, 24 to preliminary hole 40 to inspection substrate 42 to bump 61 to plunger 61a to connecting portion 61b to inclined portion 61c to guiding portion 61d to protruding portion 61 in to internal thread 62 to stopper 62a The locking portion 62b to the main body portion 62c to the inclined surface 62in to the through hole 62p to the narrowed portion 63 to the main body portion 63p to the narrowed portion 63s to the spring portion S to the test head plate 11 are pressed downward

Claims (1)

201126184 七、申請專利範圍: 裝置^種檢查治具,使用於用來測定待檢查物之電氣特性的測定 該檢查治具包含: 複數之探針,分別具有用來接 的前端部,與電連接至該測定裝置的後;查物之既定對象部 測試碩平板,具有供該複數 丄 底板,具有用來將該複數之部貫穿的孔部; 裝置的電極;及 、· 後知部電連接到該測定 二支持棒,具有位置確定機構;其中 °亥位置確疋機構設在該測試頭平你盘3α 試頭平板簡第丨位置沿著。7 間,以使該測 該第=使該測試頭平板保==位置’且至少於 2·如申請專利範圍第i項之 如下之互補的形狀:於該測 :口:其中,该檢查治具具有 測試頭平板與該支持棒互相j合皮保持在該第1位置時,該 測試頭平板與該支持棒互相板被保持在該第2位置時,該 為查治具,其中,該互補的形狀 的圓錐台,並在哕 為上底而小圓為下底之圓錐台形狀 ,台形狀㈣,綱 而小圓為下底。 _α之®錐面的形狀,以大圓為上底 為:j之檢查治具,其中,該互補的形狀 的圓錐台,並在該測試頭平為上底之_台形狀 之圓錐台形狀係對應於兮成有固錐台形狀的孔部,該孔部 而小圓為上底。…^回錐口之圓錐面的形狀,以大圓為下底 6.如申請專利範圍第4或5項之檢查治具,其中,環繞該支持 19 201126184 棒設置有彈·笼· ϋιτ 向偏壓。 且該彈簧部將該測試頭平板朝離開該底板的方 該測利範圍第1項之基板檢查用之檢查治具,其中,於 面突出。、板成有凹部,該探針之該前端部從形成該凹部的底 不貫8穿圍第1項之基板檢查用之檢查治具,其中,在 較該測試頭 卡止於該_頭平板。 卩以使献直徑部 治具—雖,紅括檢查 该檢查治具包含: 的前槪既定對象部 底:碩:?用數之探針的該前端部貫穿的孔部; 裝置的電H 讀之騎龍後端部電連接到該測定 f持棒,、具有位置確定機構;且 試頭平頭平板與該底板之間,以使該測 該信號控制處理裝置雷、查= ' 无疋<位置,而 該電極,以對於用來啦檢查治狀麵試頭平板的 及處理。 。寺铋查物之電氣特性的信號進行栌制 圖式 20201126184 VII. Patent application scope: The device is used for measuring the electrical characteristics of the object to be inspected. The inspection tool comprises: a plurality of probes respectively having a front end portion for connection and electrical connection To the rear of the measuring device; the predetermined target portion of the inspection object is tested, and has a plurality of bottom plates for the plurality of bottom plates, and a hole portion for inserting the plurality of portions; the electrodes of the device; and, the rear portion is electrically connected to The measuring second support rod has a position determining mechanism; wherein the °H position confirmation mechanism is set on the test head to flatten the position of the disc 3α test head flat. 7 between, so that the test = the test head plate to ensure == position 'and at least 2 · as in the patent application scope i of the following complementary shape: in the test: port: where the inspection When the test head plate and the support rod are held in the first position, when the test head plate and the support bar are held in the second position, the check device is The shape of the truncated cone is in the shape of a truncated cone whose bottom is the bottom and the small circle is the lower bottom. The shape of the table is (4), and the small circle is the bottom. The shape of the _α® cone surface, with the large circle as the upper base: the inspection fixture of j, wherein the complementary shape of the truncated cone is corresponding to the truncated cone shape of the table top in the test head Yu Yucheng has a hole portion in the shape of a solid frustum, and the hole portion is a small circle. ...^ The shape of the conical surface of the cone is made with a large circle as the bottom 6. As for the inspection fixture of the fourth or fifth aspect of the patent application, wherein the support is 19 201126184, the rod is provided with a spring cage and ϋιτ bias . And the spring portion is directed to the inspection jig for the substrate inspection of the first item of the measurement range, which protrudes from the bottom surface of the test head. The plate has a recessed portion, and the front end portion of the probe passes through the bottom of the recessed portion 8 to pass the inspection tool for the substrate inspection of the first item, wherein the test head is locked to the slab .卩 使 直径 直径 直径 直径 — — — — — — — — — — — — — — — — — — 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 虽 直径 直径 直径 直径The rear end portion of the rider is electrically connected to the measuring f-holding rod, and has a position determining mechanism; and between the test head flat plate and the bottom plate, so that the signal is controlled to control the processing device, and the check is 'innocent< The position, and the electrode, is used for the treatment of the head of the interview head. . The signal of the electrical characteristics of the temple is checked.
TW099139014A 2009-11-13 2010-11-12 Inspection fixture for substrate inspection and detecting device using the inspection fixture TWI412768B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009259969A JP5397619B2 (en) 2009-11-13 2009-11-13 Inspection jig for board inspection

Publications (2)

Publication Number Publication Date
TW201126184A true TW201126184A (en) 2011-08-01
TWI412768B TWI412768B (en) 2013-10-21

Family

ID=44230521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099139014A TWI412768B (en) 2009-11-13 2010-11-12 Inspection fixture for substrate inspection and detecting device using the inspection fixture

Country Status (3)

Country Link
JP (1) JP5397619B2 (en)
KR (1) KR101157883B1 (en)
TW (1) TWI412768B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102621354A (en) * 2012-04-11 2012-08-01 游森溢 Detachable testing jig
TWI463133B (en) * 2011-08-16 2014-12-01 Ckd Corp Substrate inspecting device
CN113514674A (en) * 2020-04-08 2021-10-19 日本麦可罗尼克斯股份有限公司 Electric connection device and inspection method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808473A (en) * 1994-08-04 1998-09-15 Nippon Telegraph & Telephone Corp. Electric signal measurement apparatus using electro-optic sampling by one point contact
JPH1152000A (en) * 1997-07-31 1999-02-26 Mozu Denshi Kogyo Kk Inspection device and inspection method for printed wiring board
JP3080047B2 (en) * 1997-11-07 2000-08-21 日本電気株式会社 Bump structure and bump structure forming method
JP4207336B2 (en) * 1999-10-29 2009-01-14 ソニー株式会社 Charging system for mobile robot, method for searching for charging station, mobile robot, connector, and electrical connection structure
JP2003307542A (en) * 2002-02-18 2003-10-31 Tokyo Cosmos Electric Co Ltd Ic socket
JP2005061876A (en) * 2003-08-19 2005-03-10 Japan Electronic Materials Corp Probe unit, and manufacturing method for the probe unit
JP4769538B2 (en) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 Contactor for electronic parts and contact method
JP4863466B2 (en) * 2006-08-01 2012-01-25 日本電産リード株式会社 Manufacturing method of substrate inspection jig
JP4965341B2 (en) * 2007-05-31 2012-07-04 日置電機株式会社 Probe unit and circuit board inspection device
JP2009204393A (en) * 2008-02-27 2009-09-10 Renesas Technology Corp Probe card, method for manufacturing probe card, semiconductor inspection apparatus and method for manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463133B (en) * 2011-08-16 2014-12-01 Ckd Corp Substrate inspecting device
CN102621354A (en) * 2012-04-11 2012-08-01 游森溢 Detachable testing jig
CN113514674A (en) * 2020-04-08 2021-10-19 日本麦可罗尼克斯股份有限公司 Electric connection device and inspection method

Also Published As

Publication number Publication date
JP5397619B2 (en) 2014-01-22
JP2011106867A (en) 2011-06-02
KR20110053181A (en) 2011-05-19
KR101157883B1 (en) 2012-06-22
TWI412768B (en) 2013-10-21

Similar Documents

Publication Publication Date Title
US9733299B2 (en) Inspection jig
TWI354108B (en)
WO2018021140A1 (en) Inspection jig, substrate inspection device provided with same, and method for manufacturing inspection jig
WO2007132739A1 (en) Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig
TW201219807A (en) Testing auxiliary apparatus
TW201037328A (en) Method for the testing of circuit boards
US20200124664A1 (en) Electrical test apparatus having adjustable contact pressure
TWI635297B (en) Substrate inspecting apparatus, substrate inspecting method and jig for inspecting substrate
TW201126184A (en) Inspection fixture for substrate inspection
TW202201017A (en) Inspection jig, inspection jig set, and substrate inspecting apparatus
JP2017036997A (en) Inspection device and inspection method of double-sided circuit board
TW200819755A (en) Electronic component inspection probe
TWI427297B (en) Fixture for circuit board inspection
JP5245279B2 (en) Substrate inspection jig and electrode structure of connection electrode portion in this jig
TW200949255A (en) Probe card
US11454650B2 (en) Probe, inspection jig, inspection device, and method for manufacturing probe
JP5896878B2 (en) Evaluation apparatus and evaluation method
TWI232952B (en) Test base for a pin
TW200804826A (en) Board inspection tool and board inspection apparatus
JP2014016300A (en) Substrate inspection device and substrate inspection method
KR101075629B1 (en) Processing apparatus
TWI267641B (en) Measuring module suitable for all kind of electric characteristics and small measuring point
TW531641B (en) Test method to increase the testing density
TWM310335U (en) Precise fine-tuning mold
JP2012186354A (en) Semiconductor manufacturing apparatus and semiconductor device manufacturing method