TW200502692A - Novel photosensitive resin compositions - Google Patents

Novel photosensitive resin compositions

Info

Publication number
TW200502692A
TW200502692A TW093106372A TW93106372A TW200502692A TW 200502692 A TW200502692 A TW 200502692A TW 093106372 A TW093106372 A TW 093106372A TW 93106372 A TW93106372 A TW 93106372A TW 200502692 A TW200502692 A TW 200502692A
Authority
TW
Taiwan
Prior art keywords
photosensitive
diazoquinone
groups
precursor polymers
backbone
Prior art date
Application number
TW093106372A
Other languages
English (en)
Inventor
Ilya Rushkin
Ahmad A Naiini
Richard Hopla
Donald Racicot
Original Assignee
Arch Spec Chem Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Spec Chem Inc filed Critical Arch Spec Chem Inc
Publication of TW200502692A publication Critical patent/TW200502692A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/18—Polybenzimidazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
TW093106372A 2003-03-11 2004-03-10 Novel photosensitive resin compositions TW200502692A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45367903P 2003-03-11 2003-03-11
US45362303P 2003-03-11 2003-03-11

Publications (1)

Publication Number Publication Date
TW200502692A true TW200502692A (en) 2005-01-16

Family

ID=32994513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093106372A TW200502692A (en) 2003-03-11 2004-03-10 Novel photosensitive resin compositions

Country Status (6)

Country Link
US (1) US7101652B2 (zh)
EP (1) EP1606326A2 (zh)
JP (1) JP2007525545A (zh)
KR (1) KR20060004908A (zh)
TW (1) TW200502692A (zh)
WO (1) WO2004081057A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402616B (zh) * 2005-06-03 2013-07-21 Fujifilm Electronic Materials 新穎的光敏性樹脂組成物

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EP1611483A4 (en) * 2003-03-11 2009-12-16 Fujifilm Electronic Materials NEW PHOTOSENSITIVE RESIN COMPOSITIONS
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
US7399572B2 (en) * 2005-06-03 2008-07-15 Fujifilm Electronic Materials U.S.A., Inc. Pretreatment compositions
US7803510B2 (en) * 2005-08-17 2010-09-28 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive polybenzoxazole precursor compositions
JP5028059B2 (ja) * 2006-09-28 2012-09-19 富士フイルム株式会社 感光性樹脂組成物、それを用いた硬化レリーフパターンの製造方法及び半導体装置
JP5205772B2 (ja) * 2007-03-01 2013-06-05 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置
WO2009052177A1 (en) * 2007-10-16 2009-04-23 Fujifilm Electronic Materials U.S.A., Inc. Novel photosensitive resin compositions
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
JP5407563B2 (ja) * 2008-07-04 2014-02-05 Ｊｓｒ株式会社 ポジ型感放射線性樹脂組成物
EP2309329B1 (en) * 2008-07-22 2014-04-02 Sumitomo Bakelite Co., Ltd. Positive-type photosensitive resin composition, cured film and its use as protective film, as insulating film, in semiconductor device and display device
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
KR101333698B1 (ko) * 2009-11-10 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR20120066923A (ko) 2010-12-15 2012-06-25 제일모직주식회사 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
KR101423539B1 (ko) 2010-12-20 2014-07-25 삼성전자 주식회사 포지티브형 감광성 수지 조성물
WO2018232214A1 (en) 2017-06-16 2018-12-20 Fujifilm Electronic Materials U.S.A., Inc. Multilayer structure
KR20240073667A (ko) 2022-11-18 2024-05-27 덕산네오룩스 주식회사 벤조옥사졸계 공중합체 및 이를 포함하는 포지티브형 감광성 조성물

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US5037720A (en) * 1987-07-21 1991-08-06 Hoechst Celanese Corporation Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use
EP0391196A3 (de) * 1989-04-06 1991-02-27 Siemens Aktiengesellschaft Herstellung von Hydroxypolyamiden
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JP3992351B2 (ja) 1998-03-12 2007-10-17 住友ベークライト株式会社 ポジ型感光性樹脂組成物及びそれを用いた半導体装置
JP4330798B2 (ja) * 1998-04-15 2009-09-16 旭化成イーマテリアルズ株式会社 ポジ型レジスト組成物
US6127086A (en) * 1998-10-01 2000-10-03 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6177225B1 (en) * 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
JP4408984B2 (ja) 1999-04-21 2010-02-03 旭化成イーマテリアルズ株式会社 芳香族ポリヒドロキシアミド
JP3919147B2 (ja) 1999-09-29 2007-05-23 住友ベークライト株式会社 ポジ型感光性樹脂組成物及びそれを用いた半導体装置
JP2002020484A (ja) 2000-07-13 2002-01-23 Clariant (Japan) Kk 感光性ポリアミド
JP2002040654A (ja) * 2000-07-31 2002-02-06 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物
JP4776063B2 (ja) 2000-08-08 2011-09-21 旭化成イーマテリアルズ株式会社 ヒドロキシポリアミド及び組成物
JP4317869B2 (ja) * 2003-03-11 2009-08-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
EP1611483A4 (en) * 2003-03-11 2009-12-16 Fujifilm Electronic Materials NEW PHOTOSENSITIVE RESIN COMPOSITIONS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402616B (zh) * 2005-06-03 2013-07-21 Fujifilm Electronic Materials 新穎的光敏性樹脂組成物

Also Published As

Publication number Publication date
WO2004081057A2 (en) 2004-09-23
US7101652B2 (en) 2006-09-05
WO2004081057A3 (en) 2006-12-21
US20040249110A1 (en) 2004-12-09
JP2007525545A (ja) 2007-09-06
EP1606326A2 (en) 2005-12-21
KR20060004908A (ko) 2006-01-16

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