TW200609680A - Pattern-forming material, pattern-forming device, and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device, and pattern-forming method

Info

Publication number
TW200609680A
TW200609680A TW094124451A TW94124451A TW200609680A TW 200609680 A TW200609680 A TW 200609680A TW 094124451 A TW094124451 A TW 094124451A TW 94124451 A TW94124451 A TW 94124451A TW 200609680 A TW200609680 A TW 200609680A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
viscosity
photosensitive layer
Prior art date
Application number
TW094124451A
Other languages
Chinese (zh)
Inventor
Hidenori Takahashi
Masanobu Takashima
Hirotaka Matsumoto
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200609680A publication Critical patent/TW200609680A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The purpose of the present invention is to provide a pattern-forming material which is excellent in operability and irregularity follow-up property of substrate surface, a high prescision pattern-forming material, a pattern-forming device having said pattern-forming material, and a pattern-forming method using the above pattern-forming material. Therefore, provided are a pattern-forming material characterized in that it has a cushion layer and a photosensitive layer provided on a support in this sequence, and when the coefficient of viscosity of the cushion layer is taken as η1 and the coefficient of viscosity of the photosensitive layer is taken as η2, the respective coefficients of viscosity at a temperature TDEG C in the range of from 80DEG C to 120DEG C satisfy the relationship of η1≤η2, and provided are a pattern-forming device having said pattern-forming material and an pattern-forming method characterized in that it comprises at least carrying out exposure to the photosensitive layer of the above pattern-forming material.
TW094124451A 2004-07-22 2005-07-20 Pattern-forming material, pattern-forming device, and pattern-forming method TW200609680A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004214896 2004-07-22
JP2005206210A JP2006058864A (en) 2004-07-22 2005-07-14 Pattern forming material, and pattern forming device and pattern forming method

Publications (1)

Publication Number Publication Date
TW200609680A true TW200609680A (en) 2006-03-16

Family

ID=35785228

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124451A TW200609680A (en) 2004-07-22 2005-07-20 Pattern-forming material, pattern-forming device, and pattern-forming method

Country Status (3)

Country Link
JP (1) JP2006058864A (en)
TW (1) TW200609680A (en)
WO (1) WO2006009117A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3406544B2 (en) * 1999-03-18 2003-05-12 日立化成工業株式会社 Photosensitive element, method for producing resist pattern using the same, method for producing printed wiring board, and method for producing lead frame
TWI255393B (en) * 2000-03-21 2006-05-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern and process for producing printed wiring board
JP2001350255A (en) * 2000-06-08 2001-12-21 Hitachi Chem Co Ltd Photographic sensitive film for forming black matrix
JP2002148792A (en) * 2000-11-15 2002-05-22 Fuji Photo Film Co Ltd Method for manufacturing resin layered body and color filter
JP2002236361A (en) * 2001-02-08 2002-08-23 Fuji Photo Film Co Ltd Photosensitive transfer material and method for producing the same
JP2003005364A (en) * 2001-06-20 2003-01-08 Hitachi Chem Co Ltd Photosensitive film for forming circuit and method for producing printed wiring board
JP2003337428A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP2003337427A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP4076845B2 (en) * 2002-11-21 2008-04-16 富士フイルム株式会社 Photosensitive transfer material

Also Published As

Publication number Publication date
JP2006058864A (en) 2006-03-02
WO2006009117A1 (en) 2006-01-26

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