200841019 九、發明說明： 【發明所屬之技術領域】 上本發明係與探針卡有關，特別是指-種有效防止探針 卡漏電流問題之探針卡製作方法。 彳木針 5【先前技術】200841019 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a probe card, and more particularly to a probe card manufacturing method that effectively prevents leakage of a probe card. Elm needle 5 [prior art]
Ik者频電路高密度化及元件尺寸縮小化的演進，電 基更高級ΐ的要求’電測用探針卡則需於 六的：衣成上考量更多的因素’如基材絕緣性、 機械應力的承受度能力、線路圖案精確度、寄生電阻電容 。==間的漏電，，皆為電測探針卡供應‘； 成i方向’以弟八圖所示—般於探針卡9G表面上形 ^製程條件而言’需將整片的_金屬％背面 後貼附於電路板基材92上，再以化學姓刻方式 5去二二冬Γ圖案化成訊號傳輪導線 '然化學侧並無法 ί 屬/1背面之黏著膠，而使導線之間有背膠殘 『章ίΓ間漏電流的路徑’因而降低積體電路之電測 良率亚衫響積體電路晶圓製造的效率。 ”第九圖所示為台灣專利公告第52卿號所揭 0次其;針卡95 ’，·係提出以機械加工之方式雕刻研磨陶 :p土—,其上之導電金屬97而形成線路圖案’使線路 入基材96表面’同時免除了上述導線之間背 二心題’並利用空氣作為線路隔絕的介質 ，再配合 性盘二塞Γ易形隻且H缘性的材質’以增進探針卡的電 一構品質；然而以機械加卫方式對導電金屬97及陶变 4 200841019 基板96同時加卫亦®以不關製程條件分階段完成 階段完成，若欲The evolution of Ik frequency circuit and the reduction of component size, the requirements of the electric base are more advanced. 'Electrometer probe cards need to be considered in six factors: such as substrate insulation, Mechanical stress tolerance, line pattern accuracy, parasitic resistance and capacitance. The leakage between == is the supply of the electrical probe card'; the direction of the i-direction is shown in the figure of the eight--the surface of the probe card 9G. The back side is attached to the circuit board substrate 92, and then patterned into a signal transmission wire by the chemical surrogate method 5, and the chemical side is not able to adhere to the adhesive on the back side, and the wire is There is a back-filled “path to leakage current between the two”, thus reducing the electrical measurement yield of the integrated circuit. "The ninth picture shows the 0th issue of the Taiwan Patent Notice No. 52 Qing; the needle card 95', is proposed to engrave the polished pottery: p---the conductive metal 97 on it to form the line The pattern 'make the line into the surface of the substrate 96' while eliminating the back-and-heart problem between the above-mentioned wires and using air as the medium for the circuit isolation, and then the matching plate is easy to form and the material of the H-edge is improved. The electrical quality of the probe card; however, the conductive metal 97 and the ceramics 4 200841019 substrate 96 are simultaneously added in a mechanically-assisted manner, in a phased completion phase without a process condition, if desired
選擇性即非常有限， ’雖以陶甍材料為最佳的實用選擇 ’材料的 E擇，但 此製程複雜4的增加卿低了麟卡的製程效率； 了兼顧基材啊具有高絕緣性及低撓曲度的優點， 一 牲面臨材料成本支出昂貴的問題，因此如何以最佳的探 針卡、、。構兼顧探針卡材料選擇，以降低電測環境中不必 _ ^漏電^能’甚至能與製倾率及成本支出做到最佳 的匹配，實為齡高精密度制卫程的-大課題。 【發明内容】 因此’本發明之主要目的乃在於提供一種低漏電探針 卡之製作方法，以最節省的成本支出及簡易、高效率的製 程，有效防止訊號傳輸線路之間的漏電流問題。 15 為達成前揭目的，本發明所提供一種探針卡之製作方 法，係形成一電路板，再將該電路板與多數條訊號線及一 探針組模組製成；該電路板為由下而上疊置組合製成之一 支撐層、一絕緣層及一導電層，其中該支撐層為不易產生 形變之一高硬度材質以形成，該絕緣層為以與該支撐層大 2〇小形狀相當之絕緣材，於該絕緣材之表面向下凹設有特定 殊度及圖案之多數個溝槽所形成，該導電層為以多數個金 屬片貼附於該絕緣層之凸部所形成，因此相鄰各該金屬片 之間可藉由該溝槽達到電性絕緣的效果；將各該訊號線之 兩端分別電性連接該金屬片及該探針組之探針，則可形成 5 200841019 低成本且簡易製作之該探針卡，同時有效防止電測訊號傳 遞線路之間的漏電流問題。 【實施方式】 5 以下，茲配合圖示列舉若干較佳實施例，用以對本 — 發明之結構與功效作詳細說明，其中所用圖示之簡要說 明如下： ^ 第一圖係本發明所提供第一較佳實施例之電路板分解立 體圖； 10 第二圖係上述第一較佳實施例所提供探針卡之分解立體 圖， 第二圖係上述第一較佳實施例所提供探針卡之上視圖； 第四圖係上述第一較佳實施例所提供探針卡之結構示意 圖， 15 第五圖係上述第一較佳實施例所提供探針組之底視圖； I 第六圖係本發明所提供第二較佳實施例之結構示意圖； , 第七圖係上述第二較佳實施例之上視圖。 請參閱如第一圖所示為本發明第一較佳實施例所提供 2〇之一電路板1，為由下而上疊置組合製成之一支撐層1Q、 一絕緣層20及一導電層3〇，其製作方法為： a·備製一相當於晶圓尺寸大小之基材，於該基材中心 穿設有一測試孔11，因此形成該支撐層1〇,該基材係為不 易產生形變之高硬度材質，於美國材料與試驗學會 6 200841019 (American Society for Testing and Materials，ASTM )所定 義測試下具有每平方公分大於100公斤之彎曲強度 (flexural strength)規格，一般有相當厚度之金屬或陶瓷材 料大致即可符合此高硬度的需求，或亦可使用本實施例中 5所提供如耐燃性積層板材第四級(Flame Resistant laminates level-4，FR_4)或第五級（fr-5)等之玻璃纖維板（Glass Epoxy)； b·備製一與該支撐層i〇大小形狀相當之絕緣材，該絕 緣材於美國材料與試驗學會所定義測試下具有每平方公分 ⑺大於10的13次方歐姆之表面電阻（surface resistivity)規 格； C·對應於該支撐層10之測試孔u於該絕緣材中心穿 設大小相當之一測試孔21 ; 15 20 d·於該絕緣材周園之區域自表面向下凹設有特定深度 及圖案之錄瓣槽22，目此形絕緣層2〇，該些溝槽 22可對應形成錄個凸部23，且該些凸部23之表面近似 特定之電賴案⑽㈣魏於該麟_圍，因而可區 分多數個第-及第二貼附面23卜232 ;本實施例中所提供 ，絕緣材騎聚㈣（PE)、高分子聚M(upE)、聚丙 炸PP)、ABS树月曰、織氣龍（ρτΕΕ)、聚甲基丙埽酸甲醋 CPMMAh«氯w (pvc)等一般普通錢的工程塑 膠，因此可^般機—W侃該祕槽22，或者可 ，用先阻材料減影製程方式形成該祕槽22,皆可達成 本啦明所需形成該絕緣層扣之目的； 7 200841019 e·備製一導電銅箔將之圖案化形成多數個與該些凸部 23之表面开>狀相當之金屬片31，該些金屬片則依照對 應於不同之凸部23表面形狀而區分有第一、第二金屬片 311、312及一鎖固環32，該些第一及第二金屬片、312 5分別對應貼附於各該第一及第二貼附面231、232，該鎖固 環32為該電路板丨供螺絲鎖固之對應位置，因此形成該導 電層30。 4參閱如第二至第四圖所示為本實施例所提供該電路 板1與多數條訊號線40及一探針組5〇模組製成之一懸臂 ίο 式探針卡2，其中： “ 於該電路板1之支撐層1〇及絕緣層2〇上更同時穿設 多數個穿孔101、201，各該穿孔101、201之孔徑相當於各 該訊號線40之線徑，可供該些訊號線4〇穿過該電路板j， 各該訊號線40為同轴傳輸線之結構，具有一轴心金屬4〇1 I5及依序以同軸環繞之一絕緣材、一接地環4〇2及一保護層， 因此將各該訊號線之軸心金屬401及接地環402分別電性 連接該第一及第二金屬片311、312，使各該第一金屬片311 及與其電性連接之接地環402構成該電路板1之接地線路 41，各該苐二金屬片312及與其電性連接之轴心金屬4〇1 2〇構成該電路板1之訊號線路42。 請參閱如第四及第五圖所示，該探針組50為一般習用 之懸臂式探針結構，係具有一跳線座51、一固定座52及複 數個探針53，該跳線座51上設有多數個銲墊510，為對應 該些穿孔10卜201所設置，供各該訊號線4〇及探針53電 8 200841019 =所ΐ:定f弋為具有良好避震性及不具導電性的絕 皆為具導ΐ二定/該探針53，該些探針53 元件作電性接: 針尖部位與待測電子 5 15 各，=1測機台之測試頭點觸該電路板1之最外圍於 t二，二金屬片311、312上，該懸臂式探針卡2則 傳，線路42以及與其電性連接之該些探針53 接地線路1广至剌電子元件，並藉由相鄰所設置之該些 二41以達到電測訊號傳送的完整性；由於相鄰該第 成電屬片311、312之間由該絕緣層20之溝槽22達 汽++ 9巴之特性，因此能有效防止電測訊號於該懸臂式 ^ 上傳遞時的漏電流問題，使該懸臂式探針卡2不 2〇^mm± ^撐層10的強度特性同時取代習用之陶瓷材料，使成 本的支出相對減少且製作線路的工程相對簡化。 土本^參閱如第六及第七圖所示為本發明所提供第二較 ^貝=例之垂直式探針卡3’係以如同上述實施例所製成 %路板60與夕數條訊號線7〇及一探針組⑽模組製 成，其中： '' 、該電路板60與上述實施例之電路板丨有相同之製作方 法’可同樣形成有多數個第-、第二金屬片61、62、多數 個溝槽63以及電路板5〇中央之一測試孔64，該些訊號線 70則包性連接該些第一、第二金屬片61、Q，並延伸穿過 該測试孔64以接設至該探針組80。 9 20 200841019 路板為―般習用之垂直式探針結構，設於該電 二直二處’具有-固定座81及多 以碟i 牙 _卜朗定座81為具有 义之震性及不科雜的絕·# 5 接該訊號線-以其針尖部位與待測電子^電 因此本實施_樣可崎t路板6G上各該第一及第二 金屬片6卜62之最外圍與電測機台電性連接，使該： 探針卡3傳送t職駐制奸树 ^ 之探針卡魏板製射奸應餘大乡制探針^皆 此有效解決電測訊號傳遞線路之間的漏電流問題，僅需以 低成本支出及簡易的製作卫程即能提供高品質電測探針 卡。 唯’以上所述者，僅為本發明之較佳可行實施例而已， 故舉凡應用本發明說明書及申請專利範圍所為之等效結 變化，理應包含在本發明之專利範圍内。 15 200841019 【圖式簡單說明】 第一圖係本發明所提供第一較佳實施例之電路板分解立 體圖； 第二圖係上述第一較佳實施例所提供探針卡之分解立體 5 圖； ^三圖係上述第一較佳實施例所提供探針卡之上視圖； 第四圖係上述第一較佳實施例所提供探針卡之結構示意 圖， 第五圖係上述第-較佳實施例所提供探針组之底視圖； 0 第六®縣發明所提供第二祕實補之分解立體圖； 第七圖係上述第二較佳實_之; 第八圖係習用探針卡之局部立體示意圖； 第九圖係另-習用探針卡之局部立體示意圖。 200841019 【主要元件符號說明】 1、60電路板 3垂直式探針卡 2懸臂式探針卡 10支撐層 101、201 穿孔 5 11、21、64測試孔 20絕緣層 22、63溝槽 23凸部 231第一貼附面 232第二貼附面 30導電層 31金屬片 311、61第一金屬片 312、62第二金屬片 10 32鎖固環 40、70訊號線 401軸心金屬 402接地環 41接地線路 42訊號線路 60、80探針組 51跳線座 510銲墊 52、81固定座 15 53、82探針 12The selectivity is very limited. 'Although the pottery material is the best practical choice', the choice of the material is high, but the increase of the process 4 is lower than the processing efficiency of the Linka; the substrate is highly insulating and The advantage of low deflection is that the cost of material cost is high, so how to use the best probe card, . The configuration of the probe card material is combined to reduce the need for _ ^ leakage ^ energy in the electric measurement environment to achieve the best match with the tilt rate and cost, and it is a high-precision system . SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to provide a method for manufacturing a low leakage probe card, which can effectively prevent leakage current between signal transmission lines with the most cost-effective and simple and efficient process. In order to achieve the foregoing, the present invention provides a method for fabricating a probe card, which is formed by forming a circuit board, and then manufacturing the circuit board with a plurality of signal lines and a probe set module; The bottom layer is stacked to form a supporting layer, an insulating layer and a conductive layer, wherein the supporting layer is formed by a high hardness material which is not easy to deform, and the insulating layer is 2 inches smaller than the supporting layer. The insulating material of the same shape is formed by recessing a plurality of grooves of a specific degree and pattern on the surface of the insulating material, and the conductive layer is formed by attaching a plurality of metal pieces to the convex portion of the insulating layer. Therefore, the adjacent ones of the metal sheets can be electrically insulated by the trenches; and the two ends of the signal lines are electrically connected to the metal sheets and the probes of the probe sets, respectively, to form 5 200841019 The probe card is low-cost and easy to manufacture, and it also effectively prevents leakage current between the electrical signal transmission lines. [Embodiment] 5 Hereinafter, a number of preferred embodiments will be described in conjunction with the drawings for a detailed description of the structure and function of the present invention. The brief description of the drawings used is as follows: ^ The first figure is provided by the present invention. An exploded perspective view of a circuit board according to a preferred embodiment; 10 is an exploded perspective view of the probe card provided by the first preferred embodiment, and the second figure is above the probe card provided by the first preferred embodiment. 4 is a schematic structural view of a probe card provided by the first preferred embodiment, and 15 is a bottom view of the probe set provided by the first preferred embodiment; A schematic structural view of a second preferred embodiment is provided; and a seventh embodiment is a top view of the second preferred embodiment described above. Referring to the first embodiment, a circuit board 1 provided in a first preferred embodiment of the present invention is provided. The support layer 1Q, an insulating layer 20 and a conductive layer are formed by stacking up and down. The layer 3 is made by: a. preparing a substrate corresponding to the size of the wafer, and a test hole 11 is formed in the center of the substrate, thereby forming the support layer 1 〇, the substrate is not easy A high-hardness material that produces deformation and has a flexural strength specification of more than 100 kg per square centimeter under the test defined by American Society for Testing and Materials (ASTM). Generally, it has a considerable thickness. Metal or ceramic materials can roughly meet the requirements of high hardness, or can be used in the fifth embodiment of the present invention, such as Flame Resistant laminates level-4 (FR_4) or fifth level (fr- 5) Glass fiber plate (Glass Epoxy); b. Prepare an insulating material corresponding to the size of the supporting layer i. The insulating material has a mass per square centimeter (7) greater than 1 under the test defined by the American Society for Testing and Materials. The surface resistivity specification of the 13th ohms of 0; C. The test hole u corresponding to the support layer 10 is passed through the test hole 21 of a size corresponding to the center of the insulating material; 15 20 d·· The area of the circumference of the circumference is recessed from the surface with a groove groove 22 of a specific depth and pattern, and the insulating layer 2 is formed. The grooves 22 can form a convex portion 23 correspondingly, and the convex portions 23 The surface is similar to the specific electricity case (10) (4) Wei is in the lining, so that a plurality of the first and second attachment faces 23 232 can be distinguished; in the present embodiment, the insulating material is gathered (four) (PE), polymer Poly M (upE), polypropylene micro-expanded PP), ABS tree moon 曰, woven gas dragon (ρτΕΕ), polymethyl methacrylate methyl vinegar CPMMAh « chlorine w (pvc) and other ordinary ordinary engineering plastics, so can be The machine-W is the secret groove 22, or the secret groove 22 can be formed by the first-resistance material subtraction process, which can achieve the purpose of forming the insulation layer buckle; 7 200841019 e·Preparation of a conductive The copper foil is patterned to form a plurality of metal sheets 31 corresponding to the surface of the convex portions 23, and the metal sheets are in accordance with the pair. The first and second metal sheets 311, 312 and a locking ring 32 are respectively distinguished from the surface shapes of the different convex portions 23, and the first and second metal sheets, 312 5 are respectively attached to the first ones. And the second attaching surface 231, 232, the locking ring 32 is a corresponding position of the circuit board for screw locking, thus forming the conductive layer 30. 4, as shown in the second to fourth embodiments, the circuit board 1 and the plurality of signal lines 40 and a probe set 5 〇 module are provided as a cantilever ίο type probe card 2, wherein: A plurality of through holes 101 and 201 are bored on the support layer 1 and the insulating layer 2 of the circuit board 1. The apertures of the through holes 101 and 201 are equivalent to the line diameters of the signal lines 40. The signal lines 4 〇 pass through the circuit board j, and each of the signal lines 40 is a coaxial transmission line structure having an axial metal 4〇1 I5 and sequentially surrounding one of the insulating materials and a grounding ring 4〇2 And a protective layer, the first metal piece 311 and the grounding ring 402 are electrically connected to the first and second metal pieces 311 and 312, respectively, so that the first metal piece 311 and the first metal piece 311 are electrically connected thereto. The grounding ring 402 constitutes the grounding line 41 of the circuit board 1. Each of the second metal piece 312 and the axial metal 4〇1 2〇 electrically connected thereto form a signal line 42 of the circuit board 1. Please refer to the fourth and fourth. As shown in the fifth figure, the probe set 50 is a conventional cantilever probe structure having a jumper seat 51 and a fixed position. 52 and a plurality of probes 53. The jumper base 51 is provided with a plurality of solder pads 510, which are provided for corresponding holes 10 and 201, and the signal lines 4 and the probes 53 are electrically connected. : 弋 弋 弋 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该=1 The test head of the measuring machine touches the outermost periphery of the circuit board 1 on the second and second metal sheets 311 and 312, and the cantilever probe card 2 transmits the line 42 and the electrical connection with the same The pin grounding line 1 is wide to the electronic component, and is connected to the two adjacent 41s to achieve the integrity of the electrical signal transmission; since the insulation between the adjacent electrical components 311, 312 is The groove 22 of the layer 20 reaches the characteristic of the steam ++ 9 bar, so that the leakage current problem when the electrical test signal is transmitted on the cantilever type can be effectively prevented, so that the cantilever type probe card 2 is not 2 〇 ^ mm ± ^ The strength characteristics of the support layer 10 simultaneously replace the conventional ceramic materials, so that the cost expenditure is relatively reduced and the engineering of the production line is relatively simplified. 6 and 7 are the second embodiment of the present invention. The vertical probe card 3' of the second embodiment is provided with the % road plate 60 and the imaginary signal line 7 and the same as the above embodiment. The probe set (10) is made of a module, wherein: '', the circuit board 60 has the same manufacturing method as the circuit board of the above embodiment', and a plurality of the first and second metal pieces 61, 62, and the plurality are formed in the same manner. a trench 63 and a test hole 64 in the center of the circuit board 5, the signal lines 70 are inclusively connected to the first and second metal sheets 61, Q, and extend through the test hole 64 to be connected To the probe set 80. 9 20 200841019 The road board is a general-purpose vertical probe structure, which is located at the electric two straight places 'with a fixed seat 81 and more with a dish i tooth _ Braun seat 81 is具有 之 # # # # # # 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The outermost part of 6 Bu 62 is electrically connected with the electric measuring machine, so that: the probe card 3 transmits the t-station of the rape tree, the probe card of the Weishu system, and the probe of the Yu Daxiang system. Solve the problem of leakage current between the electrical measurement signal transmission line, only at a low cost and simple production of health expenditure process that is able to provide high-quality electrical measuring probe card. It is to be understood that the above description is only a preferred embodiment of the present invention, and the equivalents of the present invention are intended to be included in the scope of the present invention. 15 200841019 [Brief Description of the Drawings] The first drawing is an exploded perspective view of the circuit board of the first preferred embodiment of the present invention; the second drawing is an exploded perspective view of the probe card provided by the first preferred embodiment; 3 is a top view of the probe card provided by the first preferred embodiment; the fourth figure is a schematic structural view of the probe card provided by the first preferred embodiment, and the fifth figure is the first preferred embodiment The bottom view of the probe set provided by the example; 0 The second perspective of the sixth invention is provided by the sixth invention; the seventh figure is the second preferred embodiment; the eighth figure is the part of the conventional probe card. Stereoscopic view; ninth figure is a partial perspective view of another conventional probe card. 200841019 [Description of main component symbols] 1, 60 circuit board 3 vertical probe card 2 cantilever probe card 10 support layer 101, 201 perforation 5 11, 21, 64 test hole 20 insulation layer 22, 63 groove 23 convex 231 first attaching surface 232 second attaching surface 30 conductive layer 31 metal piece 311, 61 first metal piece 312, 62 second metal piece 10 32 locking ring 40, 70 signal line 401 axis metal 402 grounding ring 41 Grounding line 42 signal line 60, 80 probe set 51 jumper seat 510 pad 52, 81 fixing seat 15 53, 82 probe 12