200817818 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種投影機，特別是指一種投影機中 的光閥模組。 【先前技術】 目前採用數位光學處理（DLP)技術之投影機，是使用 數位微鏡裝置（Digital Micro-mirror Device，DMD)為顯像 元件。如圖1、2所示，習知DMD晶片12之組裝方式係先 將DMD晶片12之入光面121承靠至一光機基座11上，再 將一設有彈片131之承座13之一表面平貼於DMD晶片12 之接合面122，後將一電路板14貼設於承座13之另一表面 。由於電路板14本身的材質容易變形，因此電路板14另 一側必須設置一用以防止電路板14變形的金屬板16 ;並為 避免電路板14與金屬板16之間產生短路，因此兩者間又 設一絕緣層15，絕緣層15係為一 Mylar片。一般DMD晶 片12、承座13、電路板14、絕緣層15與金屬板16合稱為 光閥模組。光閥模組之各元件會藉由四個止付螺絲18依序 穿過金屬板16、絕緣層15及電路板14後鎖固於光機基座 11上，同時將光閥晶片12固定於光機基座11。 然DMD晶片12能承受的壓付能力有限，為避免止付 螺絲18鎖固時造成損壞，習知是將緩衝橡膠19或壓縮彈 簧（圖未示）套入止付螺絲18後鎖附，藉此調整止付螺絲 18的鎖附力道。 DMD晶片12之接合面12上設置有複數個用來與電路 5 200817818 板14電性連接的接點（圖 能夠全部與承座13的彈片m觸$等接點在組裝時必須 片U與電路板U完全的電妾觸^樣才能使娜晶 或多個接點未㈣右嶋晶片12之一 之作叙；、首, 成热法正確控制DMD晶片12 ¥致影像會有白線條 機追求精緻小巧，内部元 “况產生。而當投影 蟫# μ 兀件都盡可能地做到微小化，可供 螺絲18鎖附的空間相對 仏 的螺絲1S於… 制，因此會採用螺絲頭較小 二18,於疋，螺絲頭底面與緩衝橡 小，鎖附壓力局部集中造心㈣㈣艾 196_„ _ 木中以成緩衝橡膠19,而使得緩衝橡膠 ’甚至又由於緩衝橡膠19為了方便套設 ;累絲18，通常緩衝橡膠19 交 T央開孔扠计為較大，因此 ，緩衝橡膠19被向外擠壓而局部或整個脫落的情況 由於四個緩衝橡膠19是各自獨立，每個螺絲18 、a產生㈣程度不—’甚至有的已脫^，導致電路板 14與光機基座n之間壓緊不—，往往導致dmd晶片以 接點接觸不良，而影響影像品質。 【發明内容】 旦本發明之一目#，即纟提供一種針對鎖附產生之變形 量易於控制且可減少組裝零件且降低組裝公差的光閥模組 〇 於是，本發明光閥模組適於藉由多數螺絲組裝於一光 機基座上，該光機基座具有多數固定部；該光閥模組包含 一顯像元件、一承座、一電路板、一緩衝片、一剛性板及 政熱構件。 200817818 顯像兀件可以為一數位微鏡裝置（Digital MiCr〇-mirror Device ’ DMD )晶片，且具有_供承靠於該光機基座的前 側，及一設有多數接點的後側。承座疊設於該顯像元件之 讜後側，並具有多數用以供該等接點對應接觸之彈片。 電路板豐設於該承座後側，且該顯像元件透過該等彈 片與。亥电路板i性連接，該顯像元件具有多數與該光機基 座之固定部相對應之穿孔。 緩衝片正片地登设於該電路板後側，該緩衝片由可彈 性變形的絕緣材質製成，例如橡膠（Rubber);緩衝片並具有 多數與該電路板之該穿孔對應之穿孔或穿槽。剛性板疊設 於該緩衝片後側，該剛性板由剛性材質製成並具有多數與 :包路板之σ亥牙孔對應之穿孔或穿槽。該緩衝片以背膠方 式貼附於該剛性板之前側，且緩衝片之大小實質上等於該 剛ί*生板之大小’而緩衝片與該剛性板之穿孔或穿槽與該電 路板之穿孔大小一致。 散熱構件裝設於該剛性板後側，包括一基板及一自該 基板則側凸設之導熱體，更可包括至少一橫跨壓抵於該基 板的定位彈片，每一定位彈片二端鎖設於其中二螺絲之端 :上°該剛性板、緩衝板、電路板及承座各在其中央處開 。又開口，該等開口相互對應貫通以供該導熱體穿置並接 觸該顯像元件接觸。 ^每一螺絲依序穿過該剛性板、緩衝片及電路板之對應 貝^的穿孔或穿槽而鎖固於該光機基座之該固定部内。 【實施方式】 200817818 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 楚的呈現。在本發明被詳細描述之前，要注意的是，在以 下的況明内容中’類似的元件是以相同的編號來表示。另 外在此先疋義一元件其面向光機基座之一側為前側，背 對光機基座之一側為後側。 參閱圖3與圖4，本發明一實施例之光閥模組包含一顯 像兀件、一承座4 ' 一電路板5、一緩衝片6，及一剛性板 7。光閥模組適於藉由多數螺絲8組裝於一光機基座2上， 光機基座2具有多數固定部21，本實施例中，係於光機基 座2之一表面23之四個角落上各設有一固定部21，固定部 21包含一由垂直凸設於表面23之凸柱211及一設於凸柱 211内之螺孔212。且光機基座2之表面23之_對角上各設 有一第一定位件22，第一定位件22可為一定位孔。 顯像元件可為一數位微鏡裝置（Digiul Micr心 ⑽⑶，DMD)晶片3qDMD晶片3具有一前側3i與一相 對於前側31之後側32，前側31承#於光機基座2，後側 32設有多數導接用接點33。 承座4疊設於DMD晶片3之後側32，並具有—前側 41及-相對於前側41之後側42，承座4之前側4ι面向 DMD晶片3之後側32 ’前側41與後側42分設有第二定位 件川及第三定位# 421，第二定位件4ιι及第三定位件 421可為定位凸柱。第二定位件411與光機基座2之第—定 位件22相配合。承座4並具有多數用以與dmd晶片3之 8 200817818 接點33對應接觸之彈片43，更詳言之，承座4上具有數個 貫穿於前側41及後側42之通孔（圖未示），彈片43係設於 通孔内。該等彈片43並導接至該電路板5。 電路板5疊設於承座4之後側42，使DMD晶片3可透 過彈片41與電路板5電性連接，電路板5具有複數個與第 二定位件421相配合之第四定位件52並具有四個與光機基 座2之固定部21相對應之穿孔51。 緩衝片6鲨片地豐设於電路板$之後側53(即電路板$ 異於承座4之一側），緩衝片6為矩形片狀且在對應電路板 5之四穿孔51處各具有四位置對應且大小一致之穿槽61或 牙孔61 (如圖5)。緩衝片6是由可彈性變形的絕緣材質（ 如橡膠（Rubber))製成。 剛性板7疊設於緩衝片6後側，剛性板7呈矩形片狀 且在對應該電路板5之四穿孔51處各具有四位置對應且大 J ’致之牙槽71或穿孔71’（如圖5 )。剛性板7由剛性材 質製成，用以防止電路板5變形。該緩衝片6之大小實質 上等於剛性板7之大小。 本貝轭例中，緩衝片6之後側係以背膠方式整片地貼 附：剛性板7前側72,並爽疊於電路板5後側53與剛性板 7雨側72之間，-方面可避免難板7與電路板$直接接 觸產生短路現象，另—方面用以調整_螺絲、8的鎖附力道 及吸收光閥模組之各零件的組裝及製造公差。 組奴％，先將DMD晶片3承靠於光機基座2，再利用 第疋位件22與第二定位件411相配合將承座4定位於光 200817818 機基座2，後利用第三定位件421與第四定位件^相配合 將電路板5定位於基座2，之後，將已貼附有緩衝片6之剛 性板7組裝於電路板5之後側53，最後，利用四個螺絲8 由:性板7之後側73往前側72依序穿過穿槽71、穿槽μ 、穿孔51後’鎖固於光機基座2之螺孔2ΐ2 π，藉此將 DMD晶片3及承^ 4夾設於剛性板7及光機基座2之間而 固定並完成光閥模組的組立。 本發明以整片式具緩衝彈力的緩衝片6取代習知緩衝 橡膠或壓縮彈簧，且緩衝片6已預先以背膠方式貼附於剛 性板7上，故可完全避免緩衝片6脫落狀況，並且透過整 式勺緩衝片6可提供車父佳的緩衝效果且對於螺絲8鎖附 的變形量也容易控制，因此能使DMD晶片3與電路板5完 全！^性連接；更進—步，由於緩衝#6相較於習知技術 可說是兼具絕緣層與緩衝橡膠的角色，相當於減少光閥模 組的組裝零件，而隨著組裝零件減少，相對於的各零件的 組裝及製造公差就變小’藉以可使影像品質可獲得較佳杵 制。 工 另外’請參_ 5，由於投影機提供之照明光線會投射 於DMD晶片3之前側31(即入光面），透過DMD晶片3將 照明光線轉換為影像光線，再透過鏡頭將影像呈現於螢幕 上，因此照明光線的熱量會累積於DMD晶片3上，故可藉 由貼附-散熱構件9達到散熱。散熱構件9 I設於剛性板; 後側73,散熱構件9包括—基板91 一自基板91前側凸 設之導熱體92、多數相互平行排設於基板91後側的散熱讀 10 200817818 =3板？:刪抵於基板91的定位彈片94。剛性板7、 70 60 路板5及承座4各在其中央處貫穿開設-開口 H50 及 40,該等開口 7〇、6〇 5〇、 ==量導出。本實施例中，利用螺絲95將每一定位彈 ―鈿鎖设於其中二對應螺絲8之端面上設置之 孔81*内’藉此將散熱構件9固定於光機基座如圖6)。 歸納上述，本發明光_組採用整片式貼附於剛性板7 ^ 6’針對鎖附產生之變形量易於控制且可減少叙 衣夺件及組裝與製造公差，確實達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已， f以此限定本發明實施之範圍，即大凡依本發明申請:利 範圍及發明說明内交所你雜〇〇 斤乍之間早的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明習知光閥模組與光機基座 的組裝對應關係； 圖2是一側剖視圖，說明圖i組合狀態； 圖3是-立體分解圖，說明本發明一實施例光閥模組 與光機基座的組裝對應關係； 圖4是-側剖視圖，說明圖3的組合狀態； 圖5疋立體分解圖，說明本實施例光闊模組與散熱 構件的組裝對應關係；及 圖6是一側剖視圖，說明圖5之組合狀態。 11 200817818 【主要元件符號說明】 2 · · · · 光機基座 52···· 第四定位件 21 · · · 固定部 53···· 後側 211 · · 凸柱 6 · · * * 緩衝片 212 · · 螺孔 60· · · · 開口 22··· 第一定位件 61···· 穿槽 23··· 表面 61， · · · 穿孔 3 * · · · DMD晶片 y . . ·. 剛性板 31 · · · 前側 70· · · · 開口 32 · · · 後側 71· · · · 穿槽 33 · · · 接點 71， · · · 穿孔 /| · · · · 承座 72···· 前側 40 · · · 開口 73···· 後側 41 · · · 前側 8 · · · · 螺絲 411 · · 第二定位件 81···· 螺孔 42 · · · 後側 9 · · · · 散熱構件 421 · · 第三定位件 91· · · · 基板 43··· 彈片 92· · · · 導熱體 5 · · · · 電路板 93· · · · 散熱鰭片 50 · · · 開口 Q 4 · · · · 彈片 51 · · · 穿孔 12200817818 IX. Description of the Invention: [Technical Field] The present invention relates to a projector, and more particularly to a light valve module in a projector. [Prior Art] At present, a projector using digital optical processing (DLP) technology uses a digital micro-mirror device (DMD) as a developing element. As shown in FIG. 1 and FIG. 2, the conventional DMD wafer 12 is assembled by first accommodating the light incident surface 121 of the DMD wafer 12 onto a illuminator base 11, and then holding a socket 13 provided with the elastic piece 131. A surface is flatly attached to the bonding surface 122 of the DMD wafer 12, and a circuit board 14 is attached to the other surface of the socket 13. Since the material of the circuit board 14 itself is easily deformed, the metal plate 16 for preventing the deformation of the circuit board 14 must be disposed on the other side of the circuit board 14; and in order to avoid a short circuit between the circuit board 14 and the metal plate 16, An insulating layer 15 is further disposed, and the insulating layer 15 is a Mylar sheet. The general DMD wafer 12, the socket 13, the circuit board 14, the insulating layer 15 and the metal plate 16 are collectively referred to as a light valve module. The components of the light valve module are sequentially locked through the metal plate 16, the insulating layer 15 and the circuit board 14 by the four stop screws 18, and then locked to the base 11 of the optical machine, and the optical valve wafer 12 is fixed at the same time. Light machine base 11. However, the DMD wafer 12 can withstand a limited pressing capacity, and in order to avoid damage caused by the locking screw 18 being locked, it is conventional to lock the cushion rubber 19 or the compression spring (not shown) into the stop screw 18, and borrow This adjusts the locking force of the stop screw 18. The bonding surface 12 of the DMD chip 12 is provided with a plurality of contacts for electrically connecting to the circuit 5 200817818 board 14 (the figure can be all connected with the spring of the socket 13 and the like. The complete electrical contact of the board U can make the nano crystal or multiple contacts not (four) one of the right-handed wafers 12; first, the heating method correctly controls the DMD wafer 12 Exquisite and compact, the internal element is generated. When the projection μ# μ 兀 is made as small as possible, the space for the screw 18 is relatively loose, and the screw 1S is 2,18, Yu Wei, the bottom of the screw head and the buffer rubber are small, the pressure of the lock is concentrated locally. (4) (4) Ai 196_„ _ Wood is used as a cushion rubber 19, so that the cushion rubber is even set by the cushion rubber 19 for convenience; The tired wire 18, usually the cushion rubber 19 is considered to be large, so that the cushion rubber 19 is pressed outwardly to partially or completely fall off because the four cushion rubbers 19 are independent, and each screw 18 , a produces (four) degree does not - 'even some have been removed ^, The pressure between the circuit board 14 and the optical base n is not caused, which often leads to poor contact of the dmd wafer, which affects the image quality. [Abstract] One of the inventions, namely, provides a lock for the attachment. The light valve module is easy to control and can reduce the assembly tolerance and reduce the assembly tolerance. Therefore, the light valve module of the present invention is suitable for being assembled on a light machine base by a plurality of screws, the light machine base has a plurality of fixing portions; the light valve module comprises a developing component, a socket, a circuit board, a buffer sheet, a rigid board and a political heat member. The device can be a digital micro mirror device (Digital MiCr) a 〇-mirror Device 'DMD) chip having a front side for bearing against the base of the optical machine and a rear side provided with a plurality of contacts. The socket is stacked on the rear side of the developing element, and There are a plurality of shrapnels for the corresponding contacts of the contacts. The circuit board is augmented on the rear side of the socket, and the developing element is connected to the black board through the elastic sheets, and the developing element has a majority The fixed part of the base of the optical machine is opposite The buffer sheet is positively mounted on the rear side of the circuit board, the buffer sheet is made of an elastically deformable insulating material, such as rubber; the buffer sheet has a plurality of perforations corresponding to the perforations of the circuit board. Or a slotted plate. The rigid plate is stacked on the rear side of the buffer sheet, and the rigid plate is made of a rigid material and has a plurality of perforations or slots corresponding to the σ 牙 牙 of the road board. Attached to the front side of the rigid board, and the size of the buffer sheet is substantially equal to the size of the rigid board, and the perforation or slot of the buffer sheet and the rigid board is the same as the size of the perforation of the circuit board. The rear side of the rigid board includes a substrate and a heat conducting body protruding from the side of the substrate, and further comprising at least one positioning elastic piece that is pressed against the substrate, and the two ends of each positioning elastic piece are locked therein. The end of the two screws: upper ° The rigid plate, the buffer plate, the circuit board and the socket are each opened at the center. Further, the openings are open to each other for the heat conductor to pass through and contact the developing element. ^ Each screw is sequentially locked in the fixing portion of the base of the optical machine through the corresponding perforation or slot of the rigid plate, the buffer sheet and the circuit board. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is to be noted that the same elements are denoted by the same reference numerals in the following description. In addition, the first side of the unit is a front side facing the optical base, and the side facing the base of the optical machine is the rear side. Referring to Figures 3 and 4, a light valve module according to an embodiment of the present invention comprises a display member, a holder 4', a circuit board 5, a buffer sheet 6, and a rigid board 7. The light valve module is adapted to be assembled on a base 2 of the optical machine by a plurality of screws 8. The base 2 of the optical machine has a plurality of fixing portions 21, and in this embodiment, it is attached to the surface 23 of one of the bases 2 of the optical machine 2. Each of the corners is provided with a fixing portion 21 . The fixing portion 21 includes a protruding post 211 protruding perpendicularly from the surface 23 and a screw hole 212 disposed in the protruding post 211 . A first positioning member 22 is disposed on each of the opposite sides of the surface 23 of the optical unit base 2. The first positioning member 22 can be a positioning hole. The developing element can be a digital micromirror device (Digiul Micr core (10) (3), DMD). The wafer 3qDMD wafer 3 has a front side 3i and a front side 32 opposite to the front side 31. The front side 31 carries the lighter base 2 and the rear side 32. A plurality of contact contacts 33 are provided. The socket 4 is stacked on the rear side 32 of the DMD wafer 3 and has a front side 41 and a rear side 42 opposite to the front side 41. The front side 4 of the socket 4 faces the rear side 32 of the DMD wafer 3 and the front side 41 and the rear side 42 are separated. There is a second positioning member and a third positioning member 421. The second positioning member 4ι and the third positioning member 421 can be positioning protrusions. The second positioning member 411 is engaged with the first positioning member 22 of the optical base 2. The socket 4 has a plurality of shrapnel 43 for corresponding contact with the 8200817818 contact 33 of the dmd wafer 3. More specifically, the socket 4 has a plurality of through holes extending through the front side 41 and the rear side 42 (Fig. Shown), the elastic piece 43 is disposed in the through hole. The elastic pieces 43 are guided to the circuit board 5. The circuit board 5 is stacked on the rear side 42 of the socket 4, so that the DMD wafer 3 can be electrically connected to the circuit board 5 through the elastic piece 41. The circuit board 5 has a plurality of fourth positioning members 52 matched with the second positioning member 421. There are four perforations 51 corresponding to the fixing portions 21 of the optomechanical base 2. The buffer sheet 6 is shredded on the rear side 53 of the circuit board (ie, the circuit board is different from one side of the socket 4), and the buffer sheet 6 has a rectangular sheet shape and has a plurality of perforations 51 at the corresponding circuit board 5 A slot 61 or an aperture 61 corresponding to the four positions and having the same size (see FIG. 5). The cushion sheet 6 is made of an elastically deformable insulating material such as rubber. The rigid plate 7 is stacked on the rear side of the buffer sheet 6, and the rigid plate 7 has a rectangular sheet shape and has four positions corresponding to the four perforations 51 corresponding to the circuit board 5 and a large J's alveolar 71 or perforation 71' ( As shown in Figure 5). The rigid plate 7 is made of a rigid material to prevent deformation of the circuit board 5. The size of the cushion sheet 6 is substantially equal to the size of the rigid board 7. In the example of the present yoke, the rear side of the cushioning sheet 6 is attached in a one-piece manner in a backing manner: the front side 72 of the rigid board 7 and is stacked between the rear side 53 of the circuit board 5 and the rain side 72 of the rigid board 7, It can avoid the short circuit between the hard board 7 and the circuit board, and the other is to adjust the assembly and manufacturing tolerances of the parts of the _screw, 8 locking force and absorbing light valve module. The group slaves, firstly, the DMD wafer 3 is supported by the base 2 of the optical machine, and then the second clamping member 22 is used to cooperate with the second positioning member 411 to position the socket 4 on the base 2 of the light 200817818, and then use the third The positioning member 421 cooperates with the fourth positioning member to position the circuit board 5 on the base 2, and then, the rigid board 7 to which the buffer sheet 6 has been attached is assembled to the rear side 53 of the circuit board 5, and finally, four screws are used. 8: The rear side 73 of the flexible plate 7 and the front side 72 sequentially pass through the through slot 71, the through slot μ, and the through hole 51, and then 'locked to the screw hole 2ΐ2 π of the base 2 of the optical machine, thereby using the DMD chip 3 and The bearing 4 is sandwiched between the rigid plate 7 and the base 2 of the optical machine to fix and complete the assembly of the light valve module. The present invention replaces the conventional cushion rubber or the compression spring with the whole piece of cushioning elastic cushioning sheet 6, and the cushioning sheet 6 has been attached to the rigid board 7 in a backing manner in advance, so that the cushioning sheet 6 can be completely prevented from falling off. Moreover, the cushioning sheet 6 of the whole spoon can provide the buffering effect of the car owner and the deformation amount of the locking of the screw 8 can be easily controlled, so that the DMD wafer 3 and the circuit board 5 can be completely completed! ^Sexual connection; more advanced, because buffer #6 can be said to have both the role of insulation layer and cushion rubber compared to the conventional technology, which is equivalent to reducing the assembly parts of the light valve module, and with the reduction of assembly parts, The assembly and manufacturing tolerances of the various parts are reduced, so that the image quality can be better controlled. In addition, please refer to _ 5, because the illumination light provided by the projector will be projected on the front side 31 (ie, the light incident surface) of the DMD wafer 3, and the illumination light is converted into image light through the DMD wafer 3, and then the image is presented through the lens. On the screen, heat of the illumination light is accumulated on the DMD wafer 3, so that heat can be dissipated by attaching the heat dissipating member 9. The heat dissipating member 9 is disposed on the rigid plate; the rear side 73, the heat dissipating member 9 includes a substrate 91, a heat conductor 92 protruding from the front side of the substrate 91, and a plurality of heat dissipation readings arranged in parallel with each other on the rear side of the substrate 91. 200817818=3 ? : The positioning elastic piece 94 of the substrate 91 is deleted. The rigid plates 7, 70, 60, and the sockets 4 each open through the opening-openings H50 and 40 at the center thereof, and the openings 7, 6〇 5〇, == are derived. In this embodiment, each of the positioning springs is locked by a screw 95 in the hole 81* provided on the end surface of the two corresponding screws 8, thereby fixing the heat dissipating member 9 to the optical base as shown in Fig. 6). In summary, the light-group of the present invention is affixed to the rigid plate 7^6' in a one-piece manner for easy control of the amount of deformation caused by the locking and can reduce the tolerance of the garment and assembly and manufacturing tolerances, and indeed achieves the object of the present invention. However, the above is only the preferred embodiment of the present invention, and f is used to limit the scope of the practice of the present invention, that is, the application according to the present invention: the scope of interest and the description of the invention. Early equivalent changes and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing the assembled relationship between a conventional light valve module and a light machine base; FIG. 2 is a side sectional view showing the assembled state of FIG. i; FIG. 3 is an exploded perspective view. FIG. 4 is a side cross-sectional view illustrating the combined state of FIG. 3; FIG. 5 is an exploded perspective view illustrating the optical module of the present embodiment and the optical module of the present embodiment. The assembly relationship of the heat dissipating members; and FIG. 6 is a side cross-sectional view illustrating the combined state of FIG. 5. 11 200817818 [Explanation of main component symbols] 2 · · · · Optome base 52···· Fourth positioning member 21 · · · Fixing part 53···· Rear side 211 · · Stud 6 · · * * Buffer Sheet 212 · · Screw hole 60 · · · · Opening 22 ··· First positioning member 61···· Through groove 23··· Surface 61, · · · Perforation 3 * · · · DMD wafer y . . . Rigid plate 31 · · · Front side 70 · · · · Opening 32 · · · Rear side 71 · · · · Through groove 33 · · · Contact 71, · · · Perforation /| · · · · · Seat 72··· · Front side 40 · · · Opening 73 ···· Rear side 41 · · · Front side 8 · · · · Screw 411 · · Second positioning piece 81···· Screw hole 42 · · · Rear side 9 · · · · Heat dissipating member 421 · · Third positioning member 91 · · · · Substrate 43 · · · Spring 92 · · · · Thermal body 5 · · · · Circuit board 93 · · · · Heat sink fin 50 · · · Opening Q 4 · · · · Shrapnel 51 · · · Perforation 12