200817120 九、發明說明： 【發明所屬之技術領域】 本發明係有關於使用旋轉刀具形成工件（例如印刷電 路板）之外形的外形加工方法。 【先前技術】 在加工印刷電路板的情況，在包含有多片成為產品之 印刷電路板（以下稱為「產品電路板」）的大印刷電路板（以 下稱為「母電路板」）之狀態，進行鑽孔加工及鑽孔後的電 鍍加工後’從母電路板切出產品電路板（外形加工）。依此 方式可縮短鑽孔加工步驟及鑽孔後的電鍵步驟之準備時 間0 為了提高產品電路板的可靠性，利用配置於工具之周 邊的集塵装置從加工部周邊除去在鑽孔加工時及外形加工 時所產生的切屑（專利文獻j)。200817120 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a profile processing method for forming a shape of a workpiece (e.g., a printed circuit board) using a rotary cutter. [Prior Art] In the case of processing a printed circuit board, a state of a large printed circuit board (hereinafter referred to as a "mother circuit board") including a plurality of printed circuit boards (hereinafter referred to as "product circuit boards") After drilling and drilling after drilling, 'cut out the product board from the mother board (shape processing). In this way, the drilling process step and the preparation time of the key step after drilling can be shortened. 0 In order to improve the reliability of the product board, the dust collecting device disposed around the tool is removed from the periphery of the processing portion during the drilling process and Chips generated during contour processing (Patent Document j).
a在多層印刷電路板將配置於絕緣物之上下的圖案層以 電札式連接的情況’藉由形成通孔，並進行電鍍處理，而 在通孔之内部形成電鍍層並以電氣式連接。 第2圖係在以往之外形加工時的產品電路板之平面 :’圖中之箭號τ表示旋轉刀具的轉向’而箭號c表示切 削方向（旋轉刀具的移動方向）。 _ . - - — 二一 ％呀双乙的汗周 形）’配置向外周開口的通孔(圖示的情況為半圓形” 外形加工用之旋轉刀具5(常用直徑卜2叫以下稱為 5 222l^8998-PF;Ahddub 200817120 轉刀具5」）切削已形成電鍍層4之通孔1時，電鍍層4之 一部分常發生剝離（以下將剝離之電鍍層稱為「毛邊6」）。 毛邊6與通孔1端部的電鍍層的連接不堅固。大部分的毛 邊6雖然在加工時利用集塵裝置吸掉，但是一部分在加工 後依然和電鍍層4連接。因為毛邊6係具有導電性，所以 毛邊6因故脫離產品電路板2時，有所脫離之毛邊6使產 品電路板2之端子間變成短路的情況。毛邊6產生於旋轉 刀具5從電路板侧進入通孔1之側（脫離側）的交叉部，而a: In the case where the pattern layer disposed under the insulator is connected in an electric pattern by the multilayer printed circuit board, a through hole is formed and subjected to a plating treatment, and a plating layer is formed inside the via hole and electrically connected. Fig. 2 is a plan view of a product circuit board in the conventional outer shape processing: 'The arrow τ in the figure indicates the turning of the rotary tool' and the arrow c indicates the cutting direction (the moving direction of the rotary tool). _ . - - - 21% 呀 乙 的 周 ) ' ' ' ' ' ' ' ' ' ' ' ' ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 5 222l^8998-PF; Ahddub 200817120 Rotary cutter 5") When the through hole 1 of the plating layer 4 is formed, one portion of the plating layer 4 is often peeled off (hereinafter, the peeled plating layer is referred to as "burr 6"). 6 The connection with the plating layer at the end of the through hole 1 is not strong. Most of the burrs 6 are sucked away by the dust collecting device during processing, but some are still connected to the plating layer 4 after processing. Because the burr 6 is electrically conductive. Therefore, when the burr 6 is detached from the product board 2, the burrs 6 are separated to cause a short circuit between the terminals of the product board 2. The burrs 6 are generated on the side of the rotary cutter 5 that enters the through hole 1 from the side of the board ( Off the side of the intersection, and
在從通孔1進入電路板側的交叉部未產生。因此，以往進 行所谓的反轉加工。 第3圖係表示反轉加工的加工步驟之圖。 如第3(a)圖所示，首先，對產品電路板2之外形（圖 中以一點鏈線表示之和紙面垂直的面。以下稱為「精加工 面s」）加工偏置量係g的面（以下稱為「一次加工面f」）。 此外，在加工—次加^ F的情況，減將產品電路板2 之:部分㈣電路板3連接，並預先作成在將母電路板3 進行表背反轉時工件2不會脫離母電路板3。 3(b)圖所示，將母電路板3進行表背反轉， 之移動方向設為相同，加工精加工面s。 接著，如第 並將旋轉刀具5There is no intersection at the intersection from the through hole 1 into the board side. Therefore, in the past, so-called reverse processing has been performed. Fig. 3 is a view showing a processing procedure of reverse processing. As shown in Fig. 3(a), first, the external offset of the product circuit board 2 (the surface perpendicular to the paper surface indicated by a dotted line in the figure. Hereinafter referred to as the "finished surface s") is offset. The surface (hereinafter referred to as "one-time processing surface f"). In addition, in the case of processing-addition of F, the part (4) of the circuit board 2 of the product circuit board 2 is connected, and the workpiece 2 is not preliminarily removed from the mother board when the mother board 3 is reversed. 3. As shown in Fig. 3(b), the mother board 3 is reversed in the front and back directions, and the moving direction is set to be the same, and the finished surface s is processed. Next, as in the first and will rotate the tool 5
將已形成一次加工面之母雷敗& Q 、 霉路板3進行表背反轉時，g 為在一次加工所產生的毛邊 、 迓b破配置於旋轉刀具5從通子 1進入電路板侧之側，所以 ★弟3(c)圖所示，在形成精力 工面S時從產品電路板2降》 去。在精加工的情況，雖然功 有在叙轉刀具5從產品電路杯9 电硌扳2侧進入通孔〗之側產生毛 2221-8998-PF;Ahddub 6 200817120 邊6的情況，但是若預先將偏置量g設為小（例如〇〇5mm)， 所產生之毛邊6的大小係微小。因此，所產生之毛邊6即 使脫離產品電路板2，亦幾乎不會降低產品電路板2之作 為產品的可靠性。 此外，在此雖然說明旋轉刀具5係右轉（正轉）用的情 況，但是即使旋轉刀具5係左轉（反轉）用，產生毛邊6的 位置亦係旋轉刀具5從母電路板3向通孔〗脫離之側。 [專利文獻1]特開平3 — 178707號公報 【發明内容】 【發明要解決之課題】 可疋’在進行反轉加工的情況，因為需要從加工工作 台拆下母電路板之步驟、將母電路板進行反轉的步驟、以 及將已反轉之母電路板安裝於加工工作台的步驟，所以準 備時間變長。X，由於母電路板之安裝不良，可能發生加 工不良。 本發明之目的在於提供一種外形加工方法，其係不會 降低產品電路板之作為產品的可#性，並可提高加工效率θ。 【解決課題之手段】 為了解決上述之課題，本發明（例如參 種 ，少…布 1圓；保一 外形加工方法，其係利用旋轉刀具（5)之切削加工而形成 工件(2)的外周面⑻，其特徵在於：在和所形成之該工件 的外周面（s)交叉之空洞部（1)存在的情況，該旋轉刀具 對該工件移動，並在形成該工件的外周面時對該空洞部（1) 2221-8998-PF;Ahddub 7 200817120 之該旋轉刀具的移動 所形成之工件的外周 (7)加工排屑孔（8); 方向(C)上游側之交叉部⑻，以和該 面⑻發生干涉之方式利用鑽孔手段 然後，在使該旋轉刀具(5)之刀刀的轉 所形成的工件之外周面(文成對該 夕灿…、该方疋轉刀具的移動方向（C) 以從該排屑孔⑻往該空洞部⑴進入的方式移動 該方疋轉刀具（5)，而形成該工件之外When the female surface of the machined surface is formed, and the mold board 3 is reversed, the g is a burr generated in one process, and the 迓b is broken and disposed on the rotary tool 5 from the pass 1 to the circuit board. On the side of the side, so as shown in Fig. 3(c), it is lowered from the product board 2 when the energetic face S is formed. In the case of finishing, although the function of the cutter 5 is from the side of the product circuit cup 9 to the side of the through hole, the hair is produced 2221-8998-PF; Ahddub 6 200817120 is the case of the side 6, but if it is The offset amount g is set to be small (for example, 〇〇5 mm), and the size of the generated burrs 6 is small. Therefore, even if the generated burrs 6 are separated from the product board 2, the reliability of the product board 2 as a product is hardly lowered. In addition, although the case where the rotary tool 5 is turned right (forward rotation) is described here, even if the rotary tool 5 is used for the left turn (reverse rotation), the position where the burr 6 is generated is also the rotary cutter 5 from the mother board 3 The through hole is separated from the side. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. 178707. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] In the case of performing reverse machining, the step of removing the mother board from the processing table is required. The step of inverting the board and the step of mounting the inverted mother board on the processing table make the preparation time longer. X, due to poor mounting of the mother board, poor processing may occur. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for processing an outer shape which does not reduce the usability of a product circuit board as a product and can improve the processing efficiency θ. [Means for Solving the Problem] In order to solve the above-described problems, the present invention (for example, a seed, a small cloth), and a shape processing method for forming a periphery of a workpiece (2) by a cutting process of a rotary cutter (5) a surface (8) characterized in that, in the case where a cavity portion (1) intersecting the outer peripheral surface (s) of the formed workpiece exists, the rotary cutter moves the workpiece and forms the outer peripheral surface of the workpiece Cavity (1) 2221-8998-PF; Ahddub 7 200817120 The outer circumference of the workpiece formed by the movement of the rotary cutter (7) processing the chip evacuation hole (8); the intersection (8) of the upstream side of the direction (C), and The surface (8) is interfered by means of a drilling means and then the outer surface of the workpiece formed by the rotation of the cutter of the rotary cutter (5) (the text is the same as the movement of the cutter) C) moving the square turning tool (5) in such a manner as to enter from the chip removing hole (8) toward the cavity portion (1), and forming the workpiece
該鐵孔手段係鑽頭⑺，加工該排屑孔 刀刃的轉向（U)係和該旋轉刀1 碩之 較佳。 疋轉刀具⑸之刀料轉向⑴相反 此外，括弧内之符號等雖然係用以和圖面對照的，但 是不是因而對申請專利範圍有任何影響的。 【發明效果】 若依據本發明，不會使產品電路板之作為產品的可靠 性降低’並可提高加工效率。 【實施方式】 以下，具體地說明本發明。 第1圖係表示本發明之加工步驟的說明圖，（a)係表示 鑽頭之鑽孔步驟，（b)係表示外形加工步驟。 母電路板3已加工有通孔1，在此通孔1之内周面形 成有電鍍層4。使鑽頭及旋轉刀具5轉動之印刷電路板加 工機的主軸係可正轉及反轉。 一般’因為鑽頭大多為右轉用的，所以在此準備右轉 2221-8998-PF;Ahddub 8 200817120 用^頭7和左轉用的旋轉刀具5。此外，在旋轉刀且 的情況，右轉用及左轉用的任-種都可易於買到。^ 步紅利用鑽頭7加工排屬孔8。、 因為鑽頭7係右轉用的 _ 8和精加工面〜 如弟1Μ圖所不，以排屑 1 >、k孔1之父叉部D發生 頭7之軸線定位，並對母電路m /的方式將鑕 頭7在交…入 路板3加工排層孔8。因為鐵 未產生毛邊 付近攸通孔1側向母電路板3切入，所以 =將鑽6頭此外:在通孔1之直_如係的情 面 之直徑设為職，將排屬孔8和精加工 工面；為γ涉的距離k設為約°.〇25mm即可。即，設精加 並將六I立方向、和精加工面S垂直之方向為Y方向， 二如："(在此，忽略電鐘層4之厚度)設為原點時， 卿7鑽碩7之軸線〇決定為（〇’（). 375>另外，在此情況’ .、之轴線0的X座標即使設為—〇 ι〜〇 ι(—。。5〜〇.〇5 較佳）都在實用上無問題。 步驟2.利用旋轉刀具5加卫精加工面s(外形）。 將旋轉刀具5之轉向Τ設定成對所形成的工件2之精 加工面s按照該旋轉刀具5的移動方向c，在加工有排屑 孔!之交又部&使旋轉刀具5進入通μ並進行加工。即， 如弟1(b)圖所示，朝向右方向移動左轉之旋轉刀具5，並 對精加工面3進行加工。在旋轉刀具5進入通孔i時，因 為此部分之電鍍層4已被除去，所以在交又•"不會產生 毛邊6。又，在交叉部E附近因為旋轉刀具5之刀刃從通 孔1侧進入母電路板3，所以不會產生毛邊6。 2221-8998-pf. PF;Ahddub 200817120 在此實施例雖然作成在深度方向削除 但是關於此尺寸’亦在實用上無問題之範圍内 了增大或細小。 又’鑽頭7之直徑及旋轉刀具5的直 問題之範園内可變更。 …、 又，在使用左轉用之鑽頭7的情況，在第1(a)圖之交 叉部E侧加工排眉$8 /^# 排屑孔8而奴轉刀具5採用右轉用時，同 時將旋轉刀具5之移動方向從右方向改成左方向即可。 又，亦可替代旋轉刀具5的移動.，而使工件2移動。 又，排屑孔8之加工因為可使用和外形加工步驟相同的印 刷電路板加工機，雖，然利用鑽頭較佳，但是未必限定如此， 亦可利用雷射加工機等其他的鑽孔手段進行加卫。 如以上之說明所示，若依據本發明，因為不必將母電 路板3反轉，所以可提高加工效率。而且，和以往之反轉 力工相異’因為完全未產生毛邊6,所以可更提高產品電 路板2的可靠性。 本發明者在母電路板3係板厚〇· 5關之玻璃環氧樹月旨 土板的清況’以往重璺片數至多2片，而在本發明的情況， 即使將重豐片數設為5片’亦不會產生毛邊6，確認可大 幅度提高加工效率。 【圖式簡單說明】 第1 (a)圖至第1(b)圖係表示本發明之加工步驟的說 明圖。 10 2221-8998-PF/Ahddub 200817120 第 圖係在以往之夕卜 形加工時的產The iron hole means is a drill bit (7), and the turning (U) system for machining the chip opening edge and the rotary blade 1 are preferably. The tool turning of the twisting tool (5) is reversed. (1) In addition, although the symbols in the brackets are used in comparison with the drawing, it does not have any influence on the scope of the patent application. [Effect of the Invention] According to the present invention, the reliability of the product board as a product is not lowered, and the processing efficiency can be improved. [Embodiment] Hereinafter, the present invention will be specifically described. Fig. 1 is an explanatory view showing a processing procedure of the present invention, wherein (a) shows a drilling step of a drill bit, and (b) shows an outer shape processing step. The mother board 3 has been machined with a through hole 1 in which a plating layer 4 is formed on the inner peripheral surface of the through hole 1. The spindle of the printed circuit board processing machine that rotates the drill bit and the rotary cutter 5 can be rotated forward and reverse. Generally, since the drill is mostly used for right turn, it is prepared to turn right 2221-8998-PF; Ahddub 8 200817120 uses the head 7 and the rotary tool 5 for left turn. Further, in the case of rotating the knife, any of the right-turning and the left-turning can be easily obtained. ^ Step red uses the drill bit 7 to machine the row of holes 8. Because the drill bit 7 is used for the right turn _ 8 and the finished surface ~ such as the brother 1 map, the chip 1 >, the parent fork D of the k hole 1 occurs the axis of the head 7 and the mother circuit m / The way to put the hoe 7 in the intersection ... into the board 3 processing the row of holes 8. Because the iron does not produce a burr, the side of the through hole 1 is cut into the side of the mother circuit board 3, so = 6 will be drilled in addition: in the straight hole of the through hole 1 as the diameter of the system is set to serve, will be the hole 8 and Finishing work surface; the distance k for γ is set to about ° 〇 25mm. That is, it is set to finely add the direction of the six I vertical direction and the direction perpendicular to the finished surface S to the Y direction, and the second direction: " (here, the thickness of the electric clock layer 4 is ignored) is set as the origin, The axis of the 7 is determined as (〇'(). 375> In addition, in this case'. The X coordinate of the axis 0 is set to -〇ι~〇ι(-..5~〇.〇5 Good) There is no problem in practical use. Step 2. Use the rotary tool 5 to add the finishing surface s (outer shape). Set the turning Τ of the rotating tool 5 to the finishing surface s of the formed workpiece 2 according to the rotating tool The moving direction c of 5 is processed at the intersection of the chip removing hole! The other part of the rotating tool 5 is turned into the pass μ and processed. That is, as shown in the figure 1 (b), the left turn is rotated in the right direction. The tool 5 is machined to the finishing surface 3. When the rotating tool 5 enters the through hole i, since the plating layer 4 of this portion has been removed, the intersection and the "no burr 6" are generated. In the vicinity of the portion E, since the blade of the rotary cutter 5 enters the mother board 3 from the side of the through hole 1, no burr 6 is generated. 2221-8998-pf. PF; Ahddub 200817120 Although the embodiment is made to be cut in the depth direction, the size is also increased or reduced in a practically problem-free range. Further, the diameter of the drill bit 7 and the straight problem of the rotary cutter 5 can be changed. In the case of using the drill 7 for the left turn, the eyebrows $8 /^# the chip evacuation hole 8 is machined on the intersection E side of the first figure (a), and the slave tool 5 is used for the right turn, and the rotary cutter is simultaneously used. The movement direction of 5 can be changed from the right direction to the left direction. Further, instead of the movement of the rotary cutter 5, the workpiece 2 can be moved. Further, the processing of the chip evacuation hole 8 can be performed by using the same printing process as the profile processing step. Although the circuit board processing machine is preferably a drill bit, it is not necessarily limited thereto, and may be reinforced by other drilling means such as a laser processing machine. As shown in the above description, according to the present invention, since it is not necessary Since the mother board 3 is reversed, the processing efficiency can be improved. Moreover, unlike the conventional reversal work, the reliability of the product board 2 can be further improved because the burrs 6 are not generated at all. Plate 3 series plate thickness 〇 · 5 In the case of the present invention, even if the number of heavy pieces is set to 5 pieces, no burrs 6 are produced, and it is confirmed that the condition of the glass epoxy tree is as high as 2 pieces. The processing efficiency is greatly improved. [Brief Description] Fig. 1(a) to Fig. 1(b) are diagrams showing the processing steps of the present invention. 10 2221-8998-PF/Ahddub 200817120 The figure is in the past Production at the time of processing
品電路板之平面 第3(a)圖至第 步驟之圖。 3(c)圖係表示以往之反轉加工的加工 【主要元件符號說明】 1〜通孔（空洞部）； 7〜鑽頭（鑽孔手段）； D〜交叉部； 5〜旋轉刀具； 8~排屑孔， S〜精加工面（外周面）。 2221-8 998-PF;Ahddub 11Plane of the board Figure 3 (a) to the figure of the step. 3(c) shows the processing of the reverse machining in the past [Description of the main components] 1~through hole (cavity); 7~ drill (drilling means); D~intersection; 5~rotary tool; 8~ Chip removal hole, S ~ finishing surface (outer peripheral surface). 2221-8 998-PF; Ahddub 11