TW200721523A - Integrated circuit device and electronic equipment - Google Patents

Integrated circuit device and electronic equipment

Info

Publication number
TW200721523A
TW200721523A TW095123465A TW95123465A TW200721523A TW 200721523 A TW200721523 A TW 200721523A TW 095123465 A TW095123465 A TW 095123465A TW 95123465 A TW95123465 A TW 95123465A TW 200721523 A TW200721523 A TW 200721523A
Authority
TW
Taiwan
Prior art keywords
source voltage
integrated circuit
circuit device
supplying
power supply
Prior art date
Application number
TW095123465A
Other languages
English (en)
Inventor
Satoru Kodaira
Noboru Itomi
Shuji Kawaguchi
Takashi Kumagai
Hisanobu Ishiyama
Kazuhiro Maekawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200721523A publication Critical patent/TW200721523A/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/18—Bit line organisation; Bit line lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01037—Rubidium [Rb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01066—Dysprosium [Dy]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal Display Device Control (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW095123465A 2005-06-30 2006-06-29 Integrated circuit device and electronic equipment TW200721523A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192952A JP4158788B2 (ja) 2005-06-30 2005-06-30 集積回路装置及び電子機器

Publications (1)

Publication Number Publication Date
TW200721523A true TW200721523A (en) 2007-06-01

Family

ID=37597729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123465A TW200721523A (en) 2005-06-30 2006-06-29 Integrated circuit device and electronic equipment

Country Status (5)

Country Link
US (1) US7492659B2 (zh)
JP (1) JP4158788B2 (zh)
KR (1) KR100745634B1 (zh)
CN (1) CN100514639C (zh)
TW (1) TW200721523A (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012925A (ja) * 2005-06-30 2007-01-18 Seiko Epson Corp 集積回路装置及び電子機器
US7567479B2 (en) * 2005-06-30 2009-07-28 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP2007012869A (ja) * 2005-06-30 2007-01-18 Seiko Epson Corp 集積回路装置及び電子機器
JP4661400B2 (ja) * 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
US7564734B2 (en) 2005-06-30 2009-07-21 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4345725B2 (ja) * 2005-06-30 2009-10-14 セイコーエプソン株式会社 表示装置及び電子機器
US20070001970A1 (en) * 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
US20070001975A1 (en) * 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
US7764278B2 (en) * 2005-06-30 2010-07-27 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4552776B2 (ja) * 2005-06-30 2010-09-29 セイコーエプソン株式会社 集積回路装置及び電子機器
US7411861B2 (en) 2005-06-30 2008-08-12 Seiko Epson Corporation Integrated circuit device and electronic instrument
US7561478B2 (en) * 2005-06-30 2009-07-14 Seiko Epson Corporation Integrated circuit device and electronic instrument
US7593270B2 (en) * 2005-06-30 2009-09-22 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4661401B2 (ja) * 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
US7411804B2 (en) * 2005-06-30 2008-08-12 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4830371B2 (ja) * 2005-06-30 2011-12-07 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4665677B2 (ja) 2005-09-09 2011-04-06 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4586739B2 (ja) * 2006-02-10 2010-11-24 セイコーエプソン株式会社 半導体集積回路及び電子機器
KR102291518B1 (ko) 2015-03-20 2021-08-20 삼성전자주식회사 불휘발성 메모리 장치 및 불휘발성 메모리 장치를 포함하는 스토리지 장치
JP6572290B2 (ja) * 2017-11-22 2019-09-04 ファナック株式会社 電子機器の異常検出装置

Family Cites Families (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566038A (en) 1981-10-26 1986-01-21 Excellon Industries Scan line generator
US4648077A (en) 1985-01-22 1987-03-03 Texas Instruments Incorporated Video serial accessed memory with midline load
DE3776798D1 (de) 1987-11-23 1992-03-26 Philips Nv Schnell arbeitender statischer ram-speicher mit grosser kapazitaet.
US5659514A (en) 1991-06-12 1997-08-19 Hazani; Emanuel Memory cell and current mirror circuit
US5212652A (en) 1989-08-15 1993-05-18 Advanced Micro Devices, Inc. Programmable gate array with improved interconnect structure
JP2717738B2 (ja) 1991-06-20 1998-02-25 三菱電機株式会社 半導体記憶装置
TW235363B (zh) 1993-01-25 1994-12-01 Hitachi Seisakusyo Kk
US5877897A (en) 1993-02-26 1999-03-02 Donnelly Corporation Automatic rearview mirror, vehicle lighting control and vehicle interior monitoring system using a photosensor array
TW247359B (en) 1993-08-30 1995-05-11 Hitachi Seisakusyo Kk Liquid crystal display and liquid crystal driver
US5739803A (en) 1994-01-24 1998-04-14 Arithmos, Inc. Electronic system for driving liquid crystal displays
JPH07281636A (ja) 1994-04-07 1995-10-27 Asahi Glass Co Ltd 液晶表示装置に用いられる駆動装置ならびに列電極駆動用半導体集積回路および行電極駆動用半導体集積回路
US5490114A (en) 1994-12-22 1996-02-06 International Business Machines Corporation High performance extended data out
JPH08194679A (ja) * 1995-01-19 1996-07-30 Texas Instr Japan Ltd ディジタル信号処理方法及び装置並びにメモリセル読出し方法
JP3704715B2 (ja) 1996-03-29 2005-10-12 セイコーエプソン株式会社 表示装置の駆動方法及び表示装置並びにそれを用いた電子機器
US5950219A (en) 1996-05-02 1999-09-07 Cirrus Logic, Inc. Memory banks with pipelined addressing and priority acknowledging and systems and methods using the same
US5909125A (en) 1996-12-24 1999-06-01 Xilinx, Inc. FPGA using RAM control signal lines as routing or logic resources after configuration
TW399319B (en) 1997-03-19 2000-07-21 Hitachi Ltd Semiconductor device
US6034541A (en) 1997-04-07 2000-03-07 Lattice Semiconductor Corporation In-system programmable interconnect circuit
WO1998054727A2 (en) 1997-05-30 1998-12-03 Micron Technology, Inc. 256 Meg DYNAMIC RANDOM ACCESS MEMORY
KR19990070972A (ko) * 1998-02-26 1999-09-15 윤종용 반도체 메모리 장치의 레이아웃 구조
EP0945872B1 (de) * 1998-03-23 2006-05-31 Infineon Technologies AG Verfahren zur Programmierung einer Festwert-Speicherzellenanordnung
JPH11274424A (ja) 1998-03-23 1999-10-08 Matsushita Electric Ind Co Ltd 半導体装置
JPH11328986A (ja) 1998-05-12 1999-11-30 Nec Corp 半導体記憶装置およびそのマルチライト方法
US6229336B1 (en) 1998-05-21 2001-05-08 Lattice Semiconductor Corporation Programmable integrated circuit device with slew control and skew control
US6246386B1 (en) 1998-06-18 2001-06-12 Agilent Technologies, Inc. Integrated micro-display system
KR100290917B1 (ko) 1999-03-18 2001-05-15 김영환 이에스디(ｅｓｄ) 보호회로
WO2000070686A1 (fr) 1999-05-14 2000-11-23 Hitachi, Ltd. Dispositif semi-conducteur, dispositif d'affichage d'image, et leur procede et appareil de fabrication
JP2001067868A (ja) 1999-08-31 2001-03-16 Mitsubishi Electric Corp 半導体記憶装置
JP4061905B2 (ja) 1999-10-18 2008-03-19 セイコーエプソン株式会社 表示装置
JP3968931B2 (ja) 1999-11-19 2007-08-29 セイコーエプソン株式会社 表示装置の駆動方法、その駆動回路、表示装置、および、電子機器
JP4058888B2 (ja) 1999-11-29 2008-03-12 セイコーエプソン株式会社 Ｒａｍ内蔵ドライバ並びにそれを用いた表示ユニットおよび電子機器
JP3659139B2 (ja) 1999-11-29 2005-06-15 セイコーエプソン株式会社 Ｒａｍ内蔵ドライバ並びにそれを用いた表示ユニットおよび電子機器
JP3822411B2 (ja) 2000-03-10 2006-09-20 株式会社東芝 半導体記憶装置
US6731538B2 (en) 2000-03-10 2004-05-04 Kabushiki Kaisha Toshiba Semiconductor memory device including page latch circuit
AU2001255806A1 (en) * 2000-03-14 2001-09-24 Sony Electronics Inc. A method and device for forming a semantic description
WO2001073737A1 (fr) 2000-03-30 2001-10-04 Seiko Epson Corporation Affichage
US6559508B1 (en) 2000-09-18 2003-05-06 Vanguard International Semiconductor Corporation ESD protection device for open drain I/O pad in integrated circuits with merged layout structure
JP2002319298A (ja) 2001-02-14 2002-10-31 Mitsubishi Electric Corp 半導体集積回路装置
JP3687550B2 (ja) 2001-02-19 2005-08-24 セイコーエプソン株式会社 表示ドライバ、それを用いた表示ユニット及び電子機器
JP3977027B2 (ja) 2001-04-05 2007-09-19 セイコーエプソン株式会社 半導体メモリ装置
JP3687581B2 (ja) 2001-08-31 2005-08-24 セイコーエプソン株式会社 液晶パネル、その製造方法および電子機器
US7106319B2 (en) 2001-09-14 2006-09-12 Seiko Epson Corporation Power supply circuit, voltage conversion circuit, semiconductor device, display device, display panel, and electronic equipment
EP1431952A4 (en) 2001-09-28 2009-12-02 Sony Corp DISPLAY MEMORY, DRIVER SWITCHING, DISPLAY AND CELLULAR INFORMATION DEVICE
JP3910047B2 (ja) * 2001-11-20 2007-04-25 松下電器産業株式会社 半導体記憶装置
JP3749473B2 (ja) 2001-11-29 2006-03-01 株式会社日立製作所 表示装置
JP4127510B2 (ja) 2002-03-06 2008-07-30 株式会社ルネサステクノロジ 表示制御装置および電子機器
JPWO2003087924A1 (ja) 2002-04-12 2005-08-25 シチズン時計株式会社 液晶表示パネル
JP3758039B2 (ja) 2002-06-10 2006-03-22 セイコーエプソン株式会社 駆動回路及び電気光学装置
JP2004040042A (ja) 2002-07-08 2004-02-05 Fujitsu Ltd 半導体記憶装置
CN1706001B (zh) 2002-10-15 2012-03-21 索尼株式会社 存储器器件和检测运动向量的设备和方法
JP4055572B2 (ja) 2002-12-24 2008-03-05 セイコーエプソン株式会社 表示システム及び表示コントローラ
TW200411897A (en) 2002-12-30 2004-07-01 Winbond Electronics Corp Robust ESD protection structures
JP2004233742A (ja) 2003-01-31 2004-08-19 Renesas Technology Corp 表示駆動制御装置および表示装置を備えた電子機器
JP2004259318A (ja) 2003-02-24 2004-09-16 Renesas Technology Corp 同期型半導体記憶装置
TWI224300B (en) 2003-03-07 2004-11-21 Au Optronics Corp Data driver and related method used in a display device for saving space
JP2004287165A (ja) 2003-03-24 2004-10-14 Seiko Epson Corp 表示ドライバ、電気光学装置、電子機器及び表示駆動方法
JP4220828B2 (ja) 2003-04-25 2009-02-04 パナソニック株式会社 低域ろ波回路、フィードバックシステムおよび半導体集積回路
KR100538883B1 (ko) 2003-04-29 2005-12-23 주식회사 하이닉스반도체 반도체 메모리 장치
JP3816907B2 (ja) 2003-07-04 2006-08-30 Ｎｅｃエレクトロニクス株式会社 表示データの記憶装置
JP2005063548A (ja) 2003-08-11 2005-03-10 Semiconductor Energy Lab Co Ltd メモリ及びその駆動方法
JP4055679B2 (ja) 2003-08-25 2008-03-05 セイコーエプソン株式会社 電気光学装置、電気光学装置の駆動方法及び電子機器
KR100532463B1 (ko) 2003-08-27 2005-12-01 삼성전자주식회사 정전기 보호 소자와 파워 클램프로 구성된 입출력 정전기방전 보호 셀을 구비하는 집적 회로 장치
JP4703955B2 (ja) 2003-09-10 2011-06-15 株式会社 日立ディスプレイズ 表示装置
JP4601279B2 (ja) 2003-10-02 2010-12-22 ルネサスエレクトロニクス株式会社 コントローラドライバ，及びその動作方法
JP4744075B2 (ja) 2003-12-04 2011-08-10 ルネサスエレクトロニクス株式会社 表示装置、その駆動回路およびその駆動方法
US20050195149A1 (en) 2004-03-04 2005-09-08 Satoru Ito Common voltage generation circuit, power supply circuit, display driver, and common voltage generation method
JP4093197B2 (ja) 2004-03-23 2008-06-04 セイコーエプソン株式会社 表示ドライバ及び電子機器
JP4093196B2 (ja) 2004-03-23 2008-06-04 セイコーエプソン株式会社 表示ドライバ及び電子機器
JP4567356B2 (ja) 2004-03-31 2010-10-20 ルネサスエレクトロニクス株式会社 データ転送方法および電子装置
KR100607195B1 (ko) * 2004-06-28 2006-08-01 삼성전자주식회사 반도체 메모리 장치 및 이의 신호라인 및 파워라인 배치방법
KR20050106895A (ko) * 2004-05-06 2005-11-11 주식회사 하이닉스반도체 반도체 메모리 장치 및 그의 레이아웃 방법
KR100658617B1 (ko) 2004-05-24 2006-12-15 삼성에스디아이 주식회사 발광표시 장치용 정적램 코어 셀
US7411861B2 (en) 2005-06-30 2008-08-12 Seiko Epson Corporation Integrated circuit device and electronic instrument
US20070001970A1 (en) 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
US7561478B2 (en) 2005-06-30 2009-07-14 Seiko Epson Corporation Integrated circuit device and electronic instrument
US20070001975A1 (en) 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
KR100826695B1 (ko) * 2005-06-30 2008-04-30 세이코 엡슨 가부시키가이샤 집적 회로 장치 및 전자 기기
KR100828792B1 (ko) 2005-06-30 2008-05-09 세이코 엡슨 가부시키가이샤 집적 회로 장치 및 전자 기기
JP2007012925A (ja) 2005-06-30 2007-01-18 Seiko Epson Corp 集積回路装置及び電子機器
JP4010335B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
US7564734B2 (en) 2005-06-30 2009-07-21 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4010336B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP2007012869A (ja) 2005-06-30 2007-01-18 Seiko Epson Corp 集積回路装置及び電子機器
JP4661401B2 (ja) 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4830371B2 (ja) 2005-06-30 2011-12-07 セイコーエプソン株式会社 集積回路装置及び電子機器
US7411804B2 (en) 2005-06-30 2008-08-12 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4010334B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
US7593270B2 (en) 2005-06-30 2009-09-22 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4345725B2 (ja) 2005-06-30 2009-10-14 セイコーエプソン株式会社 表示装置及び電子機器
US7567479B2 (en) 2005-06-30 2009-07-28 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4186970B2 (ja) 2005-06-30 2008-11-26 セイコーエプソン株式会社 集積回路装置及び電子機器
US7755587B2 (en) 2005-06-30 2010-07-13 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4010333B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4661400B2 (ja) 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
US7764278B2 (en) 2005-06-30 2010-07-27 Seiko Epson Corporation Integrated circuit device and electronic instrument
US20070001984A1 (en) 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
US20070016700A1 (en) * 2005-06-30 2007-01-18 Seiko Epson Corporation Integrated circuit device and electronic instrument
KR100850614B1 (ko) * 2005-06-30 2008-08-05 세이코 엡슨 가부시키가이샤 집적 회로 장치 및 전자 기기
US20070001974A1 (en) 2005-06-30 2007-01-04 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4151688B2 (ja) 2005-06-30 2008-09-17 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4552776B2 (ja) 2005-06-30 2010-09-29 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010332B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4613761B2 (ja) 2005-09-09 2011-01-19 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4586739B2 (ja) * 2006-02-10 2010-11-24 セイコーエプソン株式会社 半導体集積回路及び電子機器

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KR20070003584A (ko) 2007-01-05
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US7492659B2 (en) 2009-02-17
US20070013074A1 (en) 2007-01-18
JP2007011077A (ja) 2007-01-18
CN1893064A (zh) 2007-01-10
CN100514639C (zh) 2009-07-15

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