JPH08181411A - Outer shape processing method of printed wiring board - Google Patents
Outer shape processing method of printed wiring boardInfo
- Publication number
- JPH08181411A JPH08181411A JP31983594A JP31983594A JPH08181411A JP H08181411 A JPH08181411 A JP H08181411A JP 31983594 A JP31983594 A JP 31983594A JP 31983594 A JP31983594 A JP 31983594A JP H08181411 A JPH08181411 A JP H08181411A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- outer shape
- printed wiring
- cutting tool
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Milling, Drilling, And Turning Of Wood (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子部品の搭載用又は
電子装置の構成部品として使用される種々のプリント配
線板の外形加工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing the outer shape of various printed wiring boards used for mounting electronic parts or as constituent parts of electronic devices.
【0002】[0002]
【従来の技術】一般に、プリント配線板の外形加工に
は、打ち抜きやミーリングによる外形加工の他に、NC
ルーターによる外形加工が知られている。基板の外形加
工は、その手法によって仕上がりの程度が個々に異な
り、特に、NCルーターによる外形加工では、切削した
端面が平滑でしかも高い直角度が得られることから、最
近では積層板レベルにまで採用されている。今後は、高
密度配線化が進むにつれて、基板端面からの小片による
断線防止を目的としたルーター仕様品の増大が予想され
る。通常のルーター加工では、ドリルに似たルータービ
ットと呼ばれる切削工具が使用される。この切削工具
は、ビット先端側の外周部分に切刃を備えており、基板
の外形加工時にはその切刃部分で基板を削り取ってい
く。2. Description of the Related Art Generally, in addition to punching or milling, NC is generally used for external processing of printed wiring boards.
Outline processing by a router is known. Depending on the method used, the degree of finish differs for each board's outer shape processing. Especially, in the case of the outer shape processing with an NC router, the cut edge surface is smooth and a high squareness can be obtained. Has been done. In the future, as high-density wiring is advanced, it is expected that the number of router-specification products for the purpose of preventing disconnection due to small pieces from the board end face will increase. In normal router machining, a cutting tool called a router bit similar to a drill is used. This cutting tool is provided with a cutting edge on the outer peripheral portion on the tip side of the bit, and the substrate is scraped off by the cutting edge portion when the outer shape of the substrate is processed.
【0003】図2は従来におけるプリント配線板の外形
加工方法を説明する図であり、図中(a)は外形加工済
み基板を示す部分平面図、(b)はそのA部拡大図であ
る。なお、ここでは半導体装置等のベース材料として使
用されるプリント配線板を例に挙げて説明する。先ず、
加工対象となる基板1には、それ以前の基板製造工程で
既に配線パターンや保護膜(レジスト膜)の形成、さら
には電極部分へのメッキや識別のための文字印刷等の処
理が施されている。こうして製作された基板1には、配
線パターン(不図示)が形成された有効領域2ととも
に、パターン無しの無効領域3が有効領域2の周辺に設
けられており、それらの境目には切削工具の切り込み経
路(移動経路)となる境界線(図中一点鎖線で示す)L
が規定されている。2A and 2B are views for explaining a conventional external shape processing method for a printed wiring board, in which FIG. 2A is a partial plan view showing the externally processed substrate, and FIG. 2B is an enlarged view of part A thereof. Here, a printed wiring board used as a base material for a semiconductor device or the like will be described as an example. First,
The substrate 1 to be processed has already been subjected to a process such as formation of a wiring pattern and a protective film (resist film), plating on the electrode portion and character printing for identification in the substrate manufacturing process before that. There is. The substrate 1 thus manufactured is provided with an effective area 2 having a wiring pattern (not shown) and an ineffective area 3 having no pattern in the periphery of the effective area 2. Boundary line (indicated by a dashed line in the figure) that serves as a cut path (moving path) L
Is specified.
【0004】基板の外形加工時には、先ず、切削工具を
高速で回転させつつ、その刃先部分を基板1の境界線L
上に挿入し、これにより切削工具の切刃部分が基板1を
貫通したら、基板1と切削工具の相対位置を変化させな
がら規定の境界線Lにならって切削工具を横方向に移動
させる。これにより、図2(a)に示すように、基板1
の有効領域2と無効領域3の境界部分に切削工具の削り
込みによるスリット4が形成され、このスリット4の有
効領域2側の切削面4aが最終的なプリント配線板の仕
上げ端面となる。ちなみに、半導体装置等のベース材料
として使用されるプリント配線板の場合は、部品搭載や
半導体素子の樹脂封止等を終えた段階で、各々の半導体
装置が図中破線の位置を境に一枚の基板1から個片に分
割されるため、この時点では各々のスリット4間(図中
破線部分)が切り離されていない。また、図面の中で
は、説明の便宜上、スリット4の内側に一点鎖線をもっ
て境界線Lを表示しているが、実際にはスリット4の端
面が境界線Lと一致するように外形加工が行われる。At the time of processing the outer shape of the substrate, first, while the cutting tool is rotated at a high speed, the cutting edge portion thereof is bordered by the boundary line L of the substrate 1.
When the cutting edge portion of the cutting tool penetrates through the substrate 1 by inserting it above, the cutting tool is moved laterally along the specified boundary line L while changing the relative position of the substrate 1 and the cutting tool. As a result, as shown in FIG.
A slit 4 is formed at the boundary between the effective area 2 and the ineffective area 3 by cutting with a cutting tool, and the cutting surface 4a of the slit 4 on the effective area 2 side is the final end surface of the printed wiring board. By the way, in the case of a printed wiring board used as a base material for semiconductor devices, each semiconductor device is separated by a broken line in the drawing at the stage where component mounting and semiconductor element resin sealing are completed. Since the substrate 1 is divided into individual pieces, the slits 4 (broken line portions in the drawing) are not separated at this point. Further, in the drawings, for convenience of description, the boundary line L is shown inside the slit 4 with a dashed-dotted line, but in reality, the outer shape processing is performed so that the end surface of the slit 4 coincides with the boundary line L. .
【0005】[0005]
【発明が解決しようとする課題】ところで、従来におけ
るプリント配線板の外形加工方法では、図2(b)に示
すように、基板1内に規定された境界線L上のP位置
(◎印位置)に切削工具を挿入し、そこから図中矢印で
示す方向に切削工具を移動させてスリット4を形成して
いた。しかしながら、ルータービット等の切削工具には
その外周部分にのみ切刃が設けられ、先端面には基板1
を削り込む切刃が設けられていないため、従来方法のよ
うに、基板1内の有効領域(パターン形成領域)2とそ
の周辺の無効領域3とを区分する境界線L上(図中◎印
で示すP位置)に切削工具を挿入すると、図3(a)に
示すように、切削工具を挿入した周辺エリアにカケやバ
リ等の破損箇所(図中ハッチング部分)Vが発生し、そ
の一部が基板の有効領域2内、つまり最終的に個片に分
割されるプリント配線板の周縁部に残ってしまうことに
なる。特に、最近では外形加工後の外観を重視する傾向
にあることから、外形加工済みのプリント配線板にあっ
ては、上述した破損箇所Vが外観上の不都合として指摘
されるようになっている。By the way, in the conventional method for processing the outer shape of a printed wiring board, as shown in FIG. 2B, the P position (circle mark position) on the boundary line L defined in the substrate 1 is used. ), The cutting tool was moved in the direction indicated by the arrow in the figure to form the slit 4. However, a cutting tool such as a router bit is provided with a cutting blade only on the outer peripheral portion thereof, and the substrate 1 is provided on the tip surface.
Since there is no cutting blade for shaving, it is on the boundary line L (marked with a circle in the figure) that separates the effective area (pattern formation area) 2 in the substrate 1 from the ineffective area 3 around it, unlike the conventional method. When the cutting tool is inserted at the position (P) shown in Fig. 3), as shown in Fig. 3 (a), a damaged portion V (hatched portion in the drawing) such as a chip or a burr is generated in the peripheral area where the cutting tool is inserted. The portion remains in the effective area 2 of the substrate, that is, in the peripheral portion of the printed wiring board that is finally divided into individual pieces. In particular, recently, since there is a tendency to attach importance to the appearance after the outer shape processing, in the printed wiring board having the outer shape processing, the above-mentioned damaged portion V has been pointed out as an inferior appearance.
【0006】そこで、暫定的な加工方法としては、図3
(b)に示すように、先ず、境界線の途中位置(図中◎
で示すP位置)に切削工具を挿入し、これを図中矢印
のごとく境界線Lの終端部まで切り込んだ後、切削方向
を図中矢印のごとく反転させることで、有効領域2内
における破損箇所Vの面積を極力小さくする方法も考え
られるが、そうした場合でも有効領域2内に破損箇所V
が残るうえ、外形加工の所要時間も長くなる。Therefore, as a provisional processing method, FIG.
As shown in (b), first, the middle position of the boundary line (◎ in the figure)
After inserting the cutting tool to the end position of the boundary line L as indicated by the arrow in the drawing, and then reversing the cutting direction as indicated by the arrow in the drawing, the damage point in the effective area 2 is inserted. It is possible to make the area of V as small as possible, but even in such a case, the damaged portion V in the effective area 2
Is left, and the time required for the outer shape processing becomes long.
【0007】本発明は、上記問題を解決するためになさ
れたもので、その目的は、基板の有効領域内に破損箇所
を残すことなく好適に外形加工を行うことができるプリ
ント配線板の外形加工方法を提供することにある。The present invention has been made in order to solve the above problems, and an object thereof is to perform an outer shape processing of a printed wiring board capable of performing outer shape processing without leaving a damaged portion in an effective area of a substrate. To provide a method.
【0008】[0008]
【課題を解決するための手段】本発明は、上記目的を達
成するためになされたもので、配線パターンが形成され
た有効領域とその周辺の無効領域とを有する基板を、規
定の境界線にならって切削工具により外形加工するプリ
ント配線板の外形加工方法であり、先ず、切削工具の切
刃部分を基板の有効領域から所定の距離だけ離れた無効
領域内に挿入し、その後、切削工具と基板の相対位置を
変化させつつ規定の境界線にならって基板の外形加工を
行うものである。The present invention has been made in order to achieve the above-mentioned object, and a substrate having an effective area in which a wiring pattern is formed and an ineffective area around it is provided with a prescribed boundary line. It is a contouring method for a printed wiring board that contours with a cutting tool.First, the cutting edge portion of the cutting tool is inserted into an ineffective area that is separated from the effective area of the board by a predetermined distance, and then the cutting tool is used. The outer shape of the substrate is processed according to a prescribed boundary line while changing the relative position of the substrate.
【0009】[0009]
【作用】本発明のプリント配線板の加工方法において
は、切削工具の切刃部分を基板の有効領域から十分に離
れた無効領域内に挿入するようにしたので、たとえ工具
挿入位置にカケやバリ等の破損箇所が発生しても、それ
が基板の有効領域内に残ることはない。In the method for processing a printed wiring board according to the present invention, the cutting edge portion of the cutting tool is inserted into the ineffective area sufficiently separated from the effective area of the substrate. Even if such a damaged portion occurs, it does not remain in the effective area of the substrate.
【0010】[0010]
【実施例】以下、本発明の実施例について図面を参照し
ながら詳細に説明する。図1は本発明に係わるプリント
配線板の外形加工方法の一実施例を示す図であり、図中
(a)は外形加工済み基板を示す部分平面図、(b)は
そのB部拡大図である。なお、本実施例においては、上
記従来例と同様の構成部分に同じ符号を付して説明す
る。先ず、加工対象となる基板1には、従来同様に配線
パターンや保護膜の形成、さらには電極部分へのメッキ
や識別用の文字印刷等の処理が施されている。この基板
1には、銅箔等の導電材料をエッチング等によりパター
ニングしてなる配線パターン(不図示)が形成された有
効領域2とともに、配線パターンが形成されていない、
いわゆるパターン無しの無効領域3が有効領域2の周辺
に設けられている。また、有効領域2と無効領域3の境
目には、後述する切削工具の切り込み経路(移動経路)
となる境界線(図中一点鎖線で示す)Lが規定されてい
る。Embodiments of the present invention will now be described in detail with reference to the drawings. 1A and 1B are views showing an embodiment of a method for processing an outer shape of a printed wiring board according to the present invention, in which FIG. 1A is a partial plan view showing an outer shape processed substrate, and FIG. is there. In this embodiment, the same components as those in the conventional example will be designated by the same reference numerals. First, the substrate 1 to be processed is subjected to processing such as formation of a wiring pattern and a protective film, plating on the electrode portion and character printing for identification as in the conventional case. No wiring pattern is formed on the substrate 1 together with an effective area 2 having a wiring pattern (not shown) formed by patterning a conductive material such as copper foil by etching or the like.
A so-called patternless invalid area 3 is provided around the valid area 2. Further, at the boundary between the effective area 2 and the ineffective area 3, a cutting tool cutting path (moving path) described later is provided.
A boundary line (indicated by a one-dot chain line in the drawing) L is defined.
【0011】ここで本実施例における基板の外形加工時
には、先ず、ルータービット等の切削工具を高速で回転
させつつ、その刃先部分を図1(b)に示すように基板
1の有効領域2から所定の距離Dだけ離れた無効領域3
内(図中◎で示すP位置)に挿入する。有効領域2から
工具挿入位置P(◎)までの離間距離Dは、基板1に切
削工具を挿入した際に発生するカケやバリ等の破損箇所
V(図中ハッチング部分)が有効領域2内に残らない距
離に設定されるものである。Here, at the time of processing the outer shape of the substrate in this embodiment, first, while rotating a cutting tool such as a router bit at a high speed, the cutting edge portion thereof is removed from the effective area 2 of the substrate 1 as shown in FIG. 1 (b). Invalid area 3 separated by a predetermined distance D
Insert it inside (P position indicated by ◎ in the figure). The separation distance D from the effective area 2 to the tool insertion position P (⊚) is such that a damaged portion V (hatched portion in the figure) such as a chip or a burr generated when the cutting tool is inserted into the substrate 1 is within the effective area 2. It is set to a distance that does not remain.
【0012】そこで、上記離間距離Dの設定にあたって
は、破損箇所Vの大きさが基板1の厚みや切削工具の仕
様、さらには加工時における切削工具の回転数や切り込
み速度など、種々の加工条件に依存することから、例え
ば実験的に外形加工を行って破損箇所Vの最大面積を割
り出し、これに適度のマージンを加味して設定するよう
にすればよい。Therefore, in setting the above-mentioned separation distance D, various processing conditions such as the size of the damaged portion V, the thickness of the substrate 1, the specifications of the cutting tool, the number of revolutions and the cutting speed of the cutting tool during processing, etc. Therefore, for example, the outer shape may be experimentally determined to determine the maximum area of the damaged portion V, and the maximum area may be set in consideration of the appropriate margin.
【0013】このようにして基板1の無効領域3内に切
削工具を挿入し、これにより切削工具の刃先部分が基板
1を貫通したら、例えば基板1及び切削工具のいずれか
一方を水平移動させることで、基板1と切削工具の相対
位置を変化させ、図1(b)中の矢印で示すように切
削工具を境界線Lに向けて移動させる。In this way, the cutting tool is inserted into the ineffective region 3 of the substrate 1, and when the cutting edge portion of the cutting tool penetrates the substrate 1 in this way, for example, either one of the substrate 1 and the cutting tool is horizontally moved. Then, the relative position between the substrate 1 and the cutting tool is changed, and the cutting tool is moved toward the boundary line L as shown by the arrow in FIG.
【0014】続いて、切削工具が境界線L上に到達した
ら、そこから図中矢印のごとく境界線Lにならって切
削工具を横方向に移動させていく。その後、境界線Lの
終端部に切削工具が到達したら、そのまま基板1から切
削工具を引き抜いてもよいが、本実施例では工具引抜時
の微小な破損をも防止すべく、あえて切削工具を無効領
域3側に移動させてから切削工具を引き抜くようにし
た。これにより、図1(a)に示すように、基板1の有
効領域2と無効領域3の境界部分に切削工具の削れ込み
によるスリット4が形成され、このスリット4の有効領
域2側の切削面4aが最終的なプリント配線板の仕上げ
端面となる。Subsequently, when the cutting tool reaches the boundary line L, the cutting tool is moved laterally along the boundary line L as indicated by an arrow in the figure. After that, when the cutting tool reaches the terminal end of the boundary line L, the cutting tool may be pulled out from the substrate 1 as it is. However, in the present embodiment, the cutting tool is intentionally disabled in order to prevent even minute damage at the time of pulling the tool. The cutting tool was pulled out after being moved to the region 3 side. As a result, as shown in FIG. 1A, a slit 4 is formed by cutting the cutting tool at the boundary between the effective area 2 and the ineffective area 3 of the substrate 1, and the cutting surface of the slit 4 on the effective area 2 side. 4a is the final end surface of the printed wiring board.
【0015】このように本実施例においては、ルーター
ビット等の切削工具の切刃部分を、基板1の有効領域2
から十分に離れた無効領域3内、すなわち基板1に切削
工具を挿入した際に発生するカケやバリ等の破損箇所V
が有効領域2内に残らない程度の距離Dを隔てた位置P
に挿入し、その後、規定の境界線Lにならって基板1の
外形加工を行うようにしたので、たとえ切削工具の挿入
位置Pに破損箇所Vが発生しても、それが基板1の有効
領域2内、つまり最終的に個片に分割されるプリント配
線板の周縁部に残ることがない。As described above, in this embodiment, the cutting edge portion of the cutting tool such as the router bit is set to the effective area 2 of the substrate 1.
Inside the ineffective area 3 sufficiently distant from the substrate 1, that is, a damaged portion V such as a chip or a burr generated when the cutting tool is inserted into the substrate 1.
Is separated by a distance D that does not remain in the effective area 2.
Since the outer shape of the substrate 1 is processed according to the prescribed boundary line L after that, even if the damaged portion V occurs at the insertion position P of the cutting tool, it is the effective area of the substrate 1. 2 does not remain in the peripheral part of the printed wiring board that is finally divided into individual pieces.
【0016】なお、本発明に係わるプリント配線板の外
形加工方法は、一般的なガラス繊維入りの有機系プリン
ト配線板に限らず、他の多種多様なプリント配線板(積
層板を含む)の外形加工を行う際にも広く適用できるも
のである。The method for processing the outer shape of a printed wiring board according to the present invention is not limited to general glass fiber-containing organic printed wiring boards, but can be applied to various other printed wiring boards (including laminated boards). It can also be widely applied when processing.
【0017】[0017]
【発明の効果】以上、説明したように本発明によれば、
切削工具の切刃部分を基板の有効領域から離れた無効領
域内に挿入し、その後、規定の境界線にならって基板の
外形加工を行うようにしたので、切削工具の挿入部分に
破損箇所が発生しても、それが基板の有効領域内に残る
ことがなくなる。これにより、プリント配線板の周縁部
分におけるカケやバリ等の破損を確実に回避できるよう
になるため、プリント配線板の外観レベルを大幅に向上
させることが可能となる。As described above, according to the present invention,
The cutting edge part of the cutting tool is inserted into the invalid area away from the effective area of the board, and after that, the outer shape of the board is processed according to the specified boundary line, so there is no damage on the insertion part of the cutting tool. When it occurs, it does not remain in the effective area of the substrate. As a result, it is possible to reliably avoid damage such as chipping and burrs in the peripheral portion of the printed wiring board, and it is possible to greatly improve the appearance level of the printed wiring board.
【図1】本発明に係わるプリント配線板の外形加工方法
の一実施例を示す図である。FIG. 1 is a diagram showing an embodiment of a method for processing an outer shape of a printed wiring board according to the present invention.
【図2】従来方法を説明する図である。FIG. 2 is a diagram illustrating a conventional method.
【図3】従来方法の問題点を説明する図である。FIG. 3 is a diagram illustrating a problem of a conventional method.
1 基板 2 有効領域 3 無効領域 L 境界線 P 工具挿入位置 1 Board 2 Effective area 3 Invalid area L Boundary P Tool insertion position
Claims (1)
の周辺の無効領域とを有する基板を、規定の境界線にな
らって切削工具により外形加工するプリント配線板の外
形加工方法において、 前記切削工具の切刃部分を前記基板の有効領域から所定
の距離だけ離れた無効領域内に挿入したのち、前記切削
工具と前記基板の相対位置を変化させつつ前記規定の境
界線にならって基板の外形加工を行うことを特徴とする
プリント配線板の外形加工方法。1. A contour cutting method for a printed wiring board, wherein a board having an effective area in which a wiring pattern is formed and an ineffective area around the board is contour-machined by a cutting tool along a prescribed boundary line. After inserting the cutting edge portion of the cutting edge portion into the ineffective area which is separated from the effective area of the substrate by a predetermined distance, the outer shape of the substrate is processed according to the specified boundary line while changing the relative position of the cutting tool and the substrate. A method for processing the outer shape of a printed wiring board, the method comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31983594A JPH08181411A (en) | 1994-12-22 | 1994-12-22 | Outer shape processing method of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31983594A JPH08181411A (en) | 1994-12-22 | 1994-12-22 | Outer shape processing method of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08181411A true JPH08181411A (en) | 1996-07-12 |
Family
ID=18114752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31983594A Withdrawn JPH08181411A (en) | 1994-12-22 | 1994-12-22 | Outer shape processing method of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08181411A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030517A (en) * | 2011-07-26 | 2013-02-07 | Kyocer Slc Technologies Corp | Method of manufacturing multi-piece wiring board |
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
-
1994
- 1994-12-22 JP JP31983594A patent/JPH08181411A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
JP2013030517A (en) * | 2011-07-26 | 2013-02-07 | Kyocer Slc Technologies Corp | Method of manufacturing multi-piece wiring board |
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