TW200631730A - A double side polishing carrier and method for polishing semiconductor wafer - Google Patents

A double side polishing carrier and method for polishing semiconductor wafer

Info

Publication number
TW200631730A
TW200631730A TW094140774A TW94140774A TW200631730A TW 200631730 A TW200631730 A TW 200631730A TW 094140774 A TW094140774 A TW 094140774A TW 94140774 A TW94140774 A TW 94140774A TW 200631730 A TW200631730 A TW 200631730A
Authority
TW
Taiwan
Prior art keywords
carrier
polishing
double side
carrier body
workpiece
Prior art date
Application number
TW094140774A
Other languages
Chinese (zh)
Other versions
TWI271263B (en
Inventor
Akira Horiguchi
Shoji Nakao
Original Assignee
Kashiwara Machine Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kashiwara Machine Mfg Co Ltd filed Critical Kashiwara Machine Mfg Co Ltd
Publication of TW200631730A publication Critical patent/TW200631730A/en
Application granted granted Critical
Publication of TWI271263B publication Critical patent/TWI271263B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention relates to a double side polishing carrier. The carrier of the present invention, under the state of holding a workpiece, is held between upper and lower rotating plates and is moved with compound movement including a first movement in a circumferential direction and a second movement having a radial component, and thus it can be used for polishing both sides of workpiece. The above carrier comprises a disk-shaped carrier body (10) provided with an opening (11) for holding the workpiece; and a ring-shape support frame (20) provided at an outer periphery of the carrier body (10) to support the carrier body (10). The support frame is thicker than the carrier body (10), and a teeth portion (21) for engaging with driving gears (30) is formed at a periphery of the support frame.
TW094140774A 2004-12-10 2005-11-21 A double side polishing carrier and method of polishing semiconductor wafers TWI271263B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004358247A JP4727218B2 (en) 2004-12-10 2004-12-10 Double-side polishing carrier

Publications (2)

Publication Number Publication Date
TW200631730A true TW200631730A (en) 2006-09-16
TWI271263B TWI271263B (en) 2007-01-21

Family

ID=36584640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140774A TWI271263B (en) 2004-12-10 2005-11-21 A double side polishing carrier and method of polishing semiconductor wafers

Country Status (4)

Country Link
US (1) US20060128276A1 (en)
JP (1) JP4727218B2 (en)
KR (1) KR100695341B1 (en)
TW (1) TWI271263B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5076723B2 (en) * 2007-08-09 2012-11-21 富士通株式会社 Polishing apparatus, substrate and method for manufacturing electronic apparatus
KR100897677B1 (en) 2007-10-29 2009-05-14 주식회사 실트론 Carrier palte in double side polishing apparatus for substrate
JP2009285768A (en) * 2008-05-28 2009-12-10 Sumco Corp Method and device for grinding semiconductor wafer
DE102010063179B4 (en) * 2010-12-15 2012-10-04 Siltronic Ag Method for simultaneous material-removing machining of both sides of at least three semiconductor wafers
DE102011082777A1 (en) * 2011-09-15 2012-02-09 Siltronic Ag Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
KR101285897B1 (en) 2012-02-28 2013-07-12 주식회사 엘지실트론 Apparatus and method for polishing wafer
JP5748717B2 (en) 2012-09-06 2015-07-15 信越半導体株式会社 Double-side polishing method
US10354905B2 (en) * 2015-03-11 2019-07-16 Nv Bekaert Sa Carrier for temporary bonded wafers
JP6707831B2 (en) * 2015-10-09 2020-06-10 株式会社Sumco Grinding device and grinding method
JP6513174B2 (en) * 2017-12-25 2019-05-15 信越半導体株式会社 Design method of wafer holding carrier
CN112571261B (en) * 2020-12-31 2022-07-22 重庆化工职业学院 Computer box burnishing device
CN114800109A (en) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 Double-side polishing machine and polishing method thereof

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1536714A (en) * 1921-04-04 1925-05-05 Pratt & Whitney Co Apparatus for and method of making similar articles
JPS59156755A (en) * 1983-02-25 1984-09-06 Kyowa Leather Kk Manufacture of multi-step and multi-color product and apparatus therefor
JPS59156755U (en) * 1983-04-06 1984-10-20 株式会社　市川製作所 Double-sided grinding board
US4827527A (en) * 1984-08-30 1989-05-02 Nec Corporation Pre-processing system for pre-processing an image signal succession prior to identification
DE3624878A1 (en) * 1985-07-31 1987-02-12 Speedfam Corp Flat lay machine
JPH0729263B2 (en) * 1989-04-25 1995-04-05 光永産業株式会社 Lapping machine
JPH0646854U (en) * 1992-11-27 1994-06-28 直江津精密加工株式会社 Carrier for polishing semiconductor wafers
JP2673216B2 (en) * 1993-10-23 1997-11-05 光永産業株式会社 Lapping machine workpiece removal device
JPH08112751A (en) * 1994-10-17 1996-05-07 Koei Sangyo Kk Carrier for lapping machine
JP3379097B2 (en) * 1995-11-27 2003-02-17 信越半導体株式会社 Double-side polishing apparatus and method
JPH1076460A (en) * 1996-08-30 1998-03-24 Shin Etsu Handotai Co Ltd Device and method for polishing thin plate
JPH10175159A (en) * 1996-12-18 1998-06-30 Nippon Electric Glass Co Ltd Both side polishing device of plate form article
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP4256977B2 (en) * 1999-04-13 2009-04-22 不二越機械工業株式会社 Double-side polishing system
US6210259B1 (en) * 1999-11-08 2001-04-03 Vibro Finish Tech Inc. Method and apparatus for lapping of workpieces
WO2001082354A1 (en) * 2000-04-24 2001-11-01 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer
DE10023002B4 (en) * 2000-05-11 2006-10-26 Siltronic Ag Set of carriers and its use
JP3791302B2 (en) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ Semiconductor wafer polishing method using a double-side polishing apparatus
KR100932741B1 (en) * 2002-03-28 2009-12-21 신에쯔 한도타이 가부시키가이샤 Wafer double side polishing device and double side polishing method
JP2004106173A (en) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp Double-sided polishing device
JP4343020B2 (en) * 2003-12-22 2009-10-14 株式会社住友金属ファインテック Double-side polishing method and apparatus

Also Published As

Publication number Publication date
JP4727218B2 (en) 2011-07-20
JP2006159383A (en) 2006-06-22
US20060128276A1 (en) 2006-06-15
TWI271263B (en) 2007-01-21
KR20060065502A (en) 2006-06-14
KR100695341B1 (en) 2007-03-16

Similar Documents

Publication Publication Date Title
TW200631730A (en) A double side polishing carrier and method for polishing semiconductor wafer
US4739589A (en) Process and apparatus for abrasive machining of a wafer-like workpiece
EP1852900A4 (en) Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
CN102264508B (en) Device for grinding both sides of flat workpieces
EP2194568B1 (en) Semiconductor wafer manufacturing method
CN107706129A (en) Engagement device and mating system
TW200721366A (en) Body for keeping a wafer, method of manufacturing the same and device using the same
EP0673059A3 (en) Semiconductor wafer with pre-process denudation
TW200711023A (en) Body for keeping a wafer and wafer prober using the same
TW200731380A (en) Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
WO2005041267A3 (en) Substrate carrier
JP2014124732A (en) Work clamp method, work clamp device, work plane grinding method and work plane grinder
EP1401022A8 (en) Method of manufacturing laminated wafer
ATE411124T1 (en) TOOL HOLDER WITH DIAMETER COMPENSATION BUSH
CN111805417A (en) Feeding and blanking device for wafer grinding production and wafer batch taking and placing method
TW200520084A (en) Method and apparatus for joining protective tape to semiconductor wafer
JPH11267964A (en) Surface polishing device and carrier used therefor
JP2013537711A (en) Semiconductor and solar wafer and processing method thereof
WO2002022469A3 (en) Loadlock with integrated pre-clean chamber
JP2007142220A (en) Chuck device for work
WO2000058188B1 (en) Wafer handling robot having x-y stage for wafer handling and positioning
EP1202328A3 (en) Quartz glass wafer support jig and method for producing the same
WO2005050895A3 (en) A method of backgrinding wafers while leaving backgrinding tape on a chuck
FR2809649A1 (en) Transfer machine has several workstations, drive arrangement for stepwise rotation of rotary table in one direction and continuous rotation without stopping in opposite direction
TW201032272A (en) Carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers