200427389 玖、發明說明： 【發明所屬之技術領域】 本發明係關於多層印刷電路板用貼銅層積板、多層印刷 電路板、及多層印刷電路板之製造方法；更詳細為關於製 造埋孔構造之多層印刷電路板時有效之多層印刷電路板用 貼銅層積板、及使用該多層印刷電路板用貼銅層積板所製 造之多層印刷電路板及其製造方法。 【先前技術】 埋孔構造多層印刷電路板之製造方法，自許久以前即已 進行檢討（例如參照專利文獻υ。近年來隨雷射加工技術與 膠印刷技術之進步，已提案有可削減製造埋孔構造多層印 刷電路板之際之壓鑄次數之方法（例照參照專利文獻2)。 s兒明專利文獻2所不之方法時，如圖丨〇Α.所示準備於單面 貼附金屬箱i 0 2之絕緣性硬質基板i 〇 3。其次姓刻金屬箱 102，如圖i〇B所示，形成電路1〇7。其次於形成電路之 絕緣性硬質基板103之與電路1〇7相反側之面，如圖i〇c所 示，形成接著劑層104。其次，如圖1〇D所示，形成貫通接 著劑層104及絕緣性硬質基板1〇3厚度方向並接觸電路ι〇7 之孔108。其次，如圖10E所示，將導電性膠1〇9填充於孔 而製作單面電路基板llla。在將導電性膠1〇9填充於孔 T於孔1 08周圍預先形成保護掩模。保護掩模可於接著劑 層104之表面層疊薄膜與紙，於穿孔加工之際一併開孔而： 同樣地，製作圖π所示之單面電路基板lllb、lUc、 92787.doc -6- 200427389 llld。其次，如圖11所示，重合單面電路基板11U、mb、 Ulc、liid之後，使用熱壓鑄加熱加壓而一體化，製造圖 12所示之多層印刷電路板1丨2。 專利文獻1 :特公昭45-1：33〇3號公報 專利文獻2 :特開平9_36551號公報 【發明内容】 所惟專利文獻2所揭示之方法中，雖於形成電路之絕緣性硬 質基板之與電路為相反側之面，形成接著劑層，惟於單面 形成電路之絕緣性硬質基板之與電路為相反側之面，於接 著劑之塗布後加熱，或一面加熱接著片材一面貼合形成接 者劑層時’因背面是否具有電路將產生熱容量之部分差 異，其結果，料劑層之膜厚與黏性將產生部分差異。 ^別於料性硬f基板較薄時，_«層形成時之熱 =之部分差異，使得接著劑層之膜厚與純產生部分差 ”日守在所仔到之具有接著劑層之單面電路基板將產生扭 轉、扭曲，該單面電路基板多片重合、加熱、加壓之際之 對位’將成為極為困難之問題。 此外，即使以銷貼合法等將多片重合之單面電路基板之 位置暫停固定’於單面電路基板產生扭轉、扭曲時，因單 面電路基板為不平坦’在加熱、加墨而得之多層印刷電路 板，將具有關於内層電路位置之錯位不良現象產生之問題。 夕本發明係為改善上述問題點而成者，其目的係提供—種 2印刷電路板用貼銅層積板’其係將具有接著劑層之單 路基板多片重合者’經由加熱、加堡、及一體化工序 92787.doc 200427389 而製造埋孔構造之多層印刷電路板時，可容易進行將呈有 接著劑層之單面電路基板多片重合時之對位。 、 本电明之其他目的係提供—種多層印刷電路板及其製造 方法’其係藉由使用上述多層印刷電路板用貼銅層積板製 造：可降低關於内層電路位置之錯位不良現象之產生。 為達成上述目的，本發明第1樣態之多層印刷電路板用貼 銅層積板’其特徵在於：將整面銅箱，其係未形成電路者； 硬貝絶緣層，其係使熱硬化性樹脂硬化而形成者；接著巧 層，其係藉由加熱可暫時炫化者；及保護膜，依其順序二 置而一體化。 、 树明第2樣態之多層印刷電路板用貼銅層積板，係於本 發明弟1樣態之多層印刷電路板用貼銅層積板中，其中硬 絕緣層為添加基材者。 、 轉明第3樣態之多層印刷電路板用貼銅層積板，係於本 4月第2樣恶之多層印刷電路板用貼銅層積板中，i中美材 =璃織布、玻璃不織布、有機纖維織布、或有機_ 織布。 . =明第4樣態之多層印刷電路板用貼銅層積板，係於本 3樣態之多層印刷電路板用貼銅層積板中，其中基材 為玻离4布或有機纖維織布，且已進行開纖處理。 表本，明第5樣態之多層印刷電路㈣貼銅層積板，係於本 ^明弟1至4樣態中任—項之多層印刷電路㈣貼銅層積板 ，其中作為保護膜，可將具有表面粗度（Rz)為GG1 粗面之膜，社斗， μ 、使该粗面配置於接著劑層側而使用。 92787.doc 200427389 本發明第6樣態之多層印刷電路板用貼銅層積板，係於本 發明第1至5樣態中任一項之多層印刷電路板用貼銅層積板 中’其中保護膜之厚度為5〜1〇〇 μχη範圍内。 本發明第7樣態之多層印刷電路板，其特徵在於··使用多 片本發明第⑴樣態中任一項之多層印刷電路板用貼銅^ 積板而製造。 曰 本發明第8樣態之多層印刷電路板之製造方法，其係製造 本發明第7樣態之多層印刷電路板者，其特徵在於經過= 工序： Γ (1)於本發明第1至6樣態中任一項之 銅層積板之整面㈣面形成電路；Η $路板用貼 甬):：有底孔’該有底孔係由保護膜側進行穿孔加工， 貝版、接著劑層及硬質絕緣層而接觸前述電路者. (3)給與前述有底孔導電性； ， ⑷剝離保護膜而製作單面電路基板； (5)至少使用2片以卜爺、^ 成形。 ，处早面電路基板’藉由熱屬而層積 依據本發明第丨樣態，因 層積板，將具有接著劑層之單::路二 由加熱、加星、及一體化工序製：：基：夕片重合者，經 路板，故可得到將1孔構造之？層印刷電 將有接者劑屏> 之際可容易進行對位曰早面琶路基板多片重合 丁位之早面電路基板。 依據本發明第2樣熊， "彳電路板用貼銅層積板除本 92787.doc 200427389 1¾明苐1樣態之效果以外，可達成能成為尺寸定安性良好之 多層印刷電路板用貼銅層積板之效果。 依據本發明第3樣態，多層印刷電路板用貼銅層積板除本 發明第2樣態之效果以外，可達成能成為耐熱性良好之多層 印刷電路板用貼銅層積板之效果。 依據本發明第4樣態，多層印刷電路板用貼銅層積板除本 發明第3樣態之效果以外，可達成能得到引洞間之絕緣性提 升之多層印刷電路板之效果。 依據本發明第5樣態，多層印刷電路板用貼銅層積板除本 發明第1樣態之效果以外，可達成能使保護膜與接著劑層之 密合性良好之效果。 依據本發明第6樣態，多層印刷電路板用貼銅層積板除本 發明第1樣態之效果以外，可達成能製作與其他電路基板之 連接性良好之單面電路基板之效果。 第1至6樣態之任一 造，故成為可ϋ a 依據本發明第7樣態，多層印刷電路板因使用多片本發明 者之夕層印刷電路板用貼銅層積板而製200427389 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a copper-clad laminated board for a multilayer printed circuit board, a multilayer printed circuit board, and a multilayer printed circuit board; more specifically, it relates to the manufacturing of a buried hole structure A multi-layer printed circuit board which is effective for a copper-clad laminated board for a multilayer printed circuit board, a multilayer printed circuit board manufactured using the multilayer printed-circuit board copper-clad laminate, and a method for manufacturing the same. [Previous technology] The manufacturing method of buried-layer multilayer printed circuit boards has been reviewed a long time ago (for example, refer to patent document υ. In recent years, with the advancement of laser processing technology and offset printing technology, it has been proposed to reduce manufacturing The method of the number of die-casting in the case of multi-layer printed circuit boards with holes (for example, refer to Patent Document 2). When the method described in Patent Document 2 is not used, prepare a metal box to be attached on one side as shown in Figure 丨 〇A. The insulating hard substrate i 0 2 of i 0 2. The second name is the engraved metal box 102, as shown in FIG. 10B, to form the circuit 107. The second is the opposite of the insulating hard substrate 103, which forms the circuit, to the circuit 107. As shown in FIG. 10c, the side surface is formed with an adhesive layer 104. Next, as shown in FIG. 10D, a through-adhesive layer 104 and an insulating rigid substrate 10 are formed in a thickness direction and contact the circuit ι07. Hole 108. Next, as shown in FIG. 10E, a conductive adhesive 109 is filled in the hole to produce a single-sided circuit board 111a. The conductive adhesive 109 is filled in the hole T around the hole 108 in advance to form a protection. Mask. A protective mask can be on the surface of the adhesive layer 104 The film and paper are stacked to make holes at the same time as perforation processing: Similarly, the single-sided circuit substrates lllb, lUc, 92787.doc -6- 200427389 llld shown in Fig. Π are produced. Second, as shown in Fig. 11, After the single-sided circuit substrates 11U, mb, Ulc, and liid are superimposed, they are integrated by heating, pressing, and pressing with hot die casting to manufacture the multilayer printed circuit board 1 丨 2 shown in Fig. 12. Patent Document 1: Japanese Patent Publication No. 45-1: 33. Patent Document 3: Japanese Patent Application Laid-Open No. 9_36551 [Summary of the Invention] In the method disclosed in Patent Document 2, although an adhesive layer is formed on the surface of the insulating hard substrate forming the circuit on the side opposite to the circuit, However, when the insulating rigid substrate on which the circuit is formed on one side is on the opposite side to the circuit, it is heated after the adhesive is applied, or heated and then the sheet is bonded to form a contact agent layer. Part of the difference in heat capacity will be generated. As a result, the film thickness and viscosity of the material layer will be partially different. ^ Different from the difference in the heat of the layer formation when the material is hard and the substrate is thin, making the adhesive Film thickness The “differential difference” will be twisted and distorted on the single-sided circuit board with adhesive layer. The alignment of the single-sided circuit board when multiple sheets are stacked, heated, and pressed will become extremely difficult. In addition, even if the positions of multiple overlapping single-sided circuit substrates are temporarily fixed by pinning, etc., when the single-sided circuit substrate is twisted or distorted, the single-sided circuit substrate is not flat. The multilayer printed circuit board will have problems caused by the misalignment of the position of the inner layer circuit. The present invention is made to improve the above problems, and its purpose is to provide-2 kinds of copper-clad laminated boards for printed circuit boards. It is a multilayer printed circuit board with a buried hole structure that is made by laminating multiple single-circuit substrates with an adhesive layer through heating, Gabor, and integration processes 92787.doc 200427389. The alignment of multiple layers of single-sided circuit substrates. Other purposes of the present invention are to provide a multilayer printed circuit board and a manufacturing method thereof, which is manufactured by using the above-mentioned copper-clad laminated board for the multilayer printed circuit board: to reduce the occurrence of misalignment of the position of the inner layer circuit. In order to achieve the above-mentioned object, the first aspect of the present invention is a copper-clad laminated board for a multilayer printed circuit board, which is characterized in that: the entire copper box is formed without a circuit; a hard shell insulation layer is made by thermal curing The resin is hardened and formed; then the clever layer is temporarily heated by heating; and the protective film is integrated in the order of two. In the second aspect, the copper-clad laminated board for multilayer printed circuit boards in the second aspect belongs to the copper-clad laminated board for multilayer printed circuit boards in the first aspect of the present invention, in which the hard insulating layer is a substrate added. 3. It turns out that the third aspect of the copper-clad laminated board for multilayer printed circuit boards is in the second copper-clad laminated board for multilayer printed circuit boards of April this year, i. Glass nonwovens, organic fiber wovens, or organic wovens. == The copper clad laminate for multilayer printed circuit boards in the fourth aspect, which is the copper clad laminate for multilayer printed circuit boards in the third aspect, in which the substrate is a glass cloth or an organic fiber weave. Cloth, and has been opened. In the table, the fifth aspect of the multilayer printed circuit of the fifth aspect of the present invention is a copper laminate, which is a multilayer printed circuit of any of the first to fourth aspects of the present invention. The multilayer is a copper laminate that is used as a protective film. It is possible to use a film having a surface roughness (Rz) of GG1 rough surface, μ, and arrange the rough surface on the side of the adhesive layer. 92787.doc 200427389 The copper clad laminated board for multilayer printed circuit boards according to the sixth aspect of the present invention is among the copper clad laminated boards for multilayer printed circuit boards according to any one of the first to fifth aspects of the present invention. The thickness of the protective film is in the range of 5 to 100 μχη. A multilayer printed wiring board according to a seventh aspect of the present invention is characterized by using a plurality of copper-clad laminated boards for multilayer printed wiring boards according to any one of the second aspect of the present invention. The method for manufacturing a multilayer printed circuit board according to the eighth aspect of the present invention is a method for manufacturing a multilayer printed circuit board according to the seventh aspect of the present invention, which is characterized by the following steps: Γ (1) In the first to sixth aspects of the present invention, The whole surface of the copper laminated board in any one of the aspects forms a circuit; Η $ circuit board stickers 甬) :: Bottom hole 'The bottom hole is perforated from the protective film side, The agent layer and the hard insulating layer are in contact with the aforementioned circuit. (3) Give the aforementioned bottomed hole conductivity; ⑷ Peel off the protective film to make a single-sided circuit board; (5) Use at least two pieces to form the cypress. The early circuit board is laminated according to the first aspect of the present invention by thermal genus. Because of the laminated board, the single layer with the adhesive layer :: Road two is made by heating, staring, and integrated processes: : Base: Those who overlap the night film, the warp board, so you can get a 1-hole structure? In the case of multi-layer printed circuits, it is possible to easily align a plurality of pieces of the early-side Pa circuit substrates with a small-size early-side circuit substrate when a receiver screen is available. According to the second kind of the present invention, in addition to the effect of the copper laminated laminated board for circuit board of 92787.doc 200427389 1 ¾ Ming 1 form, a multilayer printed circuit board with good dimensional stability can be achieved. Effect of copper laminates. According to the third aspect of the present invention, in addition to the effects of the second aspect of the present invention, the copper-clad laminated board for a multilayer printed circuit board can achieve the effect of being a copper-clad laminated board for a multilayer printed circuit board having good heat resistance. According to the fourth aspect of the present invention, in addition to the effect of the third aspect of the present invention, the copper-clad laminated board for a multilayer printed circuit board can achieve the effect of a multilayer printed circuit board having improved insulation between lead holes. According to the fifth aspect of the present invention, in addition to the effects of the first aspect of the present invention, the copper-clad laminated board for a multilayer printed circuit board can achieve the effect of improving the adhesion between the protective film and the adhesive layer. According to the sixth aspect of the present invention, in addition to the effects of the first aspect of the present invention, the copper-clad laminated board for a multilayer printed circuit board can achieve the effect of producing a single-sided circuit board having good connectivity with other circuit boards. According to the seventh aspect of the present invention, a multilayer printed circuit board is produced by using a plurality of copper-clad laminated boards for the inventor's evening printed circuit board.
於内層電路之錯位不良現象之產生。 【實施方式】The misalignment of the inner circuit occurs. [Embodiment]
92787.doc -10- 200427389 衣=夕層Hp刷t路板時所使用之為製作單面電路基板之原 科者亦即”將具有接著劑層之單面電路基板多片重合 由加熱、加壓、及一體化工序而製造埋孔構造之 層印刷電路板。 1呈如圖i所示，該實施形態之多層印刷電路板用貼銅層積板 有將正面鋼箔2，其係未形成電路者；硬質絕緣層3，其 =使熱硬化性樹脂硬化而形成者；接著劑層4，其係藉由加 …可暫日禮化者，·及保護膜5，依其順序配置而-體化之構 成。 再 該々多層印刷電路板用貼銅層積板1中，其特徵在於：於整 面銅箔2形成電路圖案前之階段中，使硬質絕緣層3與接 齊J 4 -— /» 、 _ 因此，為於硬質絕緣層3上形成接著劑層4， ;、:布4寸定接著劑後加熱，或一面將成為搂著劑層4之薄膜 ^妾士者片j才）加熱並一面貼合，使接著劑層4於硬質絕緣層3 讀著日T，不因電路之有無而於暫時接 之部分差異。 …里 因此，接著劑層4之膜厚與黏度可橫跨全區域而均一保 ::即使硬質絕緣層3較薄時，不因電路之有無而於暫時接 者時產净勃六旦 B ^ …、谷里之部分差異，故於接著劑層4之膜厚盥黏性 不產生部分差显，甘' .“ ” ^、、、"果，可防止於得到之具有接著劑層4 早面電路基板產生扭轉、扭曲而成為平坦者。因此，將 ^用該/層印刷電路板用貼銅層積板i製作之具有接著劑 曰4之單面電路基板多片重合時，可容易進行對位。 此外，因防止於單面電路基板產生扭轉、扭曲而成為平 92787.doc -11- 200427389 坦者，故將單面電路基板多片重合者加熱、加壓之際，後 述之形成於單面電路基板之導電性凸起將不移動，可降低 因導電性凸起移動所造成之導電膠成分之落粉，與成為多 層印刷電路板時之關於内層電路位置之錯位不良現象之產 生。 該實施形態之多層印刷電路板用貼銅層積板^，硬質絕 緣層3係使熱硬化性樹脂硬化而形成者，於熱硬化性樹脂混 入基材之添加基材係由尺寸安定性之點觀之為佳。硬質絕 緣層3係使熱硬化性樹脂硬化而形成者，硬化進行時於使用 熱壓鵠之層積成形卫序中不熔化。作為形成硬f絕緣層化 熱硬化性樹脂，例如可舉出環氧樹脂、Β τ樹脂、氟樹脂等。 此外，作為使硬質絕緣層成為添加基材之基材，使用玻璃 織布、玻璃不織布、有機纖維織布、有機鐵維不織布等， 由耐熱性之點觀之為佳。 作為製作該實施形態之多層印刷電路㈣貼銅層積板】 之材料’可使用整面鋼箱2與硬質絕緣層3-體化之通常單 面貼銅層積板。作為該種單面貼銅層積板，例如可使用玻 璃織布基材環氧樹脂單面貼銅層積板、麵不織布基材環 ㈣脂:面貼銅層積板、玻璃織布基材訂樹脂單面貼銅層 積板、方香族聚醯胺纖維不織布基材環氧樹脂單面貼銅層 積板、玻璃織布基材_脂單面貼銅層積板等。此外，^ 可使用除去兩面貼銅層積板之單側銅箔者。 進一步，使硬質絕緣層3為添加基材時 玻璃織布或有機纖維織布考係基材為 已軛仃開纖處理。藉此，除 92787.doc •12- 200427389 尺寸安定性提高之外，可提升引洞間之絕緣性。此外，於 織布施行開纖遽理時，紗線被開纖且樹脂之含浸性將變 好，可防止樹脂之未填充，故可提升引洞間之絕緣性。 該實施形態之多層印刷電路板用貼銅層積板1中，接著劑 層4之形成，係例如將包含熱硬化性樹脂之接著劑，藉由滾 輪覆蓋、網簾覆蓋、喷霧覆蓋、網簾印刷等手段，以於上 述之單面貼銅層積板塗布而預加熱，或將接著片材使用熱 滾輪等貼合於單面貼銅層積板等方法進行。作為接著劑層4 之厚度，10:50 μιη之範圍内為佳。此外，本發明之接著劑 層4係具有藉由加熱可暫時溶化，力之後之加熱而硬化之性 質者。 X男、施形心之夕層印刷電路板用貼銅層積板1中，保護膜 5雖並非特定限定者，惟對於電路形成時❹層印刷電路板 用貼銅層積板i浸潰之氯化銅水溶液與氫氧化鈉水溶液等 具_品性者為佳，具體上可例舉聚苯二甲酸乙二酉旨 膜。此外，於多層印刷電路板用貼銅層積板i形成電路之工 序中，剝離保護膜5時，因具有接著劑層4露出而污染電路 幵’成工序所使用之溶液 著劑層4之密合性。“ ’故於保護膜5要求有對於接 如^保護膜5於多層印刷電路板用貼銅層積板ι形成電 二中’因作用為接著劑層4之保護層，故保護膜5之接 =層^之表面，為確保密合性，表面粗 ΓΓ 為佳。另—方面，於多片重合所得到之具有接 者』層4之早面電路基板之前，因由該單面電路基板剝離保 92787.doc -13- 200427389 護膜5，故要求·保護膜5具有剝離性。 此外，關於保護膜5之膜厚為5〜1〇〇_之範圍内為佳係因 以下之理由。製造多層印刷電路板時，於多層印刷電路板 用貼銅層積板i之整面料2面以耗2作為材料而形成電 路圖案之後，由保護膜5側進行穿孔加卫，形成貫通接著劑 層4及硬質絕緣層3並接觸前述電路圖案了之有底孔8。其 -人’為付予该有底孔導電,j·生’由1呆護膜5側將導電性物質9 印刷填充至有底孔内。其次’以擠壓器等除去表面剩餘之 導電性物質而平坦化以後，剝離保護膜5，以與保護膜以 =度大致相同之突出高度形成突出之導電性凸起ι〇。因導 電性凸起1〇之突出高度較佳範圍為5〜100 μπι，故使保護膜5 之膜厚成為5〜1〇〇 μηΐ2範圍内為佳。 其次，說明關於本發明之多層印刷電路板之製造方法與 多層印刷電路板之實施形態。 〃 本杳明之多層印刷電路板之製造方法之實施形態中，使 述之夕層印刷電路板用貼銅層積板1之同時，經過以下 工序製造多層印刷電路板： (1)於上述多層印刷電路板用貼銅層積板丨之整面 形成電路之工序； 自面 处（2)形成有底孔之工序，其中該有底孔係由保護膜側進行 牙孔加工’貫通保護膜、接著劑I、及硬質絕緣層 前述電路者； 觸 (3) 於Θ述有底孔付予導電性之工序； (4) 剝離保護膜而製作單面電路基板之工序；及 92787.doc -14- 200427389 (5)至少使用_2片以上前述單面電路基板，藉由熱壓鑄而層 積成形之工序。以下，以工序順序基於圖2A〜圖2G、圖3a〜 圖3D、圖4說明。 首先作為使未形成電路之整面銅箔2與硬質絕緣層3 一 奴化之材料，準備圖2八所示之單面貼銅層積板6。其次於與 早面貼銅層積板6之整面銅箔2相反側之面，如圖2β所示， 形成接著劑層4。接著劑層4係可藉由將包含熱硬化性樹脂 ^妾著劑’以滾輪覆蓋、網簾覆蓋、喷霧覆蓋、網簾印刷 寺手段塗布並預加熱’或將包含熱硬化性樹脂之接著片材 使用熱滾輪等貼合而形成。 其次，將保護膜5使用熱滾輪貼合於接著劑層4之表面， 如圖2C所示，製作多層印刷電路板用貼銅層積板工。 其次，於多層印刷電路板用貼銅層積板i之整面銅箱2 =貼合感光性之乾膜，施行曝光、顯像、姓刻、制離各 -理，將整面銅箔2加工為特定圖案形狀，如圖扣所 成電路圖案7。 ”次，如圖2E所示，由保護膜5側進行穿孔加工， 通=膜5、接著劑層4及硬f絕緣層3而接觸上述電路^ 之有底孔8。電路圖案7形成為有底孔8之底 ： ㈣由碳酸㈣雷射進行為佳。必彡綠去㈣^ 之_點(殘留)時，使用如過 UV雷射除去殘留亦可。 了之方法亦可’以 人於岫述有底孔8付予導電性。導電性之付早/ 網簾印刷法’如_所示，厂、f之付予係藉由 所不於别述有底孔8内填充導電性谬 92787.doc -15- 200427389 性興9Γ/、一人’猎由剝離保護膜5 ’如圖2g所示，使導電 乡大出形成之導電性凸起10由接著劑層4之表面突出。 ^電性凸起10之突出高度為5〜100 _係因以後之工序 吏^與其他電路基板之連接性良好之故。如此，製作 ，、有接著劑層4之單面電路基板lla。 冋樣地’製作如圖3A〜圖3D所示之單面電路基板川、 lc、1H。其次，如圖3A〜圖卿斤示，將單面電路基板⑽、 1:、lid以重合、融接法、使用導引洞及導引銷之銷貼合 1時固定而進行對位。此外，本發明之構成中，一併成 ，多層之諸厚度不需全部相同。㈣，構成在此使用之 单面電路基板lla、llb、llc、Ud之各層厚，不一定需要 目Π 可對應用途而利用任意之厚度。 如此’將各單面電路基板重合者使用熱壓鑄，藉由施行 :熱、加壓之層積成形而—體化，製造圖4所示之多層印刷 電路板12。作為熱壓鑄，❹真空熱壓鑄為佳。使用熱壓 鑄，藉由加熱、加壓，接著劑層4暫時熔化後，硬化，導電 性膠9亦於分別對應之電路密合而熱硬化，藉此形成引洞， 得到圖4所示之埋孔構造多層印刷電路板12。 該多層印刷電路板之製造方法中，使用如圖丨所示，將整 面銅箱2,其係未形成電路者；硬質絕緣層3,其係使熱硬 :性樹脂硬化而形成者；接著劑層4,其係藉由加熱可暫時 、熔化者；及料膜5,依其順序配置而—體化之多層印刷電 路板用貼銅層積板卜製作各單面電路基板Ua、ub、Uc、 lid，故得到之各單面電路基板Ua、Ub、Uc、ud成為可 92787.doc -16- 200427389 防止扭轉、扭曲產生之平坦者。因此，將製作之單面電路 基板lla、lib、Uc、Ud多片重合之際，可容易進行對位。 此外，單面電路基板Ha、lib、11c、lid因成為可防止 幸τ扭曲之平坦者’故將該等單面電路基板重合者暫時 固疋而加熱、加壓之際，於該等單面電路基板形成之導電 凸起將不移動，可降低伴隨導電性凸起移動之導電膠成 刀之洛勃，與成為多層印刷電路板時之内層電路位置之錯 位不良現象之產生。 仔f丨之夕層印刷電路板12，可降低内層電路位置 之錯位不良現象之產生。 (實施例1) 作為圖2 A所示之單面貼銅層積板6，使用fr_4等級之玻璃 織布基材裱氧樹脂單面貼銅層積板(松下電工公司製，商品 編齡-1661，硬質絕緣層厚度〇1顏，銅荡厚度a降）口。口 ^ 士圖2B所不，將環氧樹脂之接著劑以滾輪覆蓋在硬 貝巴彖層3表面以塗布厚度3〇 _而塗布，加熱至益凹凸性 為止（听）’·形成接著劑層4。其次錢層狀加工器（溫㈣ C ’壓力0.05 MPa)，將保護臈5之聚苯二甲酸乙二醋膜 (τ⑽y公司製，商品編號T_6G，厚度38_)貼合於接著劑層 、★圖2C所不’製作多層印刷電路板用貼銅層 1 ° " 八人’於多層印刷電路板用貼銅層積板1之整面銅箔2 ’貼合感光性之乾膜’並進行曝光、顯像。進一步，使 用虱化亞銅溶液進行敍刻處理，其次使用氫氧化納溶液剝 92787.doc •17- 200427389 離乾膜，如圖9- $圖2D所不，形成電路圖案7。 ，、次，如圖2E所示，由侔 通保_、接著劑層4及硬;:=行穿孔加工，形成貫 7之有底孔8。穿孔加工r貝、·、巴緣層3而接觸上述電路圖案 後 系由保護膜5側使用碳酸雷射開孔 後，以不於有底孔8内之 人文田射開孔 式，使用路表面不殘餘有殘留物之方 飞使用UV雷射進行殘留物之除去。 二：有底孔8付予導電性，藉由網簾印刷法，如圖 …:由於有底孔8内填充以銀為主成分之導電性膠9。直 人，猎由剝#保護膜5，如 成之導電性凸起1〇由接著突出形 ,声4劑層4之表面突出，製作具有接著 d層4之早面電路基板丨。 生扭轉及扭曲之平坦者。作之早面〶路基板1U為不產 同樣地製作如圖3A〜圖3D所示之單面電路基板m、 C、叫。其次，將單面電路基板⑴、llb、Uc、Ud重合， 以銷貼合法暫時固定而進行對位。各單面電路基板⑴、 ub、nc、lld因為不產生扭轉及扭曲之平坦者，故可容易 進行對位。- 如此，將各單面電路基板lla、llb、Uc、⑴重合者使 用熱壓鑄，於真空下加熱、加壓（18(TC，i小時）’得到圖4 所示之多層印刷電路板12。得到之多層印刷電路板η，未 產生内層電路位置之錯位不良現象。 (實施例2) 與實施例1相同，製作圖5所示之單面電路基板na、ub、 lie、lid。其次，於兩面形成之内層電路間導通之核心基 92787.doc •18- 200427389 f13上下’如圓5所示，分別配置單面電路基板lla、與 單面電路基板He、lld，以銷貼合法暫時固定而進行對位。 各單面電路基板^”^、…、…因係未產生扭轉及扭 曲之平坦者，故可容易進行對位。 如此，將核心基板13與單面電路基板山、⑴、⑴、… 重=者’使用熱Μ鑄，於真空下進行加熱、加郭帆，！ 小# ) ’ #到圖6所示之多層印刷電路板12。得到之多層印 刷電路板12，未產生内層電路位置之錯位不良現象。 (實施例3) 舆實施例1相同，製作圖7所示之單面電路基板iib、山。 此外，如圖7所示，將形成導電性凸起1〇，於整面銅猪2未 形成電路之表層用基板i 4 a ’藉由製作實施例】之單面電路 基板Ua之條件而製作。並同樣地製作另外之表層用基板 14b 〇 ”人士圖7所不，將表層用基板14a、單面電路基板ub、 山、另外之表層用基板14b重合，以銷貼合法暫時固定而 進行對位。表層用基板14a、14b、單面電路基板⑽、山 因係未產生扭轉及扭曲之平坦者，故可容易進行對位。 如此，將表層用基板14a、14b、單面電路基板川 如圖7所示重合者，使用熱壓鑄’於真空下進行加熱、加壓 (1 80°C，1小時），如圖8所示，得刭於主 传到於表面具備整面銅箔2 之多層板15。 其次，於多層印刷電路板15之特定位置施行穿孔加工 後，施行通孔鍍金。其次’進行電路圖案之形成，得到一 92787.doc -19- 200427389 併具有引洞與通孔16之圖9所示之多層印刷電路板12。得到 之多層印刷電路板12，未產生内層電路位置之錯位不良現 象0 產業上之利用可能性 依據本發明，可提供一種多層印刷電路板用貼銅層積 板，其係將具有接著劑層之單面電路基板多片重合時，可 =易進行對位。此外，提供一種藉由使用得到之多層印刷 電路板用貼鋼層積板，可降低錯位不良現象之產生之多層 印刷電路板$其製造方法。 【圖式簡單說明】 圖1係本發明實施形態之多層印 曰1 Μ包路板用貼銅層積板 為說明本發明實施例1之多層印刷電路板之製造方 工序之剖面圖。 Θ 之=、圖3Β、圖3C、圖3D係表示為說明本發明實施例】 之夕層印刷電路板之製造方法之圖2G以後工序之气 圖4係表示本發明實施例1之多層印刷電路板之剖面圖 圖5係表示為說明本發明 θ 造方法之以序之剖面圖。 夕層印刷電路板之製 圖6係表不本發明會々 之多層印刷電路板之剖面圈。 圖7係表示為㈣本發明實 j面圖 造方法之各工序之心L 〇騎刷電路板之製 圖8係表示為說明本發明實施例3之多層印刷電路极之圖 92787.doc -20. 200427389 7以後工序之剖面圖。 圖9係表示本發明實施例 例3之夕層印刷電路板 圖i〇A、圖10B、圖10c 敗之。】面圖。 a夕夕思p ° 、圖1犯係表示為說明弁 則之多層印刷電路板之製 月先 方法之各工序之剖面圖。 圖1 Hr、表示為說明先箭 J之夕層印刷電路板之製造方法之 圖10E以後工序之剖面圖。 表、方法之 圖12係表示先前之多層印刷電路板之剖面圖。 【圖式代表符號說明】 1 多層印刷電路板用貼銅層積板 2 整面銅箔 3 硬質絕緣層 4, 104 接著劑層 5 保護膜 6 單面貼銅層積板 7 電路圖案 8 有底孔 9 導電性膠 10 導電性凸起 11a，11b，11c，lld， 111a，111b，111c，llld 卓面電路基板 12, 15, 112 多層印刷電路板 13 核心基板 14a，14b 表層用基板 16 通孔 92787.doc -21- 20042738992787.doc -10- 200427389 clothing = evening layer Hp brush t circuit board is used to make single-sided circuit substrates, that is, "multiple pieces of single-sided circuit substrates with adhesive layer superimposed by heating, adding The laminated printed circuit board with a buried hole structure is manufactured by pressing and integrating processes. 1 is shown in FIG. I. The copper-clad laminated board for a multilayer printed circuit board of this embodiment includes a front steel foil 2 which is not formed. Circuit person; Hard insulating layer 3, which is formed by hardening a thermosetting resin; Adhesive layer 4, which can be temporarily customized by adding ..., and a protective film 5, which are arranged in this order- The copper-clad laminated board 1 for multi-layer printed circuit boards is characterized in that the hard insulating layer 3 is aligned with J 4- — / », _ Therefore, in order to form the adhesive layer 4 on the hard insulating layer 3,;:: heat the adhesive 4 inches after setting the adhesive, or one side will become a thin film of the adhesive layer 4 妾 士 者 片 j 才) Heating and bonding on one side, so that the adhesive layer 4 reads the day T on the hard insulating layer 3, and is not temporarily connected due to the existence of the circuit. Partial differences.... Therefore, the film thickness and viscosity of the adhesive layer 4 can be uniform across the entire area .: Even when the hard insulating layer 3 is thin, it will not produce a net effect when it is temporarily connected due to the existence of the circuit. There are some differences between Liudan B ^ and Guli, so the film thickness and adhesiveness of the adhesive layer 4 will not cause some difference. It can prevent the “ Agent layer 4 The early-side circuit board is twisted, twisted, and flattened. Therefore, when a single-sided circuit board with an adhesive agent 4 made of this / layer printed circuit board copper-clad laminated board i is superimposed, It is easy to perform alignment. In addition, it is flat because it prevents twisting and twisting on the single-sided circuit board. Therefore, when heating and pressing multiple pieces of single-sided circuit board, The conductive bumps formed on the single-sided circuit board, which will be described later, will not move, which can reduce the powder falling of the conductive adhesive component caused by the movement of the conductive bumps, and the misalignment of the position of the inner layer circuit when it becomes a multilayer printed circuit board. The occurrence of the phenomenon. The copper-clad laminated board for multilayer printed circuit boards ^, the hard insulating layer 3 is formed by hardening a thermosetting resin, and the added base material in which the thermosetting resin is mixed into the base material is viewed from the point of dimensional stability. Good. The hard insulating layer 3 is formed by hardening a thermosetting resin. The hardening layer does not melt during the lamination molding process using hot pressing. As a thermosetting resin for forming a hard f insulating layer, for example, Epoxy resin, B τ resin, fluororesin, etc. In addition, as the base material for making the hard insulating layer an additional base material, glass woven fabric, glass non-woven fabric, organic fiber woven fabric, organic iron woven fabric, etc. are used. The point of view is better. As the material for making the multilayer printed circuit of this embodiment, the copper-clad laminated board] can be used as a single-sided copper-clad laminated board with a full-surface steel box 2 and a hard insulating layer 3-body. . As such a single-sided copper-clad laminated board, for example, a glass woven substrate epoxy resin single-sided copper-clad laminated board, or a non-woven substrate ring grease can be used: a copper-clad laminated board, a glass woven substrate Resin single-sided copper-clad laminates, fragrant polyamide fiber non-woven substrate epoxy resin single-sided copper-clad laminates, glass woven substrate_fat single-sided copper-clad laminates, etc. In addition, ^ can be used to remove the copper foil on one side of the copper foil laminated on one side. Furthermore, when the hard insulating layer 3 is a base material, a glass woven fabric or an organic fiber woven test base material is yoke-opened. In this way, in addition to 92787.doc • 12- 200427389 improved dimensional stability, the insulation between the lead holes can be improved. In addition, when the fabric is opened, the yarn is opened and the resin's impregnation will be improved, which can prevent the resin from being unfilled, so the insulation between the lead holes can be improved. In the copper-clad laminated board 1 for a multilayer printed circuit board of this embodiment, the formation of the adhesive layer 4 is performed by, for example, covering the adhesive containing a thermosetting resin with a roller, a net curtain, a spray coating, or a net. The means such as curtain printing is performed by applying and pre-heating the single-sided copper-clad laminate as described above, or by bonding the adhesive sheet to the single-sided copper-clad laminate using a hot roller or the like. The thickness of the adhesive layer 4 is preferably within a range of 10:50 μm. In addition, the adhesive layer 4 of the present invention has properties such that it can be temporarily dissolved by heating and hardened by heating after force. X male, in the copper-clad laminated board 1 for printed circuit boards, although the protective film 5 is not specifically limited, the copper-clad laminated board i for the printed circuit board when the circuit is formed is immersed. Copper chloride aqueous solution and sodium hydroxide aqueous solution are preferred. Specific examples include polyethylene terephthalate film. In addition, in the step of forming a circuit by using a copper-clad laminated board i for a multilayer printed circuit board, when the protective film 5 is peeled off, the adhesive layer 4 is exposed and contaminates the circuit.合 性。 Combined. "'Therefore, the protective film 5 is required to be connected to the protective film 5 on a multilayer printed circuit board with a copper-clad laminated board to form an electrical second'. Because it acts as a protective layer for the adhesive layer 4, the connection of the protective film 5 = The surface of layer ^, in order to ensure the adhesion, the surface thickness ΓΓ is better. On the other hand, before the early-side circuit substrate of layer 4 obtained by multiple pieces of overlap, the single-sided circuit substrate is peeled to protect it. 92787.doc -13- 200427389 The protective film 5 is required to have a peelable protective film 5. In addition, the thickness of the protective film 5 is preferably within a range of 5 to 100 mm for the following reasons. Manufacturing multiple layers When printing a circuit board, after forming a circuit pattern on the entire fabric 2 side of the copper-clad laminated board i for a multilayer printed circuit board using 2 as a material, perforation is performed from the protective film 5 side to form a through-adhesive layer 4 and The hard insulating layer 3 is in contact with the above-mentioned circuit pattern and has a bottomed hole 8. Its-person 'is to give the bottomed hole to conduct electricity, and J. Health' prints and fills the conductive material 9 from the side of the protective film 5 to the bottom. Inside the hole. Secondly, the conductive material remaining on the surface is removed by an extruder, etc. The protective film 5 is peeled off to form a protruding conductive protrusion ι0 with a protruding height approximately equal to that of the protective film. Since the protruding height of the conductive protrusion 10 is preferably in the range of 5 to 100 μm, the protection is made. The film thickness of the film 5 is preferably in the range of 5 to 100 μηΐ 2. Next, the manufacturing method of the multilayer printed circuit board of the present invention and the embodiment of the multilayer printed circuit board will be described. 之 Manufacturing of the multilayer printed circuit board of the present invention In an embodiment of the method, a multilayer printed circuit board is manufactured through the following steps while the copper-clad laminated board 1 for a printed circuit board is described: (1) The copper-clad laminated board for the multilayer printed circuit board described above The process of forming a circuit on the entire surface; the process of forming a bottom hole from the surface (2), wherein the bottomed hole is processed by the protective film side through the hole'through the protective film, the adhesive I, and the hard insulating layer ; (3) a step of applying conductivity to the bottomed hole described in Θ; (4) a step of peeling off the protective film to make a single-sided circuit board; and 92787.doc -14- 200427389 (5) using at least _2 pieces or more of the foregoing Surface circuit board The process of lamination by hot die casting will be described below in the order of steps based on Figs. 2A to 2G, Figs. 3a to 3D, and Fig. 4. First, the entire surface of the copper foil 2 and the hard insulating layer 3 where no circuit is formed will be described. As a slave material, the single-sided copper-clad laminated board 6 shown in FIG. 2 is prepared. Secondly, the surface opposite to the entire copper foil 2 of the early-side copper-clad laminated board 6 is formed as shown in FIG. 2β. Adhesive layer 4. Adhesive layer 4 can be coated with pre-heating by roller coating, net curtain covering, spray covering, net curtain printing, or the The adhesive sheet of the curable resin is formed by bonding using a hot roller or the like. Next, a protective film 5 is bonded to the surface of the adhesive layer 4 using a hot roller, as shown in FIG. 2C, to produce a copper-clad layer for a multilayer printed circuit board. Japonist. Secondly, the entire copper box 2 of the copper-clad laminated board i for the multilayer printed circuit board is laminated with a photosensitive dry film, and exposed, developed, scribed, and separated, and the entire copper foil 2 is laminated. Processed into a specific pattern shape, such as the circuit pattern 7 formed by the button. Secondly, as shown in FIG. 2E, a perforation process is performed from the protective film 5 side, and the bottom 5 of the circuit ^ is contacted with the film 5, the adhesive layer 4, and the hard f insulating layer 3. The circuit pattern 7 is formed as Bottom of the bottom hole 8: ㈣It is better to use ㈣carbonate laser. When it is necessary to go to the _ ^ point (residual) of green, use UV laser to remove the residue. The method can also be used as a person It is stated that the bottomed hole 8 is provided with conductivity. The conductivity of the early / screen printing method is as shown in _, and the factory and f are given by filling the bottom hole 8 with conductivity. 92787.doc -15- 200427389 Xing Xing 9Γ /, one person "hunting by peeling off the protective film 5 'as shown in Fig. 2g, so that the conductive bumps 10 formed by the conductive region are protruded from the surface of the adhesive layer 4. ^ 电The protruding height of the flexible bump 10 is 5 to 100. This is because the connection with other circuit boards is good in subsequent processes. In this way, a single-sided circuit board 11a with an adhesive layer 4 is produced. 'Make single-sided circuit substrates Chuan, lc, 1H as shown in Figures 3A ~ 3D. Second, as shown in Figure 3A ~ Figure 3, the single-sided circuit substrates ⑽, 1 :, Lid The method of fusion, fusion, and use of a guide hole and a guide pin pin 1 is fixed and aligned. In addition, in the structure of the present invention, the thicknesses of the multiple layers need not be all the same. The thicknesses of the layers of the single-sided circuit substrates 11a, 11b, 11c, and Ud used here do not necessarily need to be of any thickness and can be used in any thickness. In this way, 'the single-sided circuit substrates that are superimposed are used by hot die-casting and implemented by : Laminated by heat and pressure to form a single body, and manufacture the multilayer printed circuit board 12 shown in Fig. 4. As a hot die casting, vacuum hot die casting is preferred. Use hot die casting by heating, pressing, and adhesive After the layer 4 is temporarily melted, it is hardened, and the conductive adhesive 9 is also adhered and thermally hardened on the corresponding circuits, thereby forming a lead-through hole, and obtaining the buried hole structure multilayer printed circuit board 12 shown in Fig. 4. The multilayer printed circuit board In the manufacturing method, as shown in FIG. 丨, the entire copper box 2 is used without forming a circuit; the hard insulating layer 3 is formed by hardening a thermosetting resin: the adhesive layer 4 is formed by It can be temporarily and melted by heating; and the film 5, according to Sequentially arranged-a single-sided circuit board Ua, ub, Uc, lid made of copper-clad laminated board using a multilayer multilayer printed circuit board, so the obtained single-sided circuit board Ua, Ub, Uc, ud becomes 92787. .doc -16- 200427389 Prevents flatness caused by twisting and twisting. Therefore, it is easy to perform alignment when multiple single-sided circuit boards 11a, lib, Uc, and Ud are stacked. In addition, single-sided circuit boards Ha , Lib, 11c, and lid are flat ones that can prevent the distortion of τ. Therefore, when these single-sided circuit substrates are overlapped and temporarily fixed and heated and pressurized, conductive bumps formed on these single-sided circuit substrates It will not move, which can reduce the occurrence of the misalignment of the position of the inner layer circuit when the conductive glue that moves with the conductive protrusion moves into a knife and the multilayer circuit board. The printed circuit board 12 of the evening layer can reduce the occurrence of misalignment of the inner layer circuit. (Example 1) As the single-sided copper-clad laminated board 6 shown in FIG. 2A, a glass cloth substrate of fr_4 grade was used to mount an oxygen resin single-sided copper-clad laminated board (manufactured by Matsushita Electric Works Co., Ltd.- 1661, the thickness of the hard insulating layer is 0, and the thickness of the copper ring is reduced. As shown in FIG. 2B, the epoxy resin adhesive is covered with a roller to cover the surface of the hard shell layer 3 so as to apply a thickness of 30 °, and is heated until it has good unevenness (listening). 4. Next, a layered processor (temperature: C 'pressure: 0.05 MPa), a polyethylene terephthalate film (manufactured by τ⑽y Company, product number T_6G, thickness 38_) for protection of 臈 5 is attached to the adhesive layer. 2C does not make a copper-clad layer for multilayer printed circuit boards 1 ° " Eight people 'on the entire copper foil 2 of the copper-clad laminate 1 for multilayer printed circuit boards 2' attaches a photosensitive dry film 'and exposes it , Development. Further, using a cuprous lice solution for engraving treatment, followed by stripping 92787.doc • 17- 200427389 using a sodium hydroxide solution, as shown in Fig. 9- $ 2D, forming a circuit pattern 7. ,, times, as shown in FIG. 2E, 侔 通 保 _, adhesive layer 4 and hard ;: = line perforation processing to form bottomed holes 8 through 7. After perforating the shell layer 3 and contacting the above-mentioned circuit pattern, the protective film 5 is used to open the hole with a carbonic acid laser. Fang Fei, which has no residue, uses UV laser to remove the residue. 2: The bottomed hole 8 is conductive, and the screen printing method is used as shown in the figure .... Because the bottomed hole 8 is filled with a conductive adhesive 9 mainly composed of silver. Straight, hunting and peeling the #protective film 5, the conductive bump 10 formed by the protrusion is protruded from the surface of the acoustic agent layer 4, and an early-side circuit substrate having the d layer 4 is produced. Those who twist and twist flat. As a result, the early-sided circuit board 1U is not produced. Similarly, the single-sided circuit boards m, C, as shown in FIGS. 3A to 3D are produced. Secondly, the single-sided circuit substrates ll, 11b, Uc, and Ud are overlapped, and the positioning is performed by temporarily fixing the pins. The single-sided circuit boards ⑴, ub, nc, and lld can be easily aligned because they do not generate flatness of twist and distortion. -In this way, each of the single-sided circuit boards 11a, 11b, Uc, and ⑴ is overlapped using hot die casting, and heated and pressurized under vacuum (18 (TC, i hours) 'to obtain the multilayer printed circuit board 12 shown in FIG. 4. The obtained multilayer printed circuit board η did not cause misalignment of the position of the inner layer circuit. (Example 2) The same as Example 1, a single-sided circuit board na, ub, lie, and lid shown in FIG. 5 was produced. Next, in The core base for conducting the inner layer circuits between the two sides is 92787.doc • 18- 200427389 f13 up and down 'as shown in circle 5, the single-sided circuit board 11a, and the single-sided circuit board He, lld are respectively arranged, and temporarily fixed with pin stickers. Alignment. Each single-sided circuit board ^ "^, ..., ... can be easily aligned because it is flat without twisting and twisting. In this way, the core substrate 13 and the single-sided circuit board are aligned with each other. , ... = = 'Use hot M casting, heating under vacuum, add Guo Fan, small #)' # to the multilayer printed circuit board 12 shown in Figure 6. The obtained multilayer printed circuit board 12, without the inner layer Misalignment of circuit position (Example 3) In the same manner as in Example 1, a single-sided circuit board iib and a mountain as shown in Fig. 7 were produced. In addition, as shown in Fig. 7, a conductive bump 10 was formed, and a substrate for a surface layer of a circuit was not formed on the entire copper pig 2. i 4 a ′ is produced according to the conditions of the single-sided circuit board Ua according to the embodiment]. The other surface-layer substrate 14 b is produced in the same manner. As shown in FIG. 7, the surface-layer substrate 14 a and the single-sided circuit substrate ub are prepared. The substrates 14b, 3b, and other surface layers are superimposed, and are aligned temporarily by a pinning method. The surface substrates 14a and 14b, the single-sided circuit substrate ⑽, and the mountain are flat ones that do not have twists and twists, and thus can be easily aligned. In this way, as shown in FIG. 7, the surface substrates 14 a and 14 b and the single-sided circuit substrate are superimposed, and heated and pressurized under vacuum (1 80 ° C, 1 hour) using hot die casting, as shown in FIG. 8. It can be obtained from the main transmission to the multilayer board 15 having the entire surface of the copper foil 2 on the surface. Next, through-hole processing is performed at a specific position of the multilayer printed circuit board 15, and then through-hole gold plating is performed. Next, the formation of the circuit pattern is performed, and a multilayer printed circuit board 12 shown in FIG. 9 having 92787.doc -19-200427389 and having lead-throughs and through-holes 16 is obtained. The obtained multilayer printed circuit board 12 did not produce misalignment of the position of the inner layer circuit. 0 Industrial Applicability According to the present invention, a copper-clad laminated board for a multilayer printed circuit board can be provided, which will have an adhesive layer. When multiple pieces of single-sided circuit boards are stacked, alignment can be performed easily. In addition, a method for manufacturing a multilayer printed circuit board capable of reducing occurrence of misalignment by using the obtained laminated steel circuit board for multilayer printed circuit board is provided. [Brief description of the drawings] FIG. 1 is a cross-sectional view illustrating a manufacturing process of a multilayer printed circuit board according to Embodiment 1 of the present invention. Θ =, FIG. 3B, FIG. 3C, and FIG. 3D are shown to explain the embodiment of the present invention.] The manufacturing method of the printed circuit board of the evening layer is shown in FIG. 2G and subsequent steps. FIG. 4 is a multilayer printed circuit of Embodiment 1 of the present invention. Sectional view of the plate FIG. 5 is a sectional view showing the order of explaining the θ manufacturing method of the present invention. Manufacture of Even Layer Printed Circuit Board FIG. 6 shows a cross-section circle of a multilayer printed circuit board that the present invention can encounter. FIG. 7 is a drawing showing the heart of each step of the method for realizing the surface drawing method of the present invention. The drawing of the riding circuit board is shown in FIG. 8 which is a diagram illustrating the multilayer printed circuit pole of Embodiment 3 of the present invention. 92787.doc -20. 200427389 Sectional view of processes after 7 Fig. 9 shows the printed circuit board of the evening layer of Example 3 of the embodiment of the present invention. Figs. 10A, 10B, and 10c are defeated. 】 Front view. A Xi Xi Si p °, Figure 1 is a cross-sectional view of each step of the method of manufacturing a multilayer printed circuit board to illustrate the principle. Fig. 1 Hr is a cross-sectional view showing a process subsequent to Fig. 10E for explaining a method for manufacturing the first-row J-layer printed circuit board. Table and Method Fig. 12 is a sectional view showing a conventional multilayer printed circuit board. [Illustration of representative symbols of drawings] 1 Copper-clad laminated board for multilayer printed circuit board 2 Copper foil on the whole surface 3 Hard insulating layer 4, 104 Adhesive layer 5 Protective film 6 Copper-clad laminated board on one side 7 Circuit pattern 8 Bottom Holes 9 Conductive adhesive 10 Conductive bumps 11a, 11b, 11c, lld, 111a, 111b, 111c, llld Glossy circuit boards 12, 15, 112 Multilayer printed circuit boards 13 Core substrates 14a, 14b Surface layer substrates 16 Through holes 92787.doc -21- 200427389
102 金屬箔 103 硬質絕緣基板 107 電路 108 子L 92787.doc -22-102 Metal Foil 103 Rigid Insulated Substrate 107 Circuit 108 Sub-L 92787.doc -22-