200847319 九、發明說明 【發明所屬之技術領域】 本發明爲薄片張貼裝置及張貼方法，更詳細地說，是 將校準單元設置在具有板狀構件之載置面的薄片張貼用工 作台的薄片張貼裝置、及張貼方法。 【先前技術】 當半導體晶圓（以下，簡稱爲「晶圓」）執行背面硏 削、其他的各種處理時，爲了確保晶圓的操控性，通常是 藉由黏著性的薄片與連結框形成一體化後執行上述處理。 上述晶圓與連結框之間的一體化，是藉由將晶圓配置於薄 片張貼用工作台，並將連結框配置於該晶圓的外周側，再 將黏著性薄片供給至上述物品的上表面後加以張貼的方式 來執行。 前述晶圓，在移載至薄片張貼用工作台的前一個步驟 中，是由校準裝置所定位，並於該定位結束後，藉由具有 吸附保持功能的機器人移載至工作台，而這樣的構成已爲 大眾所熟知（譬如，請參考專利文獻1 )。 [專利文獻1 ]日本特開2 0 0 3 - 2 5 7 8 9 8號公報 【發明內容】 [發明主題] [發明欲解決之課題] 雖然前述晶圓是受到機器人的控制而能保持校準裝置 -4- 200847319 所定位的狀態，但實際上卻具有：當移載 產生位置偏移的問題。特別的是，在近來 面硏削成數十// m等級之極薄的晶圓的場 圓承載於工作台上表面的瞬間，也就是解 間’具有因存在於兩者間的空氣朝外側流 晶圓朝橫向形成位置偏移的傾向。因此， 用工作台上維持經執行晶圓定位後的效果 致後續的薄片張貼精度、甚至半導體裝置 問題。 [發明的目的] 本發明是著眼於上述的問題所提出的 提供一種薄片張貼裝置，該薄片張貼裝置 工作台作爲載置手段，並使該載置手段具 可執行板狀構件的定位。 此外，本發明的另一個目的是提供一 件移載至前述工作台的前一個步驟中，無需 件的定位並可提高處理効率的薄片張貼裝置 [解決問題之手段] 爲達成前述目的，本發明是具備以下構 裝置：載置手段，該載置手段是用來載置板 貼手段，該張貼手段是用來將薄片張貼於前 前述載置手段具備：校準單元，該校準 工作台時容易 圓的板厚被背 中，當將該晶 吸附保持的瞬 的氣流而導致 得在薄片張貼 得困難，而招 良率下降等的 明，其目的爲 將薄片張貼用 校準功能，而 :在將板狀構 執行該板狀構 件的薄片張貼 狀構件；及張 述板狀構件， 單元可與特定 -5- 200847319 的檢查手段配合來執行前述板狀構件的定位。 在本發明中，前述載置手段包含具有前述板狀構件之 載置面的工作台，該工作台是採用以下的構造：設成可移 動於平面内之特定的二軸方向，且設成可在前述平面内旋 轉。 此外，前述載置手段包含：工作台，該工作台具有前 述板狀構件的載置面；和外側工作台，該外側工作台具有 框載置面，該框載置面是隔著前述薄片而將板狀構件支承 成一體；及基座，該基座是用來支承該外側工作台， 本發明可採用：前述工作台與外側工作台之間是藉由 X軸驅動手段及γ軸驅動手段所連結，且前述外側工作台 與基座之間是藉由z軸驅動手段所連結的構造。 不僅如此，前述工作台是由上層工作台與下層工作台 所形成，上層工作台是面對下層工作台而支承成可在平面 内旋轉。 此外，本發明，是在將板狀構件載置於載置手段的狀 態下，藉由使該載置手段與薄片張貼手段相對移動，而將 薄片張貼於前述板狀構件的薄片張貼方法， 當將前述板狀構件載置於載置手段後，是採用藉由該 載置手段來執行前述板狀構件的定位並張貼前述薄片的方 法。 [發明的效果] 根據本發明，可藉由形成：具備用來將晶圓等板狀構 -6- 200847319 件定位於載置手段的校準單元的構造，無論板狀構件以任 何位置、方向移載至載置手段，也能將該板狀構件設定於 特定的位置。因此，不會因爲將板狀構件移載於載置手段 時之晶圓的位置偏移而產生問題。 此外，由於載置手段本身備有校準單元，而無需另外 配置用來在前一步驟中執行定位的校準裝置，故可提高裝 置配置的自由度。 【實施方式】 [實施形態] 以下，針對本發明的最佳實施形態參考圖面進行說 明。 在第1圖中，是顯示本實施形態之薄片張貼裝置的槪 略前視圖。在該圖中，薄片張貼裝置1〇是具備以下構件 所構成：載置手段1 1，該載置手段i i是用來載置作爲板 狀構件的晶圓W ;和導引手段1 2，該導引手段1 2是用來 導引該載置手段1 1使其可朝X軸方向移動；和張貼手段 1 3 ’該張貼手段1 3是用來將黏著性薄片s張貼於前述晶 圓w ;及檢查手段1 4，該檢查手段1 4是與後述的校準單 元配合。而本實施形態中的晶圓W，是以在迴路面側未圖 示之能量線硬化型保護薄片者作爲對象，該保護薄片是在 形成第1圖中下面側的狀態下，由載置手段1 1所。 如第2圖及第3圖所示，前述載置手段11是包含以 下構件所構成：工作台丨5，該工作台1 5於上表面形成有 200847319 晶圓W的載置面1 5 A ;和外側工作台1 6，該外側工 16具有連結框RF的載置面16A，而該連結框RF的 面16A可隔著前述薄片 S —體地支承晶圓 W;和 1 7，該基座1 7是用來支承該外側工作台1 6 ;和X軸 手段1 8、Y軸驅動手段19，該X軸驅動手段1 8、γ 動手段1 9可使工作台1 5相對於外側工作台1 6而移 X軸、Y軸的特定二軸方向；及z軸驅動手段20，該 驅動手段2 0可使外側工作台1 6相對於基座1 7而移 Z軸方向。 如第2圖及第3圖所示，前述工作台15包含： 工作台22與下層工作台23，該上層工作台22與下層 台23於俯視角度中略成圓形；及驅動裝置24，該驅 置24具有使上層工作台22相對於下層工作台23而 面内旋轉的功能、與使上層工作台2 2升降的功能（ 考第2圖）。在該例中，上層工作台2 2於内部設有 手段（圖示省略），且在其上表面，也就是前述載 1 5 A設有未圖示的吸附孔，而構成可吸附保持晶圓w 前述驅動裝置2 4，是與X軸、Y軸、各驅動手段1 8 一起構成校準單元21。 前述外側工作台1 6是形成具備：略圓形的底壁 及從該底壁25外周豎起之筒狀周壁26的上部開放型 周壁26上端面，也就是載置面16A形成有突部29， 部29是卡合在形成於連結框RF外周二處俯視視角略 字型的缺口 28，並用來執行連結框rf的定位。200847319 IX. OBJECT OF THE INVENTION [Technical Field] The present invention relates to a sheet affixing device and a affixing method, and more particularly to a sheet affixing in which a aligning unit is provided on a sheet affixing table having a mounting surface of a plate member. Device, and posting method. [Prior Art] When a semiconductor wafer (hereinafter, simply referred to as "wafer") performs back boring and other various processes, in order to ensure the handling of the wafer, it is usually formed by an adhesive sheet and a joint frame. After the above, the above processing is performed. The integration between the wafer and the connecting frame is performed by arranging the wafer on the sheet placing table, and arranging the connecting frame on the outer peripheral side of the wafer, and then supplying the adhesive sheet to the article. The surface is post-posted to perform. The wafer is positioned by the calibration device in a previous step of transferring to the sheet setting table, and after the positioning is completed, the robot having the adsorption holding function is transferred to the table. The composition is well known to the public (for example, please refer to Patent Document 1). [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-A No. 2 0 7 8 9 8 [Description of the Invention] [Problems to be Solved by the Invention] Although the wafer is controlled by a robot, the calibration device can be held. -4- 200847319 The state of the location, but actually has the problem of shifting the position when the transfer occurs. In particular, the field circle that has been slashed into a very thin wafer of several tens/m in the recent moment is carried on the upper surface of the table, that is, the solution has the air that exists between the two. The flow wafer tends to be displaced in the lateral direction. Therefore, the effect of the post-execution wafer positioning on the workbench is maintained, resulting in subsequent sheet sticking accuracy and even semiconductor device problems. [Object of the Invention] The present invention has been made in view of the above problems, and provides a sheet affixing apparatus which serves as a mounting means and which allows the mounting means to perform positioning of a plate-like member. Further, another object of the present invention is to provide a sheet affixing apparatus which is transferred to the previous step of the aforementioned stage, which does not require positioning of parts and can improve processing efficiency. [Means for Solving the Problems] To achieve the aforementioned object, the present invention The mounting means is a mounting means for placing a plate attaching means for attaching the sheet to the front mounting means, comprising: a calibration unit, which is easy to round when calibrating the table The thickness of the plate is backed up, and when the instantaneous airflow is maintained by the adsorption of the crystal, the sheet is difficult to be attached, and the yield is lowered. The purpose of the sheet is to align the sheet with a calibration function: The sheet-like member that performs the plate-like member is configured; and the plate-like member is described, and the unit can cooperate with the inspection means of the specific -5-200847319 to perform positioning of the aforementioned plate-like member. In the present invention, the mounting means includes a table having a mounting surface of the plate-shaped member, and the table is configured to be movable in a specific two-axis direction in a plane, and is configured to be Rotate in the aforementioned plane. Further, the mounting means includes a table having a mounting surface of the plate-shaped member, and an outer table having a frame mounting surface on which the sheet is placed Supporting the plate-like member as a unit; and a base for supporting the outer working table, the present invention can adopt: the X-axis driving means and the γ-axis driving means between the working table and the outer working table The structure is connected to the outer table and the base by a z-axis driving means. Moreover, the aforementioned workbench is formed by an upper workbench and a lower workbench, and the upper workbench is supported to be rotatable in a plane facing the lower workbench. Further, the present invention is a sheet sheeting method in which a sheet member is placed on a sheet placing member while the sheet member is placed on the placing means, and the sheet is attached to the sheet member by relatively moving the sheet placing means. After the plate-like member is placed on the mounting means, the positioning means is used to perform the positioning of the plate-shaped member and the sheet is attached. [Effects of the Invention] According to the present invention, it is possible to form a structure including a calibration unit for positioning a plate-like member such as a wafer in a mounting manner, such as a wafer, regardless of the position or orientation of the plate member. The plate-shaped member can also be set to a specific position by being carried on the mounting means. Therefore, there is no problem that the position of the wafer is shifted when the plate member is transferred to the mounting means. Further, since the mounting means itself is provided with the calibration unit without separately arranging a calibration device for performing positioning in the previous step, the degree of freedom in device configuration can be improved. [Embodiment] [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In the first drawing, a schematic front view of the sheet applying device of the embodiment is shown. In the figure, the sheet loading device 1A is configured by a mounting means 1 1 for mounting a wafer W as a plate-like member, and a guiding means 1 2 for mounting the device 1 1 . The guiding means 1 2 is for guiding the mounting means 1 1 to be movable in the X-axis direction; and the posting means 1 3 ' is for applying the adhesive sheet s to the wafer w And inspection means 14 which cooperate with a calibration unit to be described later. In the present embodiment, the wafer W is an energy ray-curable protective sheet (not shown) on the side of the circuit surface, and the protective sheet is placed on the lower surface side in the first drawing. 1 1 office. As shown in FIGS. 2 and 3, the mounting means 11 includes a table 5 having a mounting surface 15A of a 200847319 wafer W formed on the upper surface thereof; And the outer table 16 has a mounting surface 16A that connects the frame RF, and the surface 16A of the connecting frame RF can support the wafer W integrally via the sheet S; and the base 1 7 is for supporting the outer table 16; and the X-axis means 18, the Y-axis driving means 19, the X-axis driving means 18, the gamma means 1 9 can make the table 15 relative to the outer table The specific two-axis direction of the X-axis and the Y-axis is shifted by 16; and the z-axis driving means 20 allows the outer stage 16 to move in the Z-axis direction with respect to the susceptor 17. As shown in FIGS. 2 and 3, the table 15 includes: a table 22 and a lower stage 23, the upper stage 22 and the lower stage 23 are slightly rounded in a plan view angle; and the drive unit 24, the drive The arrangement 24 has a function of rotating the upper stage 22 in the plane with respect to the lower stage 23 and a function of raising and lowering the upper stage 2 2 (see Fig. 2). In this example, the upper stage 2 2 is internally provided with means (not shown), and the upper surface, that is, the above-mentioned carrier 15 5 is provided with an adsorption hole (not shown) to constitute an adsorbable holding wafer. w The aforementioned driving device 24 constitutes a calibration unit 21 together with the X-axis, the Y-axis, and the respective driving means 18. The outer table 16 is formed with an upper end surface of the upper open type peripheral wall 26 having a substantially circular bottom wall and a cylindrical peripheral wall 26 rising from the outer periphery of the bottom wall 25. That is, the mounting surface 16A is formed with a projection 29. The portion 29 is engaged with a notch 28 which is formed in a rectangular shape in a plan view from the outer periphery of the joint frame RF, and is used to perform positioning of the joint frame rf.
作台 載置 基座 驅動 軸驅 動於 Z軸 動於 上層 工作 動裝 在平 三主 S円爹 加熱 置面 〇而 、19 25 ； 。在 該突 成V -8 - 200847319 如第3圖及第4圖所示，前述基座17是設成俯視 角中略呈方形的板狀。該基座17是設成：可藉由前述 引手段12而移動於前述X軸方向。導引手段12是由以 構件所構成：螺栓構件3 3，該螺栓構件3 3是設在基座 的下面中央部；和進給螺桿軸3 4，該進給螺桿軸3 4是 伸於X軸方向而與螺旋卡合於該螺帽構件3 3 ;和馬 Μ1，該馬達Μ 1是連結於該進給螺桿軸3 4的其中一端 並驅動該進給螺桿軸3 4旋轉（請參考第1圖）：和軸 3 6，該軸承3 6是設於進給螺桿軸3 4的另一端；和滑 3 7，該滑塊3 7是設於前述基座1 7的下面側；及一對滑 4〇 ’該一對滑軌40可導引該滑塊37沿著X軸方向移動 前述X軸驅動手段1 8是由以下構件所構成：X軸 動馬達M2，該X軸移動馬達M2是設於前述外側工作 16的底壁25上表面；及X軸移動滑塊42，該X軸移 滑塊42是設成可藉由該X軸移動馬達M2而移動於X 方向，前述Υ軸驅動手段1 9是由以下構件所構成·· Υ 移動馬達Μ 3，該Υ軸移動馬達Μ 3是設於X軸移動滑 42的上表面；及γ軸移動滑塊43，該Υ軸移動滑塊 是設於前述下層工作台23的下面，並可藉由前述Υ軸 動馬達Μ 3而移動於γ軸方向。此外，前述Ζ軸驅動手 2〇是由上下移動馬達Μ4所構成，該上下移動馬達Μ4 設成可使外側工作台1 6移動於Ζ軸方向，並具備可於 面内旋轉的功能。 前述張貼手段1 3是由以下構件所構成：支承軸5 0 視 導 下 17 延 達 側 承 [rH 塊 軌 〇 移 台 動 軸 軸 塊 4 3 移 段 是 平 -9- 200847319 該支承軸5 0是使「前述黏著性薄片S暫時附著於剝離薄 片 RL」的母材 R形成滾筒狀並將其支承成可送出 (feed );和剝離板5 1，該剝離板5 1是用來從前述剝離 薄片RL將薄片S剝離；和按壓滾子52，該按壓滾子52 是用來將薄片S按壓於晶圓W的上表面；和驅動滾子5 3 與束緊滾子54，該驅動滾子53與束緊滾子54是用來對前 述母材R作用送出力；和捲取滾子5 6，該捲取滾子5 6是 用來捲取剝離薄片RL ;及導引滾子57，該導引滾子57是 配置於支承滾子50與按壓滾子54之間。上述的各構件均 被圖面中未顯示的框板所支承。 而本實施形態中的薄片S，是具備以下構造的積層 體：安裝用薄片，該安裝用薄片具有可張貼於連結框RF 與晶圓W的尺寸；及晶片接合用薄片，該晶片接合用薄 片的形狀略對應形成於其内側的晶圓W。該薄片S是在晶 片接合用薄片位於安裝用薄片下面側的狀態下，從剝離薄 片RL剝離。而薄片S，其外周側是利用安裝用薄片的黏 著力而黏著於連結框RF，内側的晶片接合用薄片則是受 到前述上層工作台22内之加熱手段的加熱，而黏著於晶 圓W的背面（第1圖中上表面）。 前述檢查手段14是由感應器58所構成，該感應器58 是在前述張貼手段1 3的下側，透過圖面中未顯示的框所 支承。如第4圖所示，該感應器5 8是形成：將形成於晶 圓W外周部分的缺口 5 9、及連接於此之外緣部分的位置 當成影像資料輸出至圖面中未顯示的控制器。 - 10- 200847319 接著，針對前述晶圓W的定位、薄片張貼動作進行 說明。而在本實施例中，張貼手段1 3是被當成：用來完 成當母材R的捲繞，整理黏著薄片S張貼於晶圓W之態 勢的裝置。 當晶圓W移載至載置手段11時，載置手段11是在 第1圖中二點虛線所示的位置待機。接著，藉由圖面中未 顯示的搬送臂等將晶圓W移載至工作台15的載置面 1 5 A，並將連結框rf移載至外側工作台1 6的載置面 16A。而連結框rf，突部29是移載於其缺口 28的角落 (底部）而形成卡合。 載置著晶圓W及連結框RF的載置手段Π，是藉由導 引手段1 2的驅動而移動至第1圖中的實線位置。接著， 藉由檢查手段1 4的感應器5 8，將晶圓W之缺口 5 9的位 置及外緣部分的位置當成攝影資料讀取，並輸出至圖面中 未顯示的控制器。 控制器，是以所輸入的攝影資料爲基準來計算晶圓W 對基準位置的偏移量，並指定缺口 5 9的位置。接下來， 對應於所計算出的修正量，將晶圓W定位（校準）在相 對於連結框RF的特定位置，藉由前述X軸、Y軸、各驅 動手段18、19及驅動裝置24來正確定位。此時藉由圖面 中未顯示的感應器來偵測晶圓W的高度及連結框RF的高 度’並由驅動裝置24驅動而使前述兩者的上表面形成特 疋的筒度。The stage is mounted on the pedestal. The drive shaft is driven by the Z-axis. The upper-layer work is moved in the flat main S円爹 heating surface, 19 25 ; In the projections V -8 - 200847319, as shown in Figs. 3 and 4, the susceptor 17 is formed in a substantially square shape in a plan view. The susceptor 17 is provided to be movable in the X-axis direction by the above-described means 12. The guiding means 12 is composed of a member: a bolt member 33 which is provided at a central portion of the lower surface of the base; and a feeding screw shaft 34 which extends from the X Engaged with the screw in the axial direction of the nut member 33; and the stirrup 1, the motor Μ 1 is coupled to one end of the feed screw shaft 34 and drives the feed screw shaft 34 to rotate (please refer to 1)): and the shaft 3 6, the bearing 36 is disposed at the other end of the feed screw shaft 34; and the slide 3 7 is disposed on the lower side of the base 17; The pair of slide rails 40 can guide the slider 37 to move along the X-axis direction. The X-axis driving means 18 is composed of the following components: an X-axis moving motor M2, and the X-axis moving motor M2 Is disposed on the upper surface of the bottom wall 25 of the outer working 16; and an X-axis moving slider 42 that is configured to be movable in the X direction by the X-axis moving motor M2, the aforementioned shaft The driving means 19 is composed of the following members: Υ moving motor Μ 3, the cymbal moving motor Μ 3 is provided on the upper surface of the X-axis moving slider 42; and the γ-axis moving slider 43, the y-axis The movable slider is disposed below the lower table 23, and the movable shaft by the motor Υ Μ 3 is moved to the γ-axis direction. Further, the above-described cymbal drive hand 2 is constituted by a vertical movement motor Μ4 which is provided to move the outer table 16 in the yaw axis direction and to have a function of being rotatable in the plane. The above-mentioned posting means 13 is composed of the following members: the support shaft 50 is viewed from the lower side 17 and extends to the side bearing [rH block rail shifting table moving shaft shaft block 4 3 shifting section is flat-9-200847319 the supporting shaft 5 0 The base material R in which the "adhesive sheet S temporarily adheres to the release sheet RL" is formed into a roll shape and supported to be fed; and the peeling plate 5 1 is used for peeling from the foregoing The sheet RL peels the sheet S; and presses a roller 52 for pressing the sheet S against the upper surface of the wafer W; and a driving roller 53 and a tightening roller 54, the driving roller 53 and the tightening roller 54 are for applying a force to the base material R; and the take-up roller 56 is for taking up the peeling sheet RL; and the guide roller 57, The guide roller 57 is disposed between the support roller 50 and the pressing roller 54. Each of the above members is supported by a frame plate not shown in the drawing. The sheet S in the present embodiment is a laminated body having a structure in which the mounting sheet has a size that can be attached to the connection frame RF and the wafer W, and a wafer bonding sheet, the wafer bonding sheet. The shape slightly corresponds to the wafer W formed on the inner side thereof. The sheet S is peeled off from the peeling sheet RL in a state where the wafer bonding sheet is positioned on the lower surface side of the mounting sheet. On the other hand, the outer peripheral side of the sheet S is adhered to the connecting frame RF by the adhesive force of the mounting sheet, and the inner wafer bonding sheet is heated by the heating means in the upper stage 22 and adhered to the wafer W. The back side (upper surface in Figure 1). The inspection means 14 is constituted by an inductor 58 which is supported by a frame which is not shown in the drawing on the lower side of the above-mentioned posting means 13. As shown in FIG. 4, the inductor 58 is formed such that a notch 59 formed on the outer peripheral portion of the wafer W and a position connected to the outer edge portion are output as image data to a control not shown in the drawing. Device. - 10-200847319 Next, the positioning of the wafer W and the sheet attaching operation will be described. In the present embodiment, the posting means 13 is used as a means for completing the winding of the base material R and arranging the state in which the adhesive sheet S is applied to the wafer W. When the wafer W is transferred to the placing means 11, the placing means 11 stands by at the position indicated by the two-dotted line in the first drawing. Then, the wafer W is transferred to the mounting surface 15A of the table 15 by a transfer arm or the like which is not shown in the drawing, and the connecting frame rf is transferred to the mounting surface 16A of the outer table 16. On the other hand, the joint frame rf, the projection 29 is transferred to the corner (bottom) of the notch 28 to form an engagement. The mounting means 载 on which the wafer W and the connection frame RF are placed is moved to the solid line position in Fig. 1 by the driving of the guiding means 12. Next, the position of the notch 5 9 of the wafer W and the position of the outer edge portion are read as photographic data by the sensor 5 8 of the inspection means 14 and output to the controller not shown in the drawing. The controller calculates the offset of the wafer W from the reference position based on the input photographic data, and specifies the position of the notch 5 9 . Next, corresponding to the calculated correction amount, the wafer W is positioned (calibrated) at a specific position relative to the connection frame RF by the X-axis, the Y-axis, the respective driving means 18, 19, and the driving device 24. Correct positioning. At this time, the height of the wafer W and the height of the joint frame RF are detected by an inductor not shown in the drawing and driven by the driving device 24 to form a characteristic degree of the upper surface of the both.
如此一來，在完成晶圓W定位的狀態下，驅動前述Z -11 - 200847319 軸驅動手段20促使外側工作台1 6上升，而設定成可 片S張貼於晶圓W上表面的高度。 接著，藉由導引手段12使載置手段1 1從第丨圖 線位置所示的位置移動至二點虛線所示的位置。接下 譬如當由圖面中未顯示的感應器偵處出載置手段11 動方向的前端側時，執行母材R的送出，並利用剝 5 1的前端位置將薄片S從剝離薄片RL剝離，同時利 壓滾子5 2將該薄片S張貼於連結框RF及晶圓W的 面。此時晶圓W，是受到上層工作台22内之加熱手 加熱而張貼於晶片接合用薄片。 如此一來，隔著薄片S與連結框RF形成一體化 圓W，是藉由圖面中未顯示之機械手臂等的搬送手段 容於晶圓儲藏庫，或者移載置下一個處理步驟。而與 框RF形成一體化的晶圓W是形成：根據収容方向或 個處理步驟，使Z軸驅動手段2 0旋轉後由圖面中未 之機械手臂等的搬送手段所受授。 因此，根據上述的實施形態，由於是構成將校準 2 1設置於載置手段1 1，並根據感應器5 8的攝影資料 晶圓W的定位，故可獲得以下的效果：無需在將晶丨 移載至工作台1 5的前一個步驟中執行定位，在保持 W之正確位置的狀態下與連結框RF形成一體化。 如以上所述，雖然在以上的說明中揭示用來實施 明的最佳構造、方法等，但本發明並不侷限於上述 明。 將薄 中實 來， 之移 離板 用按 上表 段的 的晶 而收 連結 下一 顯示 單元 執行 B w 晶圓 本發 的說 -12- 200847319 換言之，雖然本發明主要是針對特定的實施形態，特 別是圖示來進行說明，但是只要在不脫離本發明之技術性 思想及目的的範圍內，相關的業者可就上述的實施形態， 視需要而針對形狀、位置或者配置等增加各種的變更。 舉例來說，雖然在前述的實施形態中，是針對使晶圓 W與連結框RF形成一體化的場合來舉例說明，但本發明 並不受限於此。譬如，本發明亦可適用於張貼用來保護晶 圓W之迴路面的黏著薄片的場合等。 此外，構成校準單元2 1的各驅動手段1 8、1 9、也沒 有特殊的限制，只要是可執行各軸與在平面内實質上相同 之驅動的話，可採用各式各樣的驅動裝置。 不僅如此，本發明中的板狀構件也不限定爲半導體晶 圓W，也可以將玻璃、鋼板、或者樹脂板等的其他板狀構 件作爲對象’半導體晶圓也可以是矽晶圓或化合物晶圓。 此外，檢查手段的感應器5 8，只要是可指出板狀構件 位置者即可’並無任何的限制。 【圖式簡單說明】 第1圖：是顯示本實施形態之薄片張貼裝置的整體構 造的槪略前視圖。 第2圖：是顯示將薄片張貼於晶圓之動作的局部剖面 前視圖。 第3圖：爲局部地透視載置手段的槪略立體圖。 第4圖：爲載置手段的槪略立體圖。 -13- 200847319 【主要元件符號說明】 1 〇 :薄片張貼裝置 η :載置手段 1 3 :張貼手段 1 4 :檢查手段 1 5 :工作台 1 5 A :載置面 1 6 :外側工作台 1 7 :基座 2 1 :校準單元 RF :連結框 S :薄片 W :半導體晶圓（板狀構件） -14-In this manner, in the state where the wafer W is positioned, the Z -11 - 200847319 shaft driving means 20 is driven to cause the outer stage 16 to rise, and is set to the height at which the sheet S is attached to the upper surface of the wafer W. Next, the placing means 1 is moved by the guiding means 12 from the position indicated by the position of the second line to the position indicated by the two-dotted line. Next, when the front end side of the moving direction of the mounting means 11 is detected by the sensor not shown in the drawing, the feeding of the base material R is performed, and the sheet S is peeled off from the peeling sheet RL by the leading end position of the peeling 51 At the same time, the sheet S is applied to the surface of the connection frame RF and the wafer W by the pressure roller 52. At this time, the wafer W is heated by the heating hand in the upper stage 22 and is attached to the wafer bonding sheet. In this manner, the integrated circle W is formed between the sheet S and the connecting frame RF via the sheet S, and is transported to the wafer storage by means of a transport means such as a robot arm not shown in the drawing, or the processing step is carried out. Further, the wafer W integrated with the frame RF is formed by rotating the Z-axis driving means 20 according to the housing direction or the processing steps, and then transferring it by a transfer means such as a robot arm in the drawing. Therefore, according to the above-described embodiment, since the calibration 2 1 is provided on the mounting means 1 1 and the positioning of the wafer W based on the photographic data of the sensor 58 is obtained, the following effect can be obtained: Positioning is performed in the previous step of transfer to the table 15 and integrated with the joint frame RF while maintaining the correct position of W. As described above, although the best construction, method, and the like for carrying out the invention are disclosed in the above description, the present invention is not limited to the above. Move the thin plate, move it away from the plate, and connect the next display unit with the crystal according to the above table to execute the B w wafer. The present invention is -12-200847319. In other words, although the present invention is mainly directed to a specific embodiment. In particular, the present invention can be modified in various ways, such as shape, position, or arrangement, as needed, as long as the technical idea and object of the present invention are not deviated from the scope of the present invention. . For example, in the above-described embodiment, the case where the wafer W and the connection frame RF are integrated is exemplified, but the present invention is not limited thereto. For example, the present invention is also applicable to the case of attaching an adhesive sheet for protecting the circuit surface of the wafer W, and the like. Further, the respective driving means 18 and 19 constituting the aligning unit 21 are not particularly limited, and various driving means can be employed as long as the respective axes can be driven substantially the same as in the plane. In addition, the plate member in the present invention is not limited to the semiconductor wafer W, and other plate members such as glass, steel plate, or resin plate may be used as the object. The semiconductor wafer may be a germanium wafer or a compound crystal. circle. Further, the sensor 5 8 of the inspection means can be arbitrarily limited as long as it can indicate the position of the plate member. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic front elevational view showing the overall configuration of a sheet placing apparatus of the present embodiment. Fig. 2 is a partial cross-sectional front view showing the action of posting a sheet on a wafer. Fig. 3 is a schematic perspective view of a partial perspective mounting means. Fig. 4 is a schematic perspective view of the mounting means. -13- 200847319 [Description of main component symbols] 1 〇: sheet stacking device η: mounting means 1 3 : mounting means 1 4 : inspection means 1 5 : table 1 5 A : mounting surface 1 6 : outer table 1 7 : Base 2 1 : Calibration unit RF : Connection frame S : Sheet W : Semiconductor wafer (plate member) -14-