TW200609538A - Composite optical lens with an integrated reflector - Google Patents
Composite optical lens with an integrated reflectorInfo
- Publication number
- TW200609538A TW200609538A TW094118052A TW94118052A TW200609538A TW 200609538 A TW200609538 A TW 200609538A TW 094118052 A TW094118052 A TW 094118052A TW 94118052 A TW94118052 A TW 94118052A TW 200609538 A TW200609538 A TW 200609538A
- Authority
- TW
- Taiwan
- Prior art keywords
- optical lens
- light
- composite optical
- optical
- concave
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 7
- 239000002131 composite material Substances 0.000 title abstract 3
- 230000000694 effects Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Lenses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/861,639 US7280288B2 (en) | 2004-06-04 | 2004-06-04 | Composite optical lens with an integrated reflector |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200609538A true TW200609538A (en) | 2006-03-16 |
Family
ID=35063050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118052A TW200609538A (en) | 2004-06-04 | 2005-06-01 | Composite optical lens with an integrated reflector |
Country Status (5)
Country | Link |
---|---|
US (1) | US7280288B2 (zh) |
EP (1) | EP1756880B1 (zh) |
JP (2) | JP5260049B2 (zh) |
TW (1) | TW200609538A (zh) |
WO (1) | WO2005119799A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI447970B (zh) * | 2011-09-23 | 2014-08-01 | Advanced Optoelectronic Tech | 發光二極體裝置及其製造方法 |
TWI454635B (zh) * | 2007-05-25 | 2014-10-01 | Molex Inc | 形成散熱器及介於產熱裝置與電源之間的電連線之互連裝置 |
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US20040264201A1 (en) * | 2003-06-30 | 2004-12-30 | Guide Corporation, A Delaware Corporation | Chromatic effect using light sources and condensing lenses |
JP2005129354A (ja) * | 2003-10-23 | 2005-05-19 | Toshiba Lighting & Technology Corp | Led照明装置 |
US20050135109A1 (en) * | 2003-12-17 | 2005-06-23 | Guide Corporation, A Delaware Corporation | Light blade |
US20050135113A1 (en) * | 2003-12-18 | 2005-06-23 | Harvatek Corporation | Optical projection device of a colored lighting module |
-
2004
- 2004-06-04 US US10/861,639 patent/US7280288B2/en not_active Expired - Lifetime
-
2005
- 2005-06-01 TW TW094118052A patent/TW200609538A/zh unknown
- 2005-06-03 EP EP05775549.8A patent/EP1756880B1/en active Active
- 2005-06-03 WO PCT/US2005/019722 patent/WO2005119799A1/en active Application Filing
- 2005-06-03 JP JP2007515656A patent/JP5260049B2/ja active Active
-
2011
- 2011-05-06 JP JP2011103758A patent/JP5695488B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI454635B (zh) * | 2007-05-25 | 2014-10-01 | Molex Inc | 形成散熱器及介於產熱裝置與電源之間的電連線之互連裝置 |
TWI447970B (zh) * | 2011-09-23 | 2014-08-01 | Advanced Optoelectronic Tech | 發光二極體裝置及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2011176356A (ja) | 2011-09-08 |
WO2005119799A1 (en) | 2005-12-15 |
JP5260049B2 (ja) | 2013-08-14 |
EP1756880A1 (en) | 2007-02-28 |
JP2008502160A (ja) | 2008-01-24 |
US7280288B2 (en) | 2007-10-09 |
JP5695488B2 (ja) | 2015-04-08 |
US20050270666A1 (en) | 2005-12-08 |
EP1756880B1 (en) | 2014-04-02 |
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