TWI310873B

TWI310873B -

Info

Publication number: TWI310873B
Application number: TW95137152A
Authority: TW
Inventors: Chia Lun Liu; Tai Li Chang
Original assignee: Coretronic Corp
Priority date: 2006-10-05
Filing date: 2006-10-05
Publication date: 2009-06-11
Also published as: TW200817818A

Description

1310873 九、發明說明：【發明所屬之技術領域】本發明是有關於一種投影機，特別是指一種投影機中的光閥模組。【先前技術】目两採用數位光學處理（DLP)技術之投影數位微鏡裝置（Digital Micro-mirror Device，DMD)為顯像1310873 IX. Description of the Invention: [Technical Field] The present invention relates to a projector, and more particularly to a light valve module in a projector. [Prior Art] Two digital optical processing (DLP) technology digital micro-mirror device (DMD) is used for imaging

兀件。如圖1、2所示，習知DMD晶片之組裝方式係先將DMD晶片12之入光面121承靠至一光機基座i]L上，再將一設有彈片131之承座13之一表面平貼於DMD晶片12 之接。面122，後將一電路板14貼設於承座13之另一表面。由於電路板14本身的材質容易變形，因此電路板14另一側必須設置一用以防止電路板14變形的金屬板16;並為避免電路板U與金屬板16之間產生短路，因此兩者間又 Γ絕緣層15，絕緣層15係為—Μ細片一般獅晶光^承座^13、電路板14、絕緣層15與金屬板16合稱為先閥杈組。光閥模組之各门穿過金屬“、絕緣層 11上，同時將光間晶片12:定:：14後鎖固於繼然獅晶片12 承機基座u。螺絲U鎖固時造成損壞，付能力有限，為避免止付簧（圖未示）套人止付螺疋將&衝橡膠19或壓縮彈 18的鎖附力道。 ’、後鎖附，藉此調整止付螺絲 DMD晶片12之接合面^ 上設置有複數個用來與電路 5 1310873 板14電性連接能夠全部與承座13的彈片^該等接點在組裝時必須片^ 131接觸，這樣才能使DMD晶 “料14完全的電性軸，若膽或多個接點未接觸，則合片2之之作動而導致影像二…〆去正確控制DMD晶片12 機追求浐緻丨9線條等不良情況產生。而當投影螺辞二：巧’内部元件都盡可能地做到微小化，可供的相對受到限制，因此會採用螺絲頭較小、、、疋’螺絲頭底面與緩衝橡勝19的接觸面積變小，鎖附壓力局部集中造積欠】珉衝橡膠19，而使得緩衝橡膠於螺絲ιΓ王度不一’甚至又由於緩衝橡膝19為了方便套設 *易二’通常緩衝橡膠19的中央開孔設計為較大，因此 :易發生㈣轉19被向外播壓而局部或整個㈣的情況再者’由於四個緩衝橡膠19是各自獨立，每個螺絲Μ 鎖附時產生變形程度不一’甚至有的已脫落導致電路板 14與光機基座u之間壓緊不―，往往導致η·晶片u之接點接觸不良，而料影像品質。【發明内容】 θ I月之目的，即在提供一種針對鎖附產生之變形里易於控制且可減少組裝零件且降低組裝公差的光閥模組於疋，本發明光閥模組適於藉由多數螺絲組裝於一光機基座上’遠光機基座具有多數固定#;該光閥模組包含 -顯像元件、H、—電路板缓衝片、—剛性板及一散熱構件。 1310873 择員像元件可以為一數位微鏡裝置（Digital Micro_mirror Device ’ DMD)晶片，且具有一供承靠於該光機基座的前側’及一設有多數接點的後側。承座疊設於該顯像元件之 s亥後侧，並具有多數用以供該等接點對應接觸之彈片。電路板疊設於該承座後側，且該顯像元件透過該等彈片與該電路板電性連接，該顯像元件具有多數與該光機基座之固定部相對應之穿孔。緩衝片整片地疊設於該電路板後側，該緩衝片由可彈性變形的絕緣材質製成，例如橡膠（Rubber);緩衝片並具有多數與該電路板之該穿孔對應之穿孔或穿槽。剛性板疊設於該緩衝片後側，該剛性板由剛性材質製成並具有多數與該電路板之該穿孔對應之穿孔或穿槽。該緩衝片以背膠方式貼附於該剛性板之前側’且緩衝片之大小實質上等於該剛性板之大小，而緩衝片與該剛性板之穿孔或穿槽與該電路板之穿孔大小一致。散熱構件裝設於該剛性板後側，包括一基板及一自該基板前側凸設之導熱體，更可包括至少一橫跨壓抵於該基板的定位彈片，每一定位彈片二端鎖設於其中二螺絲之端面上。該剛性板、緩衝板、電路板及承座各在其中央處開設一開口，該等開口相互對應貫通以供該導熱體穿置並接觸該顯像元件接觸。母一螺絲依序穿過该剛性板、緩衝片及電路板之對應貝通的穿孔或穿槽而鎖固於該光機基座之該固定部内。【實施方式】 7 1310873 有關本發明之前述及其他技術内容、特點與功效，在以下配〇參考圖式之一較佳實施例的詳細說明中，將可清楚的呈現。在本發明被t羊細描述之前，要注意的是，在以下的說明内容中，類似的元件是以相同的編號來表示。另外，在此先定義一元件其面向光機基座之一側為前側，背對光機基座之一側為後側。 ^ 3與圖4，本發明一實施例之光閥模組包含一顯Mail. As shown in FIG. 1 and FIG. 2, the conventional DMD wafer is assembled by first feeding the light incident surface 121 of the DMD wafer 12 to a light machine base i]L, and then holding a socket 13 provided with the elastic piece 131. One of the surfaces is flatly attached to the DMD wafer 12. The surface 122 is followed by a circuit board 14 attached to the other surface of the socket 13. Since the material of the circuit board 14 itself is easily deformed, a metal plate 16 for preventing deformation of the circuit board 14 must be disposed on the other side of the circuit board 14; and in order to avoid a short circuit between the circuit board U and the metal plate 16, both The insulating layer 15 is interposed, and the insulating layer 15 is a Μ Μ 一般一般一般一般一般一般一般一般一般一般一般一般一般一般一般、、、、、、。。。。。。。。。。。。。 The doors of the light valve module pass through the metal ", the insulating layer 11, and at the same time, the inter-optical wafer 12: fixed: 14 and then locked on the base of the relay lion chip 12. The damage caused by the screw U is locked. The ability to pay is limited, in order to avoid the stop spring (not shown), the set of people will stop the screw and the rubber 19 or the compression bomb 18 will be attached to the force. ', rear lock, thereby adjusting the stop screw DMD chip The joint surface of the 12 is provided with a plurality of elastic pieces for electrically connecting to the circuit 14 1310873, and all of the contacts of the socket 13 must be in contact with each other during assembly, so that the DMD crystal material can be made. 14 complete electrical axis, if the gallbladder or multiple contacts are not in contact, then the action of the splicing 2 causes the image 2 to properly control the DMD wafer 12 machine to pursue the 线条 9 line and other undesirable conditions. And when the projection thread 2: Qiao 'internal components are as small as possible, the available is relatively limited, so the screw head is smaller, and the contact area between the bottom of the screw head and the cushion rubber 19 is used. It becomes smaller, and the partial pressure of the lock is concentrated. The rubber 19 is used, so that the cushion rubber is different from the screw ', and even because of the cushioning rubber knee 19, it is easy to set the sleeve. The hole is designed to be large, so: it is easy to occur. (4) The turn 19 is externally broadcasted and partially or entirely (4). Again, since the four cushion rubbers 19 are independent, each screw 锁 is deformed to a different degree. 'Even if it has fallen off, the board 14 and the base u of the optical machine are not pressed together, which often leads to poor contact of the contacts of the η· wafer u, and the image quality is good. SUMMARY OF THE INVENTION The purpose of θ I is to provide a light valve module that is easy to control for deformation caused by the lock and that can reduce assembly parts and reduce assembly tolerances. The light valve module of the present invention is suitable for Most of the screws are assembled on a pedestal base. The high-end machine base has a plurality of fixings. The light valve module includes a developing element, H, a circuit board buffer sheet, a rigid board and a heat dissipating member. The 1310873 optional image component can be a Digital Micro_mirror Device (DMD) wafer and has a front side for bearing against the base of the optical machine and a rear side with a plurality of contacts. The socket is superposed on the rear side of the developing element, and has a plurality of elastic pieces for corresponding contact of the contacts. The circuit board is stacked on the rear side of the socket, and the image forming element is electrically connected to the circuit board through the elastic piece. The image forming element has a plurality of perforations corresponding to the fixing portion of the optical machine base. The buffer sheet is stacked on the back side of the circuit board, and the buffer sheet is made of an elastically deformable insulating material, such as rubber; the buffer sheet has a plurality of perforations or holes corresponding to the perforations of the circuit board. groove. A rigid plate is stacked on the back side of the cushion sheet, the rigid plate being made of a rigid material and having a plurality of perforations or slots corresponding to the perforations of the circuit board. The buffer sheet is attached to the front side of the rigid board in a backing manner and the size of the buffer sheet is substantially equal to the size of the rigid board, and the perforation or the slot of the buffer sheet and the rigid board are the same as the perforation of the circuit board. . The heat dissipating member is disposed on the rear side of the rigid board, and includes a substrate and a heat conductor protruding from the front side of the substrate, and further comprising at least one positioning elastic piece that is pressed against the substrate, and the two ends of each positioning elastic piece are locked. On the end face of two of the screws. The rigid plate, the buffer plate, the circuit board and the socket are each provided with an opening at a center thereof, and the openings are correspondingly penetrated for the heat conductor to pass through and contact the developing element. The female screw is sequentially inserted into the fixing portion of the base of the optical machine through the perforation or slot of the corresponding rigid hole, the buffer sheet and the circuit board. [Embodiment] 7 1310873 The foregoing and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. Further, here, an element is defined such that one side facing the base of the optical machine is the front side, and one side facing the base of the optical machine is the rear side. ^3 and FIG. 4, a light valve module according to an embodiment of the present invention includes a display

像元件承座4、-電路板5、一緩衝片6，及一剛性板 7。光閥模組適於藉由多數螺絲8組裴於一光機基座2上，光機基座2具有多數固定部21，本實施例中，係於光機基座2之一表面23之四個角落上各設有-固^部21，固定部包含一由垂直凸設於表面23之凸柱2ιι及一設於凸柱 211内之螺孔212。且光機基座2之表面23之―對角上各設有一第一定位件22,第一定位件22可為一定位孔。顯像元件可為一數位微鏡裝置（Digita〗 Micr〇 mh〇rLike the component holder 4, the circuit board 5, a buffer sheet 6, and a rigid board 7. The light valve module is adapted to be mounted on a light machine base 2 by a plurality of screws 8 . The light machine base 2 has a plurality of fixing portions 21 . In this embodiment, it is attached to one surface 23 of the light machine base 2 . Each of the four corners is provided with a fixing portion 21, and the fixing portion includes a protruding post 2 ι which is vertically protruded from the surface 23 and a screw hole 212 which is disposed in the protruding post 211. A first positioning member 22 is disposed on each of the opposite sides of the surface 23 of the optical unit base 2. The first positioning member 22 can be a positioning hole. The imaging element can be a digital micromirror device (Digita Micr〇 mh〇r

DeWce’DMD)晶片3dDMD晶片3具有一前側Η與一相DeWce'DMD) wafer 3dDMD wafer 3 has a front side and a phase

對於前側之後側32,前側31承靠於錢基座2,後側 32設有多數導接用接點33。 3之後側32，並具有一前側承座4疊設於DMD晶片 41及-相對於前側41之後側42,承座4之前側Ο面向 DMD晶片3之後側32’前側41與後側心分設有第二定位件421’第二定位件4ΐι及第三定位件 421可為定位凸柱。第二定位件4]1與光機基座2之第—定位件22相配合。承座4並具有多數用以與dmd晶片3之 8 1310873 接點33一對應接觸之彈片43，更詳言之，承座4上具有數個貫穿於前側4!及後側42之通孔（圖未示），彈片43係設於通孔内。該等彈片43並導接至該電路板5。電路板5疊設於承座4之後側42，使DMD晶片3可透過彈片41與電路板5電性連接’電路板5具有複數個與第三定位件421相配合之第四定位件52並具有四個與光機基座2之固疋部21相對應之穿孔5工。For the front side rear side 32, the front side 31 bears against the money base 2, and the rear side 32 is provided with a plurality of guide contacts 33. 3 rear side 32, and having a front side socket 4 stacked on the DMD wafer 41 and - with respect to the front side 42 of the front side 41, the front side of the socket 4 facing the rear side 32' of the DMD wafer 3 is provided with a front side 41 and a rear side The second positioning member 421 ′ and the third positioning member 421 may be positioning ribs. The second positioning member 4]1 cooperates with the first positioning member 22 of the base 2 of the optical machine. The socket 4 has a plurality of elastic pieces 43 for making a corresponding contact with the 8 1310873 contacts 33 of the dmd wafer 3. More specifically, the socket 4 has a plurality of through holes extending through the front side 4! and the rear side 42 ( (not shown), the elastic piece 43 is disposed in the through hole. The elastic pieces 43 are guided to the circuit board 5. The circuit board 5 is stacked on the rear side 42 of the socket 4, so that the DMD wafer 3 can be electrically connected to the circuit board 5 through the elastic piece 41. The circuit board 5 has a plurality of fourth positioning members 52 matched with the third positioning member 421. There are four perforations corresponding to the solid portion 21 of the optomechanical base 2.

緩衝片6整片地疊設於電路板5之後側53(即電路板$ 異方、承座4之一側)’緩衝片6為矩形片狀且在對應電路板 5之四穿孔51處各具有四位置對應且大小一致之穿槽w或穿61 (如圖5 )。緩衝片6是由可彈性變形的絕緣材質（如橡夥（Rubber))製成。剛性板7疊設於鳐彳缸y A 4 v , 1又万、攱衝片6後側，剛性板7呈矩形片狀且在對應该電路板5之四穿孔51處各具有四位置對應且大小一致之穿槽71或穿孔71，（如圖5)。剛性板7由剛性材質製成，用以防止雷级如c μ 毛路板5變形。該緩衝片ό之大小實質上等於剛性板7之大小。、、本Λ施例中，、友衝片6之後側係以背膠方式整片地貼附於剛性板7 W側72，並夾疊於電路板5後側％與剛性板 7别側7 2之間，一方面可徹备閉丨了 G免剛性板7與電路板5直接接觸產生短路現象’另—方®田丨、/ ^田Φ4· 万面用以调整—螺絲8的鎖附力道及吸收光閥模組之各零件的組裝及製造公差。組裝時，先將DMD晶η 1 t ^ υ日日片3承罪於光機基座2，再利用第一定位件22與第二定位件411知❻人件411相配合將承座4定位於光 9 1310873 =^’_用第三定位件421與第四定位件52相配合性:板5疋位於基座2，之後，將已貼附有緩衝片6之剛 7組裝於電路板5之後側53’最後，利由剛性板7之後側73往前側72依序穿過穿槽71、穿累样糸Μ8 DIT：r後，鎖固於光機基座2之螺孔212 ^藉此將 ^、,曰曰片3及承座4夾設於剛性板7及光機基座2之間而口疋並元成光閥模組的組立。The buffer sheet 6 is stacked on the back side 53 of the circuit board 5 (ie, the circuit board is different from the side of the socket 4). The buffer sheet 6 has a rectangular sheet shape and is respectively at the four perforations 51 of the corresponding circuit board 5. A slot w or a 61 with a uniform position and a uniform size (see Fig. 5). The cushion sheet 6 is made of an elastically deformable insulating material such as a rubber. The rigid plate 7 is stacked on the rear side of the cylinder y A 4 v , 1 10,000 and the ram 6 , and the rigid plate 7 has a rectangular shape and has four positions corresponding to the four through holes 51 corresponding to the circuit board 5 and A slot 71 or a perforation 71 of uniform size (see Figure 5). The rigid plate 7 is made of a rigid material to prevent deformation of the lightning level such as the c μ hair plate 5. The size of the cushion sheet is substantially equal to the size of the rigid plate 7. In the present embodiment, the rear side of the friend punching sheet 6 is attached to the rigid board 7 W side 72 in a back-to-back manner, and is sandwiched on the rear side of the circuit board 5 and the other side of the rigid board 7 2, on the one hand, can completely close the G-free rigid board 7 and the circuit board 5 direct contact to produce a short circuit phenomenon 'other - side 丨丨, / ^ field Φ4 · million face for adjustment - screw 8 lock Assembly and manufacturing tolerances for the components of the force and absorption light valve modules. When assembling, the DMD crystal η 1 t ^ υ 日片 3 is first blamed on the illuminator base 2, and then the first locating member 22 is used to cooperate with the second locating member 411 to identify the shank 4 to position the yoke 4 Light 9 1310873 = ^ '_ with the third positioning member 421 and the fourth positioning member 52: the plate 5 is located on the base 2, after which the rigid 7 to which the buffer sheet 6 has been attached is assembled to the circuit board 5 Finally, the side 53' of the rigid plate 7 passes through the through slot 71 in the front side 72, and passes through the through hole 71 DIT:r, and is locked to the screw hole 212 of the base 2 of the optical machine. The ^, the cymbal 3 and the socket 4 are interposed between the rigid plate 7 and the illuminator base 2, and the port is assembled into a light valve module.

橡牌tr以整片式具緩衝彈力的緩衝片6取代習知緩衝 2或壓縮«，且緩衝片6已預先以轉方式貼附於剛 7上，故可完全避免緩衝片6脫落狀況，並且片：的，片6可提供較佳的緩衝效果且對於螺絲8鎖：的變形量也容易控制，因此能使DMD晶片3與電路板$完 ^的純連接；更造—步’由於緩衝4 6相較於習知技術可祝是兼具絕緣層與緩衝橡膠的角色，相當於減少光間模組的組裝零件’而隨著組裝零件減少，相對於的各零件的The rubber card tr replaces the conventional buffer 2 or the compression « with the cushion elastic plate 6 of the whole piece, and the buffer sheet 6 has been attached to the just 7 in a rotating manner in advance, so that the release condition of the cushion sheet 6 can be completely avoided, and Sheet: The sheet 6 can provide a better cushioning effect and the amount of deformation for the screw 8 lock can be easily controlled, so that the DMD wafer 3 can be purely connected to the circuit board, and the step is made by the buffer 4 Compared with the prior art, 6 is expected to have the role of both insulating layer and cushion rubber, which is equivalent to reducing the assembled parts of the optical module, and as the assembled parts are reduced, relative to the parts.

組裝及製造公差就變小’藉以可使影像品質可獲得較佳控制。另外，請㈣® 5，由於投影機提供之㈣光線會投射 ^ DMD晶片3之前側31(即入光面）’透過DMD晶片3將照明光線轉換為影像光線’再透過鏡頭將影像呈現於螢幕上，因此照明光線的熱量會累積於DMD晶片3 ±，故可藉由貼附—散熱構件9達到散熱。散熱構件9裝設於剛性板I 後側73 ’散熱構件9包括-基板91、-自基板91前側凸設之導熱體92、多數相互平行排設於基板91後側的散熱韓 10 1310873 片93,及二橫跨壓抵於基板9ι 螻尜杧 < 而 J疋仅5早片94。剛性板7、 ♦衝板6、電路板5及承座 7n cn 處貝牙開設一開口 7〇、60、50 及 40，該等開口 7〇、6〇 0、40相互對應以Assembly and manufacturing tolerances are reduced, which allows for better control of image quality. In addition, please (4)® 5, because the projector provides (4) light will project the front side 31 of the DMD wafer 3 (ie, the light incident surface) 'convert the illumination light into image light through the DMD wafer 3' and then present the image on the screen through the lens Therefore, the heat of the illumination light is accumulated on the DMD wafer 3±, so that the heat dissipation can be achieved by attaching the heat dissipation member 9. The heat dissipating member 9 is mounted on the rear side 73 of the rigid board 1. The heat dissipating member 9 includes a substrate 91, a heat conductor 92 protruding from the front side of the substrate 91, and a plurality of heat radiating elements arranged in parallel with each other on the rear side of the substrate 91. And the second cross is pressed against the substrate 9 ι 蝼尜杧 < and J 疋 only 5 early 94. The rigid plate 7, the punching plate 6, the circuit board 5, and the socket 7n cn have an opening 7〇, 60, 50 and 40, and the openings 7〇, 6〇 0, 40 correspond to each other.

七·、體92穿置並與DMD晶片3接觸，藉以將DM 上的熱量導出。本實施例中，利用螺絲％將每一定位彈 94以其—端鎖設於其中二對應螺絲8之端面上設置之螺孔81内，藉此將散熱構件9固定於光機基座2(如圖6)。、歸納上述’本發明光閥模組採用整片式貼附於剛性板7 〇緩衝片6，針對鎖附產生之變形量易於控制且可減少袓裝零件及組裝與製造公差，確實㈣本發明之目的。、 ▲ 1·隹以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請:利範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍内。【圖式簡單說明】7. The body 92 is placed and brought into contact with the DMD wafer 3 to thereby derive heat from the DM. In this embodiment, each of the positioning springs 94 is locked at its end to the screw holes 81 provided on the end faces of the two corresponding screws 8, thereby fixing the heat dissipating member 9 to the optical base 2 ( As shown in Figure 6). In summary, the above-mentioned light valve module of the present invention is attached to the rigid plate 7 〇 cushioning sheet 6 in a one-piece manner, and the deformation amount generated by the locking is easy to control and the armored parts and assembly and manufacturing tolerances can be reduced, and indeed (4) the present invention The purpose. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the application according to the present invention: the scope of the invention and the simplicity of the description of the invention, etc. Both effect changes and modifications are still within the scope of the invention patent. [Simple description of the map]

圖1是一立體分解圖，說明習知光閥模組與光機基座的組裝對應關係；圖2是一側剖視圖，說明圖1組合狀態；圖3是一 JL體分解圖，說明本發明一實施例光閥模組與光機基座的組裝對應關係；圖4是一側剖視圖，說明圖3的組合狀態；圖5是一立體分解圖，說明本實施例光閥模組與散熱構件的組裝對應關係；及圖6是一側剖視圖，說明圖5之組合狀態。 11 1310873 【主要元件符號說明】1 is an exploded perspective view showing the assembled relationship between a conventional light valve module and a light machine base; FIG. 2 is a side sectional view showing the assembled state of FIG. 1; FIG. 3 is an exploded view of the JL body, illustrating an embodiment of the present invention. FIG. 4 is a cross-sectional view showing the assembled state of FIG. 3; FIG. 5 is an exploded perspective view showing the assembly of the light valve module and the heat dissipating member of the present embodiment. Corresponding relationship; and Fig. 6 is a side cross-sectional view illustrating the combined state of Fig. 5. 11 1310873 [Description of main component symbols]

2 · · · · 光機基座 52· · · · 第四定位件 21 · · · 固定部 53··· · 後側 211 · · 凸柱 6 · · · · 缓衝片 212 · · 螺孔 60···· 開口 22··· 第一定位件 61·.·· 穿槽 23 · · · 表面 61，··· 穿孔 3 · · · · DMD晶片 7 · · · · 剛性板 31 · · · 前側 70· · · · 開口 32 · · · 後側 71· · · · 穿槽 33 · · · 接點 71，... 穿孔 4 · · · · 承座 72···· 前側 40 · · · 開口 73···· 後側 41 · · · 前側 8 · · · · 螺絲 411 · · 第二定位件 81···· 螺孑L 42 · · · 後側 g .... 散熱構件 421 · · 第三定位件 91· · · 基板 43 · · · 彈片 92· · · · 導熱體 5 · · · · 電路板 93· · · · 散熱鰭片 50 · · · 開口 94· · · 彈片 51 · · 穿孔 122 · · · · Optome base 52 · · · · 4th positioning piece 21 · · · Fixing part 53 · · · · Back side 211 · · Stud 6 · · · · Buffer piece 212 · · Screw hole 60 ···· Opening 22··· First positioning member 61···· Through groove 23 · · · Surface 61, ··· Perforation 3 · · · · DMD wafer 7 · · · · Rigid plate 31 · · · Front side 70· · · · Opening 32 · · · Back side 71 · · · · Through groove 33 · · · Contact 71,... Perforation 4 · · · · Seat 72···· Front side 40 · · · Opening 73 ···· Rear side 41 · · · Front side 8 · · · · Screw 411 · · Second positioning piece 81···· Screw L 42 · · · Rear side g .... Heat dissipation member 421 · · Third Positioning member 91· · · Substrate 43 · · · Spring 92 · · · · Thermal body 5 · · · · Circuit board 93 · · · · Heat sink fin 50 · · · Opening 94 · · · Spring 51 · · Perforation 12

Claims

1310873 十、申請專利範圍： 1. 一種光閥模組，適於藉由多數螺絲組裝於一光機基座上，S玄光機基座具有多數固定部，該光閥模組包含：一顯像兀件，具有一供承靠於該光機基座的前侧，及一設有多數接點的後側；一承座，疊設於該顯像元件之該後側，該承座具有 ^數用以供5玄寺接點對應接觸之彈片；1310873 X. Patent application scope: 1. A light valve module is suitable for being assembled on a base of a light machine by a plurality of screws. The base of the S-light machine has a plurality of fixing portions, and the light valve module comprises: an image a member having a front side for supporting the base of the optical machine and a rear side provided with a plurality of contacts; a socket superposed on the rear side of the imaging element, the holder having ^ The number of shrapnel used for the contact of the 5 Xuan Temple contacts;

一電路板，疊設於該承座後側，且該顯像元件透過 6亥等彈片與該電路板電性連接，該顯像元件具有多數與該光機基座之固定部相對應之穿孔；緩衝片，整片地疊設於該電路板後側，該緩衝片由可彈性變形的絕緣材質製成，並具有多數與該電路板之該穿孔對應之穿孔或穿槽；及 W ,剛性板，疊設於該緩衝片後側，該剛性板由剛性貝衣成並具有多數與該電路板之該穿孔對應之穿穿槽；义每螺絲依序穿過該剛性板、緩衝片及電路板之。' v牙札或穿槽而鎖固於該光機基座之該固定部内 …：：申請專利範圍第1項所述之光閥模組，其中，該緩 @片及該阿】性# 致。反之牙孔或穿槽與該電路板之穿孔大小一 3.依據申嗜# 衝Η 乾圍第1項所述之光閥模组，其中，該緩夕式貼附於該剛性板之前側。 13 1310873 4·依射請專利範圍第1項所述之光閥模組，其中，該顯像元件為一數位微鏡裝置（Digita〗 Micr〇 mirr〇r Device ’ DMD )晶片。 5. 依據中請專利範圍帛i項所述之光閥模組，更包含一裝設於該剛性板後側的散熱構件，該散熱構件包括一基板及-自該基板前側凸設之導熱體，該剛性板、緩衝板、電路板及承座各在其中央處開設—開口，該等開口相互對應貫通以供該導熱體穿置並與該顯像元件接觸。 6. 依據巾請專利範圍第5項所述之光_組，其中，該散熱構件更包括至少—橫跨壓抵於該基板的定位彈片，該疋位彈片二端鎖設於其中二螺絲之端面上。 L依據中請專利範圍第i項所述之光閥模組，其中，機=座具有至少一第一定位件’該承座之前側具有一與該第一定位件相配合之第二定位件。 /、 8·依射請專利範圍第1項所述之_模組，其中，該座之後側具有―第三^位件，該電路板具有_與該第三疋位件相配合之第四定位件。 9.依據中請專利範圍第i項所述之光_組，其中，計衝片與剛性板為矩形片狀，且該緩衝片之大小實質= 於該剛性板之大小。 '寻 10·依據申請專利範圍第1項所述之光間模組，其中，衝片為橡膠（Rubber)。 14a circuit board is stacked on the rear side of the socket, and the image forming element is electrically connected to the circuit board through a shrapnel such as 6 hai, and the developing element has a plurality of perforations corresponding to the fixing portion of the base of the optical machine. a buffer sheet, which is stacked on the back side of the circuit board, the buffer sheet is made of an elastically deformable insulating material, and has a plurality of perforations or slots corresponding to the perforations of the circuit board; and W, rigidity a plate stacked on the rear side of the buffer sheet, the rigid board being formed of a rigid bead and having a plurality of through slots corresponding to the perforations of the circuit board; each screw sequentially passes through the rigid board, the buffer sheet and the circuit Board of the. The v-shaped or slotted and locked in the fixing portion of the base of the optical machine...:: The light valve module according to claim 1, wherein the slow-up piece and the a-sexuality . Conversely, the size of the perforation or the through hole and the perforation of the circuit board is as follows: 3. The light valve module according to the first item of the application of the invention, wherein the retardation type is attached to the front side of the rigid plate. 13 1310873 4. The light valve module according to claim 1, wherein the image forming element is a digital micromirror device (Digita Micr〇 mirr〇r Device ’ DMD) wafer. 5. The light valve module of claim 1, further comprising a heat dissipating member mounted on a rear side of the rigid plate, the heat dissipating member comprising a substrate and a heat conductor protruding from a front side of the substrate The rigid plate, the buffer plate, the circuit board and the socket each have an opening at the center thereof, and the openings are correspondingly penetrated for the heat conductor to pass through and be in contact with the developing element. 6. The light_group according to claim 5, wherein the heat dissipating member further comprises at least a positioning elastic piece that is pressed against the substrate, and the two ends of the clamping elastic piece are locked to the two screws. On the end face. The light valve module according to the invention of claim 1, wherein the machine=seat has at least one first positioning member. The front side of the socket has a second positioning member matched with the first positioning member. . /, 8. In accordance with the scope of the patent scope, the module, wherein the back side of the seat has a "third position", the circuit board has _ with the third clamp Positioning piece. 9. The light_group according to item i of the patent application, wherein the punching sheet and the rigid board are rectangular sheets, and the size of the buffer sheet is substantially the size of the rigid board. The search for the optical module according to claim 1, wherein the punch is rubber. 14