TW200621850A - Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film - Google Patents
Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting filmInfo
- Publication number
- TW200621850A TW200621850A TW094134982A TW94134982A TW200621850A TW 200621850 A TW200621850 A TW 200621850A TW 094134982 A TW094134982 A TW 094134982A TW 94134982 A TW94134982 A TW 94134982A TW 200621850 A TW200621850 A TW 200621850A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- polyimide
- film
- curable resin
- forming method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004294470 | 2004-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200621850A true TW200621850A (en) | 2006-07-01 |
TWI373482B TWI373482B (zh) | 2012-10-01 |
Family
ID=37150117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094134982A TW200621850A (en) | 2004-10-07 | 2005-10-06 | Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101117023B1 (zh) |
TW (1) | TW200621850A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101606445B (zh) * | 2006-09-26 | 2012-02-22 | 阿尔普士电气股份有限公司 | 印制线路板的制造方法 |
KR100932770B1 (ko) * | 2007-12-18 | 2009-12-21 | 전북대학교산학협력단 | 포지형 감광성 폴리이미드 수지 및 이의 조성물 |
KR101656541B1 (ko) * | 2008-12-26 | 2016-09-09 | 닛산 가가쿠 고교 가부시키 가이샤 | 액정 배향제, 액정 배향막 및 액정 표시 소자 |
JP5593075B2 (ja) * | 2010-01-13 | 2014-09-17 | 富士フイルム株式会社 | パターン形成方法、パターン、化学増幅型レジスト組成物及びレジスト膜 |
WO2016060340A1 (ko) * | 2014-10-15 | 2016-04-21 | 연세대학교 원주산학협력단 | 가압 조건 하에서 수행되는 폴리이미드 제조방법 |
JP6904245B2 (ja) * | 2017-12-27 | 2021-07-14 | 信越化学工業株式会社 | 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法 |
JP7276175B2 (ja) * | 2020-01-24 | 2023-05-18 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1184653A (ja) | 1997-09-11 | 1999-03-26 | Hitachi Chem Co Ltd | 耐熱性感光性重合体組成物及びパターンの製造法 |
WO2003038526A1 (fr) * | 2001-10-30 | 2003-05-08 | Kaneka Corporation | Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus |
-
2005
- 2005-10-06 KR KR1020050093913A patent/KR101117023B1/ko active IP Right Grant
- 2005-10-06 TW TW094134982A patent/TW200621850A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060052077A (ko) | 2006-05-19 |
KR101117023B1 (ko) | 2012-03-15 |
TWI373482B (zh) | 2012-10-01 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |