1327344 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種黏著半導體晶片之裝置，尤係關於一 種用於半導體封裝製程中之黏晶（diebonding)裝置。 【先前技術】BRIEF DESCRIPTION OF THE DRAWINGS 1. Field of the Invention This invention relates to an apparatus for attaching a semiconductor wafer, and more particularly to a die bonding apparatus for use in a semiconductor packaging process. [Prior Art]
於整個半導體封裝製程中，緊接於晶圓切割後之製程為 黏晶（或稱為固晶、上片或黏片）製程，其係將晶圓上因切割 道切開後之各獨立晶粒依序取放至導線架或基板上，並藉 由銀膠或膠帶將導線架及晶粒相互穩固結合。 曾圖1係一習知黏晶機之主要機構示意圖。基板5由輸送 V軌19左邊進料端載入，被依序載入之複數個基板5係由 進料夾爪17往輸送導軌19之出料端傳送。基板5會經過 裝黏膠之注射筒狀容器8及點膠頭9下方，容器8内之黏 膠會經由點膠頭9吐出於基板5上各單元。另夕卜，取放機 構會依序拿取晶圓15上之晶粒1G，該晶圓15_定於 薄膜上’而藉由擴張機構12使薄膜拉伸而將晶粒⑺彼 :匕距離拉開。被取放機構u拿起之晶粒1()會移到輪 端，並往下運動直至將晶粒㈣定於基板5上 甶於晶粒10固定於基板 β 而戈化賈較多 < 吋間，大 :適地=面積之晶粒10更是需要較多之時間才能使塌 地擠出於四周。若是將膠材換為聚乙酿 =夥帶則每個晶粒10需要更多之時間，約需要. /才能有效結合晶粒10與基板5,因此很明顯晶粒 1327344 壓：過程會成為該習知黏晶機之瓶頸動作，亦即每小時產 ^ per h〇ur ; UPH)會受到影響而降低。當使用膠帶 =晶粒1〇與基板5之物質時，每小時產出量甚至低於 1200 個。 習知黏晶機除了單料間產量不料 ^17受到基板Μ曲問題之嚴重考驗。尤其當從事^ 日日㈣裝㈣“叫_一；批叫時，薄型之基板5在 黏者首顆晶粒後受到棋烤溫度影響會產生趣曲。該些進料 夾爪17是以接力方式交替傳輸至出料端，基板5翹曲經常 造成進料夾爪17交#換手時無法正確线而因此造 成基板5與輸送導軌19間碰撞而卡料，甚至基板5上晶粒 10因刮傷或晶崩而需要報廢。 综上所述’封裝設備市場上虽需要一種能顯著提昇單位 時間產量之黏著半導體2 有千導體曰曰片的裝置’並且還要降低黏晶製 程中不該有的停機率及報廢率。 【發明内容】 本發明之目的係提供一種黏著半導體晶片之裝置，盆係 藉由多軌進料及輪送導線架或基板，並同時進行導線架或 基板之加溫。如此藉由多執輸送線間之交替進行黏晶動 作：就能有效省去基板溫昇之等待時間，進而提升該裝置 之早位時間產量。 本發明之另一目的係提供一種具預麼及後壓之分段壓合 晶粒功能之黏晶裝置’執行後壓之主廢合模組又包含多個 望口頭έ文可同時壓合多個晶粒與基板充分結合，因此能 ' 6 - 1327344 有效提升該裝置之單位時間產量β 本發明之另-目的係提供—種沒有交接傳送動作 黏晶裝置，可避免基板傳送過程中被卡料或遭干涉 為達上述目的，本發明揭示一種黏著半導體晶片 置係用於將半導體晶片黏著固定於封裝載體之封裝: 備，該封裝載體包括基板或導線架。該裝置包含—第= 料輸送單元、-第二進料輸送單元、一預壓模組及—主塵 合模組，其中該第一進料輸送單元及該第二進料輸送單元 係輪替傳送基板至該預麼模組處。該預壓模組會將複數個 Μ體晶片依序放置於已送至^位之基板表面或基板上已 固定之晶粒表面，並施加麼力使該半導體晶片與該基板初 步結合。然後該主塵合模組中複數個麼合頭會同時觸塵該 複數個半導體晶片，並使該複數個半導體晶片與該基板或 已固定之該晶粒緊密結合。 【實施方式】 圖2係本發明黏著半導體晶片之裝置之立體圖。黏著半 2〇主要包含物料傳送模组29、預壓模組 24及主壓合模組25。物料傳送模組29包括至少第一進料 輸送單元291及第二進料輸送單元292,該兩輸送單元（本 發明並不限於兩輸送單元，多個輸送單元亦為本發明之主 張）係輪替傳送基板80或導線架至該預壓模組24處。當第 一進料輸送單元291及第二進料輸送單元292其中一者在 預壓模組24處與晶粒間進行初步之結合固定，同時另一已 =輪送單元可回到左邊之進料端承載下-片基板8。。 :^待㈣模組24將複數個晶粒依序黏合於—基板8〇 動作8，承載下一片基板8〇之輸送單元可進行基板之加溫 。如此藉由多執輸送線間之交替進行黏晶過程，就能 =以去基板溫昇之等待時間，進而提升該裝置Μ之單位 :間產量。由於第一進料輪送單元291或第二進料輸送單 ^92係直接將基板⑼傳送至預壓模組^處，因此沒有 父接傳送之料會造成切或干涉之黯，尤其適用於薄 型或趣曲量較大之基板8〇。 預壓模組24中有取放機構241會依序拿取晶圓上之晶 粒，該晶圓係固定於一薄膜上，而藉由擴張模組27使薄膜 拉伸而將晶粒彼此距離拉伸開來。被取放機構241拿起之 晶粒會移到輸送導軌19端，並往下運動直至將晶粒固定於 第一進料輸送單元291或第二進料輸送單元292上之基板 8〇表面。由於後續有主麗合模組25可完成晶粒與基板8〇 間之充分結合，因此取放機構241只要將晶粒初步固定於 基板80表面即可，意即緊接著之傳送動作中晶粒與基板間 不會有相對位移’相較於習知技術就不需要花費太長時間 而把成生產瓶頸。於擴張模組27之上方有晶圓視覺單元U 可確認各晶粒於擴張模組27上之位置與角度。又預壓視覺 模組22係設於第一進料輸送單元291及第二進料輸送單元 292行經路線上，其可以確認黏晶前基板8〇之位置與角 度，或是確認基板80上各單元是否有不良之記號。 經過預壓模組24初步固定晶粒後之基板8〇會直接送到 1327344 主壓合模組25下方，或經過轉接輸送單元293而將基板80 :晶粒移到複數個壓合頭251〜254位置處，緊接著該些壓 口頭25 1〜254會再施加適當力量於晶粒表面，藉此就能使 各對應之晶粒與基板8〇充分結合。 如圖3所不，為能使本發明更廣泛地應用於多晶粒封 裝’或基板需要置放於彈s才能進料之實際生產需求，於In the entire semiconductor packaging process, the process immediately after wafer dicing is a die-bonding (or solid crystal, top film or adhesive film) process, which is to separate the individual grains on the wafer after cutting the scribe line. The lead frame and the crystal grain are firmly combined with each other by silver glue or tape. Zeng Figure 1 is a schematic diagram of the main mechanism of a conventional die-bonding machine. The substrate 5 is loaded by the feeding end on the left side of the conveying V-track 19, and a plurality of substrates 5 sequentially loaded are conveyed from the feeding jaws 17 to the discharge end of the conveying guide 19. The substrate 5 passes under the adhesive cylindrical container 8 and the dispensing head 9, and the adhesive in the container 8 is discharged through the dispensing head 9 to the units on the substrate 5. In addition, the pick-and-place mechanism sequentially takes the die 1G on the wafer 15, and the wafer 15_ is fixed on the film, and the film is stretched by the expansion mechanism 12 to form the die (7): Pull open. The die 1 () picked up by the pick-and-place mechanism u is moved to the wheel end and moved downward until the die (4) is fixed on the substrate 5, and the die 10 is fixed on the substrate β and the geochemistry is more < Daytime, big: Fit = area of the grain 10 is more time to squeeze the ground out. If the glue is changed to the poly-bundle = the band, then each die 10 needs more time, about the need. / can effectively combine the die 10 and the substrate 5, so it is obvious that the die 1327344 pressure: the process will become The bottleneck action of the conventional die-bonding machine, that is, the hourly production per h〇ur; UPH) will be affected and reduced. When using tape = grain 1 〇 with substrate 5, the output per hour is even less than 1200. In addition to the uninterested yield of the single-grain machine, ^17 is seriously tested by the problem of substrate distortion. Especially when engaged in the day (4) loading (four) "called _ one; batching, the thin substrate 5 will be affected by the chess baking temperature after the first die of the adhesive. The feeding jaws 17 are relays. The mode is alternately transmitted to the discharge end, and the warping of the substrate 5 often causes the feed jaws 17 to fail to correctly wire when the hand is changed, thereby causing collision between the substrate 5 and the conveyance guide 19, and even the die 10 on the substrate 5 Scratches or crystal collapses need to be scrapped. In summary, the packaging equipment market needs a device that can significantly increase the output per unit time of the semiconductor 2 with a thousand conductors and also reduce the die bonding process. SUMMARY OF THE INVENTION The object of the present invention is to provide a device for bonding a semiconductor wafer by using a multi-track feeding and a wheel lead frame or a substrate, and simultaneously adding a lead frame or a substrate. Therefore, by performing the die-bonding operation by alternately between the multiple transfer lines, the waiting time of the substrate temperature rise can be effectively saved, thereby increasing the early time production of the device. Another object of the present invention is to provide a pre-preparation. What? The die-bonding device for pressing the grain function in the step of pressing the main waste combination module of the post-pressing pressure includes a plurality of prosthetic heads and can simultaneously press a plurality of crystal grains to fully integrate with the substrate, so that it can be '6 - 1327344 Effectively increasing the unit time yield of the device. The other object of the present invention is to provide a die-free device that does not have a transfer transfer action, which can avoid jamming or interference during the substrate transfer process, and the present invention discloses an adhesive semiconductor. The wafer is used for bonding a semiconductor wafer to a package of a package carrier: the package carrier comprises a substrate or a lead frame. The device comprises a first material conveying unit, a second feeding conveying unit and a pre-pressing module. And a main dust-collecting module, wherein the first feeding conveying unit and the second feeding conveying unit are arranged to transfer the substrate to the pre-module module. The pre-pressing module will rely on the plurality of body wafers The sequence is placed on the surface of the substrate that has been sent to the substrate or the surface of the substrate that has been fixed on the substrate, and a force is applied to initially combine the semiconductor wafer with the substrate. Then, the plurality of heads in the main dust-collecting module are the same. The plurality of semiconductor wafers are touched and the plurality of semiconductor wafers are tightly bonded to the substrate or the fixed crystal grains. [Embodiment] FIG. 2 is a perspective view of the device for adhering a semiconductor wafer of the present invention. The material conveying module 29, the pre-pressing module 24 and the main pressing module 25. The material conveying module 29 includes at least a first feeding conveying unit 291 and a second feeding conveying unit 292, the two conveying units (the invention) It is not limited to two transport units, and the plurality of transport units are also claimed in the present invention. The base wheel transports the substrate 80 or the lead frame to the pre-press module 24. When the first feed transport unit 291 and the second feed transport One of the units 292 is initially fixed and fixed between the pre-pressing module 24 and the die, while the other has been turned to the left feeding end to carry the lower-sheet substrate 8. . The module 24 sequentially bonds a plurality of dies to the substrate 8 〇 action 8, and the transport unit carrying the next substrate 8 可 can perform heating of the substrate. Thus, by performing the die-bonding process alternately between the multiple transfer lines, it is possible to increase the waiting time of the substrate temperature rise, thereby increasing the unit of the device: the inter-production. Since the first feed transfer unit 291 or the second feed transport unit 92 directly transfers the substrate (9) to the pre-press module, the material that is not transferred by the parent may cause cutting or interference, and is particularly suitable for A thin or large substrate with a large amount of music is 8 inches. In the pre-pressing module 24, the pick-and-place mechanism 241 sequentially picks up the crystal grains on the wafer, and the wafer is fixed on a film, and the film is stretched by the expansion module 27 to separate the crystal grains from each other. Stretch out. The die picked up by the pick-and-place mechanism 241 is moved to the end of the transport guide 19 and moved downward until the die is fixed to the surface of the substrate 8 on the first feed transport unit 291 or the second feed transport unit 292. Since the main splicing module 25 can complete the sufficient bonding between the die and the substrate 8 , the pick-and-place mechanism 241 only needs to initially fix the die on the surface of the substrate 80 , that is, the die in the next transfer operation. There is no relative displacement between the substrate and the substrate. It does not take too long to become a production bottleneck compared to the prior art. Above the expansion module 27, a wafer vision unit U can confirm the position and angle of each die on the expansion module 27. The pre-pressing visual module 22 is disposed on the route of the first feeding and conveying unit 291 and the second feeding and conveying unit 292, and can confirm the position and angle of the front substrate 8 or the substrate 80. Whether the unit has a bad mark. After the pre-pressing module 24 preliminarily fixes the die, the substrate 8〇 is directly sent under the 1327344 main pressing module 25, or passes through the transfer conveying unit 293 to move the substrate 80: the die to the plurality of pressing heads 251. At the position of -254, the pressure heads 25 1 - 254 are then applied with appropriate force on the surface of the die, whereby the corresponding die can be sufficiently bonded to the substrate 8 . As shown in Fig. 3, in order to enable the invention to be more widely applied to multi-die packages or the actual production requirements of the substrate to be placed in the bomb s,
裝置20之進料端及出料端可分別設置彈匣進料模組μ及 彈匣出料模組26。 …圖4⑷係本發明物料傳送模組29之示意圖。第—進料輸 达早兀291將原本在進料位置之基板8〇2移至預壓位置之 預>1頭241下方，晶粒1〇經過預壓頭241施加適當塵力後 初步固疋於基& 8〇2·之表面。此時第二進料輸送單元况 ，已承載並加熱一基板謝，並待基板贈傳送至轉接輸送 °°一 3後該已適备加熱之基板會被移送預麼位置The magazine feeding module μ and the magazine discharging module 26 can be respectively disposed at the feeding end and the discharging end of the device 20. ... Figure 4 (4) is a schematic view of the material transfer module 29 of the present invention. The first-feeding feed early 291 moves the substrate 8〇2 originally at the feeding position to the pre-gt;1 head 241 of the pre-pressing position, and the die 1〇 is initially solidified by applying the appropriate dust force through the pre-pressing head 241. On the surface of the base & 8〇2·. At this time, the second feeding and conveying unit condition has carried and heated a substrate, and the substrate that has been properly heated is transferred to the pre-position after the substrate is delivered to the transfer conveyor.
處（如虛線基板80Γ所示）。另第二進料輸送單元292會將 已完成懸步驟之基板直接傳送㈣合位置處，或經過平 移後才運抵壓合位1，壓合位i爽之壓合頭251〜以會再 施加適當力量於晶粒表面，藉此就能使各對應之晶粒與基 板803充分結合。 国係本發 巧、必〇心不蒽團。為能減 >裝置20之所佔面積（f(K)tprint)，可將轉接輸送單元州 直接設置於壓合位置處，並可於第一進料輸送單元29ι及 j料輸送單元292間往返’例如：於虛線表示之轉接輸 送單το 294’和轉接輸送單元294間轉換。 1327344 本發明之技術内容及技術特點已揭示如上，_悉本 項技術之人士仍可能基於本發明之❹及揭㈣作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不詩本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係一習知黏晶機之主要機構示意圖； 圖2係本發明黏著半導體晶片之裝置之立體圖； 圖3係本發明黏著半導體晶片之裝置之上視圖；以及 圖4(a)〜4(b)係本發明物料傳送模組之示意圖。 【主要元件符號說明】 5 基板 8 容器 9 點膠頭 10 晶粒 11 取放機構 12 擴張機構 15 晶圓 17 進料夾爪 19 輸送導執 20 黏著半導體晶片： 21 堆疊進料模組 22 預壓視覺單元 23 晶圓視覺單元 24 預壓模組 25 主壓合模組 26 彈匣出料模組 27 29 ' 擴張模組 29·物料傳送模組 28 241 彈匣進料模組 預壓頭 251 〜254 壓合頭 291 第一進料輸送單 292 293 第二進料輸送單元 、294、294’轉接輸送單元 1327344 80、801 ' 801·、802、802'、803 基板Where (as shown by the dashed substrate 80Γ). The second feed conveying unit 292 will directly transfer the substrate of the completed suspension step to the joint position, or after the translation, to the press-fit position 1, and the press-fit position 251 of the press-fit position will be reapplied. Appropriate force on the surface of the die, whereby each corresponding die can be sufficiently bonded to the substrate 803. The country is ingenious, and it must be a heart-wrenching group. In order to reduce the area occupied by the device 20 (f(K)tprint), the state of the transfer conveying unit can be directly set at the pressing position, and can be applied to the first feeding conveying unit 29 and the material conveying unit 292. The round trip 'for example: conversion between the transfer conveyance unit το 294' indicated by the broken line and the transfer conveyance unit 294. 1327344 The technical content and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of the invention is not to be construed as limited by the scope of the invention, but rather BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a main mechanism of a conventional die bonder; FIG. 2 is a perspective view of a device for attaching a semiconductor wafer of the present invention; FIG. 3 is a top view of the device for attaching a semiconductor wafer of the present invention; (a) to 4(b) are schematic views of the material transfer module of the present invention. [Main component symbol description] 5 Substrate 8 Container 9 Dispensing head 10 Die 11 Pick-and-place mechanism 12 Expansion mechanism 15 Wafer 17 Feeding jaw 19 Delivery guide 20 Adhesive semiconductor wafer: 21 Stacked feed module 22 Preload Vision unit 23 Wafer vision unit 24 Pre-press module 25 Main press-fit module 26 Magazine discharge module 27 29 'Expansion module 29 · Material transfer module 28 241 Magazine feed module pre-press head 251 ~ 254 press head 291 first feed conveying sheet 292 293 second feed conveying unit, 294, 294' transfer conveying unit 1327344 80, 801 '801 ·, 802, 802', 803 substrate
-11 --11 -