TW200712848A - Heat-emitting element cooling apparatus and heatsink - Google Patents

Heat-emitting element cooling apparatus and heatsink

Info

Publication number
TW200712848A
TW200712848A TW095115763A TW95115763A TW200712848A TW 200712848 A TW200712848 A TW 200712848A TW 095115763 A TW095115763 A TW 095115763A TW 95115763 A TW95115763 A TW 95115763A TW 200712848 A TW200712848 A TW 200712848A
Authority
TW
Taiwan
Prior art keywords
heat
emitting element
cooling apparatus
element cooling
radiation fins
Prior art date
Application number
TW095115763A
Other languages
English (en)
Inventor
Masashi Miyazawa
Tomoaki Ikeda
Toshiki Ogawara
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200712848A publication Critical patent/TW200712848A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095115763A 2005-05-12 2006-05-03 Heat-emitting element cooling apparatus and heatsink TW200712848A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005140396A JP2006319142A (ja) 2005-05-12 2005-05-12 発熱体冷却装置及びヒートシンク

Publications (1)

Publication Number Publication Date
TW200712848A true TW200712848A (en) 2007-04-01

Family

ID=37417987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115763A TW200712848A (en) 2005-05-12 2006-05-03 Heat-emitting element cooling apparatus and heatsink

Country Status (4)

Country Link
US (1) US7367382B2 (zh)
JP (1) JP2006319142A (zh)
CN (1) CN100561719C (zh)
TW (1) TW200712848A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365975B2 (en) * 2006-05-02 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
US20100008045A1 (en) * 2008-07-09 2010-01-14 Hong Fu Jin Precision Industry(Shenzhen) Co., Ltd Heat sink
US20100008042A1 (en) * 2008-07-09 2010-01-14 Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. Heat dissipation device
TWM355000U (en) * 2008-08-06 2009-04-11 Kwo Ger Metal Technology Inc Bottom board of heat sink module
CN101998807A (zh) * 2009-08-19 2011-03-30 富瑞精密组件（昆山）有限公司 散热装置
TWI414235B (zh) * 2009-08-24 2013-11-01 Compal Electronics Inc 散熱模組
CN102714446B (zh) * 2009-10-01 2015-02-11 贝克曼考尔特公司 声音减弱的散热器和马达外壳
DE102010025352B4 (de) * 2010-06-28 2019-12-24 Audi Ag Verfahren zum Herstellen einer elektrischen Maschine eines Kraftwagens
TW201224386A (en) * 2010-12-15 2012-06-16 Hon Hai Prec Ind Co Ltd Heat sink
US10914539B2 (en) * 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink
JP2021018279A (ja) * 2019-07-18 2021-02-15 キヤノン株式会社 光源装置およびプロジェクタ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928584Y1 (zh) * 1969-04-21 1974-08-03
JPS62203Y2 (zh) * 1981-01-30 1987-01-07
JPS57203557U (zh) * 1981-02-18 1982-12-24
JPH0385340U (zh) 1989-12-20 1991-08-29
GB2276763B (en) * 1993-03-30 1997-05-07 Thermalloy Inc Method and apparatus for dissipating thermal energy
JPH0714954A (ja) * 1993-06-22 1995-01-17 Nec Corp ヒートシンク付半導体パッケージ
JP3431004B2 (ja) * 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
JP2001326307A (ja) * 2000-05-18 2001-11-22 Matsushita Electric Ind Co Ltd 電子部品用ヒートシンクおよびその製造方法
US6310774B1 (en) * 2000-10-23 2001-10-30 Foxconn Precision Components Co., Ltd. Heat sink clip
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation
US6446708B1 (en) * 2001-10-17 2002-09-10 Tai-Sol Electronics Co., Ltd. Heat dissipating device
JP2003264262A (ja) * 2002-03-08 2003-09-19 Denso Wave Inc ヒートシンク
JP3937984B2 (ja) * 2002-09-09 2007-06-27 松下電器産業株式会社 電子部品用ヒートシンクの製造方法
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat

Also Published As

Publication number Publication date
CN100561719C (zh) 2009-11-18
CN1905172A (zh) 2007-01-31
US20060254750A1 (en) 2006-11-16
JP2006319142A (ja) 2006-11-24
US7367382B2 (en) 2008-05-06

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