TW200710581A - Protective film-forming material for a process of liquid immersion lithography and method of photoresist patterning with it - Google Patents
Protective film-forming material for a process of liquid immersion lithography and method of photoresist patterning with itInfo
- Publication number
- TW200710581A TW200710581A TW095117501A TW95117501A TW200710581A TW 200710581 A TW200710581 A TW 200710581A TW 095117501 A TW095117501 A TW 095117501A TW 95117501 A TW95117501 A TW 95117501A TW 200710581 A TW200710581 A TW 200710581A
- Authority
- TW
- Taiwan
- Prior art keywords
- protective film
- liquid immersion
- forming material
- immersion lithography
- film formation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005144270A JP2006323002A (ja) | 2005-05-17 | 2005-05-17 | 液浸露光プロセス用ホトレジスト保護膜形成用材料およびこれを用いたホトレジストパターン形成方法 |
JP2005344644A JP2007148167A (ja) | 2005-11-29 | 2005-11-29 | 液浸露光プロセス用保護膜形成用材料およびこれを用いたホトレジストパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200710581A true TW200710581A (en) | 2007-03-16 |
Family
ID=37431215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095117501A TW200710581A (en) | 2005-05-17 | 2006-05-17 | Protective film-forming material for a process of liquid immersion lithography and method of photoresist patterning with it |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200710581A (zh) |
WO (1) | WO2006123643A1 (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3979553B2 (ja) * | 1998-06-12 | 2007-09-19 | 東京応化工業株式会社 | 反射防止膜形成用塗布液組成物およびこれを用いたレジスト材料 |
TW200424767A (en) * | 2003-02-20 | 2004-11-16 | Tokyo Ohka Kogyo Co Ltd | Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method |
JP2005099646A (ja) * | 2003-03-28 | 2005-04-14 | Tokyo Ohka Kogyo Co Ltd | 液浸露光プロセス用レジスト組成物および該レジスト組成物を用いたレジストパターン形成方法 |
JP2005173474A (ja) * | 2003-12-15 | 2005-06-30 | Tokyo Ohka Kogyo Co Ltd | 液浸露光プロセス用レジスト組成物、該レジスト材料を用いたレジストパターン形成方法 |
-
2006
- 2006-05-16 WO PCT/JP2006/309718 patent/WO2006123643A1/ja active Application Filing
- 2006-05-17 TW TW095117501A patent/TW200710581A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006123643A1 (ja) | 2006-11-23 |
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