TW200615560A - Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections - Google Patents

Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Info

Publication number
TW200615560A
TW200615560A TW094116535A TW94116535A TW200615560A TW 200615560 A TW200615560 A TW 200615560A TW 094116535 A TW094116535 A TW 094116535A TW 94116535 A TW94116535 A TW 94116535A TW 200615560 A TW200615560 A TW 200615560A
Authority
TW
Taiwan
Prior art keywords
inaccessible
node
accessible
capacitively
electrical device
Prior art date
Application number
TW094116535A
Other languages
English (en)
Inventor
Kenneth P Parker
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200615560A publication Critical patent/TW200615560A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW094116535A 2004-11-02 2005-05-20 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections TW200615560A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/979,590 US7224169B2 (en) 2004-11-02 2004-11-02 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Publications (1)

Publication Number Publication Date
TW200615560A true TW200615560A (en) 2006-05-16

Family

ID=36385606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116535A TW200615560A (en) 2004-11-02 2005-05-20 Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections

Country Status (4)

Country Link
US (1) US7224169B2 (zh)
CN (1) CN1769916A (zh)
SG (1) SG121982A1 (zh)
TW (1) TW200615560A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070187844A1 (en) 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
US7928591B2 (en) * 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US7307427B2 (en) * 2005-07-23 2007-12-11 Agilent Technologies, Inc. Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards
US7818698B2 (en) * 2007-06-29 2010-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Accurate parasitic capacitance extraction for ultra large scale integrated circuits
CN102209902A (zh) * 2008-11-14 2011-10-05 泰拉丁公司 用于测试印刷电路板上的电连接的方法和设备
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
CN105093057A (zh) * 2015-09-23 2015-11-25 武汉安科新能电力科技有限公司 电路模块故障的诊断测试方法
CN108169664B (zh) * 2017-12-29 2021-01-01 深圳市大族数控科技有限公司 电路板故障检测方法和装置、计算机设备和存储介质
US10955465B2 (en) * 2018-09-14 2021-03-23 Teradyne, Inc. Method and apparatus for bond wire testing in an integrated circuit
CN109975687B (zh) * 2019-03-14 2022-07-08 深圳市大族封测科技股份有限公司 一种基于ic键合引线的质量检测装置及方法
US20220155355A1 (en) * 2019-04-10 2022-05-19 Iee International Electronics & Engineering S.A. Multi-channel capacitance sensing measurement circuit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557209A (en) 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5254953A (en) 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5124660A (en) 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5274336A (en) 1992-01-14 1993-12-28 Hewlett-Packard Company Capacitively-coupled test probe
DE69229389T2 (de) 1992-02-25 1999-10-07 Hewlett-Packard Co., Palo Alto Testsystem für Schaltkreise
US5696451A (en) 1992-03-10 1997-12-09 Hewlett-Packard Co. Identification of pin-open faults by capacitive coupling
US5420500A (en) 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
US6087842A (en) 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
US6998849B2 (en) * 2003-09-27 2006-02-14 Agilent Technologies, Inc. Capacitive sensor measurement method for discrete time sampled system for in-circuit test
US20050253616A1 (en) * 2004-04-30 2005-11-17 Parker Kenneth P Method and apparatus for testing and diagnosing electrical paths through area array integrated circuits

Also Published As

Publication number Publication date
SG121982A1 (en) 2006-05-26
US20060103391A1 (en) 2006-05-18
US7224169B2 (en) 2007-05-29
CN1769916A (zh) 2006-05-10

Similar Documents

Publication Publication Date Title
TW200615560A (en) Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
TW200638052A (en) Method and apparatus for detecting shorts on inaccessible pins using capacitive measurements
JP2783243B2 (ja) Ｃｍｏｓ集積回路の故障検出方法及び装置
CN100523844C (zh) 对电路器件进行不加电测试的方法和装置
TWI264074B (en) Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate
WO2004053944A3 (en) Fast localization of electrical failures on an integrated circuit system and method
Baker et al. I/sub DDQ/testing because'zero defects isn't enough': a Philips perspective
TW200516263A (en) Methods and apparatus for diagnosing defect locations in electrical paths of connections of circuit assemblies
US7208957B2 (en) Method for non-contact testing of fixed and inaccessible connections without using a sensor plate
TW200700750A (en) Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes
TW200506399A (en) Event based test method for debugging timing related failures in integrated circuits
KR100897982B1 (ko) 프로브카드 니들과 패드간의 미스 얼라인 방지 패턴 및 그방법
NO20062094L (no) Fremgangsmate for testing av en mellomliggende kobling
CN213210440U (zh) 一种用于集成电路自动测试机的小电流量测校准架构
CN106841991A (zh) 一种针模与电路板的对位检测方法、装置和对位***
JP2962283B2 (ja) 集積回路の故障検出方法及び故障検出装置
KR940004874B1 (ko) 액정모듈의 특성 검사방법 및 장치
CN217561608U (zh) 一种多只传感器绝缘电阻和电阻快速判定电路
KR100787742B1 (ko) 프로브 카드 인식장치 및 이를 이용한 프로브 카드인식방법
KR19980027150U (ko) 반도체 웨이퍼 검사장치
CN106970296B (zh) 显示面板、测试装置与测试方法
Muhtaroglu et al. I/O self-leakage test
Menon et al. Estimation of partition size for I/sub DDQ/testing using built-in current sensing
JPH0697254B2 (ja) 回路基板検査方法
KR970022342A (ko) 반도체 장치의 테스트 장치