TW200637470A - Heat-dissipating module of electronic device - Google Patents
Heat-dissipating module of electronic deviceInfo
- Publication number
- TW200637470A TW200637470A TW094111386A TW94111386A TW200637470A TW 200637470 A TW200637470 A TW 200637470A TW 094111386 A TW094111386 A TW 094111386A TW 94111386 A TW94111386 A TW 94111386A TW 200637470 A TW200637470 A TW 200637470A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- casing
- dissipating
- dissipating component
- disposed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094111386A TWI257285B (en) | 2005-04-11 | 2005-04-11 | Heat-dissipating module of electronic device |
US11/302,900 US20060227504A1 (en) | 2005-04-11 | 2005-12-14 | Heat-dissipating module of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094111386A TWI257285B (en) | 2005-04-11 | 2005-04-11 | Heat-dissipating module of electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI257285B TWI257285B (en) | 2006-06-21 |
TW200637470A true TW200637470A (en) | 2006-10-16 |
Family
ID=37082934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094111386A TWI257285B (en) | 2005-04-11 | 2005-04-11 | Heat-dissipating module of electronic device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060227504A1 (zh) |
TW (1) | TWI257285B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102450115A (zh) * | 2009-06-09 | 2012-05-09 | 厄利孔莱博尔德真空技术有限责任公司 | 真空泵 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004042034A1 (de) * | 2004-08-26 | 2006-03-16 | Laing, Oliver | Energieversorgungsvorrichtung für ein elektrisches Gerät und Verfahren zur Bereitstellung elektrischer Energie an Komponenten eines elektrischen Geräts |
EP1782665B1 (de) * | 2004-08-26 | 2013-01-16 | Xylem IP Holdings LLC | Kühlungsanordnung für ein elektrisches gerät und verfahren zur flüssigkeitskühlung |
DE502006005141D1 (de) * | 2005-12-08 | 2009-11-26 | Sew Eurodrive Gmbh & Co | Gerät, baureihe von geräten, vorrichtung mit gehäuund verwendung eines flüssigkeitskühlers |
US8395896B2 (en) * | 2007-02-24 | 2013-03-12 | Hewlett-Packard Development Company, L.P. | Redundant cooling systems and methods |
US20090242170A1 (en) * | 2008-03-28 | 2009-10-01 | Raytheon Company | Cooling Fins for a Heat Pipe |
DE102008052145B4 (de) * | 2008-10-20 | 2011-01-20 | Sew-Eurodrive Gmbh & Co. Kg | Anordnung zum Temperieren einer elektrischen Komponente und Elektrogerät damit |
TWI392445B (zh) * | 2010-07-21 | 2013-04-01 | Quanta Comp Inc | 伺服器機櫃之降溫設備 |
TWI457069B (zh) * | 2011-12-19 | 2014-10-11 | Inventec Corp | 伺服器及散熱模組 |
KR102166764B1 (ko) | 2013-10-10 | 2020-10-19 | 삼성전자주식회사 | 컨트롤박스 및 이를 포함하는 공기조화기의 실외기 |
EP2879476B1 (en) * | 2013-11-29 | 2016-06-29 | ABB Technology Oy | Electric apparatus |
US10455726B2 (en) * | 2014-09-30 | 2019-10-22 | Hewlett Packard Enterprise Development Lp | Modular cooling |
US9686891B2 (en) | 2015-07-06 | 2017-06-20 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air cooling for an electronics rack |
US9949412B2 (en) | 2015-08-12 | 2018-04-17 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air-cooled thermal conductors |
US9504189B1 (en) * | 2015-08-12 | 2016-11-22 | International Business Machines Corporation | Thermoelectric-enhanced, inlet air-cooled thermal conductors |
US10624244B2 (en) * | 2015-11-04 | 2020-04-14 | Preh Gmbh | Automotive power electronics assembly |
DE102016109280A1 (de) | 2016-05-20 | 2017-11-23 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung zur Kühlung von elektronischen Komponenten |
US11249522B2 (en) * | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
CN108347863A (zh) * | 2017-01-25 | 2018-07-31 | 全汉企业股份有限公司 | 电源供应装置 |
CN206909011U (zh) | 2017-04-19 | 2018-01-19 | 西门子公司 | 散热器和变频器 |
DE102017003854A1 (de) * | 2017-04-20 | 2018-10-25 | Leopold Kostal Gmbh & Co. Kg | Gehäuse für ein elektrisches oder elektronisches Gerät |
CN109427707B (zh) * | 2017-08-31 | 2020-07-07 | 华中科技大学 | 一种功率器件的三维封装结构及封装方法 |
KR102105666B1 (ko) * | 2018-02-28 | 2020-04-28 | 주식회사 뉴파워 프라즈마 | 공냉 구조와 수냉 구조가 병합된 플라즈마 처리용 고주파 전력 발생장치 |
US10681845B2 (en) * | 2018-03-26 | 2020-06-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments |
US11240932B1 (en) * | 2018-07-27 | 2022-02-01 | Waymo Llc | Cold plate |
US11076504B2 (en) * | 2019-03-08 | 2021-07-27 | Appleton Grp Llc | Arrangement for dissipating heat of a power supply unit in a housing |
CN110831406B (zh) * | 2019-10-30 | 2021-05-07 | 中国电子科技集团公司第三十八研究所 | 一种面向超高热流密度电子器件的高效散热装置 |
CN112954949B (zh) * | 2019-12-10 | 2024-05-03 | 台达电子工业股份有限公司 | 网络设备电源及用于网络设备电源的散热*** |
US10959352B1 (en) * | 2020-01-03 | 2021-03-23 | Quanta Computer Inc. | Cooling system with floating cold plate with single pipes |
EP3923689B1 (en) | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Cooling device and its manufacturing method |
EP3955716A1 (en) | 2020-08-13 | 2022-02-16 | Aptiv Technologies Limited | Cooling device and method of manufacturing the same |
CN115443027A (zh) * | 2021-06-02 | 2022-12-06 | 英业达科技有限公司 | 伺服装置 |
CN115437480A (zh) * | 2021-06-03 | 2022-12-06 | 英业达科技有限公司 | 伺服装置 |
US11785741B2 (en) * | 2021-07-20 | 2023-10-10 | Dell Products L.P. | System and method for cooling a computing device |
CN113923936B (zh) * | 2021-08-30 | 2023-08-25 | 国网安徽省电力有限公司枞阳县供电公司 | 一种电力电子模块和电力电子元器件封装基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6504719B2 (en) * | 2001-03-30 | 2003-01-07 | Intel Corporation | Computer system that can be operated without a cooling fan |
TW570227U (en) * | 2001-04-13 | 2004-01-01 | Foxconn Prec Components Co Ltd | Computer heat dissipating system |
IL146838A0 (en) * | 2001-11-29 | 2002-07-25 | Active Cool Ltd | Active cooling system for cpu |
US7133283B2 (en) * | 2002-01-04 | 2006-11-07 | Intel Corporation | Frame-level thermal interface component for transfer of heat from an electronic component of a computer system |
US6975509B2 (en) * | 2002-05-16 | 2005-12-13 | Sun Microsystems, Inc. | Computing apparatus with cooling fan |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
TW200500838A (en) * | 2003-02-19 | 2005-01-01 | Nisvara Inc | System and apparatus for heat removal |
KR100961683B1 (ko) * | 2003-06-04 | 2010-06-09 | 삼성전자주식회사 | 컴퓨터 |
JP2005228237A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システム及びそれを備えた電子機器 |
US7626815B2 (en) * | 2005-11-14 | 2009-12-01 | Nvidia Corporation | Drive bay heat exchanger |
-
2005
- 2005-04-11 TW TW094111386A patent/TWI257285B/zh active
- 2005-12-14 US US11/302,900 patent/US20060227504A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102450115A (zh) * | 2009-06-09 | 2012-05-09 | 厄利孔莱博尔德真空技术有限责任公司 | 真空泵 |
CN102450115B (zh) * | 2009-06-09 | 2015-07-15 | 厄利孔莱博尔德真空技术有限责任公司 | 真空泵 |
US9234519B2 (en) | 2009-06-09 | 2016-01-12 | Oerlikon Leybold Vacuum Gmbh | Vacuum pump |
Also Published As
Publication number | Publication date |
---|---|
US20060227504A1 (en) | 2006-10-12 |
TWI257285B (en) | 2006-06-21 |
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