200835412 九、發明說明 【發明所屬之技術領域】 本發明是關於印刷配線板的製造方法，尤其是關於電 鍍工程的事先處理方法者。 【先前技術】 通常，被處理材的表面是藉由有機物或氧化物被污染 ，無法直接實施正常的電鍍處理。因此，在電鍍處理之前 必須除去此些的污染。藉由須去掉的污染物質，其處理是 可分成爲脫脂及/或酸洗，惟其方法是大槪有浸漬於藥劑 的處理的方法及利用電解處理的方法。 其中，浸漬於藥劑的處埋的方法，是僅將被處理材與 藥液接觸就可以，而裝置構造是單純。但是，將處理效果 依據化學反應之故，因而必須進行藥劑濃度及添加劑濃度 的嚴密管理，使用的藥劑是與電解處理相比較成爲高價格 。又，因進行化學反應，因此藉由處理溫度，處理時間的 變動所做出的效果及事先處理的效果不相同，含有品質上 不穩定的情形。 又，藉由經時變化，所使用的藥劑的有效成分不但被 消耗，而蓄積著反應生成物或是變質物之故，因而即使單 純地控制藥劑濃度，也有無法得到充分的處理效果的情形 。此種情形，必須定期更新高價格的藥劑，成爲提高成本 的主要原因。 一方面，藉由電解處理的方法，是單純的藥劑就可以 -4- 200835412 而價格低廉。又，藉由藥劑濃度，處理溫度的變動對於製 品完成的影響較大，僅以電流値及處理時間的管理就可進 行穩定的處理。 在該電解處理，將裝置的構成及被處理材，作成用以 將通電進行於被處理材的構成。爲了通電於被處理材，必 須接觸被處理材與電極。如此，將電極加工成刷狀，環狀 或滾子狀而設置饋電部，作成與被處理材的特定部或全面 可接觸（參照專利文獻1)。 專利文獻1:日本特開2000-1 99096號公報 專利文獻2:日本特開2006-29 1 244號公報 【發明內容】 然而，藉由被處理材與饋電部的接觸，在被處理材會 產生某種程度卡住痕跡，貼上痕跡等。又，爲了減輕該損 傷程度，而有減輕被處理材與饋電部所接觸的荷重的方法 ，惟相反地感應通電不良，藉由火花也有損傷被處理材的 不利之處。 如此地，由處理及管理的容易性上期望採用電解處理 。但是，必須防止爲了通電目的藉由接觸饋電部與被處理 材的不利之處。 在被處理材，也必須有饋電所用的辦法。在饋電於被 處理材內的處理部位，於被處理材形成附加性配線圖案。 但是，形成附加性配線圖案。但是，形成附加性配線圖案 會成爲提昇成本的主要原因，而配線的複雜化是會降低製 -5- 200835412 品的良率。 又，隨著配線圖案的微細化而爲了確保電路 用的空間，也迴避設置通電用配線圖案，結果， 逐漸成爲無電解辦法。這時候，當然，有無法在 * 理上適用利用接觸通電的電解處理法（參照專利: ， 問題。 本發明是考慮上述事項而創作者，其目的是 φ 在藉由電解處理進行電鍍事先處理時，不必接觸 與饋電部而可饋電至被處理材的電鍍事先處理方 爲了達成上述目的，在本發明中， 一種電鍍事先處理方法，屬於在印刷配線板 程，將被處理材一面水平或垂直地搬運，一面使 極及陰極的一對電極連續地處理的電鍍事先處理 特徵爲； 在處理槽內，配置1以上的上述一對電極， • 將上述電極與上述被處理材之距離作成上述 述陽極之間的距離的1/4以下， 藉由將直流電流流在上述一對電極間，而不 電極直接接觸於上述被處理材，進行電解處理上 材。 依照本發明，當連結地進行電解處理，因不 用以饋電被處理材的工模就可饋電之故，因而可 痕跡的問題。又，不必饋電至被處理材之故，因 處理材的通電用配線圖案等不會成爲問題，而使 配線圖案 電解處理 其事先處 交獻2)的 在於提供 被處理材 法。 的製造工 用具有陽 方法，其 陰極與上 必將上述 述被處理 必接觸於 避免表面 而有無被 在無電解 -6- 200835412 規格的被處理材也可進行電解處理。 【實施方式】 以下，參照圖式來說明本發明的實施形態。 (實施形態1) 第1圖是表示適用的上述處理層的斷面構成例。如表 示於該第1圖的所示地，電極1，2是在被處理材3的一 側面（表面或背面）設置成爲+極，-極的一對。在第1圖， 將事先處理層4表示作爲朝垂直方向切斷的斷面，作成在 配設於上下的兩對電極1，2之間，而在配置於上述處理 槽4的兩端的阻塞滾子5間令被處理材3被搬運電解液6 中 〇 又，因同時地處理被處理材3兩面，因此在各該的一 面設置成爲一對電極1，2。此時，對應於被處理材3的表 ，背面所對應的位置相對的電極極性是必須作成相同，而 在同極性的電極1，1或2，2間夾有被處理材3的方式， 配置有電極1，2。 第2圖是表示在如此地配置電極1，2的狀態下施加 電壓的情形的電流流動。電流是從+極1流到-極2 ’惟分 成僅通過電解液（未予圖示）而未流在被處理材3的路徑A 與經由被處理材3流動的路徑B。 該兩路徑A，B的電流分配率是藉由電極1 ’ 2間的距 離，電極1，2與被處理材3之距離的大小等有所不同。 200835412 作爲被處理材3的電解處理成爲有效爲流在路徑B的電流 ，而流在路徑A的電流値愈小，效率愈佳。 如第3圖所示地，將各電極間的電阻作爲R1 ’ R2 ’ Rm，則路徑A的電阻是R1，而在路徑B成爲2xR2 + RM。 在此，金屬的電阻是與溶液的電阻相比較充分地小而可忽 略的値之故，因而路徑B的電阻是可作爲2 X R2。 電阻Rl，R2都是流著電流相同的電解液之際的電阻 値之故，因而該値是比例於極間距離。所流動的電流値是 比例於電阻的逆數之故，因而電流分配率是成爲路徑A : 路徑 B = 2 X R2:R1。 . 亦即，縮短電極1，2與被處理材3的距離’而增加 陽極1與陰極2之間的距離，就可增大流在被處理材3的 電流的分配。此爲表示不管電解液的種類，僅利用電極1 ，2的電極1，2的配置來決定電流的分配率。 通常，將流動電流的2/3使用於電解處理之故，因而 電極1，2與被處理材3之距離，是設定在陽極1與陰極2 之間的距離的1 /4以下。1 /3的電流是流在電解液而利用 電解液的電阻使得電解液本體會發熱，惟該熱是可使用在 電解液的保溫，而不會無謂地耗費。 但是，若流在電解液的電流値變大，則也有依電解液 的處理溫度及特性，惟因電解液的昇溫成爲需要冷卻裝置 的情形。所以，將電極1，2與被處理材3之距離，作成 陽極1與陰極2之間的距離的1/5以下較佳。配置裝置上 ，未達成此些距離的情形，也可在陽極1與陰極2之間設 -8- 200835412 置妨礙板（未圖示）。 流在一對電極1，2之間的電流是使用直流。當然， 使用交流或脈衝波等的交變波，惟在本發明中爲了明確地 分離陽極處理與陰極處理，僅使用直流。此爲在依本發明 的電鍍事先處理中，爲利用在陽極反應或陽極反應所發生 的氧氣或氬氣的處理效果比與藥劑的反應成爲主體所致。 利用以上所述的方法，不必直接饋電至被處理材3， 就能電解處理被處理材3。 作爲事先處理主要進行脫脂的情形，作爲電解液使用 苛性鈉、碳酸鹽或矽酸鹽、或此些的混合藥劑。基本上， 爲藉由陽極反應所發生的氧氣進行氧化分解附著於被處理 材3的表面的有機物的辦法，並將電解液作成鹼性。亦即 ，提高溶液的羥基濃度，而容易發生氧氣。 但是，必須避免所使用的藥劑與被處理材3之反應。 如此，使用苛性鈉、碳酸鹽或矽酸鹽或是此些的混合藥劑 ，惟以相同想法也可使用其他藥劑。 作爲事先處理欲除去表面氧化物時，選擇以硫酸作爲 主體的電解液，在印刷配線板，被鍍材的金屬種爲銅。所 以無法使用硝酸系的藥劑。又，鹽酸系的藥劑，是在本發 明中以一對產生陽極處理與陰極處理之故，因而因陽極反 應所產生的氯氣體，會發生被處理材3的變色或裝置的腐 蝕等的問題。 依本發明的處理，是以藉由陰極反應所發生的氧氣所 發生的還原作爲基本。又，銅是藉由陽極反應在表面生成 -9- 200835412 氧化物。藉由此，在處理的最後階段，被處理材3會成爲 陰極2的方式，來決定電極配置及極性。在進行兩面處理 時，欲將表背面的電極的極性作成相同，爲依說理由。 被處理材3是捲軸狀，則毫無問題地以本發明的方法 可以處理。又，即使爲片狀，若爲可進行搬運狀態，也不 需要饋電滾子，饋電刷等之故，因而以本發明的方法就可 處理。 (其他實施形態） 在本發明中使用定電流，惟藉由槽構造來決定電流分 配率之故，因而進行定電在控制也可以處理。 本發明是關於電鍍事先處理者，而不管下一工程的電 鍍處理的種類，表示作爲實施形態以外，例如也可適用電 解焊料電鍍，電解錫-銅電鍍，電解銀電鍍，無電解銀電 鍍，銅電鍍。又，其他處理，例如依鈾刻的圖案化，黑化 • 處理等的事先處理也可適用。 (被處理材的處理例） 以下’將適用本發明的上述實施形態而事先處理被處 理材3的結果，作爲處理例！至3表示於以下。 (處理例1) 藉由本發明的方法，是在單面印刷配線板的電鍍工程 中於實施電解錫電動時，進行依電解脫脂的事先處理。電 -10- 200835412 解液是使用苛性鈉：4g/L，碳酸鈉4g/L，正矽酸鈉2g/L的 混合溶液。電解液的溫度是設定在45±3°C。 陽極·陰極都使用施以鍍白金的Ti電極，將陽極1 與正極2之間的距離作爲250nm，而將電極1，2及被處 理材3之距離作爲50mm。各電極1，2的長度是作爲 3 0 0mm。處理時間是調整搬運速度成陽極，陰極2都爲30 秒鐘（通過各電極的時間）。在兩電極1，2間流著32A的 直流電流。 在被處理材3通過各電極1，2下的過程，認定由銅 表面發生氣體。又，處理後的被處理材3的表面的濕潤性 是良好，而在下一工程的電解錫電鍍後未觀察到脫脂不良 的「不會上鍍」的情形。 (處理例2) 作爲捲軸狀兩面印刷配線板的表面處理，當進行連續 電解金電鍍處理，進行依本發明的方法的電解酸洗。電解 液是使用5%硫酸溶液。電解液的溫度是設定在25 ±5t： 。在與處理劑1同一的槽構造的電解槽進行處理。處理時 間，是調整搬運速度成陰極·陽極都成爲3 0秒鐘（通過各 電極的時間）。每一單面的電流値作爲53A，而在表背流 著106A的直流。 通過事先處理槽之後的印刷配線板表面的銅是呈金屬 光澤，表示充分進行電解酸洗的情形。又，在電解金屬鍍 之後，不會有金的模糊不清，表面斑駿等不佳。或電鍍密 -11 . 200835412 接性也沒有問題。又，沒有利用痕跡的外觀不良’而可提 昇製品的良率。 (處理例3) 在片狀印刷配線上當進行無電解金電鍍’則作爲事先 處理本發明的本發明的方法的電解脫脂5繼續地進行電解 電酸洗。在電解脫脂使用苛性鈉：2g/L，正矽酸鈉5g/L的 混合溶液，而以表面溫度45d:3°C。進行與處理例1同一槽 構造的電解槽槽來進處理。 處理時間也與處理例1同樣地，陰極·陽極也成爲3 0 秒鐘（通過各電極的時間）般地調整搬運速度。在電極間流 著32A的直流電流。電解酸洗是例如與處理劑2同樣地使 用5%硫酸溶液，而電解液的溫度是被設定成25 ±5°C。 在與處理例1同一構造的電解槽中，進行處理。處理時間 是調整搬運速度成爲陰極·陽極都是30秒鐘（通過各電極 的時間。電解電流是作爲32A。 無電解金屬鍍的精修加工優異，沒有模糊不清以外的 其他問題。又，也沒有因痕跡，所產生的外觀不良的問題 【圖式簡單說明】 第1圖是表示依本發明的一實施例的事先處理槽的斷 面圖。 第2圖是表示圖示於第1圖的事先處理槽內的電流流 -12- 200835412 動方法的說明圖。 第3圖是表示圖示於第1圖的事先處理槽內各部的電 阻的說明圖。 ^ 【主要元件符號說明】 " 1 :陽極 2 :陰極 φ 3 :被處理材 4 :事先處理槽 5 :阻塞滾子 6 :電解液 A :流在電解液內的電流 B :經由被處理材3流動的電流 R1:陽極1與陰極2之間的電阻 R2 :電極1，2與被處理材3之間的電阻 φ Rm :金屬的電阻 -13-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board, and more particularly to a method for pre-processing an electroplating project. [Prior Art] Generally, the surface of the material to be treated is contaminated by organic substances or oxides, and normal plating treatment cannot be directly performed. Therefore, such contamination must be removed before the plating process. By the removal of the pollutants to be removed, the treatment can be divided into degreasing and/or pickling, but the method is a method in which the mash is immersed in the medicament and a method using electrolytic treatment. Among them, the method of immersing in the immersion of the drug is that only the material to be treated is brought into contact with the drug solution, and the device structure is simple. However, since the treatment effect is based on the chemical reaction, it is necessary to strictly manage the concentration of the drug and the concentration of the additive, and the agent to be used is expensive compared with the electrolytic treatment. Further, since the chemical reaction is carried out, the effect of the treatment temperature and the change in the treatment time and the effect of the prior treatment are different, and the quality is unstable. Further, since the active ingredient of the drug to be used is not only consumed but accumulated by the reaction product, the reaction product or the deterioration product is accumulated over time. Therefore, even if the concentration of the drug is simply controlled, a sufficient treatment effect cannot be obtained. In this case, it is necessary to regularly update high-priced pharmaceuticals, which is the main reason for increasing costs. On the one hand, by means of electrolytic treatment, it is a simple agent that can be -4-200835412 and is inexpensive. Further, with the concentration of the drug, the fluctuation of the processing temperature has a great influence on the completion of the product, and stable processing can be performed only by the management of the current and the processing time. In the electrolytic treatment, the configuration of the apparatus and the material to be processed are configured to carry out energization on the material to be processed. In order to be energized to the material to be treated, it is necessary to contact the material to be treated and the electrode. In this manner, the electrode is processed into a brush shape, a ring shape, or a roller shape, and a feeding portion is provided to be in contact with a specific portion or a whole portion of the material to be processed (see Patent Document 1). [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. 2000-29 No. Hei. No. PCT Publication No. JP-A No. 2006-29 No. 244. However, the material to be processed is treated by the contact of the material to be processed with the power feeding unit. Produce some degree of stuck marks, stickers, etc. Further, in order to reduce the degree of damage, there is a method of reducing the load on the material to be processed and the power feeding unit. However, the induction of the power supply is reversed, and the disadvantage of the material to be treated is also caused by the spark. As such, electrolytic treatment is expected to be facilitated by handling and management. However, it is necessary to prevent disadvantages of contacting the power feeding portion and the material to be processed for the purpose of power supply. In the material to be treated, there must also be a method for feeding. An additional wiring pattern is formed on the material to be processed in the processing portion fed into the material to be processed. However, an additional wiring pattern is formed. However, the formation of additional wiring patterns is the main reason for the increase in cost, and the complication of wiring will reduce the yield of the product. In addition, as the wiring pattern is miniaturized, in order to secure the space for the circuit, the wiring pattern for energization is also avoided, and as a result, it is gradually becoming electroless. At this time, of course, there is an electrolytic treatment method in which contact energization cannot be applied in a rational manner (see Patent: , Problem. The present invention is a creator considering the above matters, and the object is that φ is previously treated by electrolysis treatment. In order to achieve the above object, it is not necessary to contact the power feeding portion and can be fed to the material to be processed. In order to achieve the above object, in the present invention, a plating pretreatment method belongs to the process of printing a wiring board, and the material to be processed is horizontal or The electroplating pretreatment feature in which the pair of electrodes of the pole and the cathode are continuously processed is vertically disposed; one or more of the pair of electrodes are disposed in the treatment tank; and the distance between the electrode and the material to be processed is made 1/4 or less of the distance between the anodes, the DC current is flowed between the pair of electrodes, and the electrode is directly contacted with the material to be processed, and the material is electrolytically treated. According to the present invention, the connection is performed. Electrolytic treatment, because it is not necessary to feed the mold of the material to be processed, it can be fed, and thus can be traced. Moreover, it is not necessary to feed to be In the case of the processing material, the wiring pattern for energization of the processing material is not a problem, and the wiring pattern is subjected to electrolytic treatment in advance. 2) The method of providing the material to be processed is provided. The manufacturing process has a positive method, and the cathode and the upper portion must be treated in such a manner as to be in contact with the surface to avoid the presence or absence of the material to be treated in the electroless -6-200835412 specification. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a view showing an example of a cross-sectional structure of the above-mentioned treatment layer to be applied. As shown in Fig. 1, the electrodes 1, 2 are a pair of + and - poles provided on one side surface (surface or back surface) of the material to be processed 3. In the first drawing, the pre-processed layer 4 is shown as a cross section cut in the vertical direction, and is formed between the two pairs of electrodes 1 and 2 disposed above and below, and is blocked at the both ends of the processing tank 4. In the fifth processing, the material to be processed 3 is transported in the electrolytic solution 6 and the both sides of the material to be processed 3 are simultaneously processed. Therefore, a pair of electrodes 1 and 2 are provided on each of the surfaces. In this case, the polarity of the electrode corresponding to the position corresponding to the back surface of the material to be processed 3 must be the same, and the material to be processed 3 is interposed between the electrodes 1, 1 or 2, 2 of the same polarity, and is arranged. There are electrodes 1, 2. Fig. 2 is a view showing a flow of current when a voltage is applied in a state in which the electrodes 1 and 2 are arranged in this manner. The current flows from the + pole 1 to the - pole 2 ′, and is divided into a path A that does not flow on the material to be processed 3 and a path B that flows through the material to be processed 3 only by an electrolytic solution (not shown). The current distribution ratio of the two paths A, B is different by the distance between the electrodes 1' 2 and the distance between the electrodes 1, 2 and the material to be processed 3. 200835412 The electrolytic treatment of the material to be processed 3 is effective as a current flowing on the path B, and the current flowing in the path A is smaller, and the efficiency is better. As shown in Fig. 3, when the resistance between the electrodes is R1' R2 'Rm, the resistance of the path A is R1, and the path B is 2xR2 + RM. Here, the resistance of the metal is sufficiently small and negligible compared to the resistance of the solution, and thus the resistance of the path B is 2 x R2. The resistors R1 and R2 are resistors 流 when the electrolyte having the same current flows, and thus the 値 is proportional to the interelectrode distance. The current 値 flowing is proportional to the inverse of the resistance, so the current distribution rate becomes path A: path B = 2 X R2: R1. That is, by shortening the distance between the electrodes 1, 2 and the material to be processed 3 and increasing the distance between the anode 1 and the cathode 2, the distribution of the current flowing through the material to be processed 3 can be increased. This indicates that the distribution ratio of the current is determined only by the arrangement of the electrodes 1 and 2 of the electrodes 1 and 2 regardless of the type of the electrolytic solution. Usually, 2/3 of the flowing current is used for the electrolytic treatment, and therefore the distance between the electrodes 1, 2 and the material to be processed 3 is set to be 1/4 or less of the distance between the anode 1 and the cathode 2. One-third of the current flows through the electrolyte and the resistance of the electrolyte causes the electrolyte body to heat up, but the heat can be used to keep the electrolyte warm without unnecessarily costly. However, if the current flowing in the electrolytic solution becomes large, the processing temperature and characteristics depending on the electrolyte may be caused, but the temperature rise of the electrolytic solution may require a cooling device. Therefore, it is preferable that the distance between the electrodes 1, 2 and the material to be processed 3 is 1/5 or less of the distance between the anode 1 and the cathode 2. In the arrangement device, if such distances are not achieved, an interference plate (not shown) may be provided between the anode 1 and the cathode 2. The current flowing between the pair of electrodes 1, 2 is DC. Of course, an alternating wave such as an alternating current or a pulse wave is used, but in the present invention, in order to clearly separate the anode treatment and the cathode treatment, only direct current is used. This is because in the prior treatment of electroplating according to the present invention, the treatment effect of oxygen or argon generated by the anode reaction or the anodic reaction is mainly caused by the reaction with the agent. With the above-described method, the material to be processed 3 can be electrolytically treated without directly feeding the material to be processed 3. In the case where degreasing is mainly performed as a pretreatment, caustic soda, carbonate or citrate or a mixed agent of these is used as the electrolytic solution. Basically, the organic matter adhering to the surface of the material to be treated 3 is oxidatively decomposed by oxygen generated by the anode reaction, and the electrolyte is made alkaline. That is, the hydroxyl group concentration of the solution is increased, and oxygen is easily generated. However, it is necessary to avoid the reaction of the agent to be used with the material to be treated 3. Thus, caustic soda, carbonate or citrate or a mixture of such agents is used, but other agents can be used with the same idea. When the surface oxide is to be removed in advance, an electrolytic solution containing sulfuric acid as a main component is selected, and in the printed wiring board, the metal to be plated is copper. Therefore, a nitric acid-based agent cannot be used. Further, since the hydrochloric acid-based agent is subjected to anodization and cathode treatment in a pair in the present invention, the chlorine gas generated by the anode reaction causes discoloration of the material to be treated 3 or corrosion of the device. The treatment according to the present invention is based on the reduction of oxygen which occurs by the cathode reaction. Further, copper is formed on the surface by an anodic reaction to form an oxide of -9-200835412. Thereby, in the final stage of the process, the material to be processed 3 becomes the cathode 2, and the electrode arrangement and polarity are determined. When performing double-sided processing, the polarity of the electrodes on the back side of the watch is to be made the same for the reason. The material to be treated 3 is in the form of a reel, and can be handled by the method of the present invention without any problem. Further, even if it is in the form of a sheet, if it is in a transportable state, a feed roller, a feed brush or the like is not required, and therefore it can be handled by the method of the present invention. (Other Embodiments) In the present invention, a constant current is used, but the current distribution ratio is determined by the groove structure. Therefore, the constant current can be handled under control. The present invention relates to a type of plating process in advance, regardless of the type of plating process in the next process, and shows that, besides the embodiment, for example, electrolytic solder plating, electrolytic tin-copper plating, electrolytic silver plating, electroless silver plating, copper can be applied. plating. Further, other processes such as patterning by uranium engraving, blackening, processing, and the like can also be applied. (Processing Example of Material to be Processed) The following is a description of the result of processing the material to be processed 3 in advance in the above-described embodiment of the present invention. To 3 is indicated below. (Processing Example 1) According to the method of the present invention, in the electroplating process of a single-sided printed wiring board, prior to electrolytic tin charging, prior treatment by electrolytic degreasing is performed. Electricity -10- 200835412 The solution is a mixed solution of caustic soda: 4 g/L, sodium carbonate 4 g/L, and sodium citrate 2 g/L. The temperature of the electrolyte was set at 45 ± 3 °C. Both the anode and the cathode were subjected to a platinum electrode plated with platinum, and the distance between the anode 1 and the positive electrode 2 was taken as 250 nm, and the distance between the electrodes 1, 2 and the material to be treated 3 was taken as 50 mm. The length of each of the electrodes 1, 2 is taken as 300 mm. The processing time is to adjust the handling speed to the anode and the cathode 2 to 30 seconds (time through each electrode). A direct current of 32 A flows between the two electrodes 1, 2. In the process in which the material to be processed 3 passes through the respective electrodes 1, 2, it is determined that gas is generated from the surface of the copper. Further, the wettability of the surface of the material to be treated 3 after the treatment was good, and the "de-plating" of the degreasing failure was not observed after the electrolytic tin plating of the next process. (Processing Example 2) As a surface treatment of a reel-shaped double-sided printed wiring board, electrolytic pickling was carried out by continuous electrolytic gold plating treatment, and electrolytic pickling by the method of the present invention was carried out. The electrolytic solution was a 5% sulfuric acid solution. The temperature of the electrolyte is set at 25 ± 5t: . The treatment is carried out in an electrolytic cell having the same groove structure as the treatment agent 1. The processing time was such that the transfer speed was adjusted so that both the cathode and the anode became 30 seconds (time passed through each electrode). The current 値 of each single side is 53A, and the DC of 106A flows at the back of the surface. The copper on the surface of the printed wiring board after the groove is treated in advance is metallic luster, indicating that electrolytic pickling is sufficiently performed. Moreover, after electrolytic metal plating, there is no ambiguity of gold, and the surface is not good. Or plating density -11 . 200835412 There is no problem with the connection. Further, the appearance of the product can be improved without using the appearance defect of the mark. (Processing Example 3) Electroless gold plating was carried out on the sheet-like printed wiring, and the electrolytic degreasing 5 as the method of the present invention in which the present invention was previously treated was continuously subjected to electrolytic pickling. In the electrolytic degreasing, a caustic solution of caustic soda: 2 g/L and sodium perrhenate 5 g/L was used, and the surface temperature was 45 d: 3 °C. The electrolytic cell tank having the same groove structure as in Treatment Example 1 was subjected to treatment. In the same manner as in the treatment example 1, the cathode and the anode were also adjusted in the same manner as in the case of the treatment of the electrode. A direct current of 32 A flows between the electrodes. In the electrolytic pickling, for example, a 5% sulfuric acid solution is used in the same manner as the treating agent 2, and the temperature of the electrolytic solution is set to 25 ± 5 °C. The treatment was carried out in an electrolytic cell having the same structure as in Treatment Example 1. The processing time is to adjust the conveyance speed to 30 seconds for both the cathode and the anode (the time for passing each electrode. The electrolysis current is 32 A. The electroless metal plating is excellent in finishing, and there are no problems other than blurring. The problem of poor appearance caused by the traces [Simplified description of the drawings] Fig. 1 is a cross-sectional view showing a pretreatment tank according to an embodiment of the present invention. Fig. 2 is a view showing the first embodiment of Fig. 1 The current flow in the tank is processed in advance. -12-200835412 Explanation of the moving method. Fig. 3 is an explanatory view showing the electric resistance of each part in the pre-processing tank shown in Fig. 1. ^ [Description of main component symbols] " 1 : anode 2 : cathode φ 3 : treated material 4 : pretreatment tank 5 : clogging roller 6 : electrolyte A : current flowing in the electrolyte B : current flowing through the material to be treated 3 R1 : anode 1 and cathode Resistance R2 between 2: Resistance φ Rm between the electrodes 1, 2 and the material to be treated 3: Resistance of the metal-13-