200902208 九、發明說明： 【發明所屬之技術領域】 本發明關於一種利用雷射光束將工作物加工的裝置， 具有一個吸離頭，它可相對於該工作物定位且夾成一加工 區域’該吸離頭有一吸離件將釋放的排放物吸離，該吸離 頭與-加工光學裝置連接’ &外，本發明關於一種用於保 護雷射加工用的加工光學裝置以防加工程序排纟物污物的 方法，其中在一加工區域將氣體由側邊吸離。 【先前技術】 工作物的加工（例如利用⑶2雷射切割）基於工作物 材料吸收聚焦的雷射光束（例如在遠紅外線的波長，它具 有極高熱能）而在& c〇2雷射當作雷射源比其他雷射源更 佳，因為其他雷射光束源的脈波能量（例如一種頻率加三 倍的N d · Y A G雷射，冰q <太、 田町疫長355奈未）。足夠工作物之較 大材料厚度切斷。 由於能量耗入（主要是熱能）的方式，工作物材料變 熱得很厲可到達可見之燃燒現象或產生火焰。此外在 一定的材料/雷射組合的場合可產生電漿。 由於燃燒現象，對應於材料組成產生蒸氣及碳黑，它 們沈積在加工過的工作物上，此外可發現較大的粒子沈 積’它們部分地集結且同樣地在加工區域的環境申及加工 光學裝置上沈積，這些粒子以很高速度部分地離開加工區 域。由於被帶走的材料體積大，故在加工區域附 中可發現嚴重污染程度。 ° 200902208 這些被帶走的材料產物可在加工過的工作物上造成電 電子電路之不想要的功能損害，—方面，因為這些被 的材料產物係部分地導電且可造成短路，另方面，鮮 (鲜錫接點）（L0tpad )的以後的可潤濕性受到影響， 口此不再能確保良好的軟銲。 在先前技術已有利用吸離將烟氣及粒子吸掉 後處理。 〜1 f 6“但此處有—問題，即：在-個位於「吸離開口」之間 /央區域中側向吸離，只能達成报小的作用。特別是在 吸離頭内」’由側別將空氣吸離係沿相反流向者，= :吸離㈣山的吸離開口之間的“區域更是沒效率。因 達’“、石反黑’特別是粒子可在此區域中毫無阻礙地到 達加工光學裝置。 料，在雷射炫接技術的領域，人們還知冑，可藉著 八—股呈橫向流的方式的 污染。為了可土 L 门二轧桃防止加工光學裝置 造成損壞故保護光學裝置以防熔接煙氣及熔接喷頭 C一種高壓空氣簾幕〔所謂的橫越喷流 +匕重直於縱者設在光學裝置與工作物之間。 作中又也=噴流保護’即使該聚焦光學裝置在高功率操 作中，也能㈣-超音心氣流作最佳保護。 【發明内容】 本發明的目的在提供一種 是電路板材料）切割時發生的煙其中在（特別 免聚焦及加工用的光學裝置受^和粒子可吸離，且可避 200902208 項範二 1 發明係利用一種具有申請專利範圍第1 的其他特點見=置（―種吸離頭）㈣。該吸離頭 占見於申請專利範圍附屬項。 本毛明關於—種利用雷射光束將工作物加工的襄置， 具有-個吸離頭，它可相對於該工作物定位且失成—加工 區域^離頭有_吸離件將釋放的排放物吸離，該 頭與一加工來昼驻里、± ^ 予i置連接，其特徵在於該吸離頭另 一側向空氣供A^ -仏應用奴以在吸離件和加工光學裝置的區 供應-股高流速之大致水平的氣流。 …如此’由於以高流速供應空氣，不但使不想要的粒子 或乱體保持退離加工光學裳置，而且可造成氣流轉向，這 種轉向作用和粒子或氣體沿著向加工光學裝置方向的運動 /粒子與氣體可利用另一道側向吸離作用可靠地除 去，在加工過的材料上沈積的情事可避免。 本發明的裝置-種有利的設計，係將一個分別的吸離 装置（特別疋和側向空氣供應作用對立反向者）與空氣供 應裝置配合。如此’跟循該供應空氣的氣流的粒子或氣體 依標的捕集’並由其朝向加工光學裝置的方向偏轉。 有利的作法，係將「吸離開口」A「空氣供應開口」 設計成喷嘴形，如此可確保整股空氣流被捕集，並將旋满 減到最少。 -特點為：吸離開口與空氣供應開口可調整。如此， 所供應的空氣的體積流可調整及調節。 特別有利的做法，係利用吸離作用將該藉供應空氣所 200902208 供應的空氣體積至少一部分可偏轉，使空氣流---—股 朝向工作物的向量流的分量。如此，粒子和氣體的速度減 少且被偏轉，使它們被吸離裝置捕集。 特別有利的做法，係可將該藉空氣供應裝置送入吸離 頭中的空氣的流速調整成遠比利用吸離裝置吸離的空氣的 流迷大得多，如此對於防止加工光學裝置受到污染物（特 別是不能被吸離裝置捕集的粒子）的污染的防護更佳’如 此快速流動的空氣層形成一所謂的風幕，它由於流速高， 可將侵入的粒子由其飛行路徑偏轉，並將空氣流運動方向 加到其上。 吸離裝置和所供應的空氣流都設在加工光學裝置與工 作物之間。事貫顯示，將吸離裝置設在工作物附近，並將 空氣供應裝置設在吸離裝置與加工光學裝置之間，則甚有 利。如此，不能被吸離裝置捕集的粒子與氣體的運動被偏 轉成和工作物方向垂直.空氣供應裝置設成一種接在吸離 裝置下游的裝置形式，其功能性和一空氣簾幕相當。 也有一些習知雷射係呈點狀工作，且其中可簡單地防 4加工光學裝置以免受污染，本發明的吸離頭做成使得可 在一面上均勻地將氣體與粒子導離。如此，可使用一種加 工光學裝置，它大致設計成一種具有一平面場光學裝置的 掃瞄頭的形式。 將氣體吸離，在吸離頭中造成真空。為了將真空作補 償，宜在吸離頭和工作物之間以及在吸離頭和加工光學之 間設開口’以供自由後流的空氣流入吸離頭中。 200902208 一種有利的做法，係使該吸離頭與加工光學裝置之間 的自由後流空氣用的開口可封閉。如此，在吸離頭中的真 空和該自由後流的空氣的體積可調節。 本發明另一標的係關於一種用於保護雷射加工用的加 工光學裝置的方法，其特徵在：在一工作物與加工光學裝 置之間，粒子與氣體首先被一吸離件導離，其中未被吸離 件捕集到的粒子與氣體利用一高流速的空氣供應手段平行 於工作物沿其運動方向導離。如此’可防止氣體和粒子以 南之特殊脈波污染加工光學裝置。 知'別有利的做法，係由侧面將排放物從吸離裝置和空 氣供應裝置的空氣流導離，其中該二空氣流的流向背向加 充光子扁置，特別是垂直該光軸。如此將偏轉的粒子與氣 體從吸離頭導出，因此防止吸離頭受污染。 圖式中顯示本發明一實施例並在以下詳細說明。 【貫施方式】 圖1顯不吸離頭（1)的一示意剖面圖，它被引導在一工 作物上。 該工作物（3)被一加工光學裝置（2)的一道雷射加200902208 IX. Description of the Invention: [Technical Field] The present invention relates to a device for processing a workpiece using a laser beam, having a suction head that can be positioned relative to the workpiece and clamped into a processing area The present invention relates to a processing optical device for protecting laser processing to prevent the processing program from being discharged by a suction member that sucks the released discharge, which is connected to the processing optical device. A method of soiling in which a gas is aspirated from a side in a processing zone. [Prior Art] The processing of the workpiece (for example, using (3) 2 laser cutting) absorbs the focused laser beam based on the material of the workpiece (for example, at the wavelength of far infrared rays, it has extremely high thermal energy) while in the & c〇2 laser The laser source is better than other laser sources because of the pulse energy of other laser beam sources (for example, a frequency plus three times the N d · YAG laser, ice q < Tai, Tamachi epidemic 355 Nai). Sufficient material thickness for sufficient work. Due to the way energy is consumed (mainly heat), the material of the work heats up to a visible burning phenomenon or a flame. In addition, plasma can be produced in certain material/laser combinations. Due to the combustion phenomenon, vapors and carbon black are generated corresponding to the material composition, they are deposited on the processed work, and in addition, larger particle deposits can be found, 'they partially aggregate and likewise apply to the processing optics in the environment of the processing area. Deposited on top, these particles partially leave the processing area at very high speeds. Due to the large volume of material being carried away, a serious degree of contamination can be found in the processing area. ° 200902208 These removed material products can cause unwanted functional damage to the electrical and electronic circuits on the processed work, in part, because these materials are partially conductive and can cause short circuits, on the other hand, fresh The subsequent wettability of the (fresh tin contact) (L0tpad) is affected, and the mouth can no longer ensure good soldering. In the prior art, the flue gas and the particles have been sucked off by suction to be treated. ~1 f 6 "But here - there is a problem, that is: in the side of the "suction exit" / side suction in the central area, can only achieve a small effect. Especially in the suction head "" by the side of the air suction system along the opposite direction, =: suction (four) mountain between the suction port between the "area is more inefficient. Inda'", stone anti-black In particular, the particles can reach the processing optics in this area without any hindrance. It is expected that in the field of laser splicing technology, people also know that it can be polluted by means of a horizontal flow. In order to prevent damage caused by the processing of the optics, the optical device is protected against welding fumes and welding nozzles C. A high-pressure air curtain (so-called traverse jet + 匕 weight is set directly in the optical Between the device and the work. In the meantime, it also means jet protection. Even if the focusing optics are operated in high power, the (four)-supersonic airflow can be optimally protected. SUMMARY OF THE INVENTION The object of the present invention is to provide a kind of smoke which occurs when a circuit board material is cut. (In particular, the optical device for focusing and processing is subject to absorption and the particles can be sucked away, and the invention can be avoided. The system utilizes a special feature of the first application scope of the patent. The other features are as follows: (the type of suction head) (4). The suction head is found in the scope of the patent application. This is related to the use of laser beam to process the workpiece. The device has a suction head which can be positioned and lost with respect to the work object - the processing area ^ is separated from the head _ the wicking member absorbs the released effluent, the head and a processing 昼 昼, ^ ^ is connected to the i, characterized in that the other side of the suction head is supplied with air to the air to supply a substantially horizontal flow of the high flow rate in the area of the aspirating member and the processing optical device. By 'supplying air at a high flow rate, not only keeps unwanted particles or chaos away from the processing optics, but also causes the airflow to steer, this steering action and the movement of particles or gases in the direction of the processing optics/ grain The gas can be reliably removed by another lateral aspiration, and the deposition on the processed material can be avoided. The device of the invention is advantageously designed with a separate suction device (particularly 疋 and side) The air supply is opposite to the air supply device. Thus, the particles or gas following the air supply flow are deflected by the target and deflected in the direction of the processing optical device. The "suction outlet" A "air supply opening" is designed in the shape of a nozzle to ensure that the entire air flow is trapped and minimizes the spin-up. - Features: the suction outlet and the air supply opening can be adjusted. The volume flow of the supplied air can be adjusted and adjusted. It is particularly advantageous to use at least a portion of the volume of air supplied by the supply air 200902208 to be deflected by suction to make the air flow--- The component of the vector stream. Thus, the velocity of the particles and gas is reduced and deflected, allowing them to be trapped by the aspirating device. It is particularly advantageous to The flow rate of the air fed into the suction head by the air supply device is adjusted to be much larger than that of the air sucked away by the suction device, thus preventing the processing optical device from being contaminated (especially not being able to be sucked away) Contaminated particles) better protection against contamination's so fast flowing air layer forms a so-called air curtain, which, due to the high flow rate, deflects invading particles from their flight path and applies the direction of air flow to them The suction device and the supplied air flow are disposed between the processing optical device and the workpiece. The display shows that the suction device is disposed near the work object, and the air supply device is disposed on the suction device and the processing optics. Between the devices, it is advantageous. Thus, the movement of particles and gases that cannot be captured by the aspirating device is deflected perpendicular to the direction of the workpiece. The air supply device is in the form of a device that is connected downstream of the aspirating device. Functionality is comparable to an air curtain. There are also some conventional laser systems that work in a spot shape, and in which the optical device can be simply prevented from being contaminated, the suction head of the present invention is constructed such that the gas and particles can be uniformly guided away on one side. Thus, a processing optics can be used which is generally designed in the form of a scanning head having a planar field optics. The gas is aspirated and a vacuum is created in the suction head. In order to compensate for the vacuum, it is preferred to provide an opening between the suction head and the workpiece and between the suction head and the processing optics for free backflow of air into the suction head. An advantageous approach is to close the opening for free backflow air between the suction head and the processing optics. Thus, the volume of the vacuum in the suction head and the free back flow can be adjusted. Another subject of the invention relates to a method for protecting a processing optical device for laser processing, characterized in that between a workpiece and a processing optical device, particles and gas are first guided away by a sorbent member, wherein The particles and gas trapped by the absorbent member are guided away from the workpiece in the direction of movement thereof by a high flow rate air supply means. This prevents the gas and particles from contaminating the optical device with special pulse waves in the south. It is known that it is advantageous to conduct the effluent from the air flow of the suction device and the air supply device by the side, wherein the flow of the two air flow is flattened toward the back-charged photon, in particular perpendicular to the optical axis. The deflected particles and gas are thus withdrawn from the suction head, thus preventing the suction head from being contaminated. An embodiment of the invention is shown in the drawings and is described in detail below. [Complex mode] Fig. 1 shows a schematic sectional view of the suction head (1) which is guided on a crop. The work object (3) is added by a laser of a processing optical device (2)
的空氣作補償。在該以 丨從吸離頭（1)導出。在此，一股由吸離裝置 卜產生的真空把由側面經開口（7)自由後離 在5亥以咼流速供應空氣的空氣供應裝置（4) 200902208 的平面中，在一側有一入口開〇 (8) 供空氣流入，在對立 側有一出口開口（9)，該快速流動的Μ # w ^ ； 叼開軋從吸離頭（1)經出口 開口（9)自由流出或被吸離在工作物利用加工光學裝置雷射 加工時產生的排放物（特別是粒子和氣體）係被吸離裝置（5) 的空氣流捕集或被高流速的空氣供應裝置（句偏轉，並從吸 離頭（1)沿一運動路徑（10)運送。 【圖式簡單說明】 圖1顯示利用一雷射光束將一工作物加工的裝置的示 意剖視圖。 【主要 元件符號說明 (1) 吸離頭 (2) 加工光學裝置 (3) 工作物 (4) 空氣供應裝置 (5) 吸離裝置 (6) 開口 ⑺ 開口 (8) 入口開口 (9) 出口開口 (10) 運動路徑The air is used for compensation. It is derived from the suction head (1). Here, a vacuum generated by the suction device is placed in the plane of the air supply device (4) 200902208 which is free from the side through the opening (7) and is supplied with air at a flow rate of 5 Hz, and has an inlet on one side. 〇(8) for air inflow, with an outlet opening (9) on the opposite side, the fast-flowing Μ#w^; 叼opening is freely flowing from the suction head (1) through the outlet opening (9) or is sucked away Emissions (especially particles and gases) generated by laser processing using processing optics are captured by the airflow of the aspirating device (5) or by a high-flow air supply device (sentence deflection, and from the suction The head (1) is transported along a moving path (10). [Schematic Description] Fig. 1 shows a schematic cross-sectional view of a device for processing a workpiece using a laser beam. [Main component symbol description (1) Suction head ( 2) Processing optical device (3) Working object (4) Air supply device (5) Suction device (6) Opening (7) Opening (8) Opening opening (9) Opening opening (10) Moving path