TWI457069B - 伺服器及散熱模組 - Google Patents

伺服器及散熱模組 Download PDF

Info

Publication number
TWI457069B
TWI457069B TW100147164A TW100147164A TWI457069B TW I457069 B TWI457069 B TW I457069B TW 100147164 A TW100147164 A TW 100147164A TW 100147164 A TW100147164 A TW 100147164A TW I457069 B TWI457069 B TW I457069B
Authority
TW
Taiwan
Prior art keywords
cold plate
component
side wall
housing
chassis
Prior art date
Application number
TW100147164A
Other languages
English (en)
Other versions
TW201328554A (zh
Inventor
Yu Huan Lin
Kai Yang Tung
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW100147164A priority Critical patent/TWI457069B/zh
Publication of TW201328554A publication Critical patent/TW201328554A/zh
Application granted granted Critical
Publication of TWI457069B publication Critical patent/TWI457069B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (3)

  1. 一種伺服器，包括：一機箱；一主機板模組，配置於該機箱內且具有至少一第一元件及至少一第二元件；一散熱模組，包括：至少一冷板，配置於該主機板模組上並接觸該第一元件；一導管組，配置於該主機板模組上且連通於該冷板，其中一水冷液適於在該冷板及該導管組內流動，以帶走該第一元件傳遞至該冷板的熱；至少一殼體，配置於該主機板模組上，且具有一入風口、至少一出風口及至少一隔板，其中該隔板將該殼體內部分隔為至少一第一空間及一第二空間，該第一元件及該冷板位於該第一空間內，該第二空間連通該入風口及該出風口，該第二元件位於該殼體外且鄰近該出風口；以及一風扇模組，配置於該機箱側邊且適於提供一散熱氣流至該機箱內，該散熱氣流透過該入風口進入該殼體，並透過該出風口流出該殼體而到達該第二元件；以及一冷卻裝置，其中該導管組透過該入風口從該殼體內延伸至該殼體外，且該導管組包括：一第一導管，連通於該冷板與該冷卻裝置之間， 其中該冷板的熱傳遞至該水冷液之後，該水冷液從該冷板經過該第一導管流至該冷卻裝置而被冷卻；以及一第二導管，連通於該冷板與該冷卻裝置之間，其中被冷卻的該水冷液從該冷卻裝置經過該第二導管流至該冷板，其中該隔板具有兩開口，該第一導管與該第二導管分別透過該兩開口從該第一空間外延伸至該第一空間內。
  2. 如申請專利範圍第1項所述之伺服器，其中該機箱具有相對的一第一側壁及一第二側壁，該入風口朝向該第一側壁，該出風口朝向該第二側壁，該散熱氣流適於從該第一側壁進入該機箱並流向該入風口，且適於從該出風口流向該第二側壁並從該第二側壁流出該機箱。
  3. 如申請專利範圍第1項所述之伺服器，其中該殼體具有至少一導風板，該導風板從該殼體往該第二元件延伸，該出風口形成於該導風板末端。
TW100147164A 2011-12-19 2011-12-19 伺服器及散熱模組 TWI457069B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100147164A TWI457069B (zh) 2011-12-19 2011-12-19 伺服器及散熱模組

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100147164A TWI457069B (zh) 2011-12-19 2011-12-19 伺服器及散熱模組

Publications (2)

Publication Number Publication Date
TW201328554A TW201328554A (zh) 2013-07-01
TWI457069B true TWI457069B (zh) 2014-10-11

Family

ID=49225434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100147164A TWI457069B (zh) 2011-12-19 2011-12-19 伺服器及散熱模組

Country Status (1)

Country Link
TW (1) TWI457069B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815696B (zh) * 2022-10-13 2023-09-11 英業達股份有限公司 具有限位結構的水冷模組

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237174B (en) * 2003-02-14 2005-08-01 Hitachi Ltd Rack-mount server system, rack cabinet, server module and cooling method for a rack-mount server system
TWI257285B (en) * 2005-04-11 2006-06-21 Delta Electronics Inc Heat-dissipating module of electronic device
TW201146152A (en) * 2010-06-04 2011-12-16 Hon Hai Prec Ind Co Ltd Air duct

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237174B (en) * 2003-02-14 2005-08-01 Hitachi Ltd Rack-mount server system, rack cabinet, server module and cooling method for a rack-mount server system
TWI257285B (en) * 2005-04-11 2006-06-21 Delta Electronics Inc Heat-dissipating module of electronic device
TW201146152A (en) * 2010-06-04 2011-12-16 Hon Hai Prec Ind Co Ltd Air duct

Also Published As

Publication number Publication date
TW201328554A (zh) 2013-07-01

Similar Documents

Publication Publication Date Title
GB201216684D0 (en) Directly connected heat exchanger tube section and collant-colled structure
TW201427577A (zh) 噴霧式散熱結構
JP2005331233A5 (zh)
EP2508759A3 (en) Cooling system equipped with an advection-type fan
EP2400247A3 (en) Heat exchanger and nozzle of heat exchanger
JP2017502251A5 (ja) 流体処理装置および流体流れを冷却する方法
TW202043689A (zh) 散熱系統及其冷卻液分配模組
DK1965164T3 (da) Indretning til varmeveksling mellem medier, der hører til to kredsløb
TW201724955A (zh) 液冷式散熱裝置
TWI457069B (zh) 伺服器及散熱模組
TWI489255B (zh) 數據中心
CN205942576U (zh) 一种双冷却自降温式计算机主机箱
WO2016145995A1 (zh) 吸附分离装置
CN102147647A (zh) 一种大型电脑cpu液冷散热器
TWM575857U (zh) Water cooling system for water cooling system
TW201339808A (zh) 電子裝置
JP2010249730A5 (zh)
CN109116956A (zh) 一种一体式计算机机箱散热装置
TW201221280A (en) A cooling device for cutting fluid
TW200911101A (en) Water-cooled tap structure of a water-cooled heat dissipation system
CN202003981U (zh) 一种大型电脑cpu液冷散热器
JP2012054498A (ja) 電子機器の冷却装置
CN103727807B (zh) 内流风冷式高压流体热交换器
TWM530421U (zh) 水冷散熱機構
JP2008170042A5 (zh)