TW200635452A - Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode - Google Patents

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Info

Publication number
TW200635452A
TW200635452A TW094145509A TW94145509A TW200635452A TW 200635452 A TW200635452 A TW 200635452A TW 094145509 A TW094145509 A TW 094145509A TW 94145509 A TW94145509 A TW 94145509A TW 200635452 A TW200635452 A TW 200635452A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
semiconductor element
collective substrate
mounts
Prior art date
Application number
TW094145509A
Other languages
Chinese (zh)
Other versions
TWI326567B (en
Inventor
Kenjiro Higaki
Daisuke Takagi
Sadamu Ishidu
Yasushi Tsuzuki
Original Assignee
Almt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almt Corp filed Critical Almt Corp
Publication of TW200635452A publication Critical patent/TW200635452A/en
Application granted granted Critical
Publication of TWI326567B publication Critical patent/TWI326567B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A collective substrate (1) being produced by forming a through hole (11) aft er sintering a ceramic green sheet, wherein the inner surface of the through ho le (11) has tapered surfaces (11b, 11c) such that the aperture dimensions decrease gradually from the major surface (21) side and the outer connection surface (22) side toward the minimum hole part (11a), and the angles .theta. 1 and theta 2 formed between the tapered faces (11b, 11c) and the major surfa ce (21) and the outer connection surface (22) are both set at obtuse angles. A semiconductor element mounting member BL comprises an insulating member (2) cut out from the collective substrate (1). An imaging device PE2 mounts a semiconductor element PE1 in a region surrounded by a frame (4) bonded to th e major surface (21) side of the insulating member (2) and closed by a lid FL. A light emitting diode constituting member LE2 mounts a light emitting element LE1 on the major surface (21) of the insulating member (2) where the minimum hole part (11a) is filled with a conductive material (33a), and is sealed by phosphor and/or protective resin FR. A light emitting diode LE3 mounts the light emitting diode constituting member LE2 in a package (7).
TW094145509A 2005-02-23 2005-12-21 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode TW200635452A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047481 2005-02-23

Publications (2)

Publication Number Publication Date
TW200635452A true TW200635452A (en) 2006-10-01
TWI326567B TWI326567B (en) 2010-06-21

Family

ID=44771388

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096143369A TW200824058A (en) 2005-02-23 2005-12-21 Semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode
TW094145509A TW200635452A (en) 2005-02-23 2005-12-21 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW096143369A TW200824058A (en) 2005-02-23 2005-12-21 Semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode

Country Status (1)

Country Link
TW (2) TW200824058A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406603B (en) * 2010-07-12 2013-08-21 Holy Stone Entpr Co Ltd High thermal conductivity substrate process
TWI460893B (en) * 2010-09-28 2014-11-11 Advanced Optoelectronic Tech Substrate of led package and method for manufacturing the led package
TWI572064B (en) * 2016-03-14 2017-02-21 光寶光電（常州）有限公司 Led package structure
CN113225941A (en) * 2021-05-12 2021-08-06 四川锐宏电子科技有限公司 Preparation process of blind hole multilayer high-density circuit board

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5756803B2 (en) * 2010-07-23 2015-07-29 シャープ株式会社 Light emitting device and manufacturing method thereof
CN102468374A (en) 2010-11-11 2012-05-23 展晶科技(深圳)有限公司 Manufacturing method for light-emitting diode
TWI425681B (en) * 2010-11-15 2014-02-01 Advanced Optoelectronic Tech Method for manufacturing led
TWI492420B (en) 2011-10-31 2015-07-11 Everlight Electronics Co Ltd Light emitting device, surface mounted device-type light emitting device, and display
CN105378912B (en) * 2014-06-09 2018-12-28 三菱电机株式会社 The manufacturing method and semiconductor package part of semiconductor package part
TW202315106A (en) * 2017-10-30 2023-04-01 日商索尼半導體解決方案公司 Solid-state imaging device, and electronic apparatus
JP6629391B2 (en) * 2018-06-27 2020-01-15 株式会社アドマップ SiC coat

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406603B (en) * 2010-07-12 2013-08-21 Holy Stone Entpr Co Ltd High thermal conductivity substrate process
TWI460893B (en) * 2010-09-28 2014-11-11 Advanced Optoelectronic Tech Substrate of led package and method for manufacturing the led package
TWI572064B (en) * 2016-03-14 2017-02-21 光寶光電（常州）有限公司 Led package structure
CN113225941A (en) * 2021-05-12 2021-08-06 四川锐宏电子科技有限公司 Preparation process of blind hole multilayer high-density circuit board
CN113225941B (en) * 2021-05-12 2023-02-07 四川锐宏电子科技有限公司 Preparation process of blind hole multilayer high-density circuit board

Also Published As

Publication number Publication date
TW200824058A (en) 2008-06-01
TWI326483B (en) 2010-06-21
TWI326567B (en) 2010-06-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees