TW200643358A - Heat dissipating device - Google Patents

Heat dissipating device

Info

Publication number
TW200643358A
TW200643358A TW094118405A TW94118405A TW200643358A TW 200643358 A TW200643358 A TW 200643358A TW 094118405 A TW094118405 A TW 094118405A TW 94118405 A TW94118405 A TW 94118405A TW 200643358 A TW200643358 A TW 200643358A
Authority
TW
Taiwan
Prior art keywords
fins
base
passage
heat
dissipating device
Prior art date
Application number
TW094118405A
Other languages
Chinese (zh)
Other versions
TWI269018B (en
Inventor
Tong-Hua Lin
Chin-Lung Chen
Yeu-Lih Lin
Phil Chou
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94118405A priority Critical patent/TWI269018B/en
Publication of TW200643358A publication Critical patent/TW200643358A/en
Application granted granted Critical
Publication of TWI269018B publication Critical patent/TWI269018B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device includes a base for absorbing from a heat generating component, a plurality of fins stacked together and a plurality of heat pipes connecting the base with the fins. Any two adjacent fins forms a passage therebetween. Spacers are formed at the passage to separate the passage into a plurality of sections for avoiding disturbance when airflow flows the passage. The spacer formed at one of the fins, which is located adjacent to the base, contacts the base. Thus, one portion of the absorbed heat is transferred to the fins by the heat pipes while the other portion is transferred to the fins by the spacers arranged between the fins.
TW94118405A 2005-06-03 2005-06-03 Heat dissipating device TWI269018B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94118405A TWI269018B (en) 2005-06-03 2005-06-03 Heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94118405A TWI269018B (en) 2005-06-03 2005-06-03 Heat dissipating device

Publications (2)

Publication Number Publication Date
TW200643358A true TW200643358A (en) 2006-12-16
TWI269018B TWI269018B (en) 2006-12-21

Family

ID=38291423

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94118405A TWI269018B (en) 2005-06-03 2005-06-03 Heat dissipating device

Country Status (1)

Country Link
TW (1) TWI269018B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400032B (en) * 2008-02-05 2013-06-21 Delta Electronics Inc Heat dissipation module and supporting element thereof
TW201226824A (en) * 2010-12-17 2012-07-01 Microtips Electronics Co Ltd Heat-dissipating device

Also Published As

Publication number Publication date
TWI269018B (en) 2006-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees