200808506 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種印刷基板加工機及其開孔加工方 法0 【先前技術】 作為印刷基板加工機，例如有一種設有：形成有複數 工作台载置區域之單一機床、以跨過前述工作台載置區域 正體之方式固定於4述機床且與前述工作台載置區域對應 而形成有複數橫滑座之支撐區域之柱、於前述機床被支撐 成可個別朝X方向移動之至少一工作台、於前述柱被支撐 成可個別朝γ方向移動之至少一橫滑座、以及於此橫滑座 被支撐成可個別朝z方向移動之心軸單元的印刷基板加工 機。由於此種印刷基板加工機，係作成在單一機床上配置 複數台印刷基板加工機之構成，因此，即使面對安裝時或 隨著時間變化之地板變動，亦無需進行單一機床内加工模 組間之調整，安裝、保養調整容易。此種裝置不僅可應用 於多種類少量生產情形，亦可應用於少種類多量生產情形 (專利文獻1)。 夕 於使用鑽頭對印刷基板等進行孔加工之印刷基板加工 機情況下，在加工時，分別移動X工作台及橫滑座，將鑽 頭之轴心與加工部之中心對齊，然後，降下心軸單元，藉 由於心軸單元保持成旋轉自如之鑽頭對印刷基板進行開 孔。 當移動X工作台時，於印刷基板加工機將會於水平方 5 200808506 向產生加速度乘以χ工作台及載置於χ工作台之零件之質 畺大小之激振力。由於此激振力之作用點在較地板更高 處’因此，以此激振力及作用點之高度所決定之力矩，於 印刷基板加工機產生由地板之剛性及印刷基板加工機之旋 轉慣性所決定之固有振動數之旋轉振動（搖動振動）。接著， 從隔著印刷基板加工機之重心配置於印刷基板加工機兩側 之準平螺栓之一方傳來之激振力，朝下壓地板之方向作 用，從另一方傳來之激振力於地板隆升之方向作用。其妹 果，於地板產生上下方向之振動。因此，若欲提高加工效 率而高速移動X工作台，地板之振動即變大。 因此，有一種印刷基板加工機，係於機床上設置由於 水平方向移動自如地支撐錘之支撐裝置及驅動此錘之錘驅 動裝置所構成之慣性力產生機構，以及振動感測器，載置 振動感測器於加工裝置，錘驅動裝置根據振動感測器之輪 出訊號移動錘，減小振動感測器之輸出訊號。藉由此技術， 可優化加工後孔之位置精度（專利文獻2)。 又有一種加工機，雖非印刷基板加工機，卻係例如將 裝載加工工具夂二滑座配置於同軸上，彼此朝相反方向往 復運動，將各自產生之反作用力相互抵銷，品立。 木日、振 動之發生，提高加工精度（專利文獻3)。 [專利文獻1]曰本特開平7— 314395號公報 [專利文獻2]日本特開2003 — 181739號公報 [專利文獻3]曰本特開2002— 160104號公報 於專利文獻1中並未揭示例如在對相同加工内容之印 6 200808506 刷基板加工時，應如何進行始能提高加工精度。 於地在移動横滑座情況τ，亦如同移動x卫作台時， 二 χ上下方向之振動，因此，若使專利文獻2之技 術因應X工作台及橫滑座之 增大。 鑽頭開孔加工機整體即 相沒又於專利文獻3情況下，雖然-對滑座之移動方向 相反，惟對支標工作物之主轴 私動方向 無任何揭示。 作口之X方向的移動控制 【發明内容】 本發明之目的在於解決上述問題，提供 加卩刷基板 ,B 彳法不會使鑽頭肖孔加工機整體捭 大，且可提高加工精度。 饵i體立曰 為解決上述問題，本發明之第！機構為 加工機，具備：用以鄱婆化# α 裡Ρ刷基板 肴用以载置印刷基板之複數個 别迻各工作台並使前述工作台分別 认於 轴驅動部、分別配置於前述各工作台上方之：=向 使前述各橫滑座移動於左 月坐、分別 刖述各横滑座之心軸、以及分別使心軸上下移動於，= 之Ζ軸驅動部，藉由前述X軸驅動部及前述γ 將於前述心軸保持成旋轉自如之鑽頭的=動部， 置’然後，藉由前it Ζ軸驅動部，使前述鑽、加工位 刷基板而進杆^ 疋纘碩切入前述印 汉而進仃開孔加工，其特徵在於：控制前 部及前述Y軸驅動部，使X及γ方向之至小—軸驅動 朝相同方向移動之另—軸，朝相反方向移 相對於 Μ進行開孔 7 200808506 加工於此【月'兄下，第2機構可使x及γ方向之相鄰各麵 分別朝相反方向移動。 ，5明之第3機構為一種印刷基板加工機之開孔 力:工方法’該印刷基板加工機具備：用以載置印刷基板之 複數:工作台、設於前述各工作台並使前述工作台分別移 ;月〕後X方向之X軸驅動部、分別配置於前述各工作么 上方之橫滑座、分別使前述各横滑座移動於左右Υ方向:200808506 IX. OBJECT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a printed circuit processing machine and a method for processing the same thereof. [Prior Art] As a printed circuit processing machine, for example, there is provided a method of forming a plurality of stages a single machine tool in the mounting area is fixed to the fourth machine tool so as to straddle the normal body of the table mounting area, and the column of the support area of the plurality of cross slides is formed corresponding to the table mounting area, and the machine tool is Supporting at least one table that can be individually moved in the X direction, at least one of the horizontal slides supported by the column to be movable in the gamma direction, and the horizontal slide is supported to be movable individually in the z direction A printed circuit board processing machine for the shaft unit. Since such a printed circuit board processing machine is configured to arrange a plurality of printed circuit board processing machines on a single machine tool, it is not necessary to perform processing in a single machine tool even in the case of a floor change during installation or with time. Adjustment, installation and maintenance adjustment is easy. Such a device can be applied not only to a small number of types of production cases but also to a small number of production cases (Patent Document 1). In the case of a printed circuit board processing machine that performs hole processing on a printed circuit board or the like using a drill, the X table and the cross slide are respectively moved during machining, the axis of the drill is aligned with the center of the processed portion, and then the mandrel is lowered. The unit opens the printed circuit board by the drill which is held in a rotatable manner by the spindle unit. When moving the X table, the printed substrate processing machine will multiply the acceleration generated by the horizontal table 5 200808506 by the size of the χ table and the mass of the part placed on the χ table. Since the exciting force acts at a higher point than the floor, the torque determined by the height of the exciting force and the point of action causes the rigidity of the floor and the rotational inertia of the printed substrate processing machine in the printed circuit processing machine. Rotational vibration (shake vibration) of the number of natural vibrations determined. Next, the exciting force transmitted from one of the quasi-flat bolts disposed on both sides of the printed circuit board processing machine through the center of gravity of the printed circuit board processing machine acts in the direction of pressing the floor downward, and the exciting force transmitted from the other side to the floor The direction of the uplift. The girl, in the upper and lower directions of the floor vibration. Therefore, if the X table is moved at a high speed to improve the processing efficiency, the vibration of the floor becomes large. Therefore, there is a printed circuit processing machine which is provided with a support device for movably supporting a hammer in a horizontal direction and an inertial force generating mechanism for driving the hammer drive device, and a vibration sensor for mounting the vibration on the machine tool. The sensor is in the processing device, and the hammer driving device moves the hammer according to the wheel of the vibration sensor to reduce the output signal of the vibration sensor. With this technique, the positional accuracy of the processed hole can be optimized (Patent Document 2). Further, in the case of a non-printing substrate processing machine, for example, the loading and processing tool is disposed on the coaxial shaft, and moves in opposite directions to each other, and the respective reaction forces generated are offset from each other. The occurrence of wood and vibration increases the processing accuracy (Patent Document 3). [Patent Document 1] JP-A-2003-181739 (Patent Document 3) Japanese Patent Laid-Open Publication No. 2002-160104 In the case of the same processing content of the printing 6 200808506 brush substrate processing, how to improve the processing accuracy. In the case of moving the cross slide in the ground, as in the case of moving the x-station, the vibration in the up-and-down direction is caused by the technique of Patent Document 2, so that the X table and the cross slide are increased. In the case of the patent document 3, the bit drilling machine as a whole is inconsistent, and although the direction of movement of the sliding seat is reversed, there is no disclosure of the direction of the spindle of the supporting workpiece. BACKGROUND OF THE INVENTION The object of the present invention is to solve the above problems and to provide a twisted brush substrate. The B 彳 method does not increase the overall size of the drill hole punching machine, and can improve the machining accuracy. In order to solve the above problems, the present invention is the first! The mechanism is a processing machine, and is provided with a plurality of individual moving table for placing a printed circuit board on the substrate of the α 化 化 并使 并使 并使 并使 并使 并使 并使 并使 并使 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载Above the table: = to move the aforementioned slides to the left moon, to separate the mandrels of the respective slides, and to move the spindle up and down, respectively, to the X-axis drive unit, by X The shaft drive unit and the γ are held in the movable shaft of the drill shaft, and then the front shaft is driven by the front shaft shaft drive unit, and the drilled and machined base plate is driven into the shaft. Cutting into the above-mentioned printing and boring hole processing, which is characterized in that the front part and the Y-axis driving part are controlled such that the X-axis and the γ-direction move to the same direction as the small-axis drive, and the opposite direction shifts in the opposite direction. The opening of the hole 7 200808506 is processed here [month], the second mechanism can move the adjacent faces in the x and γ directions in opposite directions. The third mechanism of the fifth embodiment is an opening force of a printing substrate processing machine: the printing substrate processing machine includes: a plurality of mounting substrates; a table, each of the stages, and the table The X-axis driving unit in the X direction after the month and the horizontal sliding seat disposed above each of the above-mentioned respective operations are respectively moved to the left and right x-directions:
Υ轴驅動部、主擔於於 八 、刖述各杈滑座之心軸、以及使前述心 動邹動於ζ方向之2軸驅動部，藉由前述χ軸驅 則述車由驅動部’將於前述心軸保持成旋轉自如之 =的軸蚊位於加H然後，藉由前述ζ軸驅動部， 於2鑽頭切入前述印刷基板而進行開孔加工；其特徵在 _乂及¥方向之至少一軸相對於朝相同方向移動之另 由’朝相反方向移動，推4 一 4 進仃開孔加工。於此情況下，第 機構可使X及Υ方向之相鄰各軸分別朝相反方向移動。 加 料明之第5機構為—種印刷基板加工機之開孔 個工作Γ，Γ㈣基板加工機具備：載置印刷基板之複數 前後γ σ亚使刖述工作台分別移動於 之h方向之χ轴驅動部、分別配置於前述各工作台上方 驅^座、分別使前述各橫滑座移動於左右Υ方向之Υ軸 麵上^ Μ於㈣各橫滑座之心，1及分職前述心 及前诚夕動於Ζ方向之2轴驅動部，藉由前述χ軸驅動部 的料緩^7轴驅動部，將於前述心轴保持成旋轉自如之鐵頭 線疋位於加工位置，然後，藉由前述Ζ軸驅動部，將 8 200808506 丽述鑽頭切入前述印刷基板而進行開孔加工；其特徵在 於：使載置於前述玉作台之該印刷基板之方向相同，並使 鄰接之前述印刷基板之加工順序相反，進行開孔加工。 可減低印刷基板加工機之搖動振動，並可防止地板振 動，實現高精度加工。 又由於無需用於振動減低之特別制振装置，因此，可 低廉地實現高精度印刷基板加工機。a cymbal drive unit, a main shaft, a spindle that describes each of the slides, and a two-axis drive unit that causes the eccentric motion to move in the ζ direction, and the vehicle is driven by the drive unit The shaft mosquito that is rotatably supported by the mandrel is placed in the H, and the boring shaft driving portion cuts the printed circuit board into two holes to perform the hole drilling process; and the at least one axis of the _乂 and the ¥ direction is characterized. Moving in the opposite direction relative to moving in the same direction, push 4 to 4 into the opening. In this case, the first mechanism can move the adjacent axes of the X and Υ directions in opposite directions. The fifth mechanism of the addition is a hole opening operation of the printing substrate processing machine, and the (four) substrate processing machine is provided with a y-axis drive in which the gamma σ sub-paragraphs are moved in the h direction before and after the plurality of printed substrates are placed. The parts are respectively disposed on the upper part of each of the above-mentioned worktables, and each of the horizontal slides is moved on the x-axis surface of the right and left turns, and the center of each of the horizontal slides is The two-axis drive unit in the direction of the 诚 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The boring shaft drive unit cuts the drill bit into the printed circuit board by the 8 200808506 drill bit, and performs the hole forming process. The printed circuit board placed on the jade table is oriented in the same direction, and the adjacent printed circuit board is placed. The processing sequence is reversed and the drilling process is performed. It can reduce the shaking vibration of the printed circuit board processing machine and prevent the floor vibration and achieve high-precision machining. Further, since a special vibration damping device for reducing vibration is not required, a high-precision printed circuit processing machine can be realized inexpensively.
【實施方式】 以下例示具體實施例，對本發明之實施形態加以說明。 《實施例1》 第1圖係應用本發明之印刷基板加工機之外觀圖，第 2圖係本發明NC控制裝置21對又轴驅動部之處理方塊圖。 印刷基板加工機Μ之機床1G透過準平螺栓u及塾塊 構件12支標於地板。載置印刷基板^之工作台h，可藉 由省略圖示之直線導引裝置及X軸驅動裝置3a於前後（χ0) 方向移動自如。載置印刷基板lb之工作台几，可，由省 :圖示之直線導引裝置及乂軸驅動裝置3b於前後(χ)方向 2自如。又’印刷基板u與印刷基板ib之加工内容雖 &相同，惟，印刷基板lb在相對於印刷基板u旋轉18〇。 狀態下固定於工作台2b。 線導ί =定錢床1G。橫滑座8a，可藉由省略圖示之直 Λ衣及γ軸驅動裝置7a於左右（γ)方向移動自如。 ' π座8b ’可藉由省略圖示之直線 置几於左右⑺方向移動自如。 軸㈣裝 9 200808506 於也、α座8a ’保持有：保持鑽頭4a之心軸5a，以及 使心轴5a移動於上下（z)方向之z軸驅動裝置以。於橫滑 座8b，保持有：保持鑽頭4b之心軸讣，以及使心軸讣 於上下（Z)方向移動之Z軸驅動裝置6b。 NC控制裝置21控制印刷基板加工機μ之各部。 第2圖係本發明NC控制裝置幻對又軸驅動部之處理 方塊圖。 NC控制裹置21讀入加工程式，解析其内容製成X軸 之動作位置指令’將其結果送至座標轉換裝置26。座標轉 換裝置26從送來之動作位置指令製成位置指令a及位置 指令B，將位置指令A送至驅動控制部22&，並將位置指 令B送至驅動控制部22b。驅動控制部22&從位置指令a 及從位置檢測器24a送來之位置響應25a作成速度指令， 輸出至伺服放大器23a。词服放大器23a根據此速度指令 作成扭矩指令，驅動馬達3a使工作台2a動作。同樣地， 驅動控制部22b由位置指令B及從位置檢測器2仆送來之 位置響應25b作成速度指令，輸出至伺服放大器23b。伺 服放大l§ 23b根據此速度指令作成扭矩指令，驅動馬達3b 使工作台2b動作。又，位置指令B與位置指令A之目標 位置座標符號相反，加工順序相同。 NC控制裝置21針對橫滑座8a、8b& z軸驅動裝置仏、 6b亦作成相同位置指令，透過各軸之驅動裝置控制移動動 作，以上動作亦與習知情形相同。 其次’說明此實施形癌之動作。 10 200808506 第3 系表不對作為加卫對象之印刷基板^及印刷基 板lb加Ji之孔中心位置al〜a4和bi〜μ以及加工順序之 圖式又’第4圖係、表示實施第3圖所示加卫動作情形之 從X軸驅動控制部仏心輪出之速度指令之時程圖表。 又，第5圖係表示實施第3圖所示加工動作情形之從各γ 軸驅動裝置輸出之速度指令之時程圖纟，均以縱軸表示速 度指令值，以橫軸表示時間。 如第3圖箭頭所標*，相對於印刷基板U，依aH2 13^4之順序移動鑽頭牦之軸線，於 之各位置進打孔加工。另一方面，相對於印刷基板沁，依 心^b3—Μ之順序移動鑽頭4b之軸線，⑥bl、b2、 b3、b4之各位置進行孔加工。 由於印刷基板lb之各開孔位置係與印刷基板ia之各 開孔位置相對旋轉18G度之位置，因此，於印刷基板㈣ 印刷基板lb之加工内容相同情況下，工作台2a與工作台 孔以及橫滑座8a與橫滑座礼分別朝相反方向移動。〇 亦即，如第4圖所示，工作台以藉由圖中實線所示速 =令模式…工作台2b藉由圖中虛線所示速度指令 …反覆移動與停止。又，如第5圖所示，横滑座h藉 :圖中實線所示速度指令模式…橫滑座朴藉由圖； :線：：速度指令模式’反覆移動與停止。接著，於停止 進^ 5a、5b上下作動，藉鑽頭4a、4b對基板u、比 如以上所述’由於在工作台2a移動時’工作台2b必 200808506 定朝相反方向作相同動作’在橫滑座8a移動時，橫滑座此 必定朝相反方向作相同動作’因此’因各自動作而產生的 水平方向之振動力量相抵銷（或減低由於在印刷基板加 工機不會發生搖動振動，亦不會發生地板振動，因此，可 實現高精度加工。 又，於上述印刷基板加工機中，在僅藉由一方之工作 台對加工印刷基板加工情況下，，亦可使另—方以虛擬 (dummy)(亦即不載置印刷基板之狀態）方式於相反方向作 動，以防止搖動振動，實現高精度加工。 又，雖然於工作台為2個情況下’每次工作台移動即 會產生水平方向之旋轉力矩，而成為水平方向搖動產生之 主要原因，惟於卫作台例如為4個情況下，如第6圖所示， 使兩端之卫作台及内側《2工作台各成—組，並選擇使立 進行相反動作，即可肋每次卫作台㈣產 之旋轉力矩。 =’於工作台為奇數n情況下’雖無法期待如上述實 施形態之效果，惟由於可你 _ 淮由於可使n個工作台同時作動時產生之 習知激振力之1 / η，因此，盥么 可提高加工精度。 -作。為偶數之情形同樣的， 《實施例2》 於上述實施例1中 方1βΛ。 將—印刷基板之一方相對於另一 之ΧΥ :置於工作台，惟若加工位置係例如相對印刷 :肖中心成點對稱或接近點對稱之情況下，可 W_，m#2a、2bw^a、lb 12 200808506 向相同，如該圖中箭頭所示，使鄰接之前述印刷基板 之加工順序彼此相反，來進行加工。 上述汽施例1、2，雖係針對將複數橫滑座8a、8b配 置於柱9之_相I丨（楚 1 m 圖中前側）之情形做了說明，惟亦可 採以下方式。 《實施例3》 、弟、8 W係表示應用本發明之另一印刷基板加工機的構 成之俯視圖，以相同忽1 %_ $ Π付就^示與第1圖相同或功能相同 者’省略重複說明。 如該圖所示，此印刷基板加工機除了第i圖所示工作 台h、2b及橫滑座8a、8b夕卜，具備工作台2〇、^及橫滑 座 8c 、 8d 。 工作台2C與工作台2a ’工作台％與工作台几係以 各自重心之移動方向同軸之方式配置於㈣H)上。工作 台2c、2d，可藉由省略圖示之直線導引裝置及X軸驅動裝 •置〜％於前後（X)方向移動自如。於工作纟2c、2d分別 配置印刷基板lc、ld。且，印刷基板4相對於印刷基 板U旋轉⑽狀態下（與印刷基板化同方向），印刷基板 Η在相對於印刷基板lb旋轉18『狀態下（與印刷基板h 同方向），分別固定於工作台2c、2d。 橫滑座8e、8d之省略圖示之直線導μ置以與橫滑座 8a、8b之省略圖示之直線㈣裝置平行，亦即移動方'向愈 橫滑座8a、8b平行之方式配置於柱9之裏面側（第^ 上側，P圖之後侧）。橫滑座8c、8d，可藉由省⑽示 13 200808506 之Y軸驅動裝置於左右（γ)方向梦 一 ’々同私動自如。將保持省略圖[Embodiment] Hereinafter, embodiments of the present invention will be described by exemplifying specific embodiments. [Embodiment 1] Fig. 1 is an external view of a printed circuit board processing machine to which the present invention is applied, and Fig. 2 is a block diagram showing the processing of the NC drive unit 21 of the present invention. The machine tool 1G of the printed circuit processing machine is supported on the floor by the quasi-flat bolt u and the block member 12. The table h on which the printed circuit board is placed can be moved in the front-rear (χ0) direction by the linear guide device and the X-axis drive device 3a (not shown). The table on which the printed circuit board 1b is placed may be free from the front and rear (χ) directions 2 by the linear guide device and the x-axis drive device 3b shown in the drawing. Further, the printed substrate u is processed in the same manner as the printed substrate ib, except that the printed substrate lb is rotated by 18 turns with respect to the printed substrate u. It is fixed to the workbench 2b in the state. Line guide ί = fixed bed 1G. The cross slide 8a can be moved in the left and right (γ) directions by a straight hood and a γ-axis driving device 7a (not shown). The 'π-seat 8b' can be moved freely in the left-right (7) direction by a line omitted from the illustration. Shaft (four) mount 9 200808506 In the alpha seat 8a', the spindle shaft 5a holding the drill 4a and the z-axis drive device for moving the spindle 5a in the up and down (z) direction are held. In the cross slide 8b, the spindle shaft 讣 for holding the drill 4b and the Z-axis driving device 6b for moving the spindle in the up-and-down (Z) direction are held. The NC control device 21 controls each unit of the printed circuit board processing machine μ. Fig. 2 is a block diagram showing the processing of the phantom pair and the shaft driving portion of the NC control device of the present invention. The NC control wrap 21 reads the machining program, analyzes the contents and creates an X-axis operation position command, and sends the result to the coordinate conversion device 26. The coordinate conversion device 26 creates a position command a and a position command B from the sent operation position command, sends the position command A to the drive control unit 22 & and sends the position command B to the drive control unit 22b. The drive control unit 22& generates a speed command from the position command a and the position response 25a sent from the position detector 24a, and outputs the speed command to the servo amplifier 23a. The vocal amplifier 23a generates a torque command based on the speed command, and the drive motor 3a operates the table 2a. Similarly, the drive control unit 22b generates a speed command from the position command B and the position response 25b sent from the position detector 2, and outputs it to the servo amplifier 23b. The servo amplifier 1 § 23b generates a torque command based on the speed command, and the drive motor 3b operates the table 2b. Further, the position command B is opposite to the target position coordinate symbol of the position command A, and the machining order is the same. The NC control unit 21 also makes the same position command for the slides 8a, 8b & z-axis drive units 仏, 6b, and controls the movement operation through the drive units of the respective shafts. The above operation is also the same as in the conventional case. Next, the action of the cancer formation will be described. 10 200808506 The third figure shows that the printed circuit board and the printed circuit board lb, which are the target of the erection, are added to the hole center positions a1 to a4 and bi to μ, and the processing order is also shown in Fig. 4, and the third figure is shown. A time-history chart of the speed command from the X-axis drive control unit in the illustrated action. Further, Fig. 5 is a timing chart showing the speed command output from each γ-axis driving device in the case of performing the machining operation shown in Fig. 3, both of which indicate the speed command value on the vertical axis and the time on the horizontal axis. As indicated by the arrow in Fig. 3, the axis of the drill bit is moved in the order of aH2 13^4 with respect to the printed substrate U, and punching is performed at each position. On the other hand, with respect to the printed substrate 沁, the axis of the drill 4b is moved in the order of ^b3 - Μ, and the respective positions of 6b1, b2, b3, and b4 are subjected to hole processing. Since each of the opening positions of the printed substrate lb is rotated by 18 G degrees from the respective opening positions of the printed substrate ia, the table 2a and the table hole are the same when the printed substrate (4) is processed in the same manner. The cross slide 8a and the cross slide are respectively moved in opposite directions.亦 That is, as shown in Fig. 4, the table is moved and stopped by the speed command indicated by the broken line in the figure by the speed indicated by the solid line in the figure. Further, as shown in Fig. 5, the cross slide h is borrowed: the speed command mode shown by the solid line in the figure is shown by the figure; the line:: speed command mode 'reversely moves and stops. Then, the operation is stopped up and down, and the substrate u is drilled by the drills 4a, 4b. For example, when the table 2a is moved, the table 2b must be in the opposite direction in the opposite direction. When the seat 8a is moved, the horizontal slide must perform the same action in the opposite direction. Therefore, the horizontal vibration force generated by the respective actions is offset (or reduced because the shaking vibration does not occur in the printed circuit processing machine, nor Since the floor vibration occurs, high-precision machining can be realized. Further, in the above-described printed circuit board processing machine, when the processed printed circuit board is processed by only one of the stages, the other side can be virtualized (dummy). ) (that is, the state in which the printed circuit board is not placed) is operated in the opposite direction to prevent the vibration from being shaken and to achieve high-precision machining. Further, although the table is in two cases, the horizontal direction is generated every time the table moves. The rotation torque is the main cause of the horizontal shaking. However, for example, in the case of the four stations, as shown in Fig. 6, the two ends of the table and the inside are provided. 2 The workbench is formed into a group, and the opposite action is selected for the opposite direction, that is, the rotational torque produced by each rib (four) can be generated. = 'When the workbench is odd n', the effect of the above embodiment cannot be expected. However, since it is possible for you to make 1 / η of the conventional exciting force generated when n worktables are simultaneously actuated, it is possible to improve the machining accuracy. - For the case of even numbers, the implementation Example 2: 1βΛ in the above-mentioned Embodiment 1. Place one side of the printed substrate with respect to the other: placed on the table, but if the processing position is, for example, relative to the printing: the center of the shaw is point symmetrical or close to point symmetry W_, m#2a, 2bw^a, and lb 12 200808506 are the same, and as shown by the arrows in the figure, the processing order of the adjacent printed substrates is reversed to perform processing. The above-described steaming examples 1, 2, Although the case where the plurality of horizontal slides 8a and 8b are disposed on the front side of the column 9 (the front side of the Chu 1 m diagram) has been described, the following method may be employed. "Embodiment 3", brother, 8 W system represents another printed substrate processing machine to which the present invention is applied The top view of the configuration is the same as 1%_$, and the same as or the same as the first figure, the description will be omitted. As shown in the figure, the printed circuit processing machine has a table other than the one shown in the figure i. h, 2b and horizontal slides 8a, 8b, with workbench 2〇, ^ and cross slides 8c, 8d. Workbench 2C and workbench 2a 'Workbench% and workbench are driven by their respective centers of gravity Coaxial mode is configured on (4) H). The table 2c, 2d can be moved freely in the front and rear (X) directions by a linear guide (not shown) and an X-axis drive device. The printed boards lc and ld are disposed in the jobs 2c and 2d, respectively. In the state in which the printed circuit board 4 is rotated (10) with respect to the printed circuit board U (in the same direction as the printed circuit board), the printed circuit board 旋转 is rotated 18" with respect to the printed circuit board lb (in the same direction as the printed circuit board h), and is fixed to work. Table 2c, 2d. The linear guides (not shown) of the horizontal slides 8e and 8d are arranged in parallel with the straight line (four) devices (not shown) of the horizontal slides 8a and 8b, that is, the moving side is arranged in parallel with the lateral slides 8a and 8b. On the inner side of the column 9 (the upper side of the ^, the rear side of the P picture). The horizontal slides 8c and 8d can be freely moved in the left and right (γ) directions by the Y-axis driving device of the provincial (10) 13 200808506. Will remain omitted
示之鑽頭之心軸以及於上下〇太A r (乙）方向移動之省略圖示之Z軸 驅動裝置保持於横滑座8 c。將名畋m _ 竹1略圖不之鑽頭之心轴以及 上下移動於（Z)方向之省略圖示夕7 & . ’ 口不之Z軸驅動裝置保持於橫滑 座8d 〇 2b 橫 NC控制裝置21讀人加卫程式，除了 ma、 及橫滑座8a、8b之位置指令外，作成工作台2c、 滑座8c、8d之位置指令。The mandrel of the drill bit and the Z-axis drive device (not shown) moving in the direction of the upper and lower sides A (B) are held in the cross slide 8c. The name of the 畋m _ bamboo 1 is not shown in the mandrel of the bit and the up and down movement in the (Z) direction is omitted. 7 & . The Z-axis drive of the mouth is held in the horizontal slide 8d 〇 2b horizontal NC control The device 21 reads the person's program and creates a position command for the table 2c and the sliders 8c and 8d in addition to the positional commands of the ma and the sliders 8a and 8b.
其次，說明此實施形態之動作。 第9圖係表示對作為加卫對象之印刷基板— Η進行 加工之孔中心位置al〜a4、bl〜b4、ei〜e^ 以 及加工順序之圖式。 如同圖中箭頭所標示，相對於印刷基板la，依‘a2 —a3—a4之順序移動鑽頭4a之軸線，於ai、&2、a3、^ 之各位置進订孔加工。另-方面’相對於印刷基板lb，依 bl—b2—b3—b4之順序移動鑽頭仆之軸線，於M、b2、 b3、b4之各位置進行孔加 順序移動鑽頭4c之軸線， 工。又，依 cl—c2—c3—c4 之 於¢1、c2、C3、C4之各位置進 行孔加工。進一步相對於印刷基板〗d，依d 1 — Μ—们—Μ 之順序移動鑽頭4d之軸線，於dl、们、们、料之各位置 進行孔加工。 由於印刷基板lc之各開孔位置係與印刷基板la之各 開孔位置相對旋轉丨8〇度之位置，因此，於印刷基板丨&與 印刷基板lc之加工内容相同情況下，工作台2a與工作台 14 200808506Next, the operation of this embodiment will be described. Fig. 9 is a view showing the center positions of the holes a1 to a4, bl to b4, ei to e^, and the processing order of the printing substrate as the object to be cured. As indicated by the arrows in the figure, the axis of the drill 4a is moved in the order of 'a2 - a3 - a4 with respect to the printed substrate la, and the hole processing is performed at each position of ai, & 2, a3, ^. On the other hand, with respect to the printed substrate lb, the axis of the drill bit is moved in the order of bl-b2 - b3 - b4, and the axes of the drill bit 4c are sequentially moved at the respective positions of M, b2, b3, and b4. Further, hole processing is performed at each position of ¢1, c2, C3, and C4 according to cl-c2-c3-c4. Further, with respect to the printed substrate Δd, the axis of the drill 4d is moved in the order of d 1 - Μ - Μ - ,, and hole processing is performed at each position of dl, each of them, and the material. Since each of the opening positions of the printed substrate lc is rotated by 丨8 degrees with respect to each of the opening positions of the printed substrate 1a, the table 2a is the same as the processing contents of the printed substrate amp& and the printed substrate lc. With workbench 14 200808506
2c以及横滑座8a與横滑座8c係分別朝相反方向移動。又， 由於印刷基板Id之各開孔位置係與印刷基板lb之各開孔 位置相對旋轉180度之位置，因此，於印刷基板lb與印 刷基板id之加工内容相同情況下，工作台2b與工作台& 以及橫滑座8b與橫滑座8d係分別朝相反方向移動。如以 上所述，在工作台2a移動時工作台2c必定朝相反方向作 相同動作，在橫滑座8a移動時橫滑座8c必定朝相反方向 作相同動作。又，在工作台2b移動時工作台2d必定朝相 反方向作相同動作，在橫滑座8b移動時橫滑座8d必定朝 相反方向作相同動作。因此，因各自動作而產生的水平方 向之激振力相抵銷（或減低）。並且，因工作台與工作么 2d移動（驅動反作用力）而施加於機床〗〇之旋轉力矩，大 工作台2c與工作台2b移動而施加於機床1〇之逆向旋轉力 矩而抵銷。因此，即使工作台2a〜2d移動，旋轉力亦不會 施加於機| 10。同樣地，因橫滑座以及橫滑座8”多動： 施加於機床10(柱9)之旋轉力矩被因橫滑座扑及樺滑座以 移動而施加於機床10 <逆向旋轉力矩抵銷。因此’，即使 橫滑座8a〜8d移動，旋轉力亦不會施加於機床1〇。 結果，在印刷基板加工機不會發生搖動.振動 發生地板振動，可實現高精度加工。 曰 且由於驅動反作用力被開孔圖案決定的 度與可動部質量之積所決定，因此，以工 τ力速 滑座8a〜8d分別為大致相等之質量較佳。 /、 又，當將工作台2a與工作台以工 卞口 M及工作台2b 15 200808506 晨面側的工作台2c、2d 之载置及回收之際，作 與工作台2d之導引裝置作成共用， 可例如移動至舸侧時，於印刷基板 業即變得很容易。 凡貝她例雖係顯示 例 人识沉座分别為4個之 亦即：！ 滑座為4的整倍數，即有相同效果。 L傲Γ 橫滑座為8心上情況時，只要將本實2c and the cross slide 8a and the cross slide 8c are respectively moved in opposite directions. Moreover, since the respective opening positions of the printed board Id are rotated by 180 degrees with respect to the respective opening positions of the printed board 1b, the table 2b and the work are performed under the same processing contents of the printed board 1b and the printed board id. The table & and the cross slide 8b and the cross slide 8d are respectively moved in opposite directions. As described above, when the table 2a is moved, the table 2c must perform the same operation in the opposite direction, and when the carriage 10a is moved, the carriage 8c must perform the same operation in the opposite direction. Further, when the table 2b is moved, the table 2d must perform the same operation in the opposite direction, and when the carriage 10b is moved, the carriage 8d must perform the same operation in the opposite direction. Therefore, the exciting force in the horizontal direction due to the respective actions is offset (or reduced). Further, the table 2 and the work 2d movement (drive reaction force) are applied to the rotational torque of the machine tool, and the large table 2c and the table 2b are moved to be applied to the reverse rotation torque of the machine tool 1 to cancel. Therefore, even if the tables 2a to 2d are moved, the rotational force is not applied to the machine|10. Similarly, the cross slide and the cross slide 8" are multi-moved: the rotational moment applied to the machine tool 10 (column 9) is applied to the machine tool 10 by the movement of the cross slide seat and the birch slide; Therefore, even if the slides 8a to 8d are moved, the rotational force is not applied to the machine tool 1. As a result, the printing substrate processing machine does not shake. The vibration of the floor vibration causes high-precision machining. Since the driving reaction force is determined by the product of the degree of the opening pattern and the mass of the movable portion, it is preferable that the working speeds of the speed sliders 8a to 8d are substantially equal. /, Further, when the table 2a is to be used When the workbench M and the workbench 2b 15 200808506 on the morning side of the workbench 2c, 2d are placed and recovered, they are shared with the guide of the table 2d, for example, when moving to the side In the printing substrate industry, it has become very easy. Although the example of Fanbei is shown in the example, the number of people is 4, namely:! The sliding seat is an integral multiple of 4, which has the same effect. When the seat is 8 hearts, as long as it will be
於γ方向讀㈣成即可。特別是於作業員在同 二向’例如從工作台2a、2b側载置及回收印刷基板時， d列於X方向而加長縱深方向相較，可在不增 之縱深方向操作區域的狀態下，進行操作。 … 又’於上述任一 於各橫滑座8a〜8d， 台2a〜2d， 實施例之情況下，皆可配置複數心軸 而載置對應心軸數之印刷基板於工作 進而，上述實施例雖係說明以鑽頭於印刷基板開孔之 加^機之情形’惟亦可安裝路達（㈣機）鑽頭（nmerbit) 或垛銑刀（end miii)來替代鑽頭，亦可應用本發明之構成於 具有其他疋位機構之一般工作母機、製造裝置。 【圖式簡單說明】 第1圖係應用本發明之印刷基板加工機之外觀圖。 第2圖係有關本發明之X轴驅動控制裝置的處理之方 塊圖。 第3圖係表示待加工孔之中心位置及其順序之圖式（實 施例1)。 第4圖係表示實施第3圖所示加工動作時之速度指令 16Read (four) into the γ direction. In particular, when the operator mounts and collects the printed circuit board in the same direction, for example, from the table 2a, 2b side, d is listed in the X direction and lengthened in the depth direction, and the operating area can be increased without increasing the depth direction. , to operate. Further, in the case of any of the above-described horizontal sliders 8a to 8d and the stages 2a to 2d, in the case of the embodiment, the plurality of spindles can be disposed and the printed circuit board having the corresponding number of spindles can be placed, and the above embodiment Although the description is made of the case where the drill bit is used to open the hole in the printed circuit board, it is also possible to install a Luda ((4) machine) drill bit (nmerbit) or an end mill (end miii) instead of the drill bit, and the composition of the present invention can also be applied. It is a general working machine and manufacturing device with other clamping mechanisms. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an external view of a printed circuit board processing machine to which the present invention is applied. Fig. 2 is a block diagram showing the processing of the X-axis drive control device of the present invention. Fig. 3 is a view showing the center position of the hole to be processed and its sequence (Embodiment 1). Fig. 4 is a view showing the speed command when the machining operation shown in Fig. 3 is carried out.
la〜 3a〜3d 4a〜 5a〜5d 6a〜6d 7a〜7d M 200808506 的時序之圖表。 第5圖係有關本發明之γ軸驅動控制裝置的 塊圖。 之方 第6圖係具備4個工作台情形之工作台驅動方 說明圖。 1 J之 第7圖係表示進行加工之孔中心位置及其順序之 (實施例2)。 ’工 第8圖係應用本發明之另一印刷基板加工機的構之 俯視圖。 第9圖係表示進行加工之孔中心位置及其順序之圖式 (實施例3)。 【主要元件符號說明】 印刷基板 X軸驅動部 鑽頭 心轴 Z轴驅動部 Y軸驅動部 印刷基板加工機 17La~3a~3d 4a~5a~5d 6a~6d 7a~7d M 200808506 Timing chart. Fig. 5 is a block diagram showing the γ-axis drive control device of the present invention. The sixth figure is a diagram of the workbench driver with four workbench situations. Fig. 7 of Fig. 1 shows the center position of the hole to be processed and its order (Example 2). Fig. 8 is a plan view showing the structure of another printed substrate processing machine to which the present invention is applied. Fig. 9 is a view showing the position of the center of the hole to be processed and its sequence (Embodiment 3). [Description of main component symbols] Printed circuit board X-axis drive unit Drill Mandrel Z-axis drive unit Y-axis drive unit Printed substrate processing machine 17