TW200703461A - Glass-based semiconductor on insulator structures and methods of making same - Google Patents

Glass-based semiconductor on insulator structures and methods of making same

Info

Publication number
TW200703461A
TW200703461A TW095112767A TW95112767A TW200703461A TW 200703461 A TW200703461 A TW 200703461A TW 095112767 A TW095112767 A TW 095112767A TW 95112767 A TW95112767 A TW 95112767A TW 200703461 A TW200703461 A TW 200703461A
Authority
TW
Taiwan
Prior art keywords
methods
glass
based semiconductor
making same
insulator structures
Prior art date
Application number
TW095112767A
Other languages
English (en)
Inventor
Kishor Purushottam Gadkaree
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of TW200703461A publication Critical patent/TW200703461A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76259—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along a porous layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y10T428/24998—Composite has more than two layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249981—Plural void-containing components
TW095112767A 2005-04-13 2006-04-10 Glass-based semiconductor on insulator structures and methods of making same TW200703461A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67117705P 2005-04-13 2005-04-13
US11/159,889 US7410883B2 (en) 2005-04-13 2005-06-23 Glass-based semiconductor on insulator structures and methods of making same

Publications (1)

Publication Number Publication Date
TW200703461A true TW200703461A (en) 2007-01-16

Family

ID=37109064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112767A TW200703461A (en) 2005-04-13 2006-04-10 Glass-based semiconductor on insulator structures and methods of making same

Country Status (3)

Country Link
US (2) US7410883B2 (zh)
TW (1) TW200703461A (zh)
WO (1) WO2006112995A2 (zh)

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CN111052306A (zh) * 2017-09-07 2020-04-21 苏州晶湛半导体有限公司 衬底及其制备方法

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US7767541B2 (en) * 2005-10-26 2010-08-03 International Business Machines Corporation Methods for forming germanium-on-insulator semiconductor structures using a porous layer and semiconductor structures formed by these methods
US7691730B2 (en) * 2005-11-22 2010-04-06 Corning Incorporated Large area semiconductor on glass insulator
US20070277875A1 (en) * 2006-05-31 2007-12-06 Kishor Purushottam Gadkaree Thin film photovoltaic structure
WO2007142865A2 (en) * 2006-05-31 2007-12-13 Corning Incorporated Thin film photovoltaic structure and fabrication
US20070277874A1 (en) * 2006-05-31 2007-12-06 David Francis Dawson-Elli Thin film photovoltaic structure
US20080070340A1 (en) * 2006-09-14 2008-03-20 Nicholas Francis Borrelli Image sensor using thin-film SOI
US7687360B2 (en) * 2006-12-22 2010-03-30 Spansion Llc Method of forming spaced-apart charge trapping stacks
US20100314804A1 (en) * 2007-08-31 2010-12-16 Antonio Vallera Method for the production of semiconductor ribbons from a gaseous feedstock
US8217498B2 (en) * 2007-10-18 2012-07-10 Corning Incorporated Gallium nitride semiconductor device on SOI and process for making same
KR101058105B1 (ko) * 2009-04-06 2011-08-24 삼성모바일디스플레이주식회사 액티브 매트릭스 기판의 제조방법 및 유기 발광 표시장치의 제조방법
KR101127574B1 (ko) * 2009-04-06 2012-03-23 삼성모바일디스플레이주식회사 액티브 매트릭스 기판의 제조방법 및 유기 발광 표시장치의 제조방법
DE102009042886A1 (de) 2009-09-24 2011-05-26 Schott Ag Verfahren zur Herstellung einer Solarzelle oder eines Transistors mit einer kristallinen Silizium-Dünnschicht
KR101145074B1 (ko) * 2010-07-02 2012-05-11 이상윤 반도체 기판의 제조 방법 및 이를 이용한 반도체 장치의 제조 방법
US8921841B2 (en) * 2012-05-09 2014-12-30 Samsung Corning Precision Materials Co., Ltd. Porous glass substrate for displays and method of manufacturing the same
US20140264456A1 (en) * 2013-03-15 2014-09-18 Semiconductor Components Industries, Llc Method of forming a high electron mobility semiconductor device
US9327472B1 (en) * 2013-07-19 2016-05-03 Integrated Photovoltaics, Inc. Composite substrate
CN104779265B (zh) 2014-01-14 2020-07-07 松下电器产业株式会社 发光装置
FR3024587B1 (fr) * 2014-08-01 2018-01-26 Soitec Procede de fabrication d'une structure hautement resistive
CN105589587B (zh) * 2014-10-21 2018-10-26 宸鸿科技(厦门)有限公司 透明复合基板与其制备方法及触控面板
CN105702725B (zh) * 2014-11-27 2018-12-11 中国科学院微电子研究所 半导体器件及其制造方法
CN105789301B (zh) * 2014-12-25 2018-09-11 中国科学院微电子研究所 鳍式场效应晶体管、鳍结构及其制造方法
US10032870B2 (en) * 2015-03-12 2018-07-24 Globalfoundries Inc. Low defect III-V semiconductor template on porous silicon
JP2020515033A (ja) 2016-12-16 2020-05-21 エルファー エルエルシー 多孔質炭化ケイ素構造を製造およびエッチングするための方法
DE102019108754A1 (de) * 2019-03-06 2020-09-10 Infineon Technologies Ag Halbleitervorrichtung mit einem porösen bereich, waferverbundstruktur und verfahren zum herstellen einerhalbleitervorrichtung
US20230127556A1 (en) * 2021-10-22 2023-04-27 Infineon Technologies Ag Manufacturing and reuse of semiconductor substrates

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JP3381443B2 (ja) 1995-02-02 2003-02-24 ソニー株式会社 基体から半導体層を分離する方法、半導体素子の製造方法およびｓｏｉ基板の製造方法
US6107213A (en) 1996-02-01 2000-08-22 Sony Corporation Method for making thin film semiconductor
JP3250722B2 (ja) 1995-12-12 2002-01-28 キヤノン株式会社 Ｓｏｉ基板の製造方法および製造装置
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US6143628A (en) 1997-03-27 2000-11-07 Canon Kabushiki Kaisha Semiconductor substrate and method of manufacturing the same
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CN1249531A (zh) 1998-09-04 2000-04-05 佳能株式会社 半导体衬底的制造工艺
US6410436B2 (en) * 1999-03-26 2002-06-25 Canon Kabushiki Kaisha Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate
JP2001284622A (ja) 2000-03-31 2001-10-12 Canon Inc 半導体部材の製造方法及び太陽電池の製造方法
JP2004134672A (ja) * 2002-10-11 2004-04-30 Sony Corp 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置
US7176528B2 (en) * 2003-02-18 2007-02-13 Corning Incorporated Glass-based SOI structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111052306A (zh) * 2017-09-07 2020-04-21 苏州晶湛半导体有限公司 衬底及其制备方法
CN111052306B (zh) * 2017-09-07 2023-12-15 苏州晶湛半导体有限公司 衬底及其制备方法

Also Published As

Publication number Publication date
WO2006112995A3 (en) 2007-05-24
US7410883B2 (en) 2008-08-12
WO2006112995A2 (en) 2006-10-26
US20060234477A1 (en) 2006-10-19
US20080286539A1 (en) 2008-11-20

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