TWI264268B - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TWI264268B TWI264268B TW93138718A TW93138718A TWI264268B TW I264268 B TWI264268 B TW I264268B TW 93138718 A TW93138718 A TW 93138718A TW 93138718 A TW93138718 A TW 93138718A TW I264268 B TWI264268 B TW I264268B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation device
- section
- connection portion
- sections
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second with a second surface and a connection portion. The first surface is parallel to the second surface. The connection portion connects the first and second sections and extends along the normal direction thereof. An air passage is formed among the first and second sections and the connection portion, so that an air sequentially passes through the first section, the air passage and the second section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138718A TWI264268B (en) | 2004-12-14 | 2004-12-14 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138718A TWI264268B (en) | 2004-12-14 | 2004-12-14 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200621138A TW200621138A (en) | 2006-06-16 |
TWI264268B true TWI264268B (en) | 2006-10-11 |
Family
ID=37967316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93138718A TWI264268B (en) | 2004-12-14 | 2004-12-14 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI264268B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI489077B (en) * | 2010-04-23 | 2015-06-21 | 鴻準精密工業股份有限公司 | Heat sink |
TWI622752B (en) * | 2017-06-22 | 2018-05-01 | 宏碁股份有限公司 | Heat dissipation module |
-
2004
- 2004-12-14 TW TW93138718A patent/TWI264268B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI489077B (en) * | 2010-04-23 | 2015-06-21 | 鴻準精密工業股份有限公司 | Heat sink |
TWI622752B (en) * | 2017-06-22 | 2018-05-01 | 宏碁股份有限公司 | Heat dissipation module |
US10529649B2 (en) | 2017-06-22 | 2020-01-07 | Acer Incorporated | Heat dissipation module |
Also Published As
Publication number | Publication date |
---|---|
TW200621138A (en) | 2006-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI411383B (en) | ||
TW200702615A (en) | Heat sink structure | |
TW200517042A (en) | Heat sink | |
TWI267341B (en) | Heat dissipating device | |
TW200624030A (en) | Twin fin arrayed cooling device with heat spreader | |
TW200606371A (en) | Integral reflector and heat sink | |
GB0320061D0 (en) | Heat sink with heat pipe and base fins | |
WO2006105452A3 (en) | Semiconductor device based on a scr | |
GB2464046A (en) | Computer device heat dissipation system | |
TW200616527A (en) | Stagger fin array | |
TW200721947A (en) | Clip adapted to heat sink | |
TW200624022A (en) | Heat dissipation module | |
KR20130066394A (en) | Heat sink | |
TWI264268B (en) | Heat dissipation device | |
EP2559938A3 (en) | Heat sink for LED lamp | |
TW200601021A (en) | Aluminium extruded fin with noise reduction function | |
ATE470122T1 (en) | REFRIGERATED UNIT WITH PARTIALLY STRUCTURED HEAT EXCHANGER FINs | |
TW200638856A (en) | Heat sink | |
US20060102325A1 (en) | Guiding fin heat sink | |
TWI265267B (en) | Heat dissipation device with heat pipe | |
TW200738114A (en) | Heat sink | |
TW200738115A (en) | Heat sink | |
TW200732894A (en) | Heat sink | |
TW200643358A (en) | Heat dissipating device | |
TW200711560A (en) | Heat sink with heat pipes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |