TW200907110A - Etching solution and plastic surface metalizing method - Google Patents

Etching solution and plastic surface metalizing method Download PDF

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Publication number
TW200907110A
TW200907110A TW097113670A TW97113670A TW200907110A TW 200907110 A TW200907110 A TW 200907110A TW 097113670 A TW097113670 A TW 097113670A TW 97113670 A TW97113670 A TW 97113670A TW 200907110 A TW200907110 A TW 200907110A
Authority
TW
Taiwan
Prior art keywords
mol
plastic
catalyst
minutes
immersed
Prior art date
Application number
TW097113670A
Other languages
English (en)
Chinese (zh)
Inventor
Yasuyuki Kuramochi
Kaori Nakayama
Original Assignee
Ebara Udylite Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Kk filed Critical Ebara Udylite Kk
Publication of TW200907110A publication Critical patent/TW200907110A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW097113670A 2007-04-18 2008-04-15 Etching solution and plastic surface metalizing method TW200907110A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007108853 2007-04-18

Publications (1)

Publication Number Publication Date
TW200907110A true TW200907110A (en) 2009-02-16

Family

ID=39925386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113670A TW200907110A (en) 2007-04-18 2008-04-15 Etching solution and plastic surface metalizing method

Country Status (5)

Country Link
JP (1) JPWO2008132926A1 (ja)
KR (1) KR20100014699A (ja)
CN (1) CN101680093A (ja)
TW (1) TW200907110A (ja)
WO (1) WO2008132926A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5339023B2 (ja) * 2007-10-09 2013-11-13 奥野製薬工業株式会社 スミア除去用組成物
US8026200B2 (en) * 2008-05-01 2011-09-27 Advanced Technology Materials, Inc. Low pH mixtures for the removal of high density implanted resist
JP5742701B2 (ja) * 2011-12-14 2015-07-01 トヨタ自動車株式会社 無電解めっき処理方法
EP2767614A1 (en) * 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Method for depositing a first metallic layer onto non-conductive polymers
ES2744077T3 (es) 2013-10-22 2020-02-21 Okuno Chem Ind Co Composición para el tratamiento por grabado químico de un material de resina
US10920321B2 (en) 2014-05-30 2021-02-16 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
JPWO2017056285A1 (ja) * 2015-10-01 2018-10-04 株式会社Ｊｃｕ 樹脂成形体用エッチング液およびその用途
US20200087791A1 (en) * 2017-06-01 2020-03-19 Jcu Corporation Multi-stage resin surface etching method, and plating method on resin using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124434A (en) * 1976-04-14 1977-10-19 Matsushita Electric Ind Co Ltd Resin plating method and surface treating agent therefor
US4592852A (en) * 1984-06-07 1986-06-03 Enthone, Incorporated Composition and process for treating plastics with alkaline permanganate solutions
DE3740369A1 (de) * 1987-11-25 1989-06-08 Schering Ag Verfahren zur vorbehandlung von kunststoffen
BR9915280A (pt) * 1998-11-13 2001-08-07 Enthone Omi Inc Processo para metalizar uma superfìcie plástica
JP5177426B2 (ja) * 2006-04-18 2013-04-03 奥野製薬工業株式会社 樹脂成形体に対するエッチング処理用組成物

Also Published As

Publication number Publication date
JPWO2008132926A1 (ja) 2010-07-22
KR20100014699A (ko) 2010-02-10
CN101680093A (zh) 2010-03-24
WO2008132926A1 (ja) 2008-11-06

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