TW200946854A - Structure of compounding type vapor chamber - Google Patents

Structure of compounding type vapor chamber Download PDF

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Publication number
TW200946854A
TW200946854A TW97117932A TW97117932A TW200946854A TW 200946854 A TW200946854 A TW 200946854A TW 97117932 A TW97117932 A TW 97117932A TW 97117932 A TW97117932 A TW 97117932A TW 200946854 A TW200946854 A TW 200946854A
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TW
Taiwan
Prior art keywords
plate
board
capillary structure
wick
plate body
Prior art date
Application number
TW97117932A
Other languages
Chinese (zh)
Inventor
Te-Feng Chu
Ming-Tai Weng
Chao-Hsiang Hsu
Shang-Wei Kao
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Foretherma Advanced Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Foretherma Advanced Technology Co Ltd filed Critical Foretherma Advanced Technology Co Ltd
Priority to TW97117932A priority Critical patent/TW200946854A/en
Publication of TW200946854A publication Critical patent/TW200946854A/en

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Abstract

This invention is that a kind of complex type vapor chamber is constructed, mainly include the empty board body in one, locate independent wick in the body of board and managing with the envelope linking to each other within the body of board, board body outer edge office have copy shut make wick inlay empty board in entering in the body by the side among them, this wick is sintering powder taking shape independently, utilize joint technology to form vapor chamber in the body joint of empty board. Among them, independent maos of detailed organization flow and make his mobility not to have single directionality separately liquid - vapor two job fluid, is it have high efficiency transmit performance of heat systematically to make.

Description

200946854 九、發明說明: 【發明所屬之技術領域】 本發明係與一種熱交換器有關,尤指一種内具有獨立毛細 組織及工作流體之均溫板。 【先前技術】 按,如第一圖所示,係為一種習知的均溫板la;該均溫 板la具有一中空板體1〇a,該板體1〇a係由一下蓋與— 上蓋101a相互蓋合所構成,於該板體1〇a内部壁面上貼附有 毛細組織(wickstructure) 11a、lib,且於該板體10内部填充 有適量的工作流體(workingfluid,圖略);俾於灌入工作流體 後’再對板體10a内部進行抽真空(或稱除氣)作業。 惟,習知均溫板la内的雙相流作動,氣態工值與液態工 質流動方向相反,會在液氣介面上產生飛散現象,使得氣態工 質的流動速度減低,降低其效能。此外,其傳熱過程需先穿透 壁面將熱量傳至毛細結構後,再傳至液態工質,因此熱阻較大。 有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛 心研究並配合學理之運用,終於提出一種設計合理且有效改善 上述缺失之本發明。 【發明内容】 本發明主要係在提供一種複合式獨立毛細組織之均溫板 200946854 魏,善用毛細_生狀_設計,藉崎工f與液態 工質的流動路徑分離,使其能突破飛散界限,增加其最大熱傳 量,且改變其傳熱途徑,降低其熱阻值。 為了達成上述之目的,本發明係提供一種複合式毛細組織 之均溫板構,獨立毛細組織上分驗㈣㈣生絲寬比不同 之凹槽,並鑲人板體⑽,進而與上蓋板及底板分卿成液態 _ 通道及氣態通道,藉此’將氣態工質與液態工質的流動路徑分 _,且蒸汽由毛細组織表面產生,經由航通道,流經冷凝端 私卩,再纽附人杨_ ’錢熱產生航,進賴雙相流 循環,達到上述提升效能之目的。 【實施方式】 為了使貝審查委員能更進一步瞭解本發明之特徵及技 % _容’請參閱以下有關本創作之詳細說明與附圖,然而所附 圖式僅提供參考與說明用,並非用來對本發明加以限制者。 本發明係提供多種複合式毛細域之均溫板結構,其一之 樣態如第一圖所不,係為本創作之立體分解示 i包括-板體H)、獨立之毛細組_,其中:A皿板 該板體10係由散熱材質所製成,如銅、紹等,其包含一 底座100、與-封I於該底座上方之蓋板⑼所組成以 令該板體10内呈中空狀,並可供工作流體(圖略)注入其内 200946854 部而進行抽真空(除氣)作業。 獨立毛細組織11係為金屬粉末燒結而成,如第三圖所 示,利用粉末燒結填粉燒結形成溝槽112之獨立毛細組織u , 令置於板體10内’分別與底作1〇〇及蓋板101形成溝槽通道; 本創作主要在於:該獨立毛細組織11分別於上下兩面形 成液體通道1120及蒸汽通道1121,將液-汽兩相工作流體分開 流動且使其流動具有單一方向性以避免因攜帶限而產生的影 響。再者,如第四圖所示,習知均溫板,其傳熱過程係發熱源 14a發熱需先穿透底板i〇〇a將熱量傳至毛細組織1 後,再傳 至液態工質12a,因此熱阻較大。透過複合式均溫板(如第五圖 所示)’該蒸A通道1121產生於底板1〇〇及毛細組織11之間, 適使其發熱源14熱量透過底板1〇〇直接傳至毛細組織u内液 態工質12蒸發液面13,液態工作流體流動阻力小使得系統具 有尚效率傳輸熱量的性能。 综上所述,本創作實為不可多得之發明創作產品,其確可 達到預期之使用目的,而解決習知之缺失,又因極具新穎性及 進步性,完全符合發明專利申請要件,爰依專利法提出申請, 敬請詳查並賜准本案專利,以保障創作人之權利。 惟以上所述僅為本發明之較佳可行實施例,非因此即拘限 本發明之專利細’故舉凡運財發概明書及圖式内容所為 之等效結構變化,均同理皆包含於本創作之範圍内,合予陳明。 200946854 【圖式簡單說明】 第圖係習知均溫板剖面示意圖。 第二圖係本發明之立體分解示意圖。 第三圖係本發明之複合式均溫板剖面示意圖。 第四圖係習知均溫板熱傳遞過程示意圖。 第五圖係本發明之複合式均溫板熱傳遞過程示意 圖。 * 第六圖係本發明另一實施例之分解示意圖。 【主要元件符號說明】 〈習知〉 上蓋101a 下部毛細組織11 b 蒸汽13a 上蓋101 溝槽通道112 均溫板1 a 板體10a 底板100a ❹ 上部毛細組織11 a 液態工質12a 發熱源受熱方向14a 〈本創作〉 均溫板1 板體10 底板100 毛細組織11 200946854 液態工質溝槽1120 蒸汽溝槽1121 液態工質12 蒸汽13 發熱源受熱方向14200946854 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat exchanger, and more particularly to a temperature equalizing plate having an independent capillary structure and a working fluid therein. [Prior Art] According to the first figure, it is a conventional temperature equalizing plate la; the temperature equalizing plate la has a hollow plate body 1〇a, and the plate body 1〇a is covered by a cover and — The upper cover 101a is configured to be covered with each other, and wick structures 11a and lib are attached to the inner wall surface of the plate body 1a, and an appropriate amount of working fluid (not shown) is filled in the plate body 10; After the working fluid is poured, the inside of the plate body 10a is evacuated (or degassed). However, the two-phase flow in the uniform temperature plate la is active, and the gas value is opposite to the flow direction of the liquid working fluid, which causes a scattering phenomenon on the liquid gas interface, which reduces the flow velocity of the gaseous working medium and reduces its efficiency. In addition, the heat transfer process needs to penetrate the wall surface to transfer heat to the capillary structure and then to the liquid working medium, so the thermal resistance is large. In view of the above, the present inventors have made great efforts to improve and solve the above-mentioned deficiencies, and have finally made a research and rational application to improve the above-mentioned defects. SUMMARY OF THE INVENTION The present invention is mainly to provide a composite independent capillary structure of the mean temperature plate 200946854 Wei, the use of capillary _ _ _ design, the separation of the flow path of the liquid and the liquid working fluid, so that it can break through the scattering Limit, increase its maximum heat transfer, and change its heat transfer path to reduce its thermal resistance. In order to achieve the above object, the present invention provides a uniform temperature structure of a composite capillary structure, which is characterized by independent (4) (4) different width ratios of the raw silk, and is embedded with the plate body (10), and further with the upper cover plate and the bottom plate. Divided into a liquid _ channel and a gaseous channel, by which 'the flow path of the gaseous working fluid and the liquid working fluid is divided _, and the steam is generated from the surface of the capillary structure, through the voyage channel, flows through the condensing end privately, and then attached People Yang _ 'The heat of money generates a flight, and it depends on the two-phase flow cycle to achieve the above-mentioned purpose of improving efficiency. [Embodiment] In order to enable the Beck Review Committee to further understand the features and techniques of the present invention, please refer to the following detailed description and drawings regarding the present invention. However, the drawings are provided for reference and explanation only, and are not used. The invention is limited. The present invention provides a plurality of composite capillary domain uniform temperature plate structures, one of which is as shown in the first figure, which is a three-dimensional decomposition of the creation i includes a plate body H), an independent capillary group _, wherein The plate body 10 is made of a heat dissipating material, such as copper, shovel, etc., and comprises a base 100 and a cover plate (9) above the base to make the plate body 10 It is hollow and can be used for vacuuming (degassing) work by injecting the working fluid (not shown) into the 200946854 part. The independent capillary structure 11 is made by sintering a metal powder. As shown in the third figure, the individual capillary structure u of the groove 112 is formed by powder sintering and sintering, and is placed in the plate body 10 respectively. And the cover plate 101 forms a groove channel; the main purpose of the invention is that the independent capillary structure 11 forms a liquid channel 1120 and a steam channel 1121 on the upper and lower sides respectively, respectively, and the liquid-vapor two-phase working fluid flows separately and the flow has a single directivity. To avoid the effects of carrying restrictions. Furthermore, as shown in the fourth figure, the conventional uniform temperature plate has a heat transfer process in which the heat source 14a generates heat before it penetrates the bottom plate i〇〇a to transfer heat to the capillary structure 1 and then to the liquid working medium 12a. Therefore, the thermal resistance is large. Through the composite temperature equalizing plate (as shown in the fifth figure), the steaming A channel 1121 is generated between the bottom plate 1 and the capillary structure 11, so that the heat source 14 heat is transmitted directly to the capillary structure through the bottom plate 1 u The liquid working fluid 12 evaporates the liquid surface 13, and the liquid working fluid has a small flow resistance, so that the system has the performance of transferring heat efficiently. In summary, this creation is a rare invention and creation product, which can achieve the intended purpose of use, and solve the lack of knowledge, and because of its novelty and progress, fully meet the requirements of the invention patent application, To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator. However, the above description is only a preferred embodiment of the present invention, and the equivalent structural changes of the patents and the contents of the drawings are not limited thereto. Within the scope of this creation, it is given to Chen Ming. 200946854 [Simple description of the diagram] The figure is a schematic diagram of the conventional uniform temperature plate. The second drawing is a perspective exploded view of the present invention. The third figure is a schematic cross-sectional view of the composite isothermal plate of the present invention. The fourth figure is a schematic diagram of the conventional heat transfer process of the uniform temperature plate. The fifth figure is a schematic diagram of the heat transfer process of the composite isothermal plate of the present invention. * Figure 6 is an exploded perspective view of another embodiment of the present invention. [Main component symbol description] <General knowledge> Upper cover 101a Lower capillary structure 11 b Steam 13a Upper cover 101 Groove channel 112 Temperature equalization plate 1 a Plate 10a Base plate 100a 上部 Upper capillary structure 11 a Liquid working medium 12a Heat source heat direction 14a <Creation> Mean temperature plate 1 Plate body 10 Base plate 100 Capillary structure 11 200946854 Liquid working medium groove 1120 Steam groove 1121 Liquid working medium 12 Steam 13 Heat source heating direction 14

Claims (1)

200946854 十、申請專利範園: K置St:岣溫板結構’包含有:-板體;以及-毛細組織, 2.如請體内,且該毛細組織上具有燒結粉末。 工作流體,述之均溫板,其中該金屬板體為内呈中空而具有 蓋板:,且該板體包括含-底座、與封裝於該底座上方之 均溫板’其中該金屬板體為内壁燒結過之 末請求項1所迷之均溫板,其中該毛細組織為一獨立燒結粉 之所34之均溫板’其中該毛細組織為兩面形成複數條 鲁 6 =3==^愤物娜現直條狀亦 板L ’。、所述之均溫板,其中該金屬板體為四週密閉之中空 8.=清求項4所述之毛細組織,其中該燒結粉末係銅粉燒結而200946854 X. Patent application garden: K: St: 岣 warm plate structure 'contains: - plate body; and - capillary structure, 2. If in the body, and the capillary structure has sintered powder. The working fluid, the temperature equalizing plate, wherein the metal plate body is hollow inside and has a cover plate: and the plate body comprises a base plate and a temperature equalizing plate encapsulated above the base, wherein the metal plate body is The inner wall is sintered to the temperature equalizing plate of claim 1, wherein the capillary structure is a uniform temperature plate of 34 independent sintering powders, wherein the capillary structure is formed on both sides to form a plurality of strips 6 = 3 == ^ angrily Na is now straight and is also L'. The above-mentioned uniform temperature plate, wherein the metal plate body is surrounded by a closed hollow. 8. The capillary structure described in claim 4, wherein the sintered powder is sintered by copper powder.
TW97117932A 2008-05-15 2008-05-15 Structure of compounding type vapor chamber TW200946854A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398616B (en) * 2011-01-26 2013-06-11 Asia Vital Components Co Ltd Micro - temperature plate structure improvement
TWI639806B (en) * 2016-02-05 2018-11-01 業強科技股份有限公司 Heat conduction device and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398616B (en) * 2011-01-26 2013-06-11 Asia Vital Components Co Ltd Micro - temperature plate structure improvement
TWI639806B (en) * 2016-02-05 2018-11-01 業強科技股份有限公司 Heat conduction device and manufacturing method thereof

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