JPH058198A - Method for machining contour of printed board - Google Patents
Method for machining contour of printed boardInfo
- Publication number
- JPH058198A JPH058198A JP16066091A JP16066091A JPH058198A JP H058198 A JPH058198 A JP H058198A JP 16066091 A JP16066091 A JP 16066091A JP 16066091 A JP16066091 A JP 16066091A JP H058198 A JPH058198 A JP H058198A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- reference hole
- holes
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント配線板の外形加
工方法に係り、詳しくは基準穴が外形線近くに形成され
たプリント配線板の外形加工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board outer shape processing method, and more particularly to a printed wiring board outer shape processing method in which a reference hole is formed near the outer shape line.
【0002】[0002]
【従来の技術】プリント配線板の組立作業は組立コスト
の低減と品質の向上を図る目的で、手作業から自動組立
へと移行しつつある。特に高密度化が可能な表面実装方
式を採用したプリント配線板の組立作業は、部品自体が
小さいこともあって、人手で行うことが難しいため、ほ
とんどが自動組立機によって行われている。これらの自
動組立機ではプリント配線板にあけた基準穴にガイドピ
ンを挿入して位置決めを行う方式のものが多く、図2
(a)に示すようにプリント配線板21には外形線22
の近くに基準穴23が形成されている。そして、従来は
プリント配線板21の外形加工を行う際、図2(b)に
示すようにプリント配線板21の外形線と同じ位置に形
成された金型打抜き線24に沿って金型でプレス打ち抜
きを行っていた。2. Description of the Related Art Assembling work of a printed wiring board is shifting from manual work to automatic assembly for the purpose of reducing the assembling cost and improving the quality. In particular, most of the assembling work of a printed wiring board adopting a surface mounting method capable of increasing the density is performed by an automatic assembling machine because the parts themselves are small and it is difficult to perform them manually. Many of these automatic assembling machines adopt a method of positioning by inserting a guide pin into a reference hole formed in a printed wiring board.
As shown in (a), the printed wiring board 21 has an outline 22
A reference hole 23 is formed near the. Then, conventionally, when the outer shape of the printed wiring board 21 is processed, as shown in FIG. 2B, a die is pressed along a die punching line 24 formed at the same position as the outer shape line of the printed wiring board 21. I was punching.
【0003】[0003]
【発明が解決しようとする課題】ところが、基準穴23
は外形線の近くに形成されているため、プレス打ち抜き
の際に基準穴23と外形線22との間の樹脂の白化(劣
化)が起こり、当該部分が組立作業時に破壊して位置決
めに支障を来す虞があった。白化を防ぐため基準穴23
と外形線との距離を大きくすると、プリント配線板21
の各種電子部品搭載可能面積が減少するという問題があ
る。However, the reference hole 23
Since the resin is formed near the outline, whitening (deterioration) of the resin between the reference hole 23 and the outline 22 occurs during press punching, and the portion is destroyed during the assembly work, which hinders positioning. There was a risk of coming. Reference hole 23 to prevent whitening
If the distance between the external wiring and the outline is increased, the printed wiring board 21
There is a problem that the mountable area of various electronic components is reduced.
【0004】本発明は前記の問題点に鑑みてなされたも
のであって、その目的はプリント配線板の外形線の近く
に基準穴が形成されていても、プリント配線板の外形加
工の際に基準穴と外形線との間の樹脂の白化を招くこと
がないプリント配線板の外形加工方法を提供することに
ある。The present invention has been made in view of the above problems, and an object thereof is to perform external processing of a printed wiring board even if a reference hole is formed near the external line of the printed wiring board. An object of the present invention is to provide a printed wiring board outer shape processing method which does not cause whitening of resin between the reference hole and the outer shape line.
【0005】[0005]
【課題を解決するための手段】前記の目的を達成するた
め本発明においては、プリント配線板の基準穴の近傍に
複数の孔を、隣接する孔の中心間隔が孔の直径より小さ
く、かつその周面が外形線の延長線より内側で連続する
状態に形成し、その後、外形線に沿って金型でプレス打
抜きを行うようにした。In order to achieve the above object, according to the present invention, a plurality of holes are provided in the vicinity of a reference hole of a printed wiring board, and the center distance between the adjacent holes is smaller than the diameter of the holes. The peripheral surface was formed so as to be continuous inside the extension line of the contour line, and thereafter, punching was performed with a mold along the contour line.
【0006】[0006]
【作用】プリント配線板の外形加工を行う際、基準穴の
近傍に複数の孔がその周面が外形線の延長線より内側で
連続する状態に形成されて外形線に沿った長孔が形成さ
れた後、外形線に沿ってプレス打抜きが行われる。従っ
て、プレス打抜きの際に金型は、基準穴と対応する位置
ではプリント配線板に接触せずに前記長孔部分を通過
し、当該部分ではプリント配線板に加圧力が加わらず基
準穴と外形線との間の樹脂の白化が確実に防止される。When the outer shape of the printed wiring board is processed, a plurality of holes are formed in the vicinity of the reference hole so that the peripheral surface is continuous inside the extension line of the outline line to form a long hole along the outline line. After that, press punching is performed along the outline. Therefore, at the time of punching by press, the die passes through the long hole portion without contacting the printed wiring board at the position corresponding to the reference hole, and in that portion, no pressure is applied to the printed wiring board and the outer shape of the reference hole and the outer shape. The whitening of the resin between the lines is reliably prevented.
【0007】[0007]
【実施例】以下、本発明を具体化した一実施例を図1に
従って説明する。プリント配線板1には外形線(金型打
抜線)2に近接して基準穴3が形成されている。スルー
ホールめっき、パターニング、ソルダレジスト印刷等の
工程が完了した後の外形加工の際、図1(a)に示すよ
うにまず基準穴3の近傍にプリント配線板1の外形線2
より外側に中心を有する孔4を、隣接する各孔4の周面
の一部が外形線2の延長線より内側で連続する状態に多
数形成する。これにより基準穴3の近傍に外形線に沿っ
た長孔5が形成されて図1(b)の状態となる。次に外
形線2に沿ってプレス打抜きが行われる。このとき金型
(図示せず)は外形線2に沿ってプリント配線板1を剪
断するが、基準穴3と対応する箇所は既に長孔5により
切断されているため、当該部分ではプリント配線板1に
加圧力が加わらず基準穴3と外形線2との間の樹脂の白
化(劣化)が確実に防止される。従って、基準穴3と外
形線2との間が狭くても、当該部分が破壊する虞はなく
組立作業時の位置決めに支障を来すことがない。又、各
孔4の周面の連続部は多少凹凸となるが、当該部分が外
形線2の延長線の内側にあるため、当該部分がプリント
配線板1をケース等に収容する際に支障となることはな
い。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. A reference hole 3 is formed in the printed wiring board 1 in the vicinity of the outline (die punching line) 2. At the time of outer shape processing after completion of processes such as through-hole plating, patterning, and solder resist printing, as shown in FIG. 1A, first, the outer shape line 2 of the printed wiring board 1 is provided in the vicinity of the reference hole 3.
A large number of holes 4 having a center on the outer side are formed in a state in which a part of the peripheral surface of each adjacent hole 4 is continuous inside the extension line of the outline 2. As a result, the elongated hole 5 along the outline is formed in the vicinity of the reference hole 3, and the state shown in FIG. 1B is obtained. Next, press punching is performed along the outline 2. At this time, the mold (not shown) shears the printed wiring board 1 along the outline 2, but the portion corresponding to the reference hole 3 has already been cut by the long hole 5, so that the printed wiring board is cut at that portion. The whitening (deterioration) of the resin between the reference hole 3 and the outer shape line 2 is reliably prevented without applying a pressing force to 1. Therefore, even if the distance between the reference hole 3 and the outer shape line 2 is narrow, there is no possibility that the portion will be destroyed, and there will be no hindrance in positioning during assembly work. Further, the continuous portion of the peripheral surface of each hole 4 is somewhat uneven, but since the portion is inside the extension line of the outline 2, the portion interferes when the printed wiring board 1 is housed in a case or the like. It never happens.
【0008】[0008]
【発明の効果】以上詳述したように、本発明によれば電
子部品搭載可能面積を減少しないようにプリント配線板
の外形線の近くに基準穴を形成しても、プリント配線板
の外形加工の際に基準穴と外形線との間の樹脂の白化
(劣化)を確実に防止でき、組立作業時に当該部分が破
壊することがなく位置決めに支障を来す虞がないAs described above in detail, according to the present invention, even if the reference hole is formed near the outline of the printed wiring board so as not to reduce the mountable area of the electronic component, the external processing of the printed wiring board is performed. In this case, it is possible to reliably prevent whitening (deterioration) of the resin between the reference hole and the outer shape line, and there is no fear that the part will be damaged during assembly work and positioning will not be hindered.
【図1】本発明を具体化した一実施例の外形加工手順を
示す概略図である。FIG. 1 is a schematic view showing an outline processing procedure of an embodiment embodying the present invention.
【図2】(a)はプリント配線板の部分平面図、(b)
は従来の外形加工方法を説明する概略図である。FIG. 2A is a partial plan view of a printed wiring board, and FIG.
FIG. 6 is a schematic diagram illustrating a conventional outer shape processing method.
1…プリント配線板、2…外形線、3…基準穴、4…
孔、5…長孔。1 ... Printed wiring board, 2 ... Outline line, 3 ... Reference hole, 4 ...
Holes, 5 ... long holes.
Claims (1)
近傍に複数の孔(4)を、隣接する孔(4)の中心間隔
が孔(4)の直径より小さく、かつその周面が外形線
(2)の延長線より内側で連続する状態に形成し、その
後、外形線(2)に沿って金型でプレス打抜きを行うこ
とを特徴とするプリント配線板の外形加工方法。Claims: 1. A plurality of holes (4) are provided in the vicinity of a reference hole (3) of a printed wiring board (1), and the center distance between adjacent holes (4) is the diameter of the holes (4). A printed wiring characterized in that it is smaller and its peripheral surface is continuous inside the extension line of the contour line (2), and then punching is performed with a die along the contour line (2). Board external processing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16066091A JPH058198A (en) | 1991-07-01 | 1991-07-01 | Method for machining contour of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16066091A JPH058198A (en) | 1991-07-01 | 1991-07-01 | Method for machining contour of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH058198A true JPH058198A (en) | 1993-01-19 |
Family
ID=15719741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16066091A Pending JPH058198A (en) | 1991-07-01 | 1991-07-01 | Method for machining contour of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH058198A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002030636A1 (en) * | 2000-10-11 | 2002-04-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board production method and circuit board production data |
JP2010287626A (en) * | 2009-06-09 | 2010-12-24 | Shinko Seisakusho:Kk | Printed wiring board and method of manufacturing the same |
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
-
1991
- 1991-07-01 JP JP16066091A patent/JPH058198A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002030636A1 (en) * | 2000-10-11 | 2002-04-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board production method and circuit board production data |
US7097394B2 (en) | 2000-10-11 | 2006-08-29 | Matsushita Electric Industrial Co., Ltd. | Circuit board production method and circuit board production data |
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
JP2010287626A (en) * | 2009-06-09 | 2010-12-24 | Shinko Seisakusho:Kk | Printed wiring board and method of manufacturing the same |
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